JP2000294919A - Method for separating electronic component from rejected printed board - Google Patents
Method for separating electronic component from rejected printed boardInfo
- Publication number
- JP2000294919A JP2000294919A JP9945599A JP9945599A JP2000294919A JP 2000294919 A JP2000294919 A JP 2000294919A JP 9945599 A JP9945599 A JP 9945599A JP 9945599 A JP9945599 A JP 9945599A JP 2000294919 A JP2000294919 A JP 2000294919A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- particles
- circuit board
- waste printed
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000002245 particle Substances 0.000 claims abstract description 105
- 239000002699 waste material Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 49
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 description 16
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000000498 ball milling Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 102100021260 Galactosylgalactosylxylosylprotein 3-beta-glucuronosyltransferase 1 Human genes 0.000 description 1
- 101000894906 Homo sapiens Galactosylgalactosylxylosylprotein 3-beta-glucuronosyltransferase 1 Proteins 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- -1 copper Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03B—SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
- B03B9/00—General arrangement of separating plant, e.g. flow sheets
- B03B9/06—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
- B03B9/061—General arrangement of separating plant, e.g. flow sheets specially adapted for refuse the refuse being industrial
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、使用済み電気製品
などから発生する廃プリント基板や、製造工程で発生す
る不良品、端材等の廃プリント基板から電子部品を分離
する、廃プリント基板からの電子部品分離方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating electronic components from waste printed circuit boards generated from used electrical products and the like, and defective printed circuit boards such as defective products and scrap materials generated in a manufacturing process. Electronic component separation method.
【０００２】[0002]
【従来の技術】使用済みの電気製品などに含まれている
廃プリント基板や、製造現場において不良品という形で
発生する廃プリント基板には、多くの電子部品が実装さ
れておりその電子部品中には銅をはじめとした有価金属
が多く含まれているため、電子部品の効率的な回収と共
にそれらの再資源化が望まれていた。さらに、廃プリン
ト基板における基板部分から銅箔、半田を回収するとい
う観点からも、予め電子部品を基板から取り除くことで
銅箔や半田の回収を効率的に行うことができるため、電
子部品の効率的な回収方法が望まれていた。2. Description of the Related Art A large number of electronic components are mounted on a waste printed circuit board included in a used electrical product or a waste printed circuit board generated as a defective product at a manufacturing site. Contains a lot of valuable metals such as copper, and it has been desired to efficiently recover electronic components and to recycle them. Furthermore, from the viewpoint of recovering copper foil and solder from the board portion of the waste printed circuit board, it is possible to efficiently recover copper foil and solder by removing the electronic component from the board in advance. There was a need for a more efficient collection method.
【０００３】以上のような状況を反映した廃プリント基
板の処理方法が今までに幾つか提案されている。例え
ば、特開平８−１３９４４６公報で開示されているよう
に、半田で接着された電子部品に対して、半田を加熱溶
融しながら廃プリント基板に外力を加えることで電子部
品を基板から除去する方法がある。[0003] Several methods of treating a waste printed circuit board reflecting the above situation have been proposed. For example, as disclosed in Japanese Patent Application Laid-Open No. 8-139446, a method of removing an electronic component from a board by applying an external force to a waste printed board while heating and melting the solder to the electronic component bonded by solder. There is.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記方
法では、加熱溶融状態の半田に対して外力が加わるため
半田は細かい液滴となって飛散しその後の半田回収が困
難になるという課題があった。また、リード部分が曲が
った状態で基板に実装されている電子部品に対しては上
記方法だけでは電子部品を基板から除去することが難し
いという課題があった。However, in the above method, since an external force is applied to the solder in the heated and molten state, the solder is scattered as fine droplets, which makes it difficult to recover the solder thereafter. . In addition, there is a problem that it is difficult to remove the electronic component from the substrate only by the above method for the electronic component mounted on the substrate with the lead portion bent.
【０００５】そこで本発明は、半田を加熱溶融すること
なく、効率的に電子部品を廃プリント基板から分離す
る、廃プリント基板からの電子部品分離方法を提供する
ことを目的とする。Accordingly, an object of the present invention is to provide a method of separating an electronic component from a waste printed circuit board, which efficiently separates the electronic component from the waste printed circuit board without heating and melting the solder.
