US20060033873A1 - Liquid crystal device and manufacturing method therefor - Google Patents
Liquid crystal device and manufacturing method therefor Download PDFInfo
- Publication number
- US20060033873A1 US20060033873A1 US11/250,426 US25042605A US2006033873A1 US 20060033873 A1 US20060033873 A1 US 20060033873A1 US 25042605 A US25042605 A US 25042605A US 2006033873 A1 US2006033873 A1 US 2006033873A1
- Authority
- US
- United States
- Prior art keywords
- electrode
- substrate
- conductive adhesive
- display device
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/69—Arrangements or methods for testing or calibrating a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Definitions
- the present invention relates to liquid crystal device and manufacturing method for the same.
- Liquid crystal devices have been broadly used. Particularly, due to their light weights and small sizes, many compact electric appliances such as compact electric calculators, watches, lap-top word processors and pocket television systems are provided with liquid crystal displays.
- the driving circuit of such a liquid crystal display has been formed in a separate printed board made of a glass epoxy substrate in which a semiconductor device such as a packaged IC is mounted.
- the electric connection is made through FPC (Flexible Print Circuit) between the printed board and inner electrodes formed in the insides surfaces of a pair of substrates in which a liquid crystal is disposed.
- FPC Flexible Print Circuit
- TAB Tepe Automated Bonding
- semiconductor chips provided with solder bumps on their contact pads are mounted on and electrically connected with Cu electrodes formed on a polyimide film by face-down bonding (ILB: Inner Lead Bonding), and then electrode strips formed on the substrates of a liquid crystal display are coupled respectively with counterpart electrode strips of the polyimide film (OLB: Outer Lead Bonding).
- ILB Inner Lead Bonding
- OLB Outer Lead Bonding
- the IC chips can be mounted directly on the substrates of a liquid crystal display.
- an electric circuit pattern for supplying driving signals to electrode strips of the substrates defining pixels of the liquid crystal display and control signals to the chips has to be formed in advance.
- the IC chips are connected to the pattern by means of Au wiring or bumps attached to the contact pads of the chips.
- a third substrate beside a pair of substrates sandwiching a liquid crystal layer therebeween.
- the third substrate is provided with IC chips for producing driving signals to be supplied to electrode arrangement formed on the inside surfaces of the pair of substrates.
- no epoxy print board is used and therefore the peculiar advantage of liquid crystal devices, i.e. the light weight, is not diminished.
- a method for electrically connecting the third substrate and the pair of substrates there are several examples such as a method making use of a UV light curable anisotropic conductive adhesive disposed between the third substrate and the respective substrates, a method making use of FPCs or a method making use of an anisotropic conductive rubber.
- liquid crystal panels and the circuit boards for producing driving signals are manufactured and tested separately and therefore inoperative boards can be eliminated in advance of assembling process of liquid crystal displays so that the yield is expected to substantially increase.
- FIG. 1 is a perspective view showing a liquid crystal display in accordance with an embodiment of the present invention.
- FIGS. 2 (A) and 2 (B) are plan views showing substrates formed with electrode strips for liquid crystal display.
- FIG. 3 is a partial cross sectional view showing electrical connection between substrates carrying electrode strips in accordance with the present invention.
- FIG. 4 is a perspective view showing a liquid crystal display in accordance with a modification of the embodiment of the present invention shown in FIG. 1 .
- FIG. 5 is a perspective view showing a liquid crystal display in accordance with another modification of the embodiment of the present invention.
- FIG. 6 is a perspective view showing a liquid crystal display in accordance with a further modification of the embodiment of the present invention.
- the liquid crystal display comprises a pair of glass substrates 1 and 2 between which a liquid crystal layer is disposed, and a pair of auxiliary substrates 3 carrying thereon a driving circuit for supplying driving signals to orthogonal electrode strips 9 arranged in the inside surfaces of the substrates 1 and 2 as shown in FIG. 1 .
- the auxiliary substrates 3 and the substrates 1 and 2 are connected respectively at their edges in order to establish electrical coupling between corresponding electrodes.
