JP2961948B2 - Failure diagnosis method for information processing equipment - Google Patents
Failure diagnosis method for information processing equipmentInfo
- Publication number
- JP2961948B2 JP2961948B2 JP3120589A JP12058991A JP2961948B2 JP 2961948 B2 JP2961948 B2 JP 2961948B2 JP 3120589 A JP3120589 A JP 3120589A JP 12058991 A JP12058991 A JP 12058991A JP 2961948 B2 JP2961948 B2 JP 2961948B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- abnormality
- printed circuit
- circuit board
- information processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は情報処理の故障診断方式
に関し、特に温度感知による故障診断に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a failure diagnosis method for information processing, and more particularly to a failure diagnosis based on temperature sensing.
【０００２】[0002]
【従来の技術】従来のこの種の情報処理装置の故障診断
方式は、図４に示すように、装置筺体内の発熱部上に異
常高温度信号２を発生する温度センサー１と、異常高温
信号２により異常発熱部分の電源を切断する電源制御部
３と、温度異常表示部４を有している。2. Description of the Related Art As shown in FIG. 4, a conventional fault diagnosis system for an information processing apparatus of this type includes a temperature sensor 1 for generating an abnormally high temperature signal 2 on a heat generating portion in an apparatus housing, and an abnormally high temperature signal. 2 has a power control unit 3 for turning off the power of the abnormally heated portion and a temperature abnormal display unit 4.
【０００３】温度センサー１は、発熱部であるプリント
基板１００の上部に設置され、一定温度を超えた場合に
異常高温信号２発生する。異常高温信号２を受け取った
電源制御部３は、直ちに温度異常表示部４に報告し、温
度異常表示を行なった後、高温発生部の電源を切断す
る。A temperature sensor 1 is installed above a printed circuit board 100, which is a heat-generating portion, and generates an abnormal high-temperature signal 2 when the temperature exceeds a certain temperature. Upon receiving the abnormal high temperature signal 2, the power control unit 3 immediately reports the abnormal temperature to the abnormal temperature display unit 4, performs the abnormal temperature display, and turns off the power of the high temperature generating unit.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の情報処
理装置の故障診断方式では、一定温度を超えた場合にの
み温度異常の報告を行っているため、異常定温の報告が
できず、また１枚或いは数枚のプリント基板に対して１
個の温度センサーを使用しているため、プリント基板上
の個々の部品に対しての温度異常を知ることができない
ので、詳細な故障解析ができないという問題点があっ
た。In the above-described conventional fault diagnosis method for an information processing apparatus, a temperature abnormality is reported only when the temperature exceeds a certain temperature. Therefore, an abnormal constant temperature cannot be reported. 1 for several or several printed circuit boards
Since the individual temperature sensors are used, it is not possible to know the temperature abnormality of each component on the printed circuit board, so that a detailed failure analysis cannot be performed.
【０００５】[0005]
【課題を解決するための手段】本発明の情報処理装置の
故障診断方式は、プリント基板表面の温度を測定する赤
外線カメラと、前記赤外線カメラからの温度情報を画像
データとして定期的に記憶処理しプリント基板表面の温
度を画像表示する温度画像表示部と、前記記憶処理され
た温度情報により温度異常を判断する温度異常判断部
と、前記温度異常の判断結果を表示する温度異常表示部
と、前記温度異常の場合には前記プリント基板への電源
供給を停止する電源制御部とを有し、前記温度異常の発
生の前後の温度状態を画像表示することを特徴とする。Fault diagnosis method of the information processing apparatus of the present invention According to an aspect of the infrared camera for measuring the temperature of the surface of the printed circuit board, the temperature information from the infrared camera images
A temperature image display unit for image display of the temperature of the periodically stored treated surface of the printed circuit board as the data, said stored processed
A temperature abnormality judging unit for judging a temperature abnormality based on the temperature information, a temperature abnormality display unit for displaying the judgment result of the temperature abnormality, and a power supply to the printed circuit board in the case of the temperature abnormality.
A power supply control unit for stopping supply, and
It is characterized in that the temperature state before and after raw is displayed as an image .
【０００６】[0006]
【実施例】次に本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００７】図１は本発明の一実施例をブロック図であ
る。FIG. 1 is a block diagram showing an embodiment of the present invention.
【０００８】赤外線カメラ５は被診断対象であるプリン
ト基板１００を撮影する。その画像情報をもとに温度画
材表示部６が画像として表面温度分布を表示する。The infrared camera 5 photographs the printed circuit board 100 to be diagnosed. Based on the image information, the temperature painting material display section 6 displays the surface temperature distribution as an image.
【０００９】温度異常判断部７は異常温度を判断し、温
度異常信号１０１を発生する。これにより、電源制御部
３はプリント基板１００への直流電源供給を停止させ、
また温度異常表示部４はランプ，ブザー等により外部に
対して温度異常を表示を行う。An abnormal temperature judging section 7 judges an abnormal temperature and generates an abnormal temperature signal 101. As a result, the power control unit 3 stops supplying DC power to the printed circuit board 100,
The temperature abnormality display section 4 displays temperature abnormality to the outside by a lamp, a buzzer, or the like.
