DE4209072A1 - Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated - Google Patents

Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated

Info

Publication number
DE4209072A1
DE4209072A1 DE4209072A DE4209072A DE4209072A1 DE 4209072 A1 DE4209072 A1 DE 4209072A1 DE 4209072 A DE4209072 A DE 4209072A DE 4209072 A DE4209072 A DE 4209072A DE 4209072 A1 DE4209072 A1 DE 4209072A1
Authority
DE
Germany
Prior art keywords
liquid crystal
crystal display
conductor tracks
adhesive
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4209072A
Other languages
German (de)
Inventor
Thomas Dr Rer Nat Bitter
Gernot Dr Rer Nat Schauer
Volker Dipl Phys Wenhold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE4209072A priority Critical patent/DE4209072A1/en
Publication of DE4209072A1 publication Critical patent/DE4209072A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

A liquid crystal display has a liquid crystal layer between two cover plates, one of which is glass and is larger than the other; the projecting part of the latter has conductors which are connected to those of another circuit in the form of a PCB with integrated circuits; the connections between the conductors on the projecting part of the glass plate and those on the PCB are made by means of conducting particles embedded in an anisotropic adhesive which is cured in u/v. A preferred adhesive is an epoxy resin. The cross-section shown has a glass plate (1) with a number of segment electrodes (3), a smaller pref. glass back plate (2) with its electrode (5), and the projecting part (1a) of the first plate (1). This projection (1a) has the connections (3a) from the liquid crystal to the segment electrodes (3). The back plate (2) is bonded to the front plate (1) along a seal (6) to enclose the liquid crystal layer (4). The electrodes (3,5) and leads (3a) are conventional indium-tin oxide. The control circuits (12) are on a special PCB (13). The leads (7,3a) are connected in the anisotropic adhesive (8) cured in UV and containing conducting particles (9), which are e.g. externally metallised elastic microspheres. USE/ADVANTAGE - The system has minimum stresses on the bonds because they are not subjected to high temps. The absence of heating also simplifies the procedure.

Description

Die vorliegende Erfindung betrifft eine Flüssigkristall- Anzeigeanordnung nach dem Oberbegriff des Patentanspruches 1.The present invention relates to a liquid crystal Display arrangement according to the preamble of the claim 1.

Eine solche Anzeigeanordnung ist z. B. aus der DE-OS 40 35 360 bekannt. Die Befestigung der Schaltkreise auf den Lei­ terbahnen auf dem überstehenden Teil der einen Deckplatte erfolgt dabei durch Löten oder mit anisotropen leitfähigen Klebern durch Thermokompression. Derartige Verbindungs­ techniken zur Herstellung elektrisch leitfähiger Verbin­ dungen führen bei der Herstellung zu Temperaturbelastungen der Flüssigkristallzelle und erfordern erhöhte technische Anforderungen an die Produktionsmittel.Such a display arrangement is e.g. B. from DE-OS 40 35 360 known. Fastening the circuits on the Lei tracks on the protruding part of one cover plate is done by soldering or with anisotropic conductive Glue through thermocompression. Such connection techniques for producing electrically conductive connections doses lead to temperature loads during manufacture the liquid crystal cell and require increased technical Requirements for the means of production.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, eine die Flüssigkristalle weniger belastende elektrische Verbindungstechnik anzugeben, die auch an die Produktions­ mittel verringerte Anforderungen stellt.The present invention is based on the object an electrical load that less stresses the liquid crystals Specify connection technology that also applies to the production moderately reduced requirements.

Diese Aufgabe wird durch die im Kennzeichen des Pa­ tentanspruches 1 angegebenen Merkmale gelöst. Weitere Aus­ gestaltungen der Erfindung sind in den Unteransprüchen an­ gegeben. Vorteile der Erfindung werden darin gesehen, daß bei der Verbindung der Leiterbahnen der FK-Zelle mit den Leiterbahnen der Leiterplatte keine Temperaturen auftre­ ten, die die FK-Zelle schädigen könnten. Durch den Wegfall von Heizeinrichtungen vereinfachen sich die Produkti­ onsmittel. Die Entkopplung der FK-Zelle und des Ansteuer­ teils erbringt eine erhöhte Fertigungsausbeute.This task is carried out by the Pa Tent claim 1 specified features solved. Further out designs of the invention are in the dependent claims given. Advantages of the invention are seen in that when connecting the conductor tracks of the FK cell with the PCB conductor tracks no temperatures occur that could damage the LC cell. By dropping out of heating devices simplify the production onsmittel. The decoupling of the FK cell and the control sometimes results in an increased production yield.

