JP2904148B2 - Printed wiring board processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for treating a printed circuit board to be discarded or regenerated, and more particularly to a method and an apparatus for removing various electronic components soldered to the printed circuit board and collecting the solder. .

[0002]

2. Description of the Related Art For the purpose of effective use of resources and preservation of the global environment, discarded televisions and the like are dismantled and separated and recycled (recycled) for each constituent material.

As a method of processing a printed wiring board constituting various electronic devices, for example, Japanese Patent Application Laid-Open No. 8-143823 discloses a method in which a printed wiring board is housed in a rotating drum and heated around the drum to form the printed wiring board. A method for separating and collecting electronic components and solder from a wiring board has been proposed.

[0004]

However, Japanese Patent Application Laid-open No.
In Japanese Patent No. 143823, an electric heater is used as a means for heating the printed wiring board, and it takes time to heat the solder and remove the electronic components.

SUMMARY OF THE INVENTION It is an object of the present invention to heat a printed wiring board, that is, a soldered portion in a short time, and to efficiently automate solder collection.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a structure in which a printed wiring board that vibrates, swings, or falls under its own weight is heated by high-frequency heating to remove electronic components and collect solder. did.

Further, the rotating printed wiring board is heated by high-frequency heating, and at least one of the solder and the electronic components attached to the printed wiring board is removed by centrifugal force.

[0008] With the above configuration, the removal of the electronic component and the recovery of the solder can be efficiently automated with simple equipment. As a result, the recycling rate is improved, which contributes to environmental conservation and effective use of resources.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The first invention of the present invention is to remove the electronic components by rotating the drum so that the printed wiring board accommodated therein can drop by its own weight, and heating the printed wiring board by high frequency heating. This is a method of processing a printed wiring board, which is a feature of the present invention, and enables efficient removal of electronic components and recovery of solder.

According to a second aspect of the present invention, there is provided a method of processing a printed wiring board, comprising: housing the printed wiring board in a vibrating or oscillating container; Thus, the removal of the electronic component and the recovery of the solder can be efficiently performed.

Further , a third invention provides a container for accommodating a printed circuit board, means for rotating the container, high-frequency heating means for heating the printed circuit board by high-frequency heating to remove electronic components, and the container. And a means for relatively separating and contacting the high-frequency heating means with the high-frequency heating means.The processing apparatus for a printed wiring board is characterized in that removal of electronic components and recovery of solder can be efficiently performed with simple equipment. Can be implemented.

According to a fourth aspect of the present invention, there is provided a container for accommodating a printed circuit board, means for vibrating or rocking the container, and heating the printed circuit board to a temperature higher than the melting temperature of solder to remove an electronic component. Means, and a device for processing a printed wiring board, comprising: means for relatively separating and bringing the container and the heating means into and out of contact with each other. Equipment can be implemented efficiently.

According to a fifth aspect of the present invention, a printed wiring board is heated by high-frequency heating, and at least one of solder and electronic components attached to the printed wiring board is removed by centrifugal force. This is a processing method, so that the removal of the electronic component and the recovery of the solder can be efficiently performed.

According to a sixth aspect of the present invention, the printed wiring board housed therein is heated by high-frequency heating, and the drum is rotated so as to be able to drop by its own weight, and then the rotation speed of the drum is increased to adhere to the printed wiring board. This is a method for processing a printed wiring board, characterized in that at least one of the solder and the electronic component is removed by centrifugal force, so that the removal of the electronic component and the recovery of the solder can be performed efficiently.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is a block diagram showing a principal part of a concept of a printed wiring board processing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part in a state where the drum and the printed wiring board constituting FIG. 1 are accommodated.

1 is a printed wiring board processing apparatus 1 shown in FIG.
Reference numeral 00 denotes a high-frequency heating device 1, a rotary drum 2 for accommodating various printed wiring boards, drum rotating means for supporting and rotating the rotary drum 2 in a predetermined manner, and disposing the drum 2 in the high-frequency heating device 1. It is provided with a unit for taking out (contacting and separating from the high-frequency heating device 1) and a bottomed container (a molten solder receiver) 15.

The rotary drum 2 is mounted on a drum mounting shaft 4, supported by bearings 7, and driven to rotate by a drive motor 5.

The plate 8 mounts the bearing 7 and the drive motor 5 and has a bottomed container (a molten solder receiver) on one end surface side.
15 is attached. Further, both ends of the plate 8 are slidably supported by a guide plate 9, and are reciprocated by a cylinder 11 via a bracket 12 attached to a lower surface side.