- the polyimide film on the first substrate is given rubbing treatment by means of a cotton cloth and SiO 2 fine particles of 8 ⁇ m diameter are dusted thereon as spacers.
- the second substrate is given an adhesive at its perimeter and joined to the first substrate.
- the inside space between the first and second substrates are filled with a liquid crystal material by a known vacuum injection.
- the opening, through which the liquid crystal material is injected, is then sealed off by an adhesive cured by ultraviolet rays.
- One side of each of the first and second substrates extends together with the electrode strips and is exposed beyond the other substrate in order to provide contacts for electrically connection with the driving circuits formed on the auxiliary substrates 3 as shown in FIG. 1 .
- the auxiliary substrates 3 are provided by depositing ITO films on 1.1 mm thick sodalime glass substrates of 50 mm width and 270 mm length.
- the ITO film is patterned by a known photolithography.
- the ITO pattern is then coated with Ni and thereafter with Au respectively by plating.
- the pattern includes contacts with which IC chips for producing driving signals are electrically connected.
- the connection of the chips and the contacts are made by applying Au bumps to contact pads of the chips, dripping a curable adhesive onto the rare surfaces of the chips and, after aligning the pads and the contacts of the substrate, exposing the adhesive to ultraviolet light under pressure of 95 g per bump at 150° C. for three minutes in order to harden the adhesive and fix the chips to the substrate.
- the driving circuits as manufactured as above on the substrate are tested at the outer leads with which the electrodes of a liquid crystal display should be connected for supplying driving signals in order to eliminate substrates carrying inoperative circuits.
- the electric connection between the first and second substrates 1 and 2 and the counterpart auxiliary substrates 3 respectively are done as follows.
- the extended inside surfaces of the first substrates 1 on which terminals of the respective electrodes are exposed are coated, by means of a dispenser, with an anisotropic conductive film.
- the adhesive film is made from a UV light curable adhesive 8 in which a number of resilient fine conductive particles 6 and hard particles 7 whose diameter is slightly smaller than that of the resilient particles are dispersed.
- the resilient particles are made from 7.5 ⁇ m thick polystylene spheres plated with a 1000 angstroms thick Au film.
- the hard particles are made from 5 ⁇ m thick SiO 2 spheres.
- the weight proportion among the adhesive, the resilient particles and the hard particles is 107:14:1.
- the first substrate 1 and the auxiliary substrates 3 are joined with the adhesive therebetween in order that the the terminals of the first substrate 1 and the corresponding contacts of the auxiliary substrate 3 are aligned to each other, and exposed to UV light for 3 minutes under pressure of about 2.4 kg/cm 2 .
- the hard particles are included in order to prevent the conductive resilient particles from being destroyed under excess pressure.
- the second substrate 2 is electrically connected with the other auxiliary substrate 3 in the same manner.
- First and second sodalime glass substrates of 1.1 mm thickness are coated with transparent conductive films such as ITO (Indium Tin Oxide) films by DC magnetron sputtering to a thickness of 1200 angstroms.
- the conductive films are patterned by means of laser pulses emitted from an excimer laser into a number of parallel electrode strips as shown in FIG. 2 (A).
- a liquid crystal panel is assembled in the same manner as the above embodiment except that the first and second substrates are provided with the electrode strips as illustrated in FIG. 2 (A) rather than FIG. 2 (B).
- a pair of auxiliary substrates are provided also in the same manner as the above embodiment.
- the electric connection between the first and second substrates 1 and 2 and the counterpart auxiliary substrates 3 respectively are done as follows.
- the extended inside surfaces of the first substrates 1 on which terminals of the respective electrodes are exposed are coated, by means of a dispenser, with an anisotropic conductive film.
- the adhesive film is made from a UV light curable adhesive 8 in which a number of resilient fine conductive particles 6 and hard particles 7 whose diameter is slightly smaller than that of the resilient particles are dispersed.
- the resilient particles are made from 2.5 ⁇ m thick polystylene spheres plated with a 1000 angstroms thick Au film.