【０００６】[0006]
【課題を解決するための手段】第１の本発明（請求項１
の対応）は、電子部品が実装されている廃プリント基板
に対して所定の粒子を衝突させる粒子衝突操作を行い、
前記廃プリント基板の基板部分を実質上破砕せず、かつ
前記廃プリント基板の基板部分と前記電子部品との接合
を分断し、前記廃プリント基板から前記電子部品を分離
することを特徴とする廃プリント基板からの電子部品分
離方法である。Means for Solving the Problems The first invention (claim 1)
Response) performs a particle collision operation of colliding predetermined particles against a waste printed circuit board on which electronic components are mounted,
A method of separating the electronic component from the waste printed circuit board by substantially not crushing the substrate part of the waste printed circuit board, separating the connection between the substrate part of the waste printed circuit board and the electronic component, and separating the electronic component from the waste printed circuit board. This is a method for separating electronic components from a printed circuit board.
【０００７】[0007]
【発明の実施の形態】以下に、本発明の実施の形態の廃
プリント基板からの電子部品分離方法を、図面を参照し
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for separating an electronic component from a waste printed circuit board according to an embodiment of the present invention will be described below with reference to the drawings.
【０００８】なお、以下に説明する本実施の形態におけ
る廃プリント基板とは、プリント基板に電子部品が実装
されている基板であって、いかなる実装形態のプリント
基板であっても本実施の形態の対象となる。また、実装
されている電子部品の種類や基板の材質にも限定はな
い。The waste printed circuit board in the present embodiment described below is a board on which electronic components are mounted on a printed circuit board. Be eligible. Further, there is no limitation on the type of mounted electronic component or the material of the substrate.
【０００９】さて、本実施の形態の廃プリント基板から
の電子部品分離方法では、廃プリント基板に対して粒子
を衝突させる粒子衝突操作を行うことを特徴とする。The method for separating electronic components from a waste printed circuit board according to the present embodiment is characterized in that a particle collision operation for causing particles to collide with the waste printed circuit board is performed.
【００１０】その粒子衝突操作の一例として、図１に示
すように、円筒状の容器１に多数個の粒子２と廃プリン
ト基板３とを封入して、容器１を矢印４の方向に回転さ
せ、粒子２に自由落下等の運動をさせることによって多
数の粒子２を廃プリント基板３に衝突させるという転動
ボールミル方式がある。As an example of the particle collision operation, as shown in FIG. 1, a large number of particles 2 and a waste printed circuit board 3 are sealed in a cylindrical container 1 and the container 1 is rotated in the direction of arrow 4. In addition, there is a rolling ball mill system in which a large number of particles 2 are caused to collide with a waste printed circuit board 3 by causing the particles 2 to make a motion such as free fall.
【００１１】また、別の粒子衝突操作方法として、図２
に示すように、容器１に多数個の粒子２と廃プリント基
板３とを封入して、容器１を矢印４の方向に上下振動さ
せ、粒子２の振動運動等により多数の粒子２を廃プリン
ト基板３に衝突させるという振動ボールミル方式があ
る。なお、図２は上下運動による粒子２の廃プリント基
板３への衝突を示しているが、左右運動、回転運動や、
さらにはこれら組み合わせの運動によって粒子２を廃プ
リント基板３へ衝突させることも可能である。FIG. 2 shows another particle collision operation method.
As shown in the figure, a large number of particles 2 and a waste printed circuit board 3 are sealed in a container 1, and the container 1 is vibrated up and down in a direction of an arrow 4, and a large number of particles 2 are waste printed by vibrating motion of the particles 2. There is a vibrating ball mill system in which the substrate is made to collide with the substrate 3. Note that FIG. 2 shows the collision of the particles 2 with the waste printed circuit board 3 due to the vertical movement.
Furthermore, the particles 2 can be caused to collide with the waste printed circuit board 3 by the movement of these combinations.
【００１２】また、別の粒子衝突操作方法として、図３
に示すように、圧搾空気などを利用して粒子２を高速に
噴射することができる噴射手段５を用意し、その噴射手
段５で多数の粒子２を廃プリント基板３に対して噴射し
衝突させるという方法もある。FIG. 3 shows another particle collision operation method.
As shown in (1), an injection unit 5 capable of injecting the particles 2 at high speed using compressed air or the like is prepared, and the injection unit 5 injects and collides a large number of particles 2 against the waste printed circuit board 3. There is also a method.
【００１３】なお、転動ボールミル方式および振動ボー
ルミル方式ともに装置構成が簡単であるため好ましい。[0013] The rolling ball mill system and the vibrating ball mill system are preferable because the device configuration is simple.
