JP2893070B2 - Liquid crystal electro-optical device - Google Patents
Liquid crystal electro-optical deviceInfo
- Publication number
- JP2893070B2 JP2893070B2 JP1226664A JP22666489A JP2893070B2 JP 2893070 B2 JP2893070 B2 JP 2893070B2 JP 1226664 A JP1226664 A JP 1226664A JP 22666489 A JP22666489 A JP 22666489A JP 2893070 B2 JP2893070 B2 JP 2893070B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid crystal
- optical device
- wiring
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【発明の詳細な説明】 〔従来の技術〕 液晶電気光学装置は、従来の表示素子に比較して軽
い，消費電力が小さい等の利点を有しているため種々の
方面、例えば電卓，時計，ワープロ，ポケットテレビ等
に用いられている。DETAILED DESCRIPTION OF THE INVENTION [Prior Art] A liquid crystal electro-optical device has advantages such as light weight and low power consumption as compared with a conventional display element, and thus has various advantages, such as a calculator, a clock, a clock, and the like. Used in word processors, pocket televisions, etc.
ところで液晶電気光学装置における液晶を駆動させる
ための半導体素子の配置については、当初はパッケージ
ICの状態でガラスエポキシのプリント基板上に搭載され
ているものが主であった。この場合パッケージICが搭載
されたプリント基板の電極と、液晶パネルに形成されて
いる電極との接続は、例えばFPC（Flexible Print Circ
uit）によって行われていた。By the way, regarding the arrangement of semiconductor elements for driving liquid crystal in a liquid crystal electro-optical device,
Mainly mounted on a glass epoxy printed circuit board in the state of an IC. In this case, the connection between the electrodes of the printed circuit board on which the package IC is mounted and the electrodes formed on the liquid crystal panel is made, for example, by FPC (Flexible Print Circuit).
uit).
最近になってTAB（Tape Automated Bonding）法も用
いられてきた。これは、Cu等で配線が形成されたポリイ
ミドフィルム上に、パッド部にバンプが形成された半導
体チップをフェイスダウンボンディング（ILB:Inner Le
ad Bondingという）して、さらに前記フィルムと液晶パ
ネルに作製されている電極とを接続する（OLB:Outer Le
ad Bondingという）方法である。Recently, a TAB (Tape Automated Bonding) method has also been used. This is achieved by face-down bonding (ILB: Inner Lead) a semiconductor chip with bumps formed on pads on a polyimide film on which wiring is formed with Cu or the like.
ad Bonding) and connect the film to the electrodes fabricated on the liquid crystal panel (OLB: Outer Le
ad Bonding).
また液晶パネルを構成する基板上に半導体チップを直
接搭載する方法もある。例えば、液晶パネルを構成する
基板上に、半導体チップへ信号を入力させるための配線
と半導体チップからの出力信号を液晶パネルの表示部の
電極へ供給するための配線を形成し、該配線と半導体チ
ップとをAuワイヤーを用いてワイヤーボンディングする
方法または、ICチップのパッド部にバンプを形成し、前
記配線とフェイスダウンボンディングを行う方法等もあ
る。There is also a method of directly mounting a semiconductor chip on a substrate constituting a liquid crystal panel. For example, a wiring for inputting a signal to a semiconductor chip and a wiring for supplying an output signal from the semiconductor chip to an electrode of a display portion of the liquid crystal panel are formed on a substrate constituting a liquid crystal panel, and the wiring and the semiconductor are formed. There are also a method of performing wire bonding with the chip using an Au wire, and a method of forming a bump on a pad portion of an IC chip and performing face-down bonding with the wiring.
しかしながら上記の方法のうち、ガラスエポキシのプ
リント基板上にパッケージICを搭載し、該プリント基板
と液晶パネルとをFPCを用いて接続する方法は、パッケ
ージICが大きい上にそれを重いガラスエポキシのプリン
ト基板上に配置するため、液晶電気光学装置の「軽い」
という利点が生かされないばかりでなく、プリント基板
と液晶パネルとを接続させるためにFPCを用いるので、
一方でFPCにプリント基板の接続、他方でFPCと液晶パネ
ルの接続を行わなければならず、接続する配線の本数の
２倍の個所の接続が必要なため、歩留まりも低下する。However, among the above methods, the method of mounting a package IC on a glass epoxy printed circuit board and connecting the printed circuit board and the liquid crystal panel using an FPC is based on the fact that the package IC is large and the heavy glass epoxy printed circuit board is used. "Light" of liquid crystal electro-optical device because it is placed on the substrate
Not only is the advantage not taken advantage of, but also because the FPC is used to connect the printed circuit board and the liquid crystal panel,
On the one hand, the connection of the printed circuit board to the FPC must be performed, and on the other hand, the connection of the FPC and the liquid crystal panel must be performed. This requires connection at twice the number of wires to be connected, and the yield is reduced.