- the hard particles are made from 2 ⁇ m thick SiO 2 spheres. The weight proportion among the adhesive, the resilient particles and the hard particles is 98:13:3.
- the first substrate 1 and the auxiliary substrates 3 are joined with the adhesive therebetween in order that the the terminals of the first substrate 1 and the corresponding contacts of the auxiliary substrate 3 are aligned to each other, and exposed to UV light for 3 minutes under pressure of about 2.4 kg/cm 2 .
- the hard particles are included in order to prevent the conductive resilient particles from being destroyed under excess pressure.
- the second substrate 2 is electrically connected with the other auxiliary substrate 3 in the same manner.
- FIGS. 1 and 2 A
- First and second sodalime glass substrates of 1.1 mm thickness are coated with transparent conductive films such as ITO (Indium Tin Oxide) films by DC magnetron sputtering to a thickness of 1200 angstroms.
- the conductive films are patterned by a known photolithography into a number of parallel electrode strips as shown in FIG. 2 (A).
- the number of electrode strips of the first substrate is 640 while that of the second is 400 since the shape of the substrates is rectangular and the electrode strips have to be orthogonally arranged when the substrates are joined in order to define pixels therebetween at the intersections of the orthogonal strips.
- the surfaces of the substrates provided with the electrodes are then coated with polyamic acid by the offset printing.
- the polyamic acid is then cured in a clean oven at 350° C. for three hours to form polyimide thin films.
- the polyimide film on the first substrate is given rubbing treatment by means of a cotton cloth and SiO 2 fine particles of 8 ⁇ m diameter are dusted thereon as spacers.
- the second substrate is given an adhesive at its perimeter and joined to the first substrate.
- the inside space between the first and second substrates are filled with a liquid crystal material by a known vacuum injection.
- the opening, through which the liquid crystal material is injected, is then sealed off by an adhesive cured by ultraviolet rays.
- each of the first and second substrates extends together with the electrode strips and is exposed beyond the other substrate in order to provide contacts for electrically connection with the driving circuits formed on the auxiliary substrates 3 as shown in FIG. 1 . Then, a pair of auxiliary substrates are provided, tested and coupled with the liquid crystal panel in the same manner as the above embodiment.
- FIG. 4 illustrates a modification of the embodiment illustrated in FIG. 1 .
- the liquid crystal panel is same as that of the first embodiment.
- One end of each auxiliary substrate 3 is formed to extend in order to join with the other substrate 3 .
- the extended ends of the substrates are fixed to each other by means of a UV light curable adhesive as shown in FIG. 4 . Since the distance between the joined ends of the substrates 3 equals the distance between the substrate 1 and 2 which are adhered in the same manner, this procedure can be naturally done without any dimmension disagreement.
- FIG. 5 illustrates another modification of the embodiment illustrated in FIG. 1 .
- the liquid crystal panel is same as that of the first embodiment.
- a reinforcement plate 18 is attached to the auxiliary substrate 3 and the substrate 2 astride the gap therebetween. Since the substrates 3 and 2 have their upper surfaces flush with each other, this procedure can be naturally done without any dimmension disagreement.
- FIG. 6 illustrates a further modification of the embodiment illustrated in FIG. 1 .
- the liquid crystal panel and the auxiliary substrates are same as that of the first embodiment.
- the connection therebetween is done through FPCs.
- the substrate 1 or 2 is coupled with an FPC 11 by means of an anisotropic conductive film 14 .
- the auxiliary substrate 3 is coupled with the FPC also by means of the anisotropic conductive film 14 .
- the conductive film 14 comprises a thermally curable adhesive which adheres the FPC 11 to the substrate by thermal treatment at 200° C. for 8 seconds under pressure of 30 kg/cm 2 .
- the electrodes of the substrates 1 and 2 are coupled with the corresponding electrodes 13 of the auxiliary substrates 3 respectively through Cu conductive strips 15 formed on the FPC 11 .
Abstract
A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.
