JPH06202139A - Liquid crystal display device and its production - Google Patents

Abstract

PURPOSE:To form insulating protective film to protect wiring without increasing man-hours. CONSTITUTION:Oriented film 5 is formed at the part of a display area on the upper surface of a lower transparent substrate 1 by transfer-printing, and simultaneously, the insulating protective film 16 consisting of the same material as that of the oriented film 5 is formed at a part from which a part where external connection terminals 11, 12, and 13 are provided on the upper surface of a protrusive part protruding over a transparent substrate 2 on the upper side of the lower transparent substrate 1, is removed. Therefore, the insulating protective film 16 to protect the wiring 14, 15 can be formed without increasing the man-hours.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, a liquid crystal display device is a liquid crystal display panel in which a liquid crystal is sealed between two transparent substrates made of glass or resin, and I for driving the liquid crystal display panel.
A C chip, a circuit board for controlling the IC chip, and the like are provided. Such liquid crystal display devices are roughly classified into three types depending on the arrangement position of the IC chip. First, there is one in which an IC chip is mounted on a circuit board and the liquid crystal display panel and the circuit board are connected via a flexible wiring board. Second, the IC chip is TAB
Mounted on tape, TAB the liquid crystal display panel and circuit board
Some are connected via tape. Thirdly, there is one in which an IC chip is mounted on a liquid crystal display panel and the liquid crystal display panel and a circuit board are connected via a flexible wiring board.

By the way, in the conventional liquid crystal display panel of such a liquid crystal display device, generally, two transparent substrates, each having a transparent electrode and an alignment film, are provided in the display areas of the opposite surfaces, respectively, with a sealing material interposed therebetween. After bonding, liquid crystal is sealed between the alignment films of the two transparent substrates inside the sealing material,
An external connection terminal and a transparent electrode of one transparent substrate on the surface of the protruding portion of one transparent substrate of the one transparent substrate that faces the other transparent substrate It has a structure in which a routing wiring to be connected to is provided. The external connection terminal of one transparent substrate is connected to the connection terminal of the flexible wiring substrate, TA
The connection terminal of the B tape or the connection electrode of the IC chip is connected. In addition, IC on one transparent substrate
When mounting a chip, one transparent substrate is further provided with an external connection terminal and a routing wiring for connecting this external connection terminal to an external connection terminal for an IC chip, and the connection terminal of the flexible wiring board is connected to the external connection terminal. I am trying.

[0004]

However, in such a conventional liquid crystal display device, since the routing wiring of one transparent substrate is exposed, when foreign matter such as conductive dust adheres, the routing wiring between the adjacent routing wirings is reduced. May cause short circuit, and if moisture etc. adheres to the transparent electrode (IT
There is a case where the routing wiring made of the same material as that of (O) is electrolytically corroded and disconnected (for example, a potential difference occurs between the two routing wirings adjacent to each other when moisture and electrolyte dust are attached to the two routing wirings). Then, electrolytic corrosion occurs.) Further, if foreign matter such as dust hits, the routed wiring may be damaged and broken. Especially when an IC chip is mounted on one transparent substrate,
Due to the flow of technology such as high density and multi-pin (connection electrode) of IC chip, the number of routing wires increases and the overall length increases, and the pitch of routing wires near the IC chip mounting part is fine. Therefore, the above-mentioned problems are remarkable. In addition,
In order to solve such a problem, for example, after mounting an IC chip on one transparent substrate and connecting a flexible wiring substrate to the one transparent substrate, a dispenser is provided on a portion of the one transparent substrate where the leading wiring is exposed. In some cases, an insulating protective film made of resin is provided by using such a method, but in this case, a step of providing the insulating protective film made of resin is required. There was a problem. An object of the present invention is to provide a liquid crystal display device capable of forming an insulating protective film for protecting a lead wiring and a method for manufacturing the same, without increasing the number of steps.