またTAB法においては、液晶駆動用半導体素子を配置
するプリント基板を必要としないので、「軽さ」の面で
は改善されているが、ポリイミドテープが非常に高価に
なってしまうため好ましくない。Further, the TAB method does not require a printed circuit board on which a liquid crystal driving semiconductor element is disposed, and thus is improved in terms of “lightness”, but is not preferable because a polyimide tape becomes very expensive.
また液晶パネルを搭載する基板上に半導体チップを搭
載する場合には、半導体チップと配線との接続工程の製
造歩留まりと液晶パネル自体の歩留まりとの積が液晶電
気光学装置全体の製造歩留まりとなるため、全体の製造
歩留まりの低下が著しく、好ましくない。Also, when a semiconductor chip is mounted on a substrate on which a liquid crystal panel is mounted, the product of the manufacturing yield of the connection step between the semiconductor chip and the wiring and the yield of the liquid crystal panel itself is the manufacturing yield of the entire liquid crystal electro-optical device. In addition, the overall production yield significantly decreases, which is not preferable.
上記問題点を解決するため本発明は、液晶電気光学装
置の液晶を駆動させるための半導体チップが、液晶パネ
ルを構成する第1,第２の一対の基板とは別の第３の基板
上に搭載されていて、半導体チップが搭載された基板上
の配線と、液晶パネルを構成する基板上の配線とが接続
されていることを特徴とする。In order to solve the above problems, the present invention provides a liquid crystal electro-optical device, in which a semiconductor chip for driving liquid crystal is provided on a third substrate different from the first and second pair of substrates constituting the liquid crystal panel. The semiconductor device is characterized in that the wiring on the substrate on which the semiconductor chip is mounted and the wiring on the substrate constituting the liquid crystal panel are connected.
本発明においては液晶を駆動させるため、パッケージ
された半導体素子ではなく半導体チップを用いるため、
該チップを搭載するためのガラスエポキシのプリント基
板は必要でなく、そのため「軽い」という液晶電気光学
装置の特長を生かすことができる。In the present invention, a semiconductor chip is used instead of a packaged semiconductor element to drive a liquid crystal,
A glass epoxy printed circuit board for mounting the chip is not required, and therefore, the "light" feature of the liquid crystal electro-optical device can be utilized.
さらに本発明においてはTAB法のような高価なポリイ
ミドテープを必要としないので、安価に液晶電気光学装
置を作製することができる。Further, in the present invention, an expensive polyimide tape unlike the TAB method is not required, so that a liquid crystal electro-optical device can be manufactured at low cost.
また本発明において、半導体チップが搭載された基板
上の配線と液晶パネルを構成する基板上の配線とを接続
する方法としては、例えば導電性微粒子を混合した紫外
線硬化接着剤を基板間に介在せしめ、圧力を加えながら
紫外線を照射して接続を行う方法、異方性導電ゴムを用
いる方法等がある。Further, in the present invention, as a method of connecting the wiring on the substrate on which the semiconductor chip is mounted and the wiring on the substrate constituting the liquid crystal panel, for example, an ultraviolet curing adhesive mixed with conductive fine particles is interposed between the substrates. And a method in which connection is made by irradiating ultraviolet rays while applying pressure, and a method using anisotropic conductive rubber.
さらに本発明においては、液晶パネルを構成する基板
と半導体チップを搭載する基板とを別々に作製したた
め、半導体チイップ基板上の配線と接続した後、液晶パ
ネルとの接続を行う前に半導体チップと配線との接続に
ついて電気テストを行う工程を設けることができ、その
結果半導体チップの接続が完全でないものについて液晶
パネルとの接続を行う必要がなくなるので、歩留りが大
幅に上昇する。Further, in the present invention, since the substrate constituting the liquid crystal panel and the substrate on which the semiconductor chip is mounted are separately manufactured, the semiconductor chip is connected to the wiring on the semiconductor chip substrate before the connection with the liquid crystal panel. A step of conducting an electrical test for connection with the semiconductor chip can be provided. As a result, if the connection of the semiconductor chip is not perfect, there is no need to connect to the liquid crystal panel, so that the yield greatly increases.