Description
- 1. Field of the Invention
- The present invention relates to liquid crystal device and manufacturing method for the same.
- 2. Description of the Prior Art
- Liquid crystal devices have been broadly used. Particularly, due to their light weights and small sizes, many compact electric appliances such as compact electric calculators, watches, lap-top word processors and pocket television systems are provided with liquid crystal displays.
- The driving circuit of such a liquid crystal display has been formed in a separate printed board made of a glass epoxy substrate in which a semiconductor device such as a packaged IC is mounted. The electric connection is made through FPC (Flexible Print Circuit) between the printed board and inner electrodes formed in the insides surfaces of a pair of substrates in which a liquid crystal is disposed.
- Recently, TAB (Tape Automated Bonding) has been employed to make electric connection. In accordance with this method, semiconductor chips provided with solder bumps on their contact pads are mounted on and electrically connected with Cu electrodes formed on a polyimide film by face-down bonding (ILB: Inner Lead Bonding), and then electrode strips formed on the substrates of a liquid crystal display are coupled respectively with counterpart electrode strips of the polyimide film (OLB: Outer Lead Bonding).
- The IC chips can be mounted directly on the substrates of a liquid crystal display. In this case, an electric circuit pattern for supplying driving signals to electrode strips of the substrates defining pixels of the liquid crystal display and control signals to the chips has to be formed in advance. The IC chips are connected to the pattern by means of Au wiring or bumps attached to the contact pads of the chips.
- There are some shortcomings, however, in the above conventional technique. In the case using a glass epoxy board, the advantage of light weights claimed by liquid crystal display is largely diminished because of the heavy board. Furthermore, the use of the intermediary FPC is undesirable. There are two sites of connection at both ends of the FPC and therefore the frequency of occurrence of connection error is doubled. The difference between the FPC and the glass substrates of a liquid crystal display in thermal expansion coefficient becomes a cause of stress at the connection. This problem is also the case at the connection made in accordance with the TAB method. In addition, polyimide tape is expensive. In the case of the direct mounting of IC chips, the yield of production is the product of the yield of liquid crystal panel and the yield of the driving circuit and therefore the decrease of the whole yield is substantial.
- It is an object of the present invention to provide a light weight liquid crystal device.
- It is another object of the present invention to provide a method of manufacturing liquid crystal devices at a high yield.
- Additional objects, advantages and novel features of the present invention will be set forth in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following or may be learned by practice of the present invention. The object and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.
- To achieve the foregoing and other object, and in accordance with the present invention, as embodied and broadly described herein, there is provided a third substrate beside a pair of substrates sandwiching a liquid crystal layer therebeween. The third substrate is provided with IC chips for producing driving signals to be supplied to electrode arrangement formed on the inside surfaces of the pair of substrates. In accordance with the present invention, no epoxy print board is used and therefore the peculiar advantage of liquid crystal devices, i.e. the light weight, is not diminished.
- As a method for electrically connecting the third substrate and the pair of substrates, there are several examples such as a method making use of a UV light curable anisotropic conductive adhesive disposed between the third substrate and the respective substrates, a method making use of FPCs or a method making use of an anisotropic conductive rubber.
- Furthermore, in accordance with the present invention, the liquid crystal panels and the circuit boards for producing driving signals are manufactured and tested separately and therefore inoperative boards can be eliminated in advance of assembling process of liquid crystal displays so that the yield is expected to substantially increase.
- The accompanying drawings, which are incorporated in and form a part of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 1 is a perspective view showing a liquid crystal display in accordance with an embodiment of the present invention. - FIGS. 2(A) and 2(B) are plan views showing substrates formed with electrode strips for liquid crystal display.
