JP2898694B2 - Method for manufacturing semiconductor device - Google Patents

Description

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to an envelope for taking out external electrodes used in a high-power semiconductor device.

(Prior Art) FIG. 8 (ii) is a cross-sectional view of a generally used resin-encapsulated high-power semiconductor device. FIG. 1I is a top view thereof. In this device, the semiconductor pellet is arranged on the circuit board (11), and the substrate (11) and the pellet are electrically connected by bonding wires. In order to take out the external electrodes from the circuit board (11), the terminals of the envelope (20) are fixed on the circuit board (11) by soldering (10) or the like, and the resin of the envelope (20) is formed. The space between the holder (1) and the circuit board (11) is filled with a potting agent (12) and a casting agent (13). The side and lower parts of the device are covered with a case (8) and a radiator plate (9). 9 and 10 show a perspective view and a sectional view of the envelope (20) of the resin-encapsulated high-power semiconductor device. The envelope (20) includes a terminal (2) for connecting to an external electrode, and a resin holder (1) for fixing the terminal (2). In the manufacture of the envelope (20), the terminal (2) is placed in a resin molding die, and the resin is injected into the die under pressure to thereby form the terminal (2).
And the holder (1) are integrally formed.

(Problems to be Solved by the Invention) However, when the terminal (2) for taking out the external electrode and the resin holder are integrally formed, the resin is prevented from flowing out from the contact portion between the mold and the terminal (2). The terminal (2) was tightened by a mold in order to
However, there was a drawback that it was deformed. Further, the terminal (2) was sometimes deformed by the resin injection pressure at the time of molding.
Deformation of the terminal in the envelope is caused by bonding the terminal (2) to the circuit board (11) by soldering (10) or the like.
This deformed member becomes defective because it prevents the circuit board (11) from adhering to the substrate. Therefore, the molding yield of the envelope is reduced, and the cost is increased.

In addition, an increase in the number of terminals (2) due to an increase in the number of external electrodes, or an increase in the shape of the terminals (2) may cause the molding die to become complicated, making it impossible to form the envelope. I was

An object of the present invention is to provide a method of manufacturing a semiconductor device which is high in quality and can improve the yield.

[Constitution of the Invention] (Means for Solving the Problems) In the present invention, in an envelope of a high-power semiconductor device, an electrode extraction terminal constituting the envelope and a resin holder holding the terminal are separately provided. Mold into A projection is provided below the terminal and wider than the insertion hole of the holder, and a spring portion is formed in one main surface of the terminal and is convex with respect to the main surface. To manufacture.

(Operation) As described above, in the envelope of the high power semiconductor device,
Since the molding of the resin holder is not performed integrally with the electrode extraction terminal, the molding die is also simplified to some extent, and it is possible to manufacture even a large number of terminals and a holder having a complicated shape. In addition, since the mold is not tightened or the resin injection pressure is not applied to the terminal during molding, the terminal is not deformed.

(Example) FIG. 1 is a perspective view showing a configuration of an envelope of a high-power semiconductor device showing a reference example of the present invention, and FIG. 2 is a cross-sectional view showing each part of the envelope.

In the manufacture of the envelope according to the reference example of the present invention, first, as shown in FIG. 1 (i), a resin holder (1) is formed by itself and prepared. The holder (1) has a hole (4) for inserting a separately manufactured terminal (2) and a hole (3) for inserting a nut as shown in FIG. There are as many as. As shown in FIG. 2 (i), the terminal insertion hole (4) is formed at a lower portion of the holder (1) to be wider than a portion where the terminal protrudes from the holder. In the manufacture of the terminal, the protrusion (5) is formed so that the intermediate portion of the terminal has substantially the same width as the wide portion (6) of the terminal insertion hole. Thereafter, the terminal (2) is inserted into the terminal insertion hole (4) of the holder, and the portion where the terminal protrudes from the holder (1) is bent as shown in FIG. 1 (ii) to manufacture an envelope. .

Then, the terminal (2) of the envelope is fixed on the circuit board (11) by solder (10) or the like in the same process as the conventional case, and the terminal (2) is arranged on the circuit board (11). Electrically connected to the semiconductor pellet.

As in the conventional case, the side and lower parts of the device are covered with a case (8) and a radiator plate (9), and a potting agent (12) is provided between the resin holder (1) and the circuit board (11). ) And a casting agent (13).

As described above, in the reference example of the present invention, since the terminal and the resin holder are not integrally formed, not only the deformation of the terminal due to the influence of the resin injection pressure or the like during the molding of the resin holder, but also the terminal is prevented, Since the terminal and the holder are not fixed, the terminal can move vertically in the insertion hole of the holder, and the circuit board and the terminal are always in close contact when the circuit board and the terminal are joined by solder etc. Can be kept. Also, since the terminal insertion hole of the holder has a wide portion in accordance with the protrusion at the intermediate portion of the terminal, by adjusting the position of the protrusion on the terminal, the height dimension of the terminal and the holder can be adjusted. Can be easily regulated. FIG. 3 is a diagram showing the rate of occurrence of terminal deformation failure and its frequency in the production of the envelope. As can be seen from FIG. 3, terminal deformation failure during the production of the envelope is almost eliminated.