以下、実施例を示し本発明を説明する。 Hereinafter, the present invention will be described with reference to examples.
〔実施例１〕 本実施例においては、導電性微粒子を用いて半導体チ
ップを搭載させた基板上の配線と液晶パネルを構成する
基板上の配線とを接続させた場合について第１図
（ａ），（ｂ）を用いて説明する。なお第１図（ａ）は
本実施例によって作製された液晶電気光学装置の全体の
概略図，第１図（ｂ）はその液晶パネルと液晶駆動用半
導体チップを搭載した第３の基板との接続部を示す断面
の概略図である。Example 1 In this example, FIG. 1 (a) shows a case in which conductive fine particles are used to connect a wiring on a substrate on which a semiconductor chip is mounted and a wiring on a substrate constituting a liquid crystal panel. , (B). FIG. 1 (a) is a schematic view of the entire liquid crystal electro-optical device manufactured according to the present embodiment, and FIG. 1 (b) is a view of the liquid crystal panel and the third substrate on which a liquid crystal driving semiconductor chip is mounted. It is the schematic of the cross section which shows a connection part.
まず液晶パネルを作製する。 First, a liquid crystal panel is manufactured.
第１の基板（１）として1.1mm厚のソーダガラス上にD
Cマグネトロンスパッタ法を用いてITO（Indium Tin Oxi
de）を1200Å成膜した。そして公知のフォトリソグラフ
ィーを用いて640本のストライプ状の電極（９）を作製
する。そして第２の基板（２）として同様に1.1mm厚の
ソーダガラス上にITOを1200Å成膜し、フォトリソグラ
フィーにより400本の電極を作製する。その後、第1,第
２の基板上にポリアミック酸をオフセット印刷法を用い
て塗布し、クリーンオーブン中で350℃３時間の加熱を
行いポリイミド薄膜を得る。そして第１の基板（１）上
のポリイミド薄膜形成面を綿布を用いてラビング処理し
た後、スペーサーとして直径８μｍのSiO2粒子を散布し
た。第２の基板（２）上にはスクリーン印刷機を用いて
エポキシ系の接着剤を印刷した。そして第1,第２の基板
を貼りあわせた後、液晶を公知の真空注入法により注入
して液晶の注入口を紫外線硬化接着剤を用いてシールし
た。これで液晶パネルは完成した。D on a 1.1 mm thick soda glass as the first substrate (1)
ITO (Indium Tin Oxi) using C magnetron sputtering
de) was formed into a 1200Å film. Then, 640 stripe-shaped electrodes (9) are formed by using known photolithography. Then, similarly, as the second substrate (2), an ITO film having a thickness of 1200 mm is formed on soda glass having a thickness of 1.1 mm, and 400 electrodes are formed by photolithography. Thereafter, polyamic acid is applied on the first and second substrates by using an offset printing method, and heated at 350 ° C. for 3 hours in a clean oven to obtain a polyimide thin film. Then, the surface of the first substrate (1) on which the polyimide thin film was formed was rubbed with a cotton cloth, and then SiO 2 particles having a diameter of 8 μm were sprayed as spacers. An epoxy adhesive was printed on the second substrate (2) using a screen printer. Then, after bonding the first and second substrates, liquid crystal was injected by a known vacuum injection method, and the injection port of the liquid crystal was sealed using an ultraviolet curing adhesive. This completes the liquid crystal panel.
次に、液晶駆動用ICチップ搭載用基板の作製について
説明する。Next, the production of a substrate for mounting an IC chip for driving a liquid crystal will be described.
第３の基板（３）として、幅50mm,長さ270mm,厚さ1.1
mmのソーダガラス上にITOを成膜した後、フォトリソで
配線（19）を作製する。そして該配線上にNiメッキを行
いさらにAuメッキを行った。この配線は半導体チップ
（５）に信号を入力するための配線（図示しない）と半
導体チップ（５）からの出力信号を液晶パネルに伝える
ための配線とからなっている。As the third substrate (3), width 50 mm, length 270 mm, thickness 1.1
After forming an ITO film on soda glass of mm, the wiring (19) is made by photolithography. Then, Ni plating was performed on the wiring, and further, Au plating was performed. The wiring is composed of a wiring (not shown) for inputting a signal to the semiconductor chip (5) and a wiring for transmitting an output signal from the semiconductor chip (5) to the liquid crystal panel.