【００１４】上述した粒子衝突操作を行うと、電子部品
６と基板部分との、半田やリード線部分による接合部分
が、粒子２の衝突による衝撃力を受け、基板と電子部品
とが分断される。なぜなら、基板は強固な材質で形成さ
れ破砕されにくいのに対して、電子部品６との接合部分
は衝撃力に対して弱いからである。つまり、粒子２の基
板との衝突時の衝撃力は、電子部品６を基板から分離す
るのには充分であるが、一方、基板の破砕に関してはそ
の衝撃力では不充分で基板を破砕することができないた
め、実質上電子部品６だけが基板から脱離するのであ
る。これにより、容易に電子部品６を回収することがで
きる。When the above-described particle collision operation is performed, a joint portion between the electronic component 6 and the substrate portion by the solder or the lead wire portion receives an impact force due to the collision of the particles 2 and the substrate and the electronic component are separated. . This is because the substrate is made of a strong material and is hard to be crushed, whereas the joint with the electronic component 6 is weak against an impact force. In other words, the impact force at the time of the collision of the particles 2 with the substrate is sufficient to separate the electronic component 6 from the substrate, but the impact force is insufficient for the crushing of the substrate. Therefore, substantially only the electronic component 6 is detached from the substrate. Thereby, the electronic component 6 can be easily collected.
【００１５】ところで上述した粒子衝突操作では、粒子
２の質量、および粒子２の廃プリント基板３に対する衝
突速度で、電子部品６の分離に要する時間が決まる。ま
た、粒子２の質量や衝突速度が小さすぎると電子部品６
を基板から脱離させる衝撃力が不足し、粒子２の質量お
よび／または衝突速度が大きくなりすぎると基板までが
破砕されるため、使用する粒子２の質量と衝突速度とを
適切に選択する必要がある。例えば、転動ボールミル方
式では、質量の小さい粒子２でも、大きな径の容器１を
用いると落下距離を大きくすることができるので、衝突
速度を大きくすることができ、充分な衝撃力を得ること
ができる。一方、振動ボールミル方式や噴射手段５を用
いる方法では、転動ボールミル方式に比べてより大きな
加速度を粒子２に対して与えることができるため、比較
的小さい装置構成でも大きな衝撃力が得られる。ただ
し、粒子２の衝突速度を大きくしすぎると基板を破砕す
ることになるので、基板の破砕を起こさないように、用
いる粒子２の質量に対応させて衝突速度を選択する必要
がある。なお、粒子２の質量は、粒子２の大きさ、およ
び粒子２の材質（密度）が関係し、一方、衝突速度は粒
子衝突操作のための操作方法が関係する。In the above-described particle collision operation, the time required for separating the electronic components 6 is determined by the mass of the particles 2 and the collision speed of the particles 2 with respect to the waste printed circuit board 3. On the other hand, if the mass of the particles 2 or the collision velocity is too low, the electronic components 6
If the impact force for detaching the particles from the substrate is insufficient and the mass and / or the collision velocity of the particles 2 become too large, the substrate is crushed. Therefore, it is necessary to appropriately select the mass of the particles 2 to be used and the collision velocity. There is. For example, in the rolling ball mill method, even if the particles 2 have a small mass, the fall distance can be increased by using the container 1 having a large diameter. Therefore, the collision speed can be increased, and a sufficient impact force can be obtained. it can. On the other hand, in the case of using the vibrating ball mill system or the method using the injection means 5, a larger acceleration can be applied to the particles 2 than in the case of the rolling ball mill system, so that a large impact force can be obtained even with a relatively small device configuration. However, if the collision speed of the particles 2 is too high, the substrate will be crushed. Therefore, it is necessary to select the collision speed according to the mass of the particles 2 to be used so that the substrate is not crushed. Note that the mass of the particles 2 is related to the size of the particles 2 and the material (density) of the particles 2, while the collision speed is related to the operation method for the particle collision operation.
【００１６】また、本実施の形態における粒子２の大き
さは、大きすぎると電子部品６のリード線付近のような
接合部分には電子部品６が障害となって衝突しにくくな
るため、粒子２の大きさが電子部品６よりも大きすぎな
いことが望ましく、通常用いられる電子部品６の大きさ
を考慮すれば粒子径を５０ｍｍ以下とすることが望まし
い。このようにすると、粒子２を電子部品６と基板との
接合部分に容易に衝突させることができ、電子部品６を
脱離させることができる。一方、粒子２の大きさが小さ
くなりすぎると粒子２の質量が小さくなり衝撃力が不足
するため、粒子径は５ｍｍ以上であることが望ましい。
これについては以下に実施例１で述べるが、例えば比重
の大きいジルコニアを粒子２の材質とすると、粒子径が
１０ｍｍの場合では電子部品６の分離が可能であるが、
これに対して５ｍｍ未満の粒子径、つまり１０ｍｍの１
／２未満の粒子径になると、粒子２の質量が１／８未満
になり衝撃力が低下して電子部品６を効率的に分離する
ことができなくなるという現象が起こるからである。Also, if the size of the particles 2 in the present embodiment is too large, the electronic component 6 becomes difficult to collide with a joining portion such as the vicinity of a lead wire of the electronic component 6, so that the particle 2 hardly collides. Is not too large as compared with the electronic component 6, and in consideration of the size of the electronic component 6 which is usually used, the particle diameter is desirably 50 mm or less. By doing so, the particles 2 can easily collide with the joint between the electronic component 6 and the substrate, and the electronic component 6 can be detached. On the other hand, if the size of the particles 2 becomes too small, the mass of the particles 2 becomes small and the impact force becomes insufficient, so that the particle diameter is desirably 5 mm or more.