Anhand des in den Fig. 1 und 2 schematisch dargestell­ ten Ausführungsbeispiels wird die Erfindung nachfolgend näher erläutert.The invention is explained in more detail below with reference to the exemplary embodiment schematically shown in FIGS. 1 and 2.

Die Fig. 1 zeigt ausschnittsweise einen Querschnitt und die Fig. 2 ausschnittsweise eine schematische Aufsicht. Fig. 1 shows a partial cross-sectional and Fig. 2 a section of a schematic top view.

Die eigentliche Flüssigkristall-Anzeigezelle (FK-Zelle) besteht aus der vorderen, dem Betrachter zugewandten glä­ sernen Deckplatte 1 mit einer Vielzahl von Segmentelektro­ den 3. Die Rückplatte 2, die vorzugsweise auch aus Glas besteht, trägt die Rückelelektrode 5 und ist zumindest auf einer Seite kleiner ausgebildet, so daß sich ein überste­ hender Teil 1a der Deckplatte 1 ergibt. Auf dem überste­ henden Teil 1a der Glasplatte 1 befinden sich die aus der FK-Zelle herausgeführten Zuleitungen 3a zu den Segment­ elektroden 3. Die Rückplatte 2 ist am Rand über eine Dich­ tungsnaht 6 mit der Frontplatte 1 verbunden, so daß die dazwischenliegende Flüssigkristallschicht 4 hermetisch eingeschlossen ist.The actual liquid crystal display cell (LC cell) consists of the front glass cover plate 1 facing the viewer 1 with a plurality of segment electrodes 3 . The back plate 2 , which is preferably also made of glass, carries the return electrode 5 and is made smaller at least on one side, so that there is a protruding part 1 a of the cover plate 1 . On the overlying part 1 a of the glass plate 1 there are the leads 3 a led out of the LC cell to the segment electrodes 3 . The back plate 2 is connected at the edge via a sealing seam 6 to the front plate 1 , so that the liquid crystal layer 4 in between is hermetically sealed.

Die Segmentelektroden 3, die herausgeführten Leitungsbah­ nen 3a auf der Frontplatte 1 bzw. deren Teil 1a, und die Rückelektrode 5 auf der hinteren Deckplatte 2 bestehen in an sich bekannter Weise aus sogenannten ITO-Schichten (In­ dium-tin-oxid), das sind weitgehend transparente und elek­ trisch leitende Schichten.The segment electrodes 3 , the lead-out wires 3 a on the front plate 1 or their part 1 a, and the back electrode 5 on the rear cover plate 2 consist in a manner known per se of so-called ITO layers (in dium-tin oxide), these are largely transparent and electrically conductive layers.

Die Ansteuerschaltkreise 12 befinden sich auf einer geson­ derten Leiterplatte 13 aus Glas, Kunststoff, Keramik oder einer flexiblen Folie, die Leiterbahnen 7 und 11 aufweist. Die Leiterbahnen 7 sind im Bereich der Verbindungen mit den Schaltkreisen 12 zweckmäßig durch weiter aufgebrachte Metallschichten 11 verstärkt. Eine elektrisch leitende Verbindung der Leiterbahnen 7 mit den Leiterbahnen 3a auf dem überstehenden Teil 1a der Deckplatte 1 erfolgt durch Kleben mit einem anisotropen Kleber 8 der durch UV-Strah­ lung aushärtbar ist.The control circuits 12 are located on a special printed circuit board 13 made of glass, plastic, ceramic or a flexible film which has conductor tracks 7 and 11 . The conductor tracks 7 are expediently reinforced in the area of the connections to the circuits 12 by further applied metal layers 11 . An electrically conductive connection of the conductor tracks 7 with the conductor tracks 3 a on the projecting part 1 a of the cover plate 1 is carried out by gluing with an anisotropic adhesive 8 which can be cured by UV radiation.

Der Kleber 8 ist bevorzugt ein UV-härtender Epoxykleber in den sporadisch verteilt Abstandsteilchen 10 und als Kon­ taktmaterial elastische Partikel 9 eingelagert sind. Die Distanzteilchen 10 bestehen bevorzugt aus Abschnitten von Rundstäben, deren Durchmesser ca. 1 µm bis 2 µm kleiner ist als der Durchmesser der leitenden Partikel 9.The adhesive 8 is preferably a UV-curing epoxy adhesive in the sporadically distributed spacer particles 10 and as a contact material elastic particles 9 are embedded. The spacer particles 10 preferably consist of sections of round rods whose diameter is approximately 1 μm to 2 μm smaller than the diameter of the conductive particles 9 .