A rotary drum 2A shown in FIG. 2 is an example of a rotary drum attached to the apparatus shown in FIG. That is, the appearance of the rotary drum 2A is cylindrical, or polygonal such as hexagonal or octagonal.

The rotary drum 2A comprises an outer net drum and an inner net drum. The mesh of the inner net drum is provided with an opening having a size through which various electronic components 32 such as capacitors, resistors, and semiconductor components can pass. The mesh of the outer net drum is molten solder 3.
3, but has an opening large enough to prevent the passage of the various electronic components 32.

In FIG. 1 and FIG. 2, a printed wiring board 31 on which various electronic components are soldered is mounted on a rotating drum 2.
Or it is stored in 2A.

A high-frequency heating device 1 (more specifically, a high-frequency induction heating device) is arranged around the rotary drum 2.
The high-frequency heating device 1 drives the printed wiring board 31 to about 2 degrees Celsius.
Range from 00 degrees to 500 degrees Celsius, preferably about 300 degrees Celsius
Each time, the solder of the electronic component is melted. The melted solder is dropped to the outside of the rotating drum and accumulates in the bottomed container 15.
The operating conditions of the high-frequency heating device for melting the solder are as follows.
80V, 200A was applied for 5-30 seconds at 1500-2000 Hz.

In parallel with the solder melting by the high-frequency heating device 1, the rotating drum 2 P. M-100R. P. By rotating the printed wiring board at about M, the printed wiring board accommodated in the rotating drum 2 is dropped by its own weight, and the mounted components and the molten solder are removed from the printed wiring board by using the impact colliding with the inner wall of the drum.

The electronic components and the solder detached from the printed wiring board fall from an opening (not shown) provided on the outer peripheral surface of the drum or a mesh of the net drum shown in FIG.

With the electronic components and the solder separated from the printed wiring board, the rotary drum 2 is pulled out of the high-frequency heating device 1, the lid 3 is opened, and the printed wiring board is taken out.

In the above embodiment, the external dimensions of the drum, the number of printed wiring boards to be stored, and the like may be arbitrarily determined according to the size of the printed wiring board to be handled.

The means for pulling the rotary drum 2 out of the high-frequency heating device 1 may also be arbitrarily implemented. For example, in addition to the fluid shown in FIG. 1, for example, the air cylinder 11, a rack and a pinion, a crank mechanism, or the like may be used to reciprocate (not shown).

Further, when the rotating drum is cylindrical, a plurality of fin-shaped protrusions may be appropriately disposed on the inner surface, the printed wiring board may be hooked and lifted, and may be freely dropped at a predetermined angle position (not shown). ).

The high-frequency output of the high-frequency heating apparatus used in the present invention was 60 KW at the maximum, and the frequency setting range was about 0.5 to 20 kHz. Output and frequency settings
It goes without saying that the size may be appropriately set according to the size of the rotating drum to be handled, the size of the printed wiring board to be accommodated, and the number of sheets.

Further, the constituent members of the rotary drum 2 and the bottomed container 15 may be arbitrarily made, and may be any member such as a metal member, a heat-resistant resin or a ceramic member.

According to the above embodiment, the electronic component and the solder can be efficiently removed from the printed wiring board in a short time.

(Embodiment 2) FIG. 3 is a schematic diagram showing a principal part of a concept of a printed wiring board processing apparatus according to an embodiment of the present invention.

In this case, the operation is basically the same as that of the first embodiment. The configuration is different in the configuration of a container for accommodating a printed wiring board and the configuration in which reciprocating vibration or swinging is performed instead of rotation of the container.

A bottomed container 22 for storing a printed circuit board
Is provided with a plurality of openings 23 at least on the bottom surface through which electronic components and solder are separated.

The bottomed container 22 is attached to a mounting shaft 24, supported by bearings, and reciprocated or oscillated by a link plate 25, an eccentric plate 26 and a drive motor 27. As a matter of course, the eccentric plate 26 is attached to the rotation shaft of the motor 27.

The plate 8A has a bearing and a drive motor 27 mounted thereon, and has a bottomed container (molten solder receiver) 15 attached to one end face. Further, both ends of the plate 8 are slidably supported by a guide plate 9, and are reciprocated by a cylinder 11 via a bracket 12 attached to a lower surface side.

In FIG. 3, a printed wiring board on which various electronic components are mounted by soldering is housed in a bottomed container 22.

A high-frequency heating device 1 (more specifically, a high-frequency induction heating device) is arranged around the bottomed container 22.
The high-frequency heating device 1 is used to heat a printed circuit board to about 300 degrees Celsius.
Each time, the solder of the electronic component is melted. The molten solder drops out of the bottomed container 22 and accumulates in the bottomed container 15.