[0005]

The invention according to claim 1 is
A portion of the surface of the protruding portion of one transparent substrate, which protrudes from the other transparent substrate, facing the other transparent substrate except the portion where the external connection terminals are provided, and at least the portion where the routing wiring is provided In addition, an insulating protective film made of the same material as the alignment film is provided. Claim 2
In the invention described above, when the liquid crystal display device according to claim 1 is manufactured, an alignment film is formed on one of the transparent substrates, and at the same time, an insulating protective film is formed of the same material as the alignment film. .

[0006]

According to the present invention, since the alignment film can be formed on one of the transparent substrates and at the same time the insulating protective film can be formed of the same material as the alignment film, the routing wiring can be formed without increasing the number of steps. It is possible to form an insulating protective film for protecting the.

[0007]

1A shows a main part of a liquid crystal display device according to an embodiment of the present invention, FIG. 1B shows a lower transparent substrate of the liquid crystal display device, and FIG. XX of (A)
It shows a cross section along a line. This liquid crystal display device includes a lower transparent substrate 1 made of glass or resin and an upper transparent substrate 2 also made of glass or resin. Transparent electrodes 3 and 4 and alignment films 5 and 6 are provided in the display areas of the surfaces of the transparent substrates 1 and 2 which face each other. The transparent substrates 1 and 2 are attached to each other with the seal material 7 interposed therebetween, and the liquid crystal 8 is sealed inside the seal material 7 between the alignment films 5 and 6 of the transparent substrates 1 and 2.

In this liquid crystal display device, the lower transparent substrate 1
Has one end protruding from one end surface of the upper transparent substrate 2. At the center of the upper surface of the projecting portion of the lower transparent substrate 1, an IC chip output side external connection terminal 11 is provided on the right side and an IC chip input side external connection terminal 12 is provided on the left side in FIG. Further, the flexible wiring board external connection terminal 1 is provided on the upper surface of the protruding end portion of the lower transparent board 1.
3 is provided. Furthermore, at each predetermined location on the upper surface of the protruding portion of the lower transparent substrate 1, the lead wiring 14 for connecting the IC chip output side external connection terminal 11 and the transparent electrode 3 and the IC chip input side external connection terminal are provided. A wiring line 15 is provided to connect 12 and the external connection terminal 13. In addition, a part of the lead-out wiring 14 is connected to the transparent electrode 4 of the upper transparent substrate 2 via a cloth material (not shown). Further, an insulating protective film 16 made of the same material as the alignment film 5 is provided on a portion of the upper surface of the protruding portion of the lower transparent substrate 1 excluding the portions where the external connection terminals 11, 12, 13 are provided. The wiring lines 14 and 15 are covered with the insulating protective film 16. Then, the connection electrodes 18 and 19 of the IC chip 17 are formed on the output external connection terminal 11 for the IC chip and the input external connection terminal 12 for the IC chip, respectively, by mixing conductive particles in an insulating adhesive. The IC chip 17 is mounted on the central portion of the upper surface of the protruding portion of the lower transparent substrate 1 by being connected via the directional conductive adhesive 20. Although not shown, the flexible wiring board external connection terminal 13 is connected to a connection terminal of a flexible wiring board connected to the circuit board.

