JP4325009B2 - Circuit board cutting method, component removal method and processing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for treating a circuit board to be discarded or recycled, and more particularly, a method and apparatus for removing various electronic components soldered and mounted on a printed wiring board and separating and collecting the board, solder and electronic components separately. About.
[0002]
[Prior art]
Various electronic devices such as waste television are dismantled and separated and recycled (recycled) for each component material for the purpose of effective use of resources and global environmental conservation.
As a processing method of a printed wiring board constituting various electronic devices, for example, in JP-A-8-143823, a printed wiring board is accommodated in a rotating drum, heated from the periphery of the drum, A method for separating and collecting electronic components and solder has been proposed.
[0003]
[Problems to be solved by the invention]
However, the above-mentioned JP-A-8-143823 is a batch process, and it is difficult to perform unmanned operation continuously for 24 hours.
[0004]
The present invention relates to various electronic components mounted on the other main surface side by cutting a lead wire protruding on one main surface side of a printed wiring board, a clinched lead wire, or a surface mount component. Easy removal.
It is another object of the present invention to perform heating of a soldering portion in a short time, efficiently remove an electronic component, and automate separation and collection of the electronic component, solder, and a substrate.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the present invention
After the circuit board is immersed in the fluidized bed forming member in which the fluidized bed forming member is in a fluidized state, the flow of the fluidized bed forming member is stopped to hold the circuit board in the fluidized bed.
[0006]
Furthermore, a cutting means for cutting one main surface of the printed wiring board,
A striking body is rotatably attached to a support shaft standing on the main surface of the rotating body, the rotating body is rotated at a high speed, and the striking body is moved at a speed higher than the critical impact speed (about 50 m / sec (180 km / hr)). The main surface of the circuit board or at least one of the components attached to the circuit board is made to collide.
[0007]
Furthermore, the circuit board moving in the vibrating bowl is heated to separate the solder and electronic components mounted on the circuit board and separate and collect the solder, electronic components, and board, respectively.
In addition, the circuit board processing apparatus includes a ridge, a means for vibrating the ridge obliquely upward, and a means for heating the ridge. The heating means was an electric heating furnace or a high-frequency heating furnace.
[0008]
The cutting principle (workpiece / circuit board or part attached to the circuit board) used in the present invention is based on the fact that a plastic wave is generated when a high-speed tensile force higher than the critical impact velocity is applied, and at the applied end. Uses the theory of plastic wave that breaks immediately, or the theory that when high-speed compression force is applied, plastic wave is generated, very large stress is generated instantaneously, and the applied end breaks with a small strain (similar phenomenon to become brittle). It was.
[0009]
Specifically, instead of a conventional tool with a cutting edge, an impacting body made of a hard solid such as metal is made to collide with an object to be cut at a high speed and with a high frequency, and a plastic wave is generated by the impact energy to instantly collide. Based on the principle of destroying and removing parts.
That is, when an impacting body that performs high-speed circular motion (a speed of about 50 m / sec (180 Km / h) or more) collides with a workpiece and reflects (repels), high-speed compression generated with an impact, or high-speed tension caused by friction, The cutting method was based on the principle of instantly crushing (breaking) the surface of the workpiece into fine particles or fine pieces within a very limited range in the vicinity of the collision site between the impacting body and the workpiece by high-speed shearing or the like.
[0010]
In order to generate a plastic wave, the speed at which the impacting body collides with the workpiece was set in a range of about 50 m / sec (180 Km / h) to 300 m / sec (1,080 Km / h).
In terms of the peripheral speed of the disc, this corresponds to the rotation of a disc having a diameter of 100 mm at a rotational speed of 10,000 rpm to 60,000 rpm.
When cutting resin molded products, printed wiring boards, etc., the impacting body (hard solid) is made to collide with the workpiece at a speed of about 50 m / sec (180 km / hr) or more and at a frequency of about 150 times / sec or more. The surface was crushed.
In the case of cutting of metal such as carbon steel for machine structure and cold rolled steel sheet, glass, etc., the striking body has a speed of about 150 m / sec (540 km / hr) or more and a frequency of about 1,800 times / sec. Thus, the workpiece surface is crushed by colliding with the workpiece.
[0011]
The fitting gap between the support shaft for supporting the striking body and the through hole of the striking body was 2 mm or more, preferably the fitting gap was about 5 to 10 mm. The fitting gap needs to be set large in response to an increase in impact speed of the impacting body. Note that the fitting gap in the embodiment of the present invention is generally much larger than the clearance value of the JIS standard that defines the fitting state between the shaft and the bearing, and is two to three digits higher.
[0012]
Thus, the cutting principle used in the present invention is different from the conventional cutting principle. The conventional cutting principle is that the cutting edge of a cutting tool (tool) is made to collide with the workpiece at a low speed (maximum of about 10 m / sec or less), and the workpiece undergoes elastic deformation, which is sequentially deformed from plastic deformation to fracture. A relatively wide area is destroyed.
Further, the impacting body in the embodiment of the present invention does not have a sharp cutting edge portion like a conventional cutting tool (tool).
[0013]
Furthermore, another cutting means constituting the present invention,
Water (water jet), which is pressurized above the critical pressure and heated to a temperature not lower than 100 ° C. and not higher than the critical temperature, is sprayed from the nozzle to the main surface side of the circuit board, and is applied to the circuit board or the circuit board. It was set as the method of cutting or crushing at least one of the attached components.
[0014]
The critical pressure of water is 22.12 MPa (1 megapascal (MPa) ≈10 kg / cm @ 2) and the critical temperature is 374.15.degree. When the pressure is higher than the critical pressure and the liquid temperature is lower than the critical temperature, the water is jetted from the nozzle. To cause supersonic flow. At this time, the jet becomes a two-phase flow of a gas phase and a droplet and gives a mechanical and thermal shock to the object to be crushed. Further, depending on the type of the target object, a chemical destructive force by a hydrothermal reaction is applied.
An object can be cut or crushed by applying these mechanical, thermal and chemical destructive forces to an object such as a circuit board or electronic component made of a resin member, a metal member, a glass member, a ceramic member, or the like. . Moreover, the high temperature / high pressure water released into the atmosphere is instantly vaporized, and there is almost no waste water to be treated.
[0015]
According to the above configuration, the present invention can efficiently automate the removal of electronic components and the separation and collection of the removed components, solder, and substrate with simple equipment. As a result, the recycling rate is improved, which helps environmental conservation and effective use of resources.
Moreover, it is not necessary to worry about mixing different materials of the workpiece during the cutting process. For example, even if a phenol resin substrate, a glass epoxy substrate, a ceramic substrate, a metal substrate, an electronic component made of ceramics or a metal member, etc. are mixed, it is not necessary to change the processing conditions and the cutting tool according to each.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, after the circuit board is immersed in the fluidized bed forming member in a fluidized state, the flow of the fluidized bed forming member is stopped and the circuit board is held by the fluidized bed. This is a circuit board holding method, and the circuit board can be held substantially horizontally in the vicinity of the surface of the fluidized bed regardless of irregularities of various electronic components mounted on one main surface of the circuit board. Then, the other main surface side can be cut.