-
FIG. 3 is a partial cross sectional view showing electrical connection between substrates carrying electrode strips in accordance with the present invention. -
FIG. 4 is a perspective view showing a liquid crystal display in accordance with a modification of the embodiment of the present invention shown inFIG. 1 . -
FIG. 5 is a perspective view showing a liquid crystal display in accordance with another modification of the embodiment of the present invention. -
FIG. 6 is a perspective view showing a liquid crystal display in accordance with a further modification of the embodiment of the present invention. - Referring now to
FIGS. 1, 2 and 3, a liquid crystal display in accordance with the present invention is illustrated. The liquid crystal display comprises a pair ofglass substrates auxiliary substrates 3 carrying thereon a driving circuit for supplying driving signals toorthogonal electrode strips 9 arranged in the inside surfaces of thesubstrates FIG. 1 . Theauxiliary substrates 3 and thesubstrates - Next, a method of manufacturing the liquid crystal display in accordance with a first embodiment is explained. First and second sodalime glass substrates of 1.1 mm thickness are coated with transparent conductive films such as ITO (Indium Tin Oxide) films by DC magnetron sputtering to a thickness of 1200 angstroms. The conductive films are patterned by means of laser pulses emitted from an excimer laser into a number of parallel electrode strips as shown in
FIG. 2 (A). The number of electrode strips of the first substrate is 640 while that of the second is 400 since the shape of the substrates is rectangular and the electrode strips have to be orthogonally arranged when the substrates are joined in order to define pixels therebetween at the intersections of the orthogonal strips. The output energy of the excimer laser beam is 250 mJ. The pulse width is 20 nanoseconds. The cross section of the beam is 15 μm×400 mm. The repetition frequency is 10 Hz. - The laser scribing is carried out in the same manner again for the purpose of insuring the insulation between adjacent terminals of the electrodes. Namely, after the electrodes are formed, the laser scribing is carried out in order to reduce the width of the ends of the electrodes as shown in
FIG. 2 (B) with a mask covering the center portions thereof. The cross section of the excimer laser beam in this case is 30 μm×400 mm. The other lasing conditions are some as those of the above. The surfaces of the substrates provided with the electrodes are then coated with polyamic acid by the offset printing. The polyamic acid is then cured in a clean oven at 350° C. for three hours to form polyimide thin films. The polyimide film on the first substrate is given rubbing treatment by means of a cotton cloth and SiO2 fine particles of 8 μm diameter are dusted thereon as spacers. The second substrate is given an adhesive at its perimeter and joined to the first substrate. The inside space between the first and second substrates are filled with a liquid crystal material by a known vacuum injection. The opening, through which the liquid crystal material is injected, is then sealed off by an adhesive cured by ultraviolet rays. One side of each of the first and second substrates extends together with the electrode strips and is exposed beyond the other substrate in order to provide contacts for electrically connection with the driving circuits formed on theauxiliary substrates 3 as shown inFIG. 1 . - The
auxiliary substrates 3 are provided by depositing ITO films on 1.1 mm thick sodalime glass substrates of 50 mm width and 270 mm length. The ITO film is patterned by a known photolithography. The ITO pattern is then coated with Ni and thereafter with Au respectively by plating. The pattern includes contacts with which IC chips for producing driving signals are electrically connected. The connection of the chips and the contacts are made by applying Au bumps to contact pads of the chips, dripping a curable adhesive onto the rare surfaces of the chips and, after aligning the pads and the contacts of the substrate, exposing the adhesive to ultraviolet light under pressure of 95 g per bump at 150° C. for three minutes in order to harden the adhesive and fix the chips to the substrate. Then, the driving circuits as manufactured as above on the substrate are tested at the outer leads with which the electrodes of a liquid crystal display should be connected for supplying driving signals in order to eliminate substrates carrying inoperative circuits. - The electric connection between the first and