そして、パッド部にAuバンプが形成された液晶駆動用
の半導体チップ（５）を接続する。この接続方法は、デ
ィスペンス法を用いて紫外線硬化接着剤を半導体チップ
上に滴下して、配線とバンプとの位置合わせを行った
後、１バンプあたり95gの圧力を印加した状態で150℃に
加熱して３分間紫外線を照射する。この方法により必要
な数の半導体チップと配線をコモン電極側、データ電極
側ともに接続した。Then, a semiconductor chip (5) for driving a liquid crystal having an Au bump formed on the pad portion is connected. In this connection method, an ultraviolet curing adhesive is dropped on a semiconductor chip using a dispensing method, the wiring is aligned with the bump, and then heated to 150 ° C. while applying a pressure of 95 g per bump. For 3 minutes. By this method, a necessary number of semiconductor chips and wirings were connected to both the common electrode side and the data electrode side.
ここで、半導体チップの接続に関しての電気テストを
行った。Here, an electrical test regarding the connection of the semiconductor chips was performed.
そして、基板上に配置したすべての半導体チップにつ
いて、完全に接続が行われているものについてのみ液晶
パネルを接続する。その方法として本実施例において
は、まず液晶パネルの第１の基板上であって第２の基板
と重なっていない部分（４）に形成された配線上に、導
電性微粒子（６）と導電性微粒子（６）よりやや小さい
微粒子（７）を混合した紫外線硬化接着剤（８）をディ
スペンス法により塗布した後、液晶パネル上の接着剤が
塗布された部分の配線と、半導体チップを搭載した基板
上の配線とが向かい合うように重ね、約2.4kg/cm2の圧
力を加えながら紫外線を３分間照射した。ここで用いた
導電性微粒子（６）は直径7.5μｍのポリスチレン粒子
にAuメッキを1000Å施したものである。また導電性微粒
子（６）よりやや小さい微粒子（７）としては直径５μ
ｍのSiO2粒子である。また紫外線硬化接着剤（８）と導
電性微粒子（６）と微粒子（７）の混合比は重量比で10
7:14:4である。Then, with respect to all the semiconductor chips arranged on the substrate, the liquid crystal panels are connected only to those that are completely connected. In this embodiment, as the method, first, conductive fine particles (6) and conductive fine particles (6) are formed on the wiring formed on the first substrate (4) of the liquid crystal panel which does not overlap with the second substrate. An ultraviolet curing adhesive (8) mixed with fine particles (7) slightly smaller than the fine particles (6) is applied by a dispensing method, and then the wiring on the liquid crystal panel where the adhesive is applied and a substrate on which a semiconductor chip is mounted The wiring was superposed so as to face the upper wiring, and irradiated with ultraviolet rays for 3 minutes while applying a pressure of about 2.4 kg / cm 2 . The conductive fine particles (6) used here are obtained by subjecting polystyrene particles having a diameter of 7.5 μm to Au plating at 1000 μm. The fine particles (7) slightly smaller than the conductive fine particles (6) have a diameter of 5 μm.
m 2 SiO 2 particles. The mixing ratio of the ultraviolet curing adhesive (8), the conductive fine particles (6) and the fine particles (7) is 10% by weight.
7: 14: 4.
この後、−30℃,70℃（各１時間）の条件で熱ショッ
ク試験を行ったが、接続直後と同様全く不良は見られな
かった。Thereafter, a heat shock test was performed at -30 ° C. and 70 ° C. (1 hour each), but no defect was observed at all, just as in the case immediately after connection.
なお、液晶パネルの配線と半導体チップを搭載した基
板上の配線との接続の際には、導電性微粒子のみの使用
でも十分可能であるが、本実施例のように２種類の微粒
子を用いたほうがより確実な接続ができる。When connecting the wiring of the liquid crystal panel and the wiring on the substrate on which the semiconductor chip is mounted, it is possible to use only the conductive fine particles. However, as in this embodiment, two types of fine particles are used. A more secure connection is possible.