[0017]
Further, the second invention includes a step of immersing the circuit board in a fluidized bed forming member in a fluidized state, a step of stopping the flow of the fluidized bed forming member and holding the circuit board in the fluidized bed, and the circuit board. Or a cutting process that cuts at least one of the components attached to the circuit board, and the cutting method is rotatably attached to a spindle that is erected on the main surface of the rotating body, and the rotation A cutting method in which the body is rotated at a high speed to cause the impacting body to collide with at least one of the circuit board or the component at a speed equal to or higher than a critical impact speed; A circuit board cutting method characterized in that any one of cutting methods in which water heated to a temperature equal to or lower than a critical temperature is sprayed from the nozzle onto the circuit board and cut is used. As hereinbefore, leads projecting on one main surface of the circuit board, clinching the leads, such as surface mount components can be efficiently cutting and removing.
[0018]
Further, the third invention comprises a step of holding one or both ends of the circuit board, and a cutting step of cutting at least one of the circuit board or a component attached to the circuit board, and a cutting method comprising: A striking body is rotatably attached to a support shaft standing on the main surface of the rotating body, and the rotating body is rotated at a high speed so that the striking body collides with at least one of the circuit board and the component at a speed higher than the critical impact speed. Or a cutting method in which water is pressurized to a pressure higher than the critical pressure and heated to a temperature not lower than 100 ° C. and not higher than the critical temperature by spraying from the nozzle onto the circuit board. A circuit board cutting method characterized by being one of the methods, a lead wire protruding to one main surface side of the circuit board, a clinched lead wire, a surface mounting Etc. can be efficiently cutting or crushing processed goods.
[0019]
Further, the fourth invention comprises a cutting process for cutting at least one of a circuit board on a conveyor or a component attached to the circuit board, and the cutting method is supported on a main surface of a rotating body. A cutting method in which a striking body is rotatably attached to a shaft, and the rotating body is rotated at a high speed so that the striking body collides with at least one of the circuit board or the component at a speed equal to or higher than a critical impact speed, or critical It is characterized in that it is either one of the cutting methods in which water that is pressurized above the pressure and further heated to a temperature not lower than 100 ° C. and not higher than the critical temperature is sprayed from the nozzle onto the circuit board and cut. In this method, the circuit board is cut, and at least one of the circuit board and the components attached to the circuit board can be cut or crushed efficiently.
[0020]
Further, the fifth invention is a step of immersing the circuit board in a fluidized immersion tank in which the fluidized bed forming member is in a fluidized state, and the flow of the fluidized bed forming member is stopped to hold the circuit board in the fluidized bed. A process, a cutting process for cutting at least one of the circuit board or a component attached to the circuit board, a solder that heats the cut circuit board that moves in a vibration cage, and adheres to the circuit board, And a step of separating at least one of the mounted electronic components. The method of removing the component from the circuit board is characterized in that the solder and the electronic component are reliably and efficiently separated from the circuit board.
[0021]
Furthermore, the sixth invention includes a step of holding one or both ends of the circuit board, a cutting step of cutting at least one of the circuit board or a component attached to the circuit board, and the movement of the vibration board. And heating the cut circuit board to separate at least one of the solder adhered to the circuit board and the mounted component, and the cutting method is applied to the support shaft standing on the main surface of the rotating body. A cutting method in which the rotating body is rotated at a high speed to cause the impacting body to collide with at least one of the circuit board or the component at a speed equal to or higher than a critical impact speed, or a pressure exceeding the critical pressure is applied. One of the cutting methods in which water is heated and heated to a temperature not lower than 100 ° C. and not higher than the critical temperature is sprayed from the nozzle onto the circuit board and cut. It obtained by the method of removing the component from the circuit board, characterized in, reliably from the circuit board, and to separate efficiently the solder and the electronic component.
[0022]
Further, the seventh aspect of the invention is to heat a cutting process step of cutting at least one of a circuit board on a conveyor or a component attached to the circuit board, and heat the cutting circuit board that moves in a vibrating rod, A step of separating at least one of the solder adhered to the circuit board and the mounted component, and a cutting method is rotatably attached to the spindle that is erected on the main surface of the rotating body. Is rotated at a high speed to cause the impacting body to collide with at least one of the circuit board or the component at a speed equal to or higher than the critical impact speed, or a pressure higher than the critical pressure is applied, and the critical temperature is 100 ° C. or higher and critical. A component from a circuit board, characterized in that it is one of cutting methods in which water heated to a temperature below the temperature range is sprayed from the nozzle onto the circuit board and cut. Obtained by the Rihazusu method, reliably from the circuit board, and to separate efficiently the solder and the electronic component.
[0023]
Further, the eighth invention supplies the bottomed container, the breathable partition plate provided in the middle of the bottomed container, the fluidized bed forming member filled on the partition plate, and the partition plate. Pressure air supply means for fluidizing the fluidized bed forming member with pressurized air, and after immersing the circuit board substantially horizontally, the flow of the fluidized bed forming member is stopped to bring the circuit board into the fluidized bed. The circuit board holding device is characterized by being held by a forming member, and the circuit board to which various electronic components are attached can be easily held in a substantially horizontal state.
[0024]
【Example】
A circuit board processing method and processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings.
[0025]
Example 1
FIG. 1 is a plan view of an essential part of an apparatus for removing components from a circuit board in one embodiment of the present invention, and FIG. 2 is an essential part of the concept of a circuit board cutting apparatus and a circuit board holding apparatus in an embodiment of the present invention. FIG. 3 is a cross-sectional view of a main part of a circuit board (printed wiring board) before cutting used in the description of the present invention, and FIG. 4 is a cross-sectional view of a main part of the circuit board after cutting one main surface. Show.
[0026]
In FIG. 1 and FIG. 2, an apparatus 200 that removes components from a circuit board lifts the circuit board 300 from the conveyor 201 and holds and fixes the circuit board 300. Means (fluid immersion bath), a cutting device 600 (cutting means) for cutting at least one of the main surface of the circuit board 300 or various circuit components attached to the circuit board 300, and the circuit board 300. The heating furnace 10 (heating means) for heating the circuit board 300 to the solder melting temperature or higher and the vibration means for conveying the circuit board 300 while jumping in one direction.
[0027]
1 and 2, reference numeral 201 denotes a conveyor that carries and transports a circuit board, or a conveyor that transports while holding both ends of the circuit board (circuit board conveying means), 203 a vibration / heating device, and 211 a fluid. An immersion tank, 212 is a fluidized bed forming member, 213 is a breathable partition plate, 205 is a drive motor of the cutting device 600, and 206 is a drive screw.
[0028]
In the fluidized immersion tank 211, a fluidized bed forming member 212 (for example, a powdery resin) placed on a gas-permeable partition plate 213 is floated and fluidized by the supply of compressed air from an air supply port 214. That is, a layer of floating powder group that allows easy penetration of an object is formed.