second substrates auxiliary substrates 3 respectively are done as follows. The extended inside surfaces of thefirst substrates 1 on which terminals of the respective electrodes are exposed are coated, by means of a dispenser, with an anisotropic conductive film. The adhesive film is made from a UV light curable adhesive 8 in which a number of resilient fineconductive particles 6 and hard particles 7 whose diameter is slightly smaller than that of the resilient particles are dispersed. The resilient particles are made from 7.5 μm thick polystylene spheres plated with a 1000 angstroms thick Au film. The hard particles are made from 5 μm thick SiO2 spheres. The weight proportion among the adhesive, the resilient particles and the hard particles is 107:14:1. Then, thefirst substrate 1 and theauxiliary substrates 3 are joined with the adhesive therebetween in order that the the terminals of thefirst substrate 1 and the corresponding contacts of theauxiliary substrate 3 are aligned to each other, and exposed to UV light for 3 minutes under pressure of about 2.4 kg/cm2. The hard particles are included in order to prevent the conductive resilient particles from being destroyed under excess pressure. Thesecond substrate 2 is electrically connected with the otherauxiliary substrate 3 in the same manner. When displays as produced as above were subjected to a thermal shock test at −30° C. and at 70° C. respectively for an hour, all the sample displays were maintained operatable. - Next, a method of manufacturing the liquid crystal display in accordance with a second embodiment is explained in conjunction with FIGS. 1, 2(A) and 3. First and second sodalime glass substrates of 1.1 mm thickness are coated with transparent conductive films such as ITO (Indium Tin Oxide) films by DC magnetron sputtering to a thickness of 1200 angstroms. The conductive films are patterned by means of laser pulses emitted from an excimer laser into a number of parallel electrode strips as shown in
FIG. 2 (A). The number of electrode strips of the first substrate is 640 while that of the second is 400 since the shape of the substrates is rectangular and the electrode strips have to be orthogonally arranged when the substrates are joined in order to define pixels therebetween at the intersections of the orthogonal strips. The output energy of the excimer laser beam is 250 mJ. The pulse width is 20 nanoseconds. The cross section of the beam is 15 μm×400 mm. The repetition frequency is 10 Hz. - In this case, the treatment of terminals of the electrode strips 9 is not carried out. A liquid crystal panel is assembled in the same manner as the above embodiment except that the first and second substrates are provided with the electrode strips as illustrated in
FIG. 2 (A) rather thanFIG. 2 (B). A pair of auxiliary substrates are provided also in the same manner as the above embodiment. - The electric connection between the first and
second substrates auxiliary substrates 3 respectively are done as follows. The extended inside surfaces of thefirst substrates 1 on which terminals of the respective electrodes are exposed are coated, by means of a dispenser, with an anisotropic conductive film. The adhesive film is made from a UV light curable adhesive 8 in which a number of resilient fineconductive particles 6 and hard particles 7 whose diameter is slightly smaller than that of the resilient particles are dispersed. The resilient particles are made from 2.5 μm thick polystylene spheres plated with a 1000 angstroms thick Au film. The hard particles are made from 2 μm thick SiO2 spheres. The weight proportion among the adhesive, the resilient particles and the hard particles is 98:13:3. Then, thefirst substrate 1 and theauxiliary substrates 3 are joined with the adhesive therebetween in order that the the terminals of thefirst substrate 1 and the corresponding contacts of theauxiliary substrate 3 are aligned to each other, and exposed to UV light for 3 minutes under pressure of about 2.4 kg/cm2. The hard particles are included in order to prevent the conductive resilient particles from being destroyed under excess pressure. Thesecond substrate 2 is electrically connected with the otherauxiliary substrate 3 in the same manner. When displays as produced as above were subjected to a thermal shock test at −30° C. and at 70° C. respectively for an hour, all the sample displays were maintained operatable. - Next, a method of manufacturing the liquid crystal display in accordance with a third embodiment is explained in conjunction with
FIGS. 1 and 2 (A). First and second sodalime glass substrates of 1.1 mm thickness are coated with transparent conductive films such as ITO (Indium Tin Oxide) films by DC magnetron sputtering to a thickness of 1200 angstroms. The conductive films are patterned by a known photolithography into a number of parallel electrode strips as shown inFIG. 2 (A). The number of electrode strips of the first substrate is 640 while that of the second is 400 since the shape of the substrates is rectangular and the electrode strips have to be orthogonally arranged when the substrates are joined in order to define pixels therebetween at the intersections of the orthogonal strips. - The surfaces of the substrates provided with the electrodes are then coated with polyamic acid by the offset printing. The polyamic acid is then cured in a clean oven at 350° C. for three hours to form polyimide thin films. The polyimide film on the first substrate is given rubbing treatment by means of a cotton cloth and SiO2 fine particles of 8 μm diameter are dusted thereon as spacers. The second substrate is given an adhesive at its perimeter and joined to the first substrate. The inside space between the first and second substrates are filled with a liquid crystal material by a known vacuum injection. The opening, through which the liquid crystal material is injected, is then sealed off by an adhesive cured by ultraviolet rays. One side of each of the first and second substrates extends together with the electrode strips and is exposed beyond the other substrate in order to provide contacts for electrically connection with the driving circuits formed on the