Next, embodiments of the present invention will be described with reference to the drawings shown below. FIG. 7 (i) is a top view of the large electrode semiconductor device,
FIG. 7 (ii) is a sectional view thereof. FIG. 4 is a perspective view showing a configuration of an envelope of the high power semiconductor device. 5 and 6 are cross-sectional views showing each part of the envelope. In the embodiment of the present invention, similarly to the reference example, as shown in FIG. 4 (i), a resin holder (1) is formed by itself and prepared. This holder (1) has a separately manufactured terminal (2)
Are formed as shown in the figure, and there are as many as the number of terminals to be mounted.
Further, inside the insertion hole (4) of the holder (1), there is provided a step portion where a spring portion of a terminal (2) described later is hooked. The terminal (2) is provided with a portion (hereinafter, referred to as a terminal protrusion) (5) wider than the width of the insertion hole (4) at an intermediate portion thereof. Further, a spring portion (14) is provided on a side surface of the terminal (2). The spring portion (14) is normally convex with respect to the side surface of the terminal (2), and when inserted into the holder (1), the insertion hole (4) of the holder (1) is inserted.
It is designed to extend so that it does not get caught on.

To fix the terminal (2) to the holder (1), insert the terminal from the lower part of the holder in the insertion hole (4). At this time, the terminal (2) is fixed at a predetermined position by the protrusion (5) of the terminal (2). Further, since the terminal (2) is provided with the spring portion (14), the spring portion (14) is hooked on the step portion (15) provided inside the holding body (1), and the holding body (1) It is possible to prevent the terminal (2) from being pulled out from both sides.

In addition, since the gap is formed between the holder (1) and the terminal (2) when the terminal is fixed, the terminal (2) is vertically inserted into the insertion hole (4) of the holder (1). Can be moved in any direction.

In this way, an envelope is manufactured as shown in FIG. 4 (ii).

The terminal (2) of the envelope is fixed on the circuit board (11) by solder (10) or the like in the same steps as in the reference example of the present invention and the conventional method, and the terminal (2) is connected to the circuit board (11). It is electrically connected to the semiconductor pellet disposed thereon.

As in the conventional case, the side and lower parts of the device are covered with a case (8) and a radiator plate (9), and a potting agent (12) is provided between the resin holder (1) and the circuit board (11). ) And a casting agent (13).

As described above, even in the embodiment, since the terminal and the resin holder are not integrally molded, not only the deformation of the terminal due to the influence of the resin injection pressure or the like during the molding of the resin holder is prevented, but also the terminal and the holder are held. Since the body is not fixed, the terminal can move up and down in the insertion hole of the holder, and the circuit board and the terminal always keep tight contact when joining the circuit board and the terminal with solder etc. Can be. In addition, since the terminal insertion hole of the holder has a wide portion in accordance with the protrusion at the middle part of the terminal, the height of the terminal and the holder is adjusted by adjusting the position of the protrusion on the terminal. Can be easily regulated.

[Effects of the Invention] As described above, the present invention separately molds the electrode extraction terminal constituting the envelope and the holder, and then inserts the terminal into the hole of the holder, thus forming the resin holder. In this case, the terminals are not deformed at the time, and a large number of terminals and a holder having a complicated shape can be manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a manufacturing process of an envelope according to a reference example of the present invention, FIG. 2 is a cross-sectional view of the envelope showing a fitting state of a holder and terminals of the reference example, and FIG. FIG. 4 is a relationship diagram showing the rate of occurrence of terminal deformation failure and its frequency in the production of an envelope, FIG. 4 is a perspective view showing a production process of an envelope according to an embodiment of the present invention, FIG. 5 and FIG. FIG. 7 is a cross-sectional view of an envelope showing a fitting state of a holder and terminals of an example, FIG. 7 is a top view and a cross-sectional view of a resin-encapsulated high-power semiconductor device of the embodiment, and FIG. FIG. 9 is a perspective view of a conventional envelope, and FIG. 10 is a cross-sectional view showing a fitting state of a holding body and a terminal in the conventional envelope. DESCRIPTION OF SYMBOLS 1 ... resin holder, 2 ... terminal, 3 ... nut hole, 4 ... terminal insertion hole, 5 ... terminal protrusion, 6 ... holder insertion hole, 7 ... nut, 8 ... case, 9 ... heat sink, 10… Solder,
11 ... circuit board, 12 ... potting agent, 13 ... casting agent, 14 ... spring portion, 15 ... stepped portion, 20 ... envelope.

Claims (1)

(57) [Claims] 1. A step of molding an electrode terminal, a step of molding a holder for the electrode terminal having a step inside an insertion hole for inserting the electrode terminal, and inserting the electrode terminal into the holder. After that, the method further comprises: fixing the electrode terminal to the holder; and arranging and fixing an envelope formed by the electrode terminal and the holder on the substrate on which the pellet is mounted, the electrode terminal comprising: A protrusion wider than the terminal insertion hole of the holding body and a spring portion protruding from the main surface within one main surface of the electrode terminal are provided at an intermediate portion of the side surface of the holder, and the electrode terminal is inserted into the holding body. Thereafter, the electrode terminal is fixed by the spring portion and a step portion of the holder.