The main surface of the circuit board 300 on which the components are mounted is on the lower side, so that the fluidized bed is in a substantially horizontal state and immersed so that the surface of the fluidized bed and the lower surface of the circuit board substantially coincide with each other. Thereafter, by stopping the air supply, the circuit board 300 is held in a substantially horizontal state near the surface of the fluidized bed as shown in FIG.
[0029]
The fluid immersion tank 211 rises from the position indicated by the two-dot chain line, holds the circuit board 300 on the conveyor 201, and further rises to the position indicated by the solid line to reach the lower fixed position of the cutting apparatus 600. The means for supplying the circuit board 300 to the fluid immersion bath 211 may be performed by a general robot or the like. Further, in the case of a conveyor that conveys while holding both ends of the circuit board, the circuit board may be directly received in the fluid immersion tank 211 without using a robot and held in a substantially horizontal state near the surface of the fluidized bed.
[0030]
Thereafter, at least one of the circuit board 300 or a component attached to the circuit board 300 is cut by the cutting device 600.
[0031]
Next, the circuit board 300 that has been subjected to the cutting process is mounted again on the transport conveyor 201, transported, and placed in a vibrating cage. The circuit board in the cage moves while jumping in a certain direction in the cage, and is heated to the solder melting temperature during that time. As a result, at least one of the solder adhered to the circuit board and the mounted component is separated from the circuit board.
[0032]
Needless to say, the fluidized bed forming member 212 may be any member in addition to the powdery resin (powdered member). One of a powdery member, a particulate member, and a hollow member, a powdery member is one of metal, resin, ceramics, or a combination thereof, and a particulate member is a metal, resin, glass, ceramics Any one of sand, rice husks, seeds, or a combination thereof, and the hollow member was any one of glass and ceramics.
[0033]
In the cutting device 600, an impacting body is rotatably attached to a support shaft standing on a main surface of a rotating body, the rotating body is rotated at a high speed, and the impacting body is rotated at a speed higher than a critical impact speed. It is made to collide with at least one of a surface or the said components.
The device of the present invention is configured such that the cutting device 600 is arranged in two or more locations, and each cutting device cuts a component mounted on a different main surface position or different main surface position of the circuit board 300. .
[0034]
Further, as shown in FIG. 1, the cutting device 600 is driven back and forth in the direction of the arrow Y by a drive motor 205 such as a pulse motor and a drive screw 206 such as a ball screw, so that the cutting position can be arbitrarily changed. Moreover, the cutting device 600 can move to an arbitrary place in a horizontal plane by adopting a configuration in which left and right driving is performed in the arrow X direction.
[0035]
Note that the cutting device 600 may be provided at only one place. In that case, in order to be able to cut almost the entire area of the circuit board 300, it is necessary to sequentially move the cutting device 600 in the width direction of the circuit board 300. That is, pitch feeding (traverse) may be sequentially performed in a direction (arrow Y direction) perpendicular to the direction in which the circuit board 300 is conveyed by the conveyor 201.
[0036]
Next, the cutting device 600 and the cutting unit 100 constituting the cutting device 600 will be described.
FIG. 5 is a cross-sectional view of a cutting unit constituting a cutting device according to an embodiment of the present invention, FIG. 6 is a cross-sectional view of FIG. 5 viewed from the cutting line S1-S1, and FIG. FIG. 8 is a front view of a striking body constituting the cutting unit of FIG. 5, and FIG. 9 is a cutting line S3-S3. 10 and 11 are front views of another striking body constituting FIG. 5, and FIG. 12 is a cross-sectional view of an example of a cutting device 600 for cutting a main surface of a circuit board or a component attached to a circuit board book. The figure is shown.
[0037]
As shown in FIGS. 5 to 12, the cutting unit 100 according to the present invention has a support shaft 603 installed between a pair of disks (rotating bodies) 601 and 601 whose main surfaces face each other, and an impacting body is provided on the support shaft 603. 1 is rotatably attached, the pair of disks 601 and 601 are rotated at a high speed, and the impacting body 1 is rotated at a speed of about 50 m / sec (180 km / hr) or more and about 167 times / sec (10, (000/60 times) at least one of the main surface of the circuit board 300 and the components with the hit frequency. Note that the rotational speed allows a variation of about ± 10% due to fluctuations in the power supply voltage and other reasons.
[0038]
Needless to say, the impact speed of the impacting body 1 against the work (the circuit board in the present invention or a component attached to the circuit board) corresponds to the rotational speed of the pair of disks. In the present embodiment, a high-speed rotation region of 10,000 to 60,000 rpm (peripheral speed of 180 to 1080 km / h) was used for a pair of disks (rotating bodies). Due to the rotation speed region, the impacting body 1 can obtain an improvement in impact force, an air cooling effect and work hardening, and an improvement in the life of the impacting body 1 can be achieved.
[0039]
In the cutting unit 100 shown in FIG. 5, four cross-shaped impacting bodies 1 having four rectangular protrusions on a cylindrical surface are arranged at equal intervals on the main surface of the disc 601. The quadrangular protrusion corresponds to the cutting edge portion of a conventional tool and strikes the workpiece. As is clear from FIG. 5, a part of the outer periphery of the impacting body 1 (the cutting edge portion 603) is positioned outward from the outer periphery of the disk 601.
Since the impacting body 1 is arranged at four locations on the main surface of the disc 601 at equal intervals, the impact frequency of the workpiece is (10,000 revolutions / minute) × 4 locations = 40,000 times / minute or more.
[0040]
In FIG. 5, the fitting gap 604 between the support shaft 604 and the impacting body 1 is about 7 mm. By providing the fitting gap 604, the impact applied to the cutting edge portion 83 and the support shaft 603 of the impacting body 1 is reduced despite the rotating body 601 rotating at high speed, and the cutting unit 100 such as the support shaft is damaged. To prevent. In FIG. 8, reference numeral 82 denotes a through hole.
[0041]
The outer shape of the impacting body may be arbitrarily set in addition to the cross shape shown in FIG. For example, it may be a polygon having a plurality of corners (regular triangle, regular square, rectangle, regular pentagon, regular hexagon, etc.), disk shape, or the like. FIG. 10 and FIG. 11 show examples of disc-shaped and regular hexagonal impact bodies. Reference numerals 82A and 82B denote through holes, and 83A and 83B denote cutting edge portions.
Further, the shape of the rotating body 601 may be an arbitrary shape such as a regular polygon in addition to the disk shape. However, as a matter of course, the rotational balance of the rotating body is required.