Diese leitenden Partikel 9 bestehen zweckmäßig aus elasti­ schen Kügelchen, die an ihrem Umfang metallisiert sind. Zur Herstellung der elektrisch leitenden Verbindung wird die Kleberschicht mit den Teilchen 9 und 10 z. B. als brei­ ter Strich, wie aus Fig. 2 ersichtlich, auf die Leiter­ platte 13 oder den Teil 1a der Deckplatte 1 aufgebracht, dann das Gegenteil (13 oder 1a) aufgedrückt. Die festen Abstandsteilchen 10 definieren die Dicke der Kleberschicht 8. Die elastischen an ihrer Oberfläche leitenden Kügelchen deformieren sich etwas, da sie größer sind als die Ab­ standsteilchen 10 und bilden die elektrische Verbindung zwischen den sich gegenüberliegenden Leiterbahnenteilen 3a und 7, die in diesem Kontaktbereich vorzugsweise beide durchsichtige ITO-Schichten sind. Es kann nun also eine UV-Strahlung der Kleberschicht zugeführt werden, während die beiden Teile 1a und 13 zusammengedrückt werden. Der Kleber 8 wird durch die UV-Strahlung ausgehärtet und es ist eine dauerhafte elektrisch leitende Verbindung zwi­ schen den sich gegenüberliegenden Leiterbahnen 3a und 7 einerseits und eine mechanische Verbindung der Teile 13 und 1a andererseits hergestellt. Bei einem Ausführungsbei­ spiel besaßen die mit einem Metallüberzug versehenen elek­ trischen Partikel 9 einen Durchmesser von 9 µm und die Ab­ standsteilchen 10 einen Durchmesser von 7,5 µm. Die Breite des Kleberstreifens 8 betrug ca. 2mm.These conductive particles 9 suitably consist of elastic balls, which are metallized on their circumference. To produce the electrically conductive connection, the adhesive layer with the particles 9 and 10 z. B. as a broad line, as shown in Fig. 2, applied to the circuit board 13 or part 1 a of the cover plate 1 , then the opposite ( 13 or 1 a) pressed. The fixed spacer particles 10 define the thickness of the adhesive layer 8 . The elastic on their surface conductive spheres deform somewhat, since they are larger than the spacer particles from 10 and form the electrical connection between the opposite conductor track parts 3 a and 7 , which are preferably both transparent ITO layers in this contact area. UV radiation can now be supplied to the adhesive layer while the two parts 1 a and 13 are pressed together. The adhesive 8 is cured by the UV radiation and there is a permanent electrically conductive connection between the opposite conductor tracks 3 a and 7 on the one hand and a mechanical connection of the parts 13 and 1 a on the other. In an exemplary embodiment, the metallic particles 9 provided with a metal coating had a diameter of 9 μm and the spacer particles 10 had a diameter of 7.5 μm. The width of the adhesive strip 8 was approximately 2 mm.

Die Leiterbahnen 7 auf der Leiterplatte 13 können außer aus ITO-Schichten auch aus anderen elektrisch leitenden Schichten wie z. B. aus Gold bestehen und müssen nicht not­ wendigerweise transparent sein.The conductor tracks 7 on the circuit board 13 can be made of ITO layers as well as other electrically conductive layers such as. B. consist of gold and need not necessarily be transparent.

Claims (8)