本実施例において作製された液晶電気光学装置は、半
導体チップをガラス基板上に搭載したのでガラスエポキ
シのプリント基板を必要とせず非常に軽く、さらに半導
体チップを搭載する基板と液晶パネルを構成する基板と
が別であるため、半導体チップが完全に接続されている
もののみ液晶パネルとの接続を行行うことができ、製造
歩留りが大幅に上昇した。The liquid crystal electro-optical device manufactured in this embodiment has a semiconductor chip mounted on a glass substrate, so that it does not require a glass epoxy printed circuit board, is very light, and furthermore, a substrate on which the semiconductor chip is mounted and a substrate constituting a liquid crystal panel. Therefore, only the semiconductor chip that is completely connected can be connected to the liquid crystal panel, and the manufacturing yield has increased significantly.
さらに本実施例においては、一本の配線の接続につい
て接続個所が１ヵ所で良いのでFPCを用いた場合に比較
して工程が簡略化できる上に製造歩留りも上昇する。Further, in the present embodiment, since only one connection point is required for connection of one wiring, the process can be simplified and the production yield increases as compared with the case where FPC is used.
〔実施例２〕 実施例１と全く同様に作製した液晶パネルと半導体チ
ップを搭載した基板との接続の際に、第２図に示すよう
に、液晶パネルのコモン電極側と接続した基板と、液晶
パネルのデータ電極側と接続した基板とをそれらの交差
部（10）において紫外線硬化接着剤を用いて接着するこ
とにより、実施例１の場合と比較して比較的強度にも優
れた液晶電気光学装置を作製することができた。Example 2 When connecting a liquid crystal panel manufactured in exactly the same manner as in Example 1 to a substrate on which a semiconductor chip was mounted, as shown in FIG. 2, a substrate connected to the common electrode side of the liquid crystal panel, By bonding the substrate connected to the data electrode side of the liquid crystal panel to the substrate at the intersection (10) thereof using an ultraviolet-curing adhesive, the liquid crystal panel has a comparatively superior strength as compared with the first embodiment. An optical device could be manufactured.
本実施例において交差部（10）で接着することができ
たのは、液晶パネルのコモン電極側基板と、データ電極
側基板に接続した半導体チップが搭載された基板とが同
一平面を形成し、さらに液晶パネルのデータ電極側基板
と、コモン電極側基板に接続した半導体チップが搭載さ
れた基板とが同一平面を形成するからである。そのた
め、第３図のように液晶パネルを構成する一方の基板と
半導体チップを搭載する基板とをまたぐように１枚の基
板（18）を接着することができ、こうすることによりさ
らに機械的強度を上昇させることができる。In the present embodiment, what can be bonded at the intersection (10) is that the common electrode side substrate of the liquid crystal panel and the substrate on which the semiconductor chip connected to the data electrode side substrate is mounted form the same plane, Further, the data electrode side substrate of the liquid crystal panel and the substrate on which the semiconductor chip connected to the common electrode side substrate is mounted form the same plane. Therefore, as shown in FIG. 3, one substrate (18) can be bonded so as to straddle one substrate constituting the liquid crystal panel and the substrate on which the semiconductor chip is mounted, thereby further increasing the mechanical strength. Can be raised.
なお、第３図において基板（18）は半導体チップを搭
載した２枚の基板のうちの一方の基板と基板（１）との
間にのみ記載されているが、半導体チップを搭載した他
方の基板と基板（２）の間にも同様に設けている。In FIG. 3, the substrate (18) is shown only between one of the two substrates on which the semiconductor chip is mounted and the substrate (1), but the other substrate on which the semiconductor chip is mounted is shown. It is similarly provided between the substrate and the substrate (2).
基板（18）は、液晶パネルと半導体チップを搭載した
基板との接続部の補強材としているので、その材質につ
いては特に指定しない。形状も補強材としての役割を果
たすことができる程度であれば十分であり、特に指定す
るものではない。Since the substrate (18) is used as a reinforcing material for a connecting portion between the liquid crystal panel and the substrate on which the semiconductor chip is mounted, its material is not particularly specified. It is sufficient that the shape can also serve as a reinforcing material, and there is no particular designation.
本参考例については第４図を用いて説明する。 This reference example will be described with reference to FIG.