[0042]
Next, an example of the dimensions and materials of each part of the rotating body and the impacting body will be described. In the case of the cutting unit shown in FIG. 5, the diameter of the disc 601 is 100 mm, the thickness is 5 mm, the material is carbon steel for machine structure, the support shaft 603 is 10 mm in diameter, and the material is carbon steel for machine structure or carbon tool steel (JIS standard). Symbol / SK2), the distance L between the tops of the cutting blades of the impacting body 1 is about 40 mm, the diameter of the through hole 602 is 17 mm, the width dimension w of the cutting edge is about 15 mm, and the thickness dimension t of the cutting edge is about 5 mm. , Material is carbon steel for machine structure (S45C), carbon tool steel (SK2), high speed tool steel (SKH2), Ni-Cr steel (SNC631), Ni-Cr-Mo steel (SNCM420), Cr-Mo steel Any one of (SCM430), chromium steel (SCr430), manganese steel for mechanical structure (SMn433), etc. was used.
[0043]
In the cutting embodiment shown in FIG. 7, the disc 601 is rotated at 30,000 rpm in the direction of the arrow 107, and the impact speed at which the impacting body 1 collides with the main surface of the circuit board (1.6 mm thick metal board) 605 is set. The cutting movement speed was set to 50 mm / second and the cutting direction 108 was set to about 157 m / second (565 km / hour). In this case, the hit frequency is (30,000 revolutions / minute) × 4 places = 120,000 times / minute.
Since the main shaft 612 rotates at a high speed of 30,000 rpm, a large centrifugal force acts on the impacting body 1. The centrifugal force generates a high-speed compressive force with a shock within a limited range near the collision surface of the cutting body 83 and the circuit board 300 and the vicinity thereof, and the circuit board 300 is instantaneously and rapidly crushed. Is done. The cutting waste becomes finely granular. Experiments have confirmed that cutting is possible without a sharp cutting edge.
[0044]
In addition, the glass substrate and the ceramic substrate could be cut under the above processing conditions. Also, the plastic such as a resin wiring board is made by rotating the disc 601 at 10,000 rpm, hitting the impacting body 10,000 times / minute (the number of impacting bodies attached to the rotating body is 1), and the cutting movement speed is 50 mm. It was confirmed by experiment that it can be processed with / S.
[0045]
In the above embodiment, if the impact speed of the impacting body is about 50 m / second (180 km / hour) or more and the number of impacts is about 167 times / second (10,000 / 60 times per second) or more, Needless to say, it may be arbitrarily set according to the components attached to the circuit board.
Similarly, if the material of the impacting body is a hard solid, it may be set arbitrarily other than the metal member.
Furthermore, the number of impact bodies may be two or more, or may be only one.
Further, the rotating body may be only one side instead of a pair of opposed main surfaces. The rotating body may be driven at a high speed using a general spindle motor or the like.
[0046]
The impacting body 1 constituting the device of the present invention does not include a sharp cutting edge portion as in a conventional cutting tool. The cutting principle in the present invention is beyond conventional common sense. By giving the impacting body 1 a much higher speed than the conventional cutting tool, brittleness such as metal, resin, glass, ceramics, etc. even without a sharp cutting edge. Allows cutting to part.
[0047]
FIG. 12 shows a sectional view of a cutting device 600 constituting the device of the present invention. The cutting device 600 is one in which a large number of the cutting units 100 are mounted on one shaft. Therefore, the cutting principle, cutting process conditions, and the like are the same as those in the cutting example of FIG.
In FIG. 12, reference numeral 600 denotes a cutting device, 601 denotes a disk (rotary body), 612 denotes a main shaft, 603 denotes a support shaft, 604 denotes a fitting gap, 605 and 606 denote spacers, and 100 denotes a cutting unit.
[0048]
12 includes a plurality of cutting units 100 in which a support shaft 603 is installed between a pair of rotating bodies 601 and 601 whose main surfaces face each other, and the impacting body 1 is rotatably attached to the support shaft 603. Prepared, the cutting unit 100 is attached to the same main shaft 612 at predetermined intervals, the main shaft 612 is rotated at a high speed, and each impacting body 1 is cut at a speed of about 50 m / sec (180 km / hr) or more. It is characterized by being made to collide with.
[0049]
The number and arrangement pitch of the cutting units 100 to be arranged, the number of striking bodies 1 disposed on the rotating body 601, the striking speed of the striking body 1 and the like may be arbitrarily set according to the workpiece. Note that the support bearing structure of the main shaft 612 may be arbitrarily set such as cantilever support or both-end support.
The conveyor 201 that conveys the circuit board 300 is intermittently driven in a constant arrow direction.
[0050]
FIG. 3 shows a cross-sectional view of an essential part of an example of the circuit board 300. In FIG. 3, a lead wire component (axial lead component) 301 and a lead wire component (radial lead component) 302 of a circuit component are mounted on one main surface of a circuit board 300, and a chip component 303 is mounted on the other main surface. An example is shown.
In addition, the components may be any circuit components such as resistors, capacitors, transistors, ICs, LSIs (integrated circuits), flyback transformers, tuners with shield cases, heat sinks, connectors, jumper wires, and through holes. .
[0051]
As described above, the cutting device 600 removes or crushes one main surface of the circuit board, a lead wire protruding toward the main surface side, a bent lead wire (clinched), a chip component, etc. When the heating device 203 is heated to the solder melting temperature or higher and is vibrated, the electronic component mounted on the circuit board is naturally detached (dropped) from the circuit board. FIG. 4 shows a cross-sectional view of a main part in a state where one main surface side of the circuit board 300 is cut.
[0052]
Next, an operation of cutting one main surface side of the circuit board 300 will be briefly described. First, the circuit board 300 is conveyed to the lower part of the cutting device 600 by the conveyor 201 and stopped.
Next, the fluid immersion tank 211 rises. After the fluid immersion bath 211 holds the circuit board 300 substantially horizontally on the fluidized bed surface, it rises in that state and reaches the lower part of the cutting device 600. Subsequently, the first cutting device 600 moves in the longitudinal direction of the circuit board 300 while rotating in a predetermined direction (in FIG. 1, moves from right to left or from left to right (arrow X in FIG. 1). Direction)), cutting at least one first portion of one main surface of the circuit board 300 or a component attached to the circuit board.
Thereafter, the circuit board 300 is lowered, conveyed by a predetermined pitch, and conveyed to the lower part of the second cutting apparatus position. Thereafter, the second part of the circuit board 300 is cut by the same operation as described above. In addition, the 3rd, 4th cutting process is given to the non-cut site | part of the circuit board 300 as needed. (Not shown)
After the cutting process is completed over almost the entire area of the circuit board 300, the circuit board 300 is again conveyed by the conveyor 201 to above the ridge 401 of the vibration / heating device 203 and falls into the ridge 401.
[0053]
FIG. 17 shows a longitudinal sectional view of the main part of the concept of the vibration / heating apparatus constituting the apparatus of the present invention. FIG. 18 is a cross-sectional view of a main part from the side surface direction in the mesh portion of the ridge constituting FIG. (Cutting along cutting lines S to S)
The vibration / heating device 203 shown in FIG. 17 receives a circuit board 300, guides and transfers the hook 401, and vibrates the hook 401 obliquely upward to carry the circuit board in one direction while repeating jumping to dropping. It is provided with a vibrating means and a heating furnace 10 which is disposed in the middle of the basket 401 and heats the circuit board to a predetermined temperature at which the solder melts.