This will be described in Example 1 below. For example, when zirconia having a large specific gravity is used as the material of the particles 2, the electronic component 6 can be separated when the particle diameter is 10 mm.
On the other hand, a particle diameter of less than 5 mm, that is, 1 mm of 10 mm
If the particle diameter is less than / 2, the mass of the particles 2 becomes less than 1/8, the impact force decreases, and a phenomenon occurs in which the electronic component 6 cannot be efficiently separated.
【００１７】そこで粒子２の大きさの範囲を考慮する
と、粒子２の材質としては、比較的密度の高い材質が好
ましい。なぜなら、密度の高い材質の粒子を用いること
で、粒子の大きさが小さくても質量が大きくなり、衝撃
力に優れるためである。具体的には、アルミナ（密度
３．６ｇ／ｃｍ3）、ジルコニア（密度６．０ｇ／ｃ
ｍ3）、シリカ（密度２．２ｇ／ｃｍ3）、窒化珪素（密
度３．２ｇ／ｃｍ3）、炭化珪素（密度３．１ｇ／ｃ
ｍ3）などのセラミック素材、鉄やステンレス（密度
７．９ｇ／ｃｍ3）などの金属素材などを用いることが
できる。特に、ジルコニア、鉄、ステンレスは密度が高
いために好ましい。また、セラミック素材や金属素材を
芯材として用いてナイロン樹脂などの樹脂やゴム材で表
面を被覆した粒子を用いることも可能である。Considering the range of the size of the particles 2, the material of the particles 2 is preferably a material having a relatively high density. This is because the use of particles of a material having a high density increases the mass even if the size of the particles is small, and is excellent in impact force. Specifically, alumina (density 3.6 g / cm 3 ), zirconia (density 6.0 g / c 3 )
m 3 ), silica (density 2.2 g / cm 3 ), silicon nitride (density 3.2 g / cm 3 ), silicon carbide (density 3.1 g / c)
m 3 ) and metal materials such as iron and stainless steel (density 7.9 g / cm 3 ). In particular, zirconia, iron, and stainless steel are preferable because of their high density. It is also possible to use particles whose surface is covered with a resin such as a nylon resin or a rubber material using a ceramic material or a metal material as a core material.
【００１８】なお、粒子２の形状にはに特別な限定はな
いが、粒子２の形状を球状に近い形とすることが好まし
い。なぜなら、球状に近い形にすることで粒子衝突によ
る銅箔や半田の削れを抑制することができ、さらに、粒
子衝突操作後に得られる基板部分１０、基板部分１０か
ら分離した電子部品６、および粒子２の混合物から、電
子部品６の一部と粒子２との分離を容易に行うことがで
きるためである。つまり、図４に示すようなベルトが下
側から上側に進行するベルトコンベヤ７の面上に、基板
部分１０と粒子２と電子部品６の混合物を供給すると、
球状の粒子２は下側に位置する粒子回収部８に回収さ
れ、一方球状の粒子２に比べて転がりにくい電子部品６
および基板部分１０は、上側に位置する基板／電子部品
混合物回収部９に回収される。ただし、電子部品６のう
ち転がりやすい形状のものは、粒子回収部８で回収され
る。また、基板／電子部品混合物回収部９に回収された
基板部分１０と電子部品６とを分離する場合、さらに傾
斜角の大きいベルトコンベヤを用いて、基板部分１０と
電子部品６とをベルトコンベヤに供給すれば、電子部品
６は基板部分１０に比べて転落し易いので下方部で回収
され、基板部分１０は上方部で回収される。さらに、粒
子回収部８に回収された粒子２と電子部品６とを分離す
るには、傾斜角の小さいベルトコンベヤを用いて、粒子
２と電子部品６とをベルトコンベヤに供給すると、粒子
２は電子部品６に比べて転落し易いので下方部で回収さ
れ、電子部品６は上方部で回収される。ただし、基板部
分１０と電子部品６との分離や、粒子２と電子部品６と
の分離を行う場合、ベルトコンベヤの傾斜角とベルトの
移動速度を適切に選択する必要がある。なお、図４のベ
ルトコンベヤ７の傾斜角とベルトの移動速度を適切に選
択すれば、基板部分１０と粒子２と電子部品６の混合物
をベルト上面に供給すると、特に転落性が大きい粒子２
のみを下方部に回収することもできる。また、基板部分
１０と電子部品６とを分離する場合、基板部分１０の方
が電子部品６に比べて大きいため、ふるい分けによって
も容易に分離することができる。The shape of the particles 2 is not particularly limited, but it is preferable that the shape of the particles 2 is close to spherical. This is because, by making the shape close to a sphere, the scraping of the copper foil and the solder due to the particle collision can be suppressed, and furthermore, the substrate part 10 obtained after the particle collision operation, the electronic component 6 separated from the substrate part 10, and the particle This is because a part of the electronic component 6 and the particles 2 can be easily separated from the mixture of the two. That is, when a mixture of the substrate part 10, the particles 2, and the electronic components 6 is supplied onto the surface of the belt conveyor 7 in which the belt as shown in FIG.