実施例１と同様に作製した液晶パネル上の配線と半導
体チップの搭載された第３の基板上の配線とをFPC（1
1）を用いて接続した。The wiring on the liquid crystal panel manufactured in the same manner as in Example 1 and the wiring on the third substrate on which the semiconductor chip is mounted are connected to the FPC (1
Connected using 1).
この方法は、液晶パネルを構成する基板のうちの一方
の基板（12）上の電極（13）とFPC（11）に形成されて
いるCu配線（15）とを異方性導電性（14）によって接続
している。なお接続の際には、200℃で30kg/cm2の圧力
を加え８秒間熱圧着を行った。In this method, the electrode (13) on one of the substrates (12) constituting the liquid crystal panel and the Cu wiring (15) formed on the FPC (11) are connected to the anisotropic conductive film (14). Connected by At the time of connection, a pressure of 30 kg / cm 2 was applied at 200 ° C. and thermocompression bonding was performed for 8 seconds.
さらに、半導体チップを搭載する基板上の配線（16）
とFPC（11）に形成されているCu配線（15）も同様に接
続した。In addition, wiring on the substrate on which the semiconductor chip is mounted (16)
And the Cu wiring (15) formed on the FPC (11) were connected in the same manner.
本参考例ではFPCを用いたため、接続個所が接続する
配線の本数の２倍になってしまったが、実施例1,実施例
２と同様に軽く、歩留りの高い液晶電気光学装置を作製
することができた。In this reference example, the number of wirings to be connected was twice as large because of the use of the FPC in the present embodiment. Was completed.
以上述べたように本発明を用いることにより、軽量で
安価，なおかつ歩留りの高い液晶電気光学装置を作製す
ることができる。As described above, by using the present invention, a liquid crystal electro-optical device that is lightweight, inexpensive, and has a high yield can be manufactured.
第１図（ａ），第２図，第３図は本発明を用いた場合の
液晶電気光学装置の全体の概略図を示す。 第１図（ｂ）は本発明を用いた場合の液晶電気光学装置
の接続部の断面の概略を示す。 第４図は参考例の液晶電気光学装置の接続部の断面の概
略を示す。 1,2,3……基板 ５……半導体チップ ６……導電性微粒子 ７……微粒子 ８……紫外線硬化接着剤 11……FPCFIGS. 1 (a), 2 and 3 are schematic views of the whole liquid crystal electro-optical device when the present invention is used. FIG. 1B schematically shows a cross section of a connection portion of the liquid crystal electro-optical device when the present invention is used. FIG. 4 schematically shows a cross section of a connection portion of a liquid crystal electro-optical device according to a reference example. 1,2,3 ... substrate 5 ... semiconductor chip 6 ... conductive fine particles 7 ... fine particles 8 ... ultraviolet curing adhesive 11 ... FPC
Claims (4)
在させた液晶電気光学装置であって、 液晶を駆動させるための第１の半導体チップ及び配線が
配置された第３の基板を有し、 前記第１の基板上に配置された配線と前記第３の基板に
配置された配線とは、導電性微粒子と該導電性微粒子よ
り径の小さい微粒子とを含む接着剤により電気的に接続
され、 前記第１の半導体チップは、前記第１の基板の端面の外
側に位置するように前記第３の基板上に配置されてお
り、 前記第３の基板は前記第２の基板と実質的に同一平面と
されていることを特徴とする液晶電気光学装置。1. A liquid crystal electro-optical device having a liquid crystal interposed between a first and a second pair of substrates, wherein a third semiconductor chip for driving the liquid crystal and a wiring are arranged. A wiring provided on the first substrate and a wiring provided on the third substrate are electrically connected to each other by an adhesive containing conductive fine particles and fine particles having a smaller diameter than the conductive fine particles. The first semiconductor chip is disposed on the third substrate so as to be located outside an end face of the first substrate, and the third substrate is the second substrate A liquid crystal electro-optical device, wherein the liquid crystal electro-optical device is substantially coplanar.
が、前記第２の基板の外側表面及び前記第３の基板の外
側表面に接して配置されていることを特徴とする電気光
学装置。2. The electro-optical device according to claim 1, wherein the reinforcing member is disposed in contact with an outer surface of the second substrate and an outer surface of the third substrate. .