The vibration means includes a plate 6 on which the flange 401 is mounted, a leaf spring 2 that is inclined at an angle of about 60 degrees with respect to the plate 6 and attached at two locations, a leaf spring locking portion 7, and the leaf spring 2. For example, a link plate 3, an eccentric plate 4, a transmission motor 5 and the like.
[0054]
The heating furnace 10 was either a general electric heating furnace or a high-frequency heating furnace. Of course, it goes without saying that any other heating means may be used. The cross-sectional shape of the heating furnace 10 shown in FIG. 18 is a rectangular ring corresponding to the cross-sectional shape of the rod 401, and the electric heater 20 such as a nichrome heater, a far-infrared heater, or SiC is provided on the four inner surfaces facing the rod 401. It was set as the structure which arrange | positions any one among resistance heating rods.
The temperature at which the circuit board is heated via the ridge 401 is in the range of about 200 degrees Celsius to 500 degrees Celsius, and preferably about 250 degrees Celsius to 300 degrees Celsius, sufficient to melt the component mounting solder.
[0055]
As another operating means for heating the circuit board, the operating condition of the high-frequency heating apparatus is 180 V, 200 A, 1500 Hz to 2000 Hz, and is configured to act for at least 10 to 60 seconds during the moving section on the basket.
The high-frequency output of the high-frequency heating device used in the present invention is 60 KW at maximum, and the frequency setting range is about 0.5 to 20 kHz. Needless to say, the output and frequency may be set as appropriate according to the size and number of circuit boards to be handled.
[0056]
The excitation means is mounted on a base plate 8 that also serves as a weight. Anti-vibration rubber 9 is attached to the lower surface of the base plate 8 to provide anti-vibration means. When the heating means is mounted on the base plate 8, it is desirable to consider using vibration-proof rubber or the like so that vibration is not transmitted to the heating means.
[0057]
FIG. 18 shows a cross-sectional shape of an example of the ridge 401. In this case, the flange 401 has a cylindrical shape with a cross-sectional shape of a substantially rectangular shape, and the bottom plate portion has a V shape with a gentle inclination. The purpose of this is to collect the solder melted and dropped from the circuit board at the center of the bottom plate of the trough 401.
As shown in FIG. 17, the ridge 401 includes a sieve portion 11 for collecting molten solder and a component dropping hole 12 in the vicinity of the right end portion in the traveling direction of the circuit board. With this configuration, the substrate, solder, and components can be separately collected. Of course, the sieve portion 11 may be omitted, and the solder and components may be dropped in the same collection box.
[0058]
In order to allow the parts to pass through while the solder 11 collects the solder to the outside, for example, as shown in FIG. 21, fine holes having a diameter of about 0.5 mm to 1 mm are arranged in a matrix or width. A slit of about 0.5 mm to 1 mm was provided, or a mesh-like wire net made by woven metal wires as shown in FIG. 22 was attached.
The component drop hole 12 is suitable for dropping relatively small discrete components such as resistors and capacitors and chip components, while passing a flyback transformer, a large electrolytic capacitor, a substrate on which the components are mounted, and the like. A dimension configuration was adopted.
[0059]
As a matter of course, the plate 6 has through holes 13 and 14 corresponding to the sieve section 11 and the drop hole 12, respectively, and a solder recovery box 16 and a parts recovery box (not shown) in the lower part. .) Are installed. In addition, a substrate recovery box 15 is installed at the bottom end of the basket 401.
[0060]
In the present embodiment, as described above, the flange 401, that is, the means for vibrating the circuit board obliquely upward by about 30 degrees, the two leaf springs 2 that are attached to the plate 6 at an angle of about 60 degrees, and the leaf springs 2 are moved back and forth. This is implemented by a link plate 3, an eccentric plate 4, a transmission motor 5, etc. As a matter of course, the eccentric plate 4 is attached to the rotating shaft of the transmission motor 5.
The vibration conditions of the ridge 401 are such that the amplitude is several mm to several tens mm and the vibration frequency is about several tens to 2000 hertz. The vibration conditions are appropriately set according to the size of the circuit board and the number of processed sheets.
[0061]
In the embodiment of the present invention, it is general that the longitudinal axis (long axis) of the flange 401 coincides with the vibration direction of the plate 6 to which the flange 401 is attached.
However, as shown in FIG. 20, a configuration may be adopted in which the ridge is opened (tilted) by a predetermined angle in the horizontal plane with respect to the vibration direction. By setting the vibration direction and the long axis of the kite to a predetermined opening angle, the traveling speed of the circuit board in the kite is delayed and the impact force on the circuit board increases. This is because the circuit board jumps upward and collides with the side surface of the bag, and the jump direction and the path direction of the bag are different.
[0062]
FIG. 19 shows a cross-sectional shape of a ridge 401A according to another embodiment of the present invention. In this case, the wrinkle has a semicircular shape, and the molten solder and components separated from the printed circuit board are accumulated on the bottom of the wrinkle and moved to the front end of the wrinkle. In addition, a gap can always be provided between the circuit board and the bag.
[0063]
As a matter of course, the cross-sectional shape of the ridge is not limited to the above two types. It goes without saying that U-shaped, W-shaped, concave shapes such as corrugations, or the base plate may be set to an arbitrary shape such as a mountain shape or a corrugated convex shape.
Further, the circuit board may be transported in any manner. In addition to sending the printed circuit board in a substantially horizontal state where the printed circuit board is naturally stable or in a slightly inclined state, the printed circuit board may be transported simultaneously in an independent multi-row in a state where the circuit board is substantially upright. (See FIG. 23.)
Next, the process of separating the solder and components from the circuit board will be described.
First, the circuit board 300 that has undergone the cutting process is sequentially loaded from the board loading port on one side (left side in FIG. 17) of the basket 401 by the belt conveyor 201 (FIG. 1). The trough 401 is always vibrated and heated to a temperature higher than the ambient temperature at which solder can be melted in the middle section. Accordingly, the inserted circuit board is vibrated in a certain direction, jumped diagonally forward and forward, is subjected to an impact while repeating dropping, and moves toward the tip in the longitudinal direction of the heel.
Then, it is heated during the movement in the cage, the solder that has adhered the components melts, and the components are removed from the circuit board. Also, the molten solder is dropped on the bottom surface of the cocoon and moves toward the tip in the longitudinal direction of the cocoon.
The sieve portion 11 and the drop hole 12 are provided in the vicinity of the tip of the flange 401, and the solder, the component, and the substrate are separately collected in a predetermined manner.
[0064]
In the above-described embodiment, the motor, the eccentric plate attached to the motor, the link plate, and the leaf spring are used as the vibration means. However, a link mechanism may be used instead of the leaf spring. . Further, instead of the embodiment of FIG. 1, a general electromagnetic vibration mechanism may be used.
[0065]
As described above, the apparatus for removing a component from the circuit board according to the first embodiment of the present invention can automatically and efficiently remove the component from the circuit board.
