JPH0589784A - Plasma display panel - Google Patents

Abstract

PURPOSE:To prevent silver migration which occurs since the space between silver terminals is not sufficiently filled with a thermosetting-type binder in an anisotropic conductive film regarding a plasma display panel wherein FPC is stuck to the silver terminals of it by heat-pressing while the anisotropic conductive film is put between them. CONSTITUTION:With the thinner thickness than the total thickness of a silver terminal 5 and a metal conductor 4 in the FPC 3 side, an insulating layer barrier 11 is formed in the gap between silver terminals 5 of a panel terminal part. The insulating layer barrier makes it possible to fill the gap between the silver terminals sufficiently with a thermosetting binder without degrading the reliability of the connection and moreover the barrier itself becomes a barrier against migration and thus has high migration-proofing effect.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly to a terminal structure of a plasma display panel having a large number of terminals, a fine terminal pitch, and high definition and large display capacity.

[0002]

2. Description of the Related Art In recent years, plasma display panels (hereinafter referred to as "PDPs") have become larger and larger due to their characteristics.
We are steadily on the road to increasing capacity. Furthermore, research aiming at practical application of colorization is steadily progressing, and as a technology for connecting the panel terminal part and the external circuit, it is an important issue to connect the high-density terminal and the external circuit with high reliability. Has become.

Therefore, as a method for connecting the terminal portion of the PDP and the external circuit, for example, the FPC 3 is heated to the silver terminal 5 formed at the end portion of the PDP as shown in FIG. A method of crimping and coating the terminal portion with the resin 2 has been proposed. In addition, 7 is a rear substrate, 4 is a metal conductor on the FPC, and 10 is Ni particles existing in the anisotropic conductive film. The protective glass plate 9 is provided for the purpose of preventing water from entering the silver terminals and preventing migration of the silver terminals.

[0004]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The PC3 is thermocompression-bonded to the silver terminal 5 by the anisotropic conductive film 6,
After that, the terminal portion is protected by the resin 2. However, when a humidity resistance test is performed in which a DC voltage is applied between the adjacent terminals under an environment of an ambient temperature of 70 ° C. and a relative humidity of 95%, for example, the silver terminal 5
It was found that the deterioration of the insulating property due to the migration of No. 1 becomes a problem. As a result of analyzing this deterioration mode, it was revealed that the gap between the adjacent silver terminals was not sufficiently filled with the thermosetting binder forming the anisotropic conductive film and a gap was present. That is, it has been clarified that the migration of the silver terminal using the void as a path causes the deterioration of the insulation between the adjacent terminals.

[0005]

According to the present invention, a terminal group for applying a voltage from an external circuit to an electrode group inside a panel is provided at an end portion of a front substrate and a rear substrate, and the terminal group is connected from the external circuit to the terminal group. In a PDP in which a metal conductor for supplying a voltage and a panel terminal group are connected via an anisotropic conductive film,
An insulating layer barrier is provided in the gap between the terminal groups, and the thickness of the insulating layer barrier is formed to be equal to or less than the total thickness of the terminal group and the metal conductor.

[0006]

The present invention will be described below with reference to the drawings. FIG. 1 is a side view showing a first embodiment of the present invention,
FIG. 2 is a sectional view thereof. The silver terminals 5 are formed on the rear substrate 7 by, for example, screen printing so as to have a thickness of, for example, 10 μm, and the insulating layer barriers 11 are also formed by screen printing in the gaps between the silver terminals 5. If the thickness of the metal conductor 4 on the FPC 3 side is 30 μm, for example, the insulating layer barrier 1
The thickness of 1 is at least 40 μm (thickness of silver terminal 5 + thickness of metal conductor 4) or less.