The spherical particles 2 are collected by a particle collecting section 8 located on the lower side, while the electronic components 6 that are less likely to roll than the spherical particles 2
The board part 10 is collected by the board / electronic component mixture collection part 9 located on the upper side. However, among the electronic components 6, those that easily roll are collected by the particle collection unit 8. When separating the board part 10 and the electronic component 6 collected by the board / electronic component mixture recovery unit 9, the board part 10 and the electronic component 6 are transferred to the belt conveyor by using a belt conveyor having a larger inclination angle. If supplied, the electronic component 6 is more likely to fall than the substrate portion 10 and is collected at a lower portion, and the substrate portion 10 is collected at an upper portion. Further, in order to separate the particles 2 and the electronic components 6 collected by the particle collection unit 8 from each other, the particles 2 and the electronic components 6 are supplied to the belt conveyor using a belt conveyor having a small inclination angle. The electronic component 6 is collected at the lower part because it falls more easily than the electronic part 6, and the electronic part 6 is collected at the upper part. However, when separating the substrate part 10 from the electronic component 6 or separating the particles 2 from the electronic component 6, it is necessary to appropriately select the inclination angle of the belt conveyor and the moving speed of the belt. By appropriately selecting the inclination angle of the belt conveyor 7 and the moving speed of the belt in FIG. 4, if the mixture of the substrate portion 10, the particles 2, and the electronic components 6 is supplied to the upper surface of the belt, the particles 2 having particularly high falling property are obtained.
Only the lower part can be recovered. Further, when separating the substrate portion 10 and the electronic component 6, the substrate portion 10 is larger than the electronic component 6, and thus can be easily separated by sieving.
【００１９】[0019]
【実施例】以下、具体的実施例を挙げて本発明をより詳
細に説明する。Hereinafter, the present invention will be described in more detail with reference to specific examples.
【００２０】（実施例１）ガラス繊維不織布／ガラスク
ロスとエポキシ樹脂からなるコンポジット基板（サイズ
７０ｍｍ×９０ｍｍ）の片面に、集積回路部品、アルミ
ニウム電解コンデンサ、固定抵抗器、コネクタなどが実
装されているものを廃プリント基板として用いた。そし
て、内径１３０ｍｍ深さ１８０ｍｍのステンレス製の円
筒容器内に、粒径１０ｍｍのジルコニア粒子複数個と廃
プリント基板とを投入し、１分間に６４０回転で振動す
る装置（ペイントシェーカー、浅田鉄工株式会社製）を
用い、振動ボールミル方式を採用して容器を振動させ、
粒子衝突操作を５時間行った。その結果、コンポジット
基板を破砕させずにほとんどの電子部品をコンポジット
基板部分から脱離させることができた。その後、分離さ
れたコンポジット基板部分および電子部品とジルコニア
粒子との混合物を、傾斜角度が１０度で、ベルトスピー
ドが１５０ｍｍ／秒の速度で下側から上側に走るベルト
コンベアのベルト上に供給したところ、コンベア板下側
の回収部にジルコニア粒子を、コンベア板上側の回収部
にコンポジット基板部分および電子部品を回収すること
ができた。さらにその後、上側回収部で回収されたコン
ポジット基板部分および電子部品の混合物を、傾斜角度
が３０度で、ベルトスピードが１５０ｍｍ／秒の速度で
下側から上側に走るベルトコンベアのベルト上に供給し
たところ、コンベア板下側の回収部に電子部品を、コン
ベア板上側の回収部にコンポジット基板部分を回収する
ことができた。(Example 1) An integrated circuit component, an aluminum electrolytic capacitor, a fixed resistor, a connector and the like are mounted on one surface of a composite substrate (size 70 mm × 90 mm) made of glass fiber nonwoven fabric / glass cloth and epoxy resin. These were used as waste printed circuit boards. Then, a plurality of zirconia particles having a particle diameter of 10 mm and a waste printed circuit board are charged into a stainless steel cylindrical container having an inner diameter of 130 mm and a depth of 180 mm, and a device that vibrates at 640 rotations per minute (Paint Shaker, Asada Iron Works Co., Ltd.) ), The container is vibrated by using the vibrating ball mill method,
The particle collision operation was performed for 5 hours. As a result, most of the electronic components could be detached from the composite substrate without crushing the composite substrate. After that, the separated composite substrate portion and the mixture of the electronic component and the zirconia particles were supplied onto a belt of a belt conveyor running from the lower side to the upper side at a tilt angle of 10 degrees and a belt speed of 150 mm / sec. The zirconia particles could be collected in the collection section below the conveyor plate, and the composite substrate portion and the electronic component could be collected in the collection section above the conveyor plate. Further thereafter, the mixture of the composite substrate portion and the electronic components collected in the upper collection section was supplied onto a belt of a belt conveyor running from the lower side to the upper side at an inclination angle of 30 degrees and a belt speed of 150 mm / sec. However, the electronic components could be collected in the collection section below the conveyor plate, and the composite board portion could be collected in the collection section above the conveyor plate.