電気光学装置は、第２の半導体チップ及び配線が配置さ
れた第４の基板を有し、前記第２の基板上に配置された
配線と、前記第４の基板に配置された配線とは、導電性
微粒子と該導電性微粒子より径の小さい微粒子とを含む
接着剤により電気的に接続され、前記第２の半導体チッ
プは、前記第２の基板の端面の外側に位置するように前
記第４の基板上に配置されており、前記第４の基板は実
質的に第１の基板と同一平面とされていることを特徴と
する液晶電気光学装置。3. The liquid crystal electro-optical device according to claim 1, wherein the liquid crystal electro-optical device has a fourth substrate on which a second semiconductor chip and a wiring are disposed, and is disposed on the second substrate. The wiring and the wiring arranged on the fourth substrate are electrically connected to each other by an adhesive containing conductive fine particles and fine particles having a smaller diameter than the conductive fine particles. It is arranged on the fourth substrate so as to be located outside the end face of the second substrate, and the fourth substrate is substantially flush with the first substrate. Liquid crystal electro-optical device.
の基板と前記第４の基板は互いに直交して、端部が重な
るように配置され、基板が重なった前記端部は、前記液
晶電気光学装置の機械的強度を補強するように、結合さ
れていることを特徴とする液晶電気光学装置。4. The method according to claim 3, wherein
The fourth substrate and the fourth substrate are arranged so as to be orthogonal to each other and have ends overlapping each other, and the ends where the substrates overlap are joined so as to reinforce the mechanical strength of the liquid crystal electro-optical device. A liquid crystal electro-optical device.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226664A JP2893070B2 (en) | 1989-09-01 | 1989-09-01 | Liquid crystal electro-optical device |
| US07/575,442 US5130833A (en) | 1989-09-01 | 1990-08-30 | Liquid crystal device and manufacturing method therefor |
| US07/851,659 US5710612A (en) | 1989-09-01 | 1992-03-16 | Liquid crystal device and manufacturing method therefor with anisotropic conductive adhesive connecting glass substrate and glass auxiliary substrate |
| US08/962,448 US6404476B1 (en) | 1989-09-01 | 1997-10-31 | Device having an improved connective structure between two electrodes |
| US09/988,408 US6956635B2 (en) | 1989-09-01 | 2001-11-19 | Liquid crystal device and manufacturing method therefor |
| US11/250,426 US20060033873A1 (en) | 1989-09-01 | 2005-10-17 | Liquid crystal device and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226664A JP2893070B2 (en) | 1989-09-01 | 1989-09-01 | Liquid crystal electro-optical device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8021779A Division JP2995390B2 (en) | 1996-01-12 | 1996-01-12 | Liquid crystal electro-optical device |
| JP8163744A Division JP2995392B2 (en) | 1996-06-03 | 1996-06-03 | Liquid crystal electro-optical device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0389321A JPH0389321A (en) | 1991-04-15 |
| JP2893070B2 true JP2893070B2 (en) | 1999-05-17 |
Family
ID=16848725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1226664A Expired - Fee Related JP2893070B2 (en) | 1989-09-01 | 1989-09-01 | Liquid crystal electro-optical device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2893070B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0572546A (en) * | 1991-09-18 | 1993-03-26 | Sanyo Electric Co Ltd | Display device |
| JPH0527726U (en) * | 1991-09-18 | 1993-04-09 | 三洋電機株式会社 | Display device |
| JPH05249483A (en) * | 1992-03-05 | 1993-09-28 | Sharp Corp | Liquid crystal display device |
| DE4209072A1 (en) * | 1992-03-20 | 1993-09-23 | Licentia Gmbh | Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated |
| JP5125346B2 (en) * | 2007-09-19 | 2013-01-23 | セイコーエプソン株式会社 | Electronic device, method for manufacturing electronic device, electro-optical device, and electronic apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823612B2 (en) * | 1977-06-29 | 1983-05-16 | エプソン株式会社 | Manufacturing method of LCD panel |
| JPS6294379U (en) * | 1985-12-03 | 1987-06-16 | ||
| JPS63284591A (en) * | 1987-05-15 | 1988-11-21 | 松下電器産業株式会社 | Display panel module |
| JPH01281487A (en) * | 1988-05-07 | 1989-11-13 | Seiko Epson Corp | Display body |
-
1989
- 1989-09-01 JP JP1226664A patent/JP2893070B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0389321A (en) | 1991-04-15 |
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