When the metal conductor 4 on the FPC 3 side and the silver terminal 5 are aligned and thermocompression-bonded through the anisotropic conductive film 6 containing the Ni particles 10, the Ni particles 10 cause the metal conductor 4 and the silver terminal 5 to come into contact with each other. Connected. At this time, the thickness of the insulating layer barrier 11 is equal to or less than the total film thickness of the thickness of the metal conductor 4 and the thickness of the silver terminal 5, so that the connection between the metal conductor 4 and the silver terminal 5 is not hindered during thermocompression bonding, so that reliability is improved. A high connection can be realized. Furthermore, unlike the conventional example in which the insulating layer barrier 11 is not provided,
Since the thermosetting binder having high moisture resistance is sufficiently filled between the silver terminals, the insulating layer barrier 11 has a function of preventing migration of silver, and therefore, extremely excellent migration resistance can be realized. Is.

After the FPC 3 is thermocompression-bonded to the silver terminal 5 via the anisotropic conductive film 6, the resin 2 is applied from above the FPC 3,
Further, by mounting a protective glass plate 9 for preventing invasion of water on the resin 2 and curing the resin 2, it is possible to realize a PDP having high connection reliability and excellent migration resistance. it can. In this embodiment, the silver terminal formed on the rear substrate is described, but the same applies to the silver terminal formed on the front substrate side.

FIG. 3 is a sectional view of a terminal portion showing a second embodiment of the present invention. The difference between FIG. 3 and FIG. 2 is that the circuit line for supplying voltage from the external circuit to the panel terminal group is F
That is, the metal lead wire 4'is used instead of the PC. If the thickness of the metal lead wire 4'is 150 μm, for example, the insulating layer barrier 11 is formed by screen printing so as to have a thickness of 160 μm (thickness of metal lead wire + thickness of silver terminal) or less. The effect obtained by such a structure is similar to that of the first embodiment, but in the case of the metal lead wire, which was conventionally connected to the silver terminal 5 by the soldering method, in the present embodiment, the solder is used. Since it does not use
It was possible to completely solve the pollution problem caused by the organic solvent without using the organic solvent at the time of flux removal, which was conventionally required.

[0010]

As described above, according to the present invention, the silver terminal portion of the panel and the metal conductor for supplying the driving voltage from the external circuit are thermocompression bonded via the anisotropic conductive film. In this case, an insulating layer barrier is provided in the gap between the silver terminals, and the thickness of this insulating layer barrier is set to be equal to or less than the total thickness of the silver terminal and the metal conductor, thereby hindering the connection reliability. It is possible to fill the thermosetting binder that forms the anisotropic conductive film between the silver terminals without any gaps, and thus it is possible to obtain an extremely excellent migration resistance property. Incidentally, the insulation resistance between the silver terminals could be improved by one digit or more as compared with the conventional structure. Therefore, by applying the present invention to a color PDP having a fine pitch and a large capacity terminal group, in particular, it is possible to realize an extremely highly reliable connection.

[Brief description of drawings]

FIG. 1 is a side view of a PDP terminal portion showing a first embodiment of the present invention.

FIG. 2 is a sectional view of FIG. 1 showing a first embodiment.

FIG. 3 is a sectional view of a terminal portion showing a second embodiment of the present invention.

FIG. 4 is a sectional view showing a terminal portion of a conventional PDP.

[Explanation of symbols]

 1 Front Substrate 2 Resin 3 FPC 4 Metal Conductor 4'Metal Lead Wire 5 Silver Terminal 6 Anisotropic Conductive Film 7 Rear Substrate 8 Encapsulant 9 Protective Glass Plate 10 Ni Particles 11 Insulation Layer Barrier

Claims (1)

[Claims] 1. A front substrate on which an electrode group is formed and a rear substrate on which the electrode group is formed are opposed to each other and hermetically sealed, and a terminal group for externally applying a voltage to the inside electrode group is provided on the front surface. A plasma display panel in which a metal conductor having an end portion of the substrate and the rear substrate and for supplying a voltage to the terminal group from an external circuit is connected to the terminal portion via an anisotropic conductive film, wherein the terminal An insulating layer barrier is provided in a gap between the groups, and the thickness of the insulating layer barrier is formed to be equal to or less than the total thickness of the terminal group and the metal conductor.