【００２１】（実施例２）実施例１における粒子を、粒
径４０ｍｍのアルミナ粒子に変えて実施例１と同様に粒
子衝突操作を行ったところ、３分間程度でコンポジット
基板部分を破砕させずに、ほとんどの電子部品をコンポ
ジット基板部分から脱離させることができた。その後、
実施例１と同様にベルトコンベヤを用いたところ、コン
ポジット基板部分、電子部品、アルミナ粒子を別々に分
離して回収することができた。(Example 2) The particles in Example 1 were changed to alumina particles having a particle size of 40 mm, and a particle collision operation was performed in the same manner as in Example 1. As a result, the composite substrate portion was not crushed in about 3 minutes. Most of the electronic components could be detached from the composite substrate. afterwards,
When a belt conveyor was used in the same manner as in Example 1, the composite substrate portion, electronic components, and alumina particles could be separately separated and collected.
【００２２】（実施例３）実施例１と同じ廃プリント基
板を用い、内径１２５０ｍｍ、長さ１２５０ｍｍの円筒
容器を有するボールミル（中央化工機株式会社製、ＢＭ
−１５００）内に粒径１０ｍｍのステンレス粒子複数個
と廃プリント基板とを投入し、転動ボールミル方式を採
用して、容器を、１分間に２５回転させるペースで回転
させ、粒子衝突操作を８時間行った。その結果、コンポ
ジット基板部分を破砕させずにほとんどの電子部品をコ
ンポジット基板部分から脱離させることができた。その
後、実施例１と同様にベルトコンベヤを用いたところ、
コンポジット基板部分、電子部品、アルミナ粒子を別々
に分離して回収することができた。(Embodiment 3) Using the same waste printed circuit board as in Embodiment 1, a ball mill having a cylindrical container having an inner diameter of 1250 mm and a length of 1250 mm (BM, manufactured by Chuo Kakoki Co., Ltd.)
-1500), a plurality of stainless steel particles having a particle diameter of 10 mm and a waste printed circuit board are charged, and the container is rotated at a pace of 25 rotations per minute by employing a rolling ball mill method, and the particle collision operation is performed in 8 minutes. Time went. As a result, most of the electronic components could be detached from the composite substrate without crushing the composite substrate. Then, when a belt conveyor was used in the same manner as in Example 1,
The composite substrate portion, the electronic components, and the alumina particles were separately separated and collected.
【００２３】（実施例４）実施例１と同じ廃プリント基
板を用い、噴射式加工装置（株式会社不二製作所）を用
いて粒子径５ｍｍのジルコニア粒子を、基板面に対して
２０度の方向から噴射速度１０ｍ／秒で噴射して粒子衝
突操作を１０分間行った。その結果、コンポジット基板
部分を破砕させずに、ほとんどの電子部品をコンポジッ
ト基板部分から脱離させることができた。その後、実施
例１と同様にベルトコンベヤを用いたところ、コンポジ
ット基板部分、電子部品、アルミナ粒子を別々に分離し
て回収することができた。(Example 4) Using the same waste printed circuit board as in Example 1, zirconia particles having a particle diameter of 5 mm were directed in a direction of 20 degrees with respect to the substrate surface using a jet processing apparatus (Fuji Manufacturing Co., Ltd.). , And a particle collision operation was performed for 10 minutes. As a result, most of the electronic components could be detached from the composite substrate portion without crushing the composite substrate portion. Thereafter, when a belt conveyor was used in the same manner as in Example 1, the composite substrate portion, the electronic component, and the alumina particles could be separately separated and collected.