In addition, it is not necessary to worry about the type of material, such as whether the circuit board or component component is resin or metal, and cutting can be stably performed under the same processing conditions for a long period of time.
[0066]
(Example 2)
13 is a cross-sectional view of the main part of the concept of the second cutting means constituting the apparatus for removing components from the circuit board according to the second embodiment of the present invention, and FIG. 14 is a water jet generating device constituting the cutting means of FIG. The block diagram of the concept of is shown.
[0067]
The method of removing the component from the circuit board in Example 2 includes a step of immersing the circuit board in a fluidized immersion tank in which the fluidized bed forming member is in a fluid state, and stopping the flow of the fluidized bed forming member to remove the circuit board. A step of holding, a cutting step of cutting at least one of the circuit board or a component attached to the circuit board, and heating the cut circuit board moving in a vibrating rod, and attaching to the circuit board And a step of separating at least one of the solder and the mounted component. The cutting method is pressurized to a pressure higher than the critical pressure and further heated to a temperature not lower than 100 ° C. and not higher than the critical temperature. A method of cutting or crushing at least one of the circuit board or the components attached to the circuit board by spraying on the board was used. Only the cutting method differs from the configuration of Example 1, and the other configurations are the same.
[0068]
In FIG. 14, the ultrahigh pressure water pressurized (about 100 to 300 MPa) by the ultrahigh pressure water jet pump 71 is continuously heated (about 100 to 350 ° C.) by the ultrahigh pressure water heater 72, Sprayed from the tip.
An ultrahigh pressure pipe cooling device 74 is disposed between the ultrahigh pressure water jet pump 71 and the ultrahigh pressure water heating device 72, and the ultrahigh pressure water jet pump 71 and the ultrahigh pressure pipe cooling device 74 are connected by an ultrahigh pressure pipe 75. The ultrahigh pressure pipe cooling device 74 and the ultrahigh pressure water heating device 72 and the ultrahigh pressure water heating device 72 and the nozzle head 73 are connected by ultrahigh pressure heat resistant piping 76 and 77, respectively.
The ultra-high pressure pipe cooling device 74 cools the heat conducted from the ultra-high pressure water heating device 72 through the ultra-high pressure heat-resistant piping 76 so that the ultra-high pressure water jet pump 71 is not adversely affected by the heat.
[0069]
The ultra-high pressure water jet pump 71 pressurizes water with a plunger or a pressure intensifier to generate ultra-high pressure water (maximum pressure Pmax≈400 MPa). The ultra high pressure water heating device 72 is a device that heats the ultra high pressure water pressurized by the ultra high pressure water jet pump 71 (temperature Tmax≈350 ° C.).
The nozzle head 73 is equipped with a water jet nozzle (not shown) having an inner diameter of about φ0.1 to φ2.0 mm in the head, and jets high temperature / high pressure water. The super high pressure pipe cooling device 74 is a device that cools the pipe and cools the heat conducted from the super high pressure water heating device 72 so that it is not transmitted to the rear equipment such as the super high pressure water jet pump 71.
[0070]
As shown in FIG. 13, the method of removing the components attached to the circuit board is as follows. One of the main surfaces of the circuit board is sprayed with ultra-high pressure and high-temperature water from the upper right side of the circuit board 300 held near the fluidized bed surface. The protruding lead wires and surface mount components are cut or crushed.
The nozzle head 73 is configured to sequentially trace in the Y-axis direction and the X-axis direction. Of course, the nozzle head may be swung around the entire width of the circuit board. Further, a plurality of nozzle heads may be arranged in a row so as to cover the entire width of the circuit board.
[0071]
The invention apparatus in Example 2 can perform cutting at a high speed in a substantially dry manner by injecting water having a critical pressure or higher and a critical temperature or lower. Further, the cutting process can be performed without using the rotating mechanism portion.
[0072]
(Example 3)
FIG. 15: shows the principal part side view of the concept of the cutting process which comprises the apparatus which removes components from the circuit board in Example 3 of this invention.
The apparatus for removing components from the circuit board in Example 3 does not use a fluidized immersion tank as a circuit board holding means.
High-pressure water is sprayed from ultra-high pressure from the diagonally upper right side of the surface on which the components are mounted on the conveyor 201A that conveys the circuit board 300A, and the components, lead wires, the surface of the circuit board, etc. are cut or crushed. Is.
[0073]
That is, a cutting process for cutting at least one of a circuit board or a part attached to the circuit board on a conveyor, a vibrating rod that puts the cut circuit board into a vibrating rod and conveys it in one direction, A step of heating the circuit board moving in the cage and separating at least one of the solder adhered to the circuit board and the mounted component, and pressurizing the cutting method to a critical pressure or higher, and further, 100 ° C or higher In addition, a cutting method was performed in which water heated to a temperature lower than the critical temperature was sprayed from the nozzle onto the circuit board and cut.
[0074]
FIG. 15 is a conceptual diagram in the case of cutting (or crushing) a component attached to a circuit board by injecting water having a pressure equal to or higher than the critical pressure and lower than the critical temperature described in the second embodiment. Also in this case, cutting can be performed at a high speed in a substantially dry manner with the circuit board disposed substantially horizontally. Since the cutting principle by injecting water with a pressure equal to or higher than the critical pressure and lower than the critical temperature is the same as that of the second embodiment, the description is omitted.
[0075]
Any general means may be used as means for arranging the circuit boards substantially horizontally.
For example, a method of mounting a circuit board in a free state on a conveyor such as a mesh belt or a flat belt, a method of holding one or both ends of a circuit board on an attachment of a chain conveyor, and a plurality of pairs of opposed rollers A method of holding both ends of the circuit board, a method of holding a pair of opposing conveyors in parallel and holding both ends of the circuit board, and the like may be used.
In FIG. 15, reference numeral 73 </ b> A denotes a nozzle head, 201 </ b> A denotes a circuit board transport conveyor, 230 denotes a partition that prevents the circuit board from moving in the horizontal direction, and 300 </ b> A denotes a circuit board. The nozzle head 73A may be disposed so as to inject water having a predetermined angle with respect to the circuit board 300A from an obliquely upward direction so as to inject water having a critical pressure or higher and a critical temperature or lower, or in a direction substantially orthogonal to the circuit board 300A. You may make it do. Of course, you may make it arrange | position to both.
[0076]
In the third embodiment, instead of water injection at a critical pressure or higher and lower than the critical temperature as a cutting means, a cutting process in which the impact body described in the first embodiment collides with a circuit board or a component at a speed higher than the critical impact speed. It is good also as a method. Since the explanation of the cutting principle using the impacting body is the same as that of the first embodiment, it will be omitted.
[0077]
In addition, you may make it cut or crush a circuit board or the components attached to the said circuit board in the state which stood the circuit board in the perpendicular direction.
FIG. 16 shows an example in which a circuit board is erected and cut. In the case of FIG. 16, the circuit board 300B moves upward in the vertical direction.
A partition 230B is provided on the conveyor 201B so that the conveyor 201B does not fall, and a pair of sandwiching rollers 240 and 240 for holding the circuit board 300B are arranged at predetermined intervals.