【００１０】図２は温度異常判断部７と温度画像表示部
６にサービスプロセッサ７１を使用した場合の応用例で
ある。サービスプロセッサ７１は、赤外線カメラ５から
の信号を受け取り、外部記憶装置７３に画像データを定
期的に記憶し、通常状態からの温度変化，異常温度，異
常定温等を判断する。また、異常を判断した特に、温度
異常信号１０１を発生する。FIG. 2 shows an application example in which a service processor 71 is used for the temperature abnormality judgment section 7 and the temperature image display section 6. The service processor 71 receives the signal from the infrared camera 5, periodically stores the image data in the external storage device 73, and determines a temperature change from a normal state, an abnormal temperature, an abnormal constant temperature, and the like. In particular, when an abnormality is determined, a temperature abnormality signal 101 is generated.
【００１１】その時、保守員はワークステーション７２
を操作して図３に示すような異常発生前後の温度状態を
画像により確認し、故障部分を推定することになる。[0011] At that time, the maintenance staff works at the workstation 72.
Is operated, the temperature state before and after the occurrence of the abnormality as shown in FIG. 3 is confirmed by an image, and a failure portion is estimated.
【００１２】[0012]
【発明の効果】以上説明したように本発明は、温度測定
に赤外線カメラを用いたので、温度分布が画像により表
示することが可能になり、部分個々の温度異常が検出で
きるため、装置に異常が発生した時の故障解析に有効な
手段となる。さらに、異常低温時の警告も発することが
できる効果がある。As described above, according to the present invention, since the infrared camera is used for temperature measurement, the temperature distribution can be displayed as an image, and the temperature abnormality of each part can be detected. This is an effective means for failure analysis when a failure occurs. Further, there is an effect that a warning at the time of abnormal low temperature can be issued.
【図１】本発明の一実施例のブロック図である。FIG. 1 is a block diagram of one embodiment of the present invention.
【図２】図１に示した温度画像表示部と温度異常判断部
をサービスプロセッサにて実施した場合の応用例を示す
図である。FIG. 2 is a diagram illustrating an application example when a temperature processor and a temperature image display unit illustrated in FIG. 1 are implemented by a service processor;
【図３】本発明による温度状態を画像を示す図である。FIG. 3 is a diagram showing an image of a temperature state according to the present invention.
【図４】従来方式によるブロック図である。FIG. 4 is a block diagram according to a conventional method.
１ 温度センサー ２ 異常高温信号 ３ 電源制御部 ４ 温度異常表示部 ５ 赤外線カメラ ６ 温度画像表示部 ７ 温度異常判断部 ７１ サービスプロサッサ ７２ ワークステーション ７３ 外部記憶装置 １００ プリント基板 DESCRIPTION OF SYMBOLS 1 Temperature sensor 2 Abnormal high temperature signal 3 Power supply control part 4 Temperature abnormality display part 5 Infrared camera 6 Temperature image display part 7 Temperature abnormality judgment part 71 Service processor 72 Workstation 73 External storage device 100 Printed circuit board
Claims (1)
線カメラと、前記赤外線カメラからの温度情報を画像デ
ータとして定期的に記憶処理しプリント基板表面の温度
を画像表示する温度画像表示部と、前記記憶処理された
温度情報により温度異常を判断する温度異常判断部と、
前記温度異常の判断結果を表示する温度異常表示部と、
前記温度異常の場合には前記プリント基板への電源供給
を停止する電源制御部とを有し、前記温度異常の発生の
前後の温度状態を画像表示することを特徴とする情報処
理装置の故障診断方式。1. A infrared camera for measuring the temperature of the surface of the printed circuit board, image de temperature information from the infrared camera
A temperature image display unit for image display of the temperature of the periodically stored treated surface of the printed circuit board as over data, said stored processed
A temperature abnormality determining unit that determines a temperature abnormality based on the temperature information ;
A temperature abnormality display unit for displaying the judgment result of the temperature abnormality ,
Power supply to the printed circuit board in case of abnormal temperature
And a power supply control unit for stopping the occurrence of the temperature abnormality.
A failure diagnosis method for an information processing apparatus, which displays images of temperature conditions before and after .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3120589A JP2961948B2 (en) | 1991-05-27 | 1991-05-27 | Failure diagnosis method for information processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3120589A JP2961948B2 (en) | 1991-05-27 | 1991-05-27 | Failure diagnosis method for information processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04348266A JPH04348266A (en) | 1992-12-03 |
| JP2961948B2 true JP2961948B2 (en) | 1999-10-12 |
Family
ID=14790012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3120589A Expired - Lifetime JP2961948B2 (en) | 1991-05-27 | 1991-05-27 | Failure diagnosis method for information processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2961948B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021256719A1 (en) * | 2020-06-16 | 2021-12-23 | 삼성전자 주식회사 | Electronic device for controlling heat generation by using thermal image, and method therefor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5744212B2 (en) | 2011-08-31 | 2015-07-08 | シャープ株式会社 | Wiring defect detection method, wiring defect detection apparatus, and semiconductor substrate manufacturing method |
-
1991
- 1991-05-27 JP JP3120589A patent/JP2961948B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021256719A1 (en) * | 2020-06-16 | 2021-12-23 | 삼성전자 주식회사 | Electronic device for controlling heat generation by using thermal image, and method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04348266A (en) | 1992-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990706 |