1. Flüssigkristall-Anzeigeanordnung mit einer zwischen zwei Deckplatten eingeschlossenen Flüssigkristallschicht, wobei zumindest eine Deckplatte aus Glas besteht, auf ei­ ner Seite größer ist als die andere Deckplatte und auf ih­ rem überstehenden Teil aus dem Inneren der Flüssigkri­ stallzelle herausgeführte Leiterbahnen aufweist, die mit Leiterbahnen eines anderen Schaltungsteiles elektrisch leitend verbunden sind, dadurch gekennzeichnet, daß das andere Schaltungsteil eine Leiterplatte (13) ist, die mit auf ihr befindlichen Leiterbahnen (7, 11) elektrisch lei­ tend verbundene integrierte Schaltkreise (12) und derglei­ chen aufweist, und daß die elektrisch leitenden Verbindun­ gen zwischen den Leiterbahnen (3a) auf dem überstehenden Glasplattenteil (1a) und den Leiterbahnen (7) auf der Lei­ terplatte (13) mittels eines durch UV-Strahlung gehärte­ ten, anisotropen Klebers (8) mit eingelagerten elektrisch leitenden Partikeln (8) vorgenommen sind.1. Liquid crystal display arrangement with a liquid crystal layer enclosed between two cover plates, wherein at least one cover plate is made of glass, is larger on one side than the other cover plate and has protruding conductors on its protruding part from the interior of the liquid crystal cell that have conductor tracks of another circuit part are electrically conductively connected, characterized in that the other circuit part is a printed circuit board ( 13 ) which, with conductor tracks ( 7 , 11 ) located thereon, has electrically connected integrated circuits ( 12 ) and the like, and that electrically conductive connections between the conductor tracks ( 3 a) on the protruding glass plate part ( 1 a) and the conductor tracks ( 7 ) on the Lei terplatte ( 13 ) by means of an UV-hardened anisotropic adhesive ( 8 ) with embedded electrically conductive Particles ( 8 ) are made. 2. Flüssigkristall-Anzeigeanordnung nach Anspruch 1, da­ durch gekennzeichnet, daß die elektrisch leitenden Klebe­ stellen (8) zwischen den Leiterbahnen (7, 3a) in den Kle­ ber eingelagerte kalibrierte Distanzteilchen (10) und an ihrer Oberfläche elektrisch leitende, elastische Kügelchen (9) aufweisen, wobei die Durchmesser der Kügelchen (9) größer sind, als das den Abstand zwischen den verbundenen Leiterbahnen (3a, 7) bestimmende Maß der Distanzteilchen (10).2. Liquid crystal display arrangement according to claim 1, characterized in that the electrically conductive adhesive ( 8 ) between the conductor tracks ( 7 , 3 a) in the adhesive via calibrated spacer particles ( 10 ) and on their surface electrically conductive, elastic beads (9), wherein the diameter of the beads (9) are larger than the distance between the interconnected conductors (3 a, 7) determining a measure of the spacer particles (10). 3. Flüssigkristall-Anzeigeanordnung nach Anspruch 1 oder Anspruch 2, dadurch gekennzeichnet, daß die Distanzteil­ chen (10) Rundstäbchen-Abschnitte sind.3. Liquid crystal display arrangement according to claim 1 or claim 2, characterized in that the spacer Chen ( 10 ) are round rod sections. 4. Flüssigkristall-Anzeigeanordnung nach einem der An­ sprüche 1 bis 3, dadurch gekennzeichnet, daß der Kleber (8) ein durch UV-Strahlung aushärtbarer Epoxykleber ist.4. Liquid crystal display arrangement according to one of claims 1 to 3, characterized in that the adhesive ( 8 ) is a UV-curable epoxy adhesive. 5. Flüssigkristall-Anzeigeanordnung nach einem der An­ sprüche 1 bis 4, dadurch gekennzeichnet, daß die Leiterbah­ nen (7) auf der Leiterplatte (13) zumindest im Kleberbe­ reich (8) aus ITO-Schichten bestehen.5. Liquid crystal display arrangement according to one of claims 1 to 4, characterized in that the printed circuit NEN ( 7 ) on the circuit board ( 13 ) at least in the adhesive region ( 8 ) consist of ITO layers. 6. Flüssigkristall-Anzeigevorrichtung nach einem der An­ sprüche 1 bis 5, dadurch gekennzeichnet, daß die Leiter­ bahnen (7, 11) auf der Leiterplatte (13) im Bereich der Verbindungen mit Schaltkreisen (12) verstärkt (11) sind. 6. Liquid crystal display device according to one of claims 1 to 5, characterized in that the conductor tracks ( 7 , 11 ) on the circuit board ( 13 ) in the area of connections with circuits ( 12 ) are reinforced ( 11 ). 7. Flüssigkristall-Anzeigevorrichtung nach einem der An­ sprüche 1 bis 4 oder Anspruch 6, dadurch gekennzeichnet, daß die Leiterbahnen (7) auf der Leiterplatte (13) aus elek­ trisch leitenden Metallschichten, wie z. B. Goldschichten bestehen.7. Liquid crystal display device according to one of claims 1 to 4 or claim 6, characterized in that the conductor tracks ( 7 ) on the circuit board ( 13 ) made of electrically conductive metal layers, such as. B. Gold layers exist. 8. Flüssigkristall-Anzeigevorrichtung nach Anspruch 2 oder 3, dadurch gekennzeichnet, daß die Dicke der Distanz­ teilchen (10) ca. 1-2µm geringer ist als der Durchmesser der leitenden Kügelchen (9).8. Liquid crystal display device according to claim 2 or 3, characterized in that the thickness of the spacer particles ( 10 ) is approximately 1-2µm less than the diameter of the conductive spheres ( 9 ).
DE4209072A 1992-03-20 1992-03-20 Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated Ceased DE4209072A1 (en)

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DE19510186C2 (en) * 1995-03-21 2003-12-24 Aeg Ges Moderne Inf Sys Mbh Method for connecting a flexible connecting element to a substrate
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