【００２４】[0024]
【発明の効果】以上説明したところから明らかなよう
に、本発明は、効率的に廃プリント基板から電子部品を
分離する、廃プリント基板からの電子部品分離方法を提
供することができる。As is apparent from the above description, the present invention can provide a method for separating an electronic component from a waste printed board, which efficiently separates the electronic component from the waste printed board.
【図１】本発明の実施の形態の廃プリント基板からの電
子部品分離方法を説明するための図FIG. 1 is a diagram illustrating a method for separating an electronic component from a waste printed circuit board according to an embodiment of the present invention.
【図２】図１とは別の、本発明の実施の形態の廃プリン
ト基板からの電子部品分離方法を説明するための図FIG. 2 is a diagram different from FIG. 1 for explaining a method of separating an electronic component from a waste printed circuit board according to an embodiment of the present invention.
【図３】図１または２とは別の、本発明の実施の形態の
廃プリント基板からの電子部品分離方法を説明するため
の図FIG. 3 is a diagram different from FIG. 1 or 2 for explaining a method of separating an electronic component from a waste printed circuit board according to an embodiment of the present invention.
【図４】本発明の実施の形態における、少なくとも電子
部品の一部および廃プリント基板の基板部分と、粒子と
を分離回収する方法を説明するための図FIG. 4 is a diagram for explaining a method of separating and collecting at least a part of an electronic component, a substrate part of a waste printed circuit board, and particles in the embodiment of the present invention.
１ 容器 ２ 粒子 ３ 廃プリント基板 ４ 容器の運動方向を示す矢印 ５ 噴射手段 ６ 電子部品 ７ ベルトコンベヤ ８ 粒子回収部 ９ 基板／電子部品混合物回収部 １０ 基板部分 DESCRIPTION OF SYMBOLS 1 Container 2 Particle 3 Waste printed circuit board 4 Arrow indicating direction of movement of container 5 Injecting means 6 Electronic component 7 Belt conveyor 8 Particle recovery unit 9 Substrate / electronic component mixture recovery unit 10 Substrate part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 寺田 貴彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 大西 宏 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4D004 AA24 CA02 CA08 CA50 CB12 CB46 4F301 BA17 BA21 BE32 BF05 BF31 BG23 5E319 CD57 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takahiko Terada 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Term (Reference) 4D004 AA24 CA02 CA08 CA50 CB12 4CB301 4F301 BA17 BA21 BE32 BF05 BF31 BG23 5E319 CD57
Claims (5)
板に対して所定の粒子を衝突させる粒子衝突操作を行
い、前記廃プリント基板の基板部分を実質上破砕せず、
かつ前記廃プリント基板の基板部分と前記電子部品との
接合を分断し、前記廃プリント基板から前記電子部品を
分離することを特徴とする廃プリント基板からの電子部
品分離方法。1. A particle collision operation for causing predetermined particles to collide with a waste printed circuit board on which electronic components are mounted, without substantially crushing a substrate portion of the waste printed circuit board,
And separating the electronic component from the waste printed circuit board by separating a bond between the board portion of the waste printed circuit board and the electronic component and separating the electronic component from the waste printed circuit board.
板と前記粒子とを所定の容器に封入し、その容器を回転
および／または振動させて、前記粒子を前記廃プリント
基板に衝突させて行うことを特徴とする請求項１記載の
廃プリント基板からの電子部品分離方法。2. The particle collision operation is performed by enclosing the waste printed circuit board and the particles in a predetermined container, and rotating and / or vibrating the container to cause the particles to collide with the waste printed circuit board. 2. The method for separating electronic components from waste printed circuit boards according to claim 1, wherein:
速度で噴射することができる噴射手段を用意し、その噴
射手段で前記粒子を前記廃プリント基板に対して噴射
し、前記粒子を前記廃プリント基板に衝突させて行うこ
とを特徴とする請求項１記載の廃プリント基板からの電
子部品分離方法。3. An injection means capable of injecting the particles at a predetermined speed in the particle collision operation, injecting the particles to the waste printed circuit board by the injection means, 2. The method for separating an electronic component from a waste printed circuit board according to claim 1, wherein the method is performed by colliding with a waste printed circuit board.
以下であることを特徴とする請求項１から３のいずれか
に記載の廃プリント基板からの電子部品分離方法。4. The particle size of the particles is 5 mm or more and 50 mm or more.
4. The method for separating an electronic component from a waste printed circuit board according to claim 1, wherein the method is as follows.