One clamping roller is in contact with the back surface of the conveyor 201B, and the other clamping roller presses both edge portions of the circuit board 300B.
Instead of the pair of clamping rollers, the circuit board may be clamped by a belt conveyor (not shown) arranged opposite to the conveyor 201B. Naturally, the belt conveyor (not shown) is configured to press both edge portions of the main surface of the circuit board on the component mounting side.
[0078]
Also in the case of the third embodiment, the nozzle head 73B may be arranged so as to inject water having a predetermined angle with respect to the circuit board 300B from an obliquely upward direction with water having a critical pressure higher than the critical temperature and lower than the critical temperature. It may be arranged in a direction substantially orthogonal to. Of course, you may make it arrange | position to both.
Further, when cutting the circuit board in an upright state, the impacting body described in the first embodiment is used at a speed equal to or higher than the critical impact speed instead of water injection at a critical pressure or higher and lower than the critical temperature as a cutting means. It is good also as a cutting method made to collide.
[0079]
In the case of Example 3, a fluid immersion bath is not required. In addition, when the circuit board is erected and processed, the cut or crushed parts are freely dropped and can be easily recovered.
[0080]
【The invention's effect】
As described above, according to the method and apparatus of the present invention, components and solder can be efficiently removed from a circuit board in a short time. Moreover, the separation reproduction process after dismantling is facilitated. As a result, the recycling rate is improved, which helps environmental conservation and effective use of resources.
[Brief description of the drawings]
FIG. 1 is a plan view of a main part of a concept of an apparatus for removing a component from a circuit board in an embodiment of the present invention.
2 is a cross-sectional view of the main part of FIG.
FIG. 3 is a cross-sectional view of main parts before cutting a circuit board used for explaining the present invention.
4 is a cross-sectional view of a main part in a state where one main surface side of the circuit board of FIG. 3 is cut.
FIG. 5 is a sectional view of a cutting unit constituting the cutting apparatus of the present invention.
6 is a cross-sectional view of FIG. 5 as seen from the cutting line S1-S1.
7 is a cross-sectional view of a state in which at least one of a circuit board or a component is being cut using the cutting unit of FIG.
8 is a front view of an impacting body constituting the cutting unit of FIG.
9 is a cross-sectional view of FIG. 8 cut along cutting line S3-S3.
FIG. 10 is a front view of another striking body constituting FIG.
11 is a front view of another striking body constituting FIG. 5;
FIG. 12 is a cross-sectional view of an essential part of a circuit board cutting apparatus according to an embodiment of the present invention.
FIG. 13 is a cross-sectional view of an essential part of a cutting device according to an embodiment of the present invention.
14 is a conceptual configuration diagram of a water jet generator that constitutes the cutting means of FIG. 13;
FIG. 15 is a cross-sectional view of an essential part of a cutting device according to an embodiment of the present invention.
FIG. 16 is a cross-sectional view of an essential part of a cutting apparatus according to an embodiment of the present invention.
FIG. 17 is a conceptual diagram of the configuration of a circuit board vibration / heating apparatus according to an embodiment of the present invention.
18 is a cross-sectional view of the main part taken along the cutting lines S to S in FIG. 17;
FIG. 19 is a cross-sectional view of an essential part of a bag according to another embodiment of the present invention.
FIG. 20 is a plan view illustrating the relationship between the vibration direction and the heel arrangement in one embodiment of the present invention.
FIG. 21 is a plan view of the main part of the sieve section in one embodiment of the present invention.
FIG. 22 is a plan view of the main part of the sieve section in one embodiment of the present invention.
FIG. 23 is a cross-sectional view of an essential part of a bag according to another embodiment of the present invention.
[Explanation of symbols]
1, 1A, 1B
2 Leaf spring (or link plate)
3 Link plate
4 Eccentric plate
5 Variable speed motor
6, 6A plate
7 Leaf spring locking part
8 Base plate
9 Anti-vibration rubber
10, 10A heating furnace (electric heating or high frequency induction heating device)
11, 11A sieve part
12 Fall hole
13, 14, 13A Through hole
14 Mounting plate
15, 16 Collection box
20, 20A heater
71 Super High Pressure Water Jet Pump
72 Ultra High Pressure Water Heater
73, 73A, 73B Nozzle head
74 Super High Pressure Pipe Cooling System
75 Super high pressure piping
75, 76 Super high pressure heat resistant piping
82, 82A, 82B hole (through hole)
83, 83A, 83B Cutting edge
100 cutting unit
107 direction of rotation
108 Cutting direction (moving direction)
200 Device for removing components from a circuit board
201, 201A, 201B Conveyor (circuit board conveying means)
203 Vibration / heating device
205 Drive motor
206 Drive screw
211 Fluid immersion bath
212 Fluidized bed forming member
213 Breathable partition plate
214 Air outlet
230, 230B partition
240 nipping roller
300, 300A, 300B Circuit board (printed wiring board)
301 Lead wire parts (Axial lead parts)
302 Lead wire parts (radial lead parts)
303 Chip parts
304 Solder
401, 401A, 401B
600 cutting equipment
601 disc (rotating body)
602 Through hole
603 spindle
604 gap
605 Spacer
612 spindle

Claims (20)

A step of immersing the circuit board in a fluidized bed forming member in a fluidized state; a step of stopping the flow of the fluidized bed forming member and holding the circuit board in the fluidized bed; and the component attached to the circuit board or the circuit board A circuit board cutting method comprising: a cutting process for cutting at least one of
A cutting method is provided such that an impacting body is rotatably attached to a spindle that is erected on a main surface of a rotating body, the rotating body is rotated at a high speed, and the impacting body is rotated at least at a critical impact speed to at least a circuit board or a component. A cutting method that is made to collide with one side, or water that is pressurized to a critical pressure or higher and heated to a temperature that is 100 ° C. or higher and lower than the critical temperature is sprayed from the nozzle onto the circuit board. either a cutting processing method that circuitry substrate to wherein a was the cutting method to cut at least one. 2. The circuit board cutting method according to claim 1 , wherein the critical impact speed is about 50 m / second (180 km / hour) or more.   A step of holding one or both ends of the circuit board, and a cutting step of cutting at least one of the circuit board or the components attached to the circuit board, and the cutting method is erected on the main surface of the rotating body A cutting method in which an impacting body is rotatably attached to the support shaft, the rotating body is rotated at a high speed, and the impacting body is caused to collide with at least one of the circuit board and the component at a speed equal to or higher than a critical impact speed; Alternatively, it is pressurized to a pressure higher than the critical pressure, and further, water heated to a temperature not lower than 100 ° C. and lower than the critical temperature is sprayed from the nozzle onto the circuit board to cut at least one of the circuit board or the component. A circuit board cutting method, characterized in that one of the cutting methods is employed. 4. The circuit board cutting method according to claim 3 , wherein one end or both ends of the circuit board are sandwiched between opposing rollers or opposing belts. Cutting method of the circuit board according to any one of claims 3-4, characterized in that as cutting make a circuit board in a vertical direction.   A cutting process for cutting at least one of a circuit board mounted on a conveyor or a component attached to the circuit board is provided, and an impacting body is rotatably attached to a support shaft standing on a main surface of the rotating body. Is rotated at a high speed to cause the impacting body to collide with the circuit board or the component at a speed equal to or higher than the critical impact speed, or a pressure higher than the critical pressure is applied, and the temperature is higher than 100 ° C. and lower than the critical temperature. A circuit board cutting method, characterized in that either one of the circuit board mounted on a conveyor or the cutting method of spraying water heated to a range on the conveyor is cut. 7. The circuit board cutting method according to claim 6 , wherein a partition is provided on the conveyor to prevent movement of the circuit board.   