Next, a method of manufacturing this liquid crystal display device will be described with reference to FIGS. 3 (A) and 3 (B). First, as shown in FIG. 3A, the transparent electrode 3, the external connection terminals 11 and 1 are provided at predetermined positions on the upper surface of the lower transparent substrate 1.
2 and 13 and the respective lead wirings 14 and 15 are simultaneously patterned by ITO. Next, as shown in FIGS. 3 (B) and 1 (B), an alignment film 5 is formed on the upper surface of the lower transparent substrate 1 in the display region including the transparent electrode 3, and an alignment film 5 is formed on the lower transparent substrate 1. Each external connection terminal 11 on the upper surface of the protruding portion,
An insulating protective film 16 made of the same material as the alignment film 5 is formed at the same time by transfer printing on the portions other than the portions where 12 and 13 are provided. Here, the physical properties required for the alignment film 5 include high insulation, resistance to deterioration, and good adhesion, and polyimide is generally used as the material. Therefore, even if the insulating protective film 16 is formed of the same material as the alignment film 5,
The physical characteristics required for the insulating protective film 16 can be sufficiently satisfied. Therefore, the insulating protective film 16
Even if it is formed of the same material as the alignment film 5, there is no problem, and the insulating protective film 16 for protecting the routing wirings 14 and 15 can be formed without increasing the number of steps. In addition, as an example, the transparent electrode 3,
The thickness of each external connection terminal 11, 12, 13 and each routing wiring 14, 15 is about 300 to 500Å, and the thickness of the alignment film 5 and the insulating protective film 16 is 800 to 1000Å.
The degree.

Next, as shown in FIG. 2, a sealing material 7 is screened on a portion of the upper surface of the lower transparent substrate 1 around the alignment film 5 shown in FIG. 1B except the liquid crystal injection port forming region. It is formed by printing. Next, the periphery of the lower surface of the upper transparent substrate 2 having the transparent electrode 4 and the alignment film 6 formed on the lower surface is attached to the upper surface of the sealing material 7, and the upper transparent substrate 2 is opposed above the lower transparent substrate 1. Deploy. Next, the liquid crystal 8 is injected through the liquid crystal injection port (not shown) formed in the sealing material 7, and then the liquid crystal injection port is sealed. Next, the connection electrodes 18 and 19 of the IC chip 17 are connected to the output external connection terminal 11 for the IC chip and the input external connection terminal 1 for the IC chip.
2 is connected via an anisotropic conductive adhesive 20, whereby the IC chip 17 is mounted on the central portion of the upper surface of the protruding portion of the lower transparent substrate 1. Next, the connection terminal of the flexible wiring board connected to the circuit board is connected to the external connection terminal 13 for flexible wiring board. Thus, the liquid crystal display device of this embodiment is manufactured.

[0011]

As described above, according to the present invention, it is possible to form an alignment film on one transparent substrate and simultaneously form an insulating protective film using the same material as the alignment film. It is possible to form an insulating protective film for protecting the routing wiring without increasing the number of wires.

[0012]

[Brief description of drawings]

FIG. 1A is a perspective view of a main part of a liquid crystal display device according to an embodiment of the present invention, and FIG. 1B is a perspective view of a transparent substrate therebelow.

FIG. 2 is a sectional view taken along line XX in FIG.

3A and 3B are cross-sectional views shown for explaining a method of manufacturing the liquid crystal display device.

[Explanation of symbols]

 1, 2 Transparent substrate 3, 4 Transparent electrode 5, 6 Alignment film 7 Sealing material 8 Liquid crystal 11, 12, 13 External connection terminal 14, 15 Lead wiring 16 Insulating protective film 17 IC chip

Claims (2)

[Claims] 1. Two transparent substrates, each having a transparent electrode and an alignment film provided in display areas on opposite surfaces thereof, are bonded to each other via a sealing material, and the two transparent substrates inside the sealing material are bonded together. Liquid crystal is sealed between the alignment films, and an external connection terminal and an external connection terminal are provided on a surface of the protruding portion of one of the two transparent substrates that protrudes from the other transparent substrate, the surface facing the other transparent substrate. In a liquid crystal display device provided with a lead-out wiring for the external connection terminal, the external connection is provided on a surface of a protruding portion of the one transparent substrate that protrudes from the other transparent substrate, the surface facing the other transparent substrate. An insulating protective film made of the same material as the alignment film is provided at least in a portion except the portion where the terminals are provided and where the leading wiring is provided. Crystal display device. 2. When manufacturing the liquid crystal display device according to claim 1, the alignment film is formed on the one transparent substrate, and at the same time, the insulating protective film is formed of the same material as the alignment film. A method for manufacturing a liquid crystal display device.