向けて移動するベルトコンベヤを用意して、 前記廃プリント基板の基板部分、前記廃プリント基板か
ら分離した前記電子部品、および前記粒子の全部または
一部を前記ベルトコンベヤ上に供給し、 少なくとも前記粒子を前記ベルトコンベヤの下方部で回
収し、 前記廃プリント基板の基板部分と、少なくとも難転落性
形状の前記電子部品とを前記ベルトコンベヤの上方部で
回収することを特徴とする請求項１から４のいずれかに
記載の廃プリント基板からの電子部品分離方法。5. A belt conveyor which is inclined with respect to a horizontal plane and moves upward from below is provided, wherein a board portion of the waste printed board, the electronic component separated from the waste printed board, and a particle of the waste printed board are provided. Supplying all or a part of the particles on the belt conveyor, collecting at least the particles at a lower portion of the belt conveyor, and connecting the substrate portion of the waste printed circuit board and at least the electronic component having a hard-to-fall shape to the belt conveyor. The method for separating electronic components from a waste printed circuit board according to any one of claims 1 to 4, wherein the electronic component is collected at an upper portion of the printed circuit board.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9945599A JP2000294919A (en) | 1999-04-06 | 1999-04-06 | Method for separating electronic component from rejected printed board |
| EP19990124578 EP1008395A3 (en) | 1998-12-11 | 1999-12-09 | Method for separating metallic material from waste printed circuit boards, and dry distilation apparatus used for waste treatment |
| US09/458,845 US6336601B1 (en) | 1998-12-11 | 1999-12-13 | Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment |
| CN99126403A CN1115210C (en) | 1998-12-11 | 1999-12-13 | Method for separating metal material from waste printed circuit board and destruction distillation apparatus for processing waste materials |
| US09/766,232 US6523764B2 (en) | 1998-12-11 | 2001-01-19 | Method for separating metallic from waste printed circuit boards, and dry distillation apparatus used for waste treatment |
| CN03104381A CN1433851A (en) | 1998-12-11 | 2003-02-10 | Dry distillation apparatus for waste treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9945599A JP2000294919A (en) | 1999-04-06 | 1999-04-06 | Method for separating electronic component from rejected printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000294919A true JP2000294919A (en) | 2000-10-20 |
Family
ID=14247809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9945599A Pending JP2000294919A (en) | 1998-12-11 | 1999-04-06 | Method for separating electronic component from rejected printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000294919A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006192702A (en) * | 2005-01-13 | 2006-07-27 | Asahi Kasei Construction Materials Co Ltd | Separation method of flexible face material of resin foam with flexible face material and resin foam |
| WO2010055906A1 (en) | 2008-11-17 | 2010-05-20 | 独立行政法人物質・材料研究機構 | Milled electronic appliance |
| JP2010119915A (en) * | 2008-11-17 | 2010-06-03 | National Institute For Materials Science | Method of crushing electronic equipment |
| WO2012131906A1 (en) * | 2011-03-29 | 2012-10-04 | 日本磁力選鉱株式会社 | Method for reclaiming valuable metal from waste electronic devices |
| JP2017023991A (en) * | 2015-07-24 | 2017-02-02 | テクニカマシナリー株式会社 | Electronic component recovery device |
-
1999
- 1999-04-06 JP JP9945599A patent/JP2000294919A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006192702A (en) * | 2005-01-13 | 2006-07-27 | Asahi Kasei Construction Materials Co Ltd | Separation method of flexible face material of resin foam with flexible face material and resin foam |
| JP4545597B2 (en) * | 2005-01-13 | 2010-09-15 | 旭化成建材株式会社 | Separating method of flexible foam of resin foam with flexible face material and resin foam |
| WO2010055906A1 (en) | 2008-11-17 | 2010-05-20 | 独立行政法人物質・材料研究機構 | Milled electronic appliance |
| JP2010119906A (en) * | 2008-11-17 | 2010-06-03 | National Institute For Materials Science | Crushed mass of electronic equipment |
| JP2010119915A (en) * | 2008-11-17 | 2010-06-03 | National Institute For Materials Science | Method of crushing electronic equipment |
| WO2012131906A1 (en) * | 2011-03-29 | 2012-10-04 | 日本磁力選鉱株式会社 | Method for reclaiming valuable metal from waste electronic devices |
| JPWO2012131906A1 (en) * | 2011-03-29 | 2014-07-24 | 日本磁力選鉱株式会社 | Method for recovering valuable metals from waste electronic equipment |
| JP5705305B2 (en) * | 2011-03-29 | 2015-04-22 | 日本磁力選鉱株式会社 | Method for recovering valuable metals from waste electronic equipment |
| JP2017023991A (en) * | 2015-07-24 | 2017-02-02 | テクニカマシナリー株式会社 | Electronic component recovery device |
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