A step of holding one or both ends of the circuit board, a cutting step of cutting at least one of the circuit board or a component attached to the circuit board, and heating the circuit board that moves in a vibrating trough, Separating at least one of the solder adhered to the substrate and the mounted component, and the cutting method is attached to the support shaft erected on the main surface of the rotating body so as to be rotatable, and the rotating body Is rotated at a high speed to cause the impacting body to collide with at least one of the circuit board or the component at a speed equal to or higher than the critical impact speed, or a pressure higher than the critical pressure is applied, and the critical temperature is 100 ° C. or higher and critical. A cutting method in which water heated to a temperature lower than the temperature is sprayed from a nozzle onto the circuit board to cut at least one of the circuit board or the component. Removing a component from the circuit board, characterized in that Re or the other and the.   A cutting process for cutting at least one of a circuit board mounted on a conveyor or a part attached to the circuit board, a solder that adheres to the circuit board by heating the circuit board that moves in a vibration cage, and a mounted part A cutting method is attached to a support shaft erected on the main surface of the rotating body so as to be able to rotate, and the rotating body is rotated at a high speed to cause the impacting body to be subjected to a critical impact. A cutting method in which it is made to collide with at least one of the circuit board or the component at a speed higher than the speed, or water that is pressurized to a critical pressure or higher and heated to a temperature of 100 ° C. or higher and a critical temperature or lower. Is sprayed from a nozzle onto the circuit board to cut at least one of the circuit board or the component. How to remove the parts from the circuit board. At least one of a fluidized immersion tank for bringing a fluidized bed forming member into a fluidized state with pressurized air, a circuit board held in the vicinity of the fluidized bed surface, and a component attached to the circuit board. Cutting means for cutting, and the cutting means is rotatably attached to a support shaft erected on the main surface of the rotating body, the rotating body is rotated at a high speed, and the impacting body is subjected to a critical impact. Cutting means that collides with at least one of the circuit board or the component at a speed higher than the speed, or water that is pressurized to a pressure higher than the critical pressure and further heated to a temperature not lower than 100 ° C. and lower than the critical temperature. pressure from the nozzles of the circuit board, characterized in that as one of the cutting means adapted to cut at least one of the circuit board or the component by spraying on the circuit board Apparatus.   At least a fluidized immersion tank that brings the fluidized bed forming member into a fluidized state by supplying pressurized air, a circuit board that stops supplying the pressurized air and is held near the fluidized bed surface, or a component attached to the circuit board. A cutting means for cutting one side, a scissors, a vibration means for vibrating the scissors, and a circuit board heating means for heating the circuit board to melt the solder, the cutting means comprising a rotating body A striking body is rotatably attached to a spindle erected on the main surface of the head, and the rotating body is rotated at a high speed so that the striking body collides with the circuit board or at least one of the components at a speed higher than a critical impact speed. Or a cutting means that is pressurized to a pressure higher than the critical pressure and further heated to a temperature not lower than 100 ° C. and not higher than the critical temperature by spraying water onto the circuit board from the nozzle. No Re or the other and to the processing apparatus of the circuit board, characterized in that the.   A striking body is rotatably attached to a conveyor for conveying a circuit board and a support shaft standing on a main surface of the rotating body, and the rotating body is rotated at a high speed so that the striking body is at a speed higher than a critical impact speed. Alternatively, a circuit board cutting means for causing collision with at least one of the components attached to the circuit board, or water pressurized to a pressure higher than the critical pressure and further heated to a temperature not lower than 100 ° C. and lower than the critical temperature. And a circuit board cutting means for cutting at least one of the circuit board and a component attached to the circuit board by spraying a nozzle onto the circuit board. Processing equipment. 13. The circuit board processing apparatus according to claim 12 , wherein the cutting means is movable in an arbitrary direction within a horizontal plane. 13. The circuit board processing apparatus according to claim 12, further comprising means for holding one end or both ends of the circuit board. 15. The circuit board processing apparatus according to claim 14 , wherein one or both ends of the circuit board are sandwiched between opposing rollers or opposing belts.   A conveyor for transporting the circuit board; a cutting means for cutting at least one of the circuit board or the components attached to the circuit board; a ridge; an oscillating means for vibrating the ridge; and a solder melting temperature of the circuit board. Circuit board heating means for heating as described above, and the cutting means rotatably attaches the impacting body to a support shaft erected on the main surface of the rotating body, and rotates the rotating body at a high speed to cause the impacting body to rotate. A cutting means adapted to collide with at least one of the circuit board or the component at a speed equal to or higher than the critical impact speed, or a pressure higher than the critical pressure, and further heated to a temperature not lower than 100 ° C. and not higher than the critical temperature. A circuit comprising: cutting means for spraying water to be sprayed from a nozzle onto the circuit board to cut at least one of the circuit board or the component. Processing apparatus of the plate. Trough bottom V-shaped, arc-shaped, the processing apparatus of the circuit board according to claim 11 or 16, characterized in that one either of concave.   A cutting process for cutting at least one of a circuit board or a component attached to the circuit board, and heating the circuit board that moves in a vibration cage, and at least one of solder attached to the circuit board and mounted components The cutting method is attached to a support shaft erected on the main surface of the rotating body so as to be able to rotate, and the rotating body is rotated at a high speed so that the impacting body exceeds a critical impact speed. A cutting method that collides with at least one of the circuit board or the component at a speed, or water that is pressurized to a pressure higher than the critical pressure and further heated to a temperature not lower than 100 ° C. and not higher than the critical temperature from the nozzle. A part from the circuit board, characterized in that either one of the cutting methods is applied to the circuit board to cut at least one of the circuit board or the component. How to remove the.   A striking body is rotatably mounted on a spindle that is erected on the main surface of the rotating body, the rotating body is rotated at a high speed, and the striking body is attached to the main surface of the circuit board or the circuit board at a speed higher than the critical impact speed. A method of cutting a circuit board, wherein the circuit board is caused to collide with at least one of the components.   Water that is pressurized to a critical pressure or higher and heated to a temperature of 100 ° C. or higher and lower than the critical temperature is sprayed from the nozzle onto the circuit board, and at least one of the circuit board or the components attached to the circuit board is cut. Alternatively, a circuit board processing method characterized by crushing.

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