The operating conditions of the high-frequency heating device for melting the solder are as follows: 180 V, 200 A, 1500 Hz to 20 Hz.
It took 5 to 30 seconds at 00 Hz.

In parallel with the melting of the solder by the high-frequency heating device 1, the bottomed container 22 is vibrated or oscillated at an amplitude of several mm to several tens of mm and a frequency of several hundred hertz to about 2,000 hertz to obtain a bottomed container. The mounted components and the molten solder are removed from the printed wiring board by vibrating the printed wiring boards in the container 22, colliding the printed wiring boards with each other, or using the impact of the printed wiring board colliding with the inner wall of the bottomed container.

The electronic components and the solder detached from the printed wiring board fall from the opening 23 provided on the bottom surface of the bottomed container.

With the electronic components and the solder separated from the printed wiring board, the bottomed container 22 is pulled out of the high-frequency heating device 1 to take out the printed wiring board.

With the above configuration, the electronic component and the solder can be efficiently removed from the printed wiring board in a short time.

(Embodiment 3) FIG. 1 is a schematic diagram showing a principal part of the concept of a printed wiring board processing apparatus according to a third embodiment of the present invention.
Is approximated. The configuration of the apparatus differs from that of the first embodiment in that the molten solder receiver 15 is not a bottomed container but a cylindrical container arranged concentrically with the rotary drum 2 (not shown).

The procedure for separating the electronic component or the solder from the printed wiring board was performed by the following two methods.

A first method is to heat a rotating printed wiring board by high frequency heating and remove at least one of solder and electronic components attached to the printed wiring board by centrifugal force. Processing method.

That is, the printed wiring board housed in the rotating drum is heated to approximately 300 degrees Celsius by high-frequency heating, and the rotating drum is rotated by several hundred R. P. M ~ 2,0
00R. P. The electronic component or the solder was removed from the printed circuit board by centrifugal rotation.

In the second method, the printed wiring board housed inside is heated by high-frequency heating, and the rotating drum is rotated so as to be able to drop by its own weight at first (rotation speed / several RPM to 100 RPM).
R. P. M), the electronic components and the solder are removed by the impact of the printed wiring board colliding with the rotating drum. Thereafter, the rotational speed of the drum was increased to several hundred R. P. M-2,000R.
P. M, and at least one of the solder and the electronic component still attached to the printed wiring board is removed by centrifugal force.

[0050]

As described above, according to the embodiment of the present invention,
The electronic component and the solder can be efficiently removed from the printed wiring board in a short time. In addition, the separate reproduction process after disassembly is facilitated. As a result, the recycling rate is improved, which contributes to environmental conservation and effective use of resources.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a concept of a printed wiring board processing apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a principal part of a concept of a rotary drum used in an embodiment of the present invention.

FIG. 3 is a configuration diagram of a concept of a printed wiring board processing apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 High frequency heating device (high frequency induction heating device) 2, 2A rotary drum 3, 3A lid 4 Drum mounting shaft 5 Drive motor 6 Coupling 7 Bearing 8, 8A plate 9 Guide plate 10 Guide groove 11 Cylinder 12 Placket 13 Base 14 Mounting plate 15, 22 Container with a bottom (receiving molten solder) 23 Opening 24 Mounting shaft 25 Link plate 26 Eccentric plate 27 Motor 28, 29 pin 31 Printed wiring board 32 Electronic component 33 Melted solder 100, 200 Printed wiring board processing device

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/34 510 B23K 1/018

Claims (4)

(57) [Claims] 1. A plate on which a container for housing a printed wiring board and container rotating means for rotating the container are mounted, and printed wiring for heating the printed wiring board from the periphery of the container to a temperature equal to or higher than the melting temperature of solder. Substrate heating means;
An apparatus for processing a printed wiring board, comprising: a plate transferring means for separating the plate from the heating means for the printed wiring board. 2. The printed wiring board processing apparatus according to claim 1, wherein a plurality of openings are provided on an outer peripheral surface of the container. 3. A plate having a container for accommodating a printed circuit board and container vibrating means for reciprocatingly oscillating the container, and a print for heating the printed circuit board from the periphery of the container to a temperature equal to or higher than the melting temperature of solder. An apparatus for processing a printed wiring board, comprising: a wiring board heating means; and a plate transfer means for moving the plate toward and away from the printed wiring board heating means. 4. The printed wiring board processing apparatus according to claim 3, wherein a plurality of openings are provided on at least a bottom surface of the container.