auxiliary substrates 3 as shown inFIG. 1 . Then, a pair of auxiliary substrates are provided, tested and coupled with the liquid crystal panel in the same manner as the above embodiment. -
FIG. 4 illustrates a modification of the embodiment illustrated inFIG. 1 . The liquid crystal panel is same as that of the first embodiment. One end of eachauxiliary substrate 3 is formed to extend in order to join with theother substrate 3. The extended ends of the substrates are fixed to each other by means of a UV light curable adhesive as shown inFIG. 4 . Since the distance between the joined ends of thesubstrates 3 equals the distance between thesubstrate -
FIG. 5 illustrates another modification of the embodiment illustrated inFIG. 1 . The liquid crystal panel is same as that of the first embodiment. Areinforcement plate 18 is attached to theauxiliary substrate 3 and thesubstrate 2 astride the gap therebetween. Since thesubstrates -
FIG. 6 illustrates a further modification of the embodiment illustrated inFIG. 1 . The liquid crystal panel and the auxiliary substrates are same as that of the first embodiment. The connection therebetween is done through FPCs. Namely, thesubstrate FPC 11 by means of an anisotropicconductive film 14. At the other end of theFPC 11, theauxiliary substrate 3 is coupled with the FPC also by means of the anisotropicconductive film 14. Theconductive film 14 comprises a thermally curable adhesive which adheres theFPC 11 to the substrate by thermal treatment at 200° C. for 8 seconds under pressure of 30 kg/cm2. By this procedure, the electrodes of thesubstrates electrodes 13 of theauxiliary substrates 3 respectively through Cuconductive strips 15 formed on theFPC 11. - The foregoing description of preferred embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and obviously many modifications and variations are possible in light of the above teaching. The embodiment was chosen in order to explain most clearly the principles of the invention and its practical application thereby to enable others in the art to utilize most effectively the invention in various embodiments and with various modifications as are suited to the particular use contemplated. Although in the above description a pair of substrates sandwiching a liquid crystal layer are provided with electrode strips and connected with a pair of auxiliary substrates on which IC chips are mounted respectively to supply driving signals there are devices which require driving signals only at one of the pair of the substrates. In this case, the auxiliary substrates are needed only one for one liquid crystal panel.
Claims (24)
1. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
at least one second electrode electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive, and
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate.
2. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
a circuit for supplying a driving signal to the at least one first electrode, the circuit having at least one second electrode electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive, and
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate.
3. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
at least one second electrode, wherein the second electrode is coated with Ni and Au, electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive, and
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate.
4. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
a circuit for supplying a driving signal to the at least one first electrode, the circuit having at least one second electrode, wherein the second electrode is coated with Ni and Au, electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive, and
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate.
5. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
at least one second electrode, electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles by applying a pressure,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive,
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate, and
wherein a thickness of the conductive particle decreases at least 35% after applying a pressure.
6. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
a circuit for supplying a driving signal to the at least one first electrode, the circuit having at least one second electrode, electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles by applying a pressure,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive,
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate, and
wherein a thickness of the conductive particle decreases at least 35% after applying a pressure.
7. A display device according to claim 3 , wherein the second electrode comprises a transparent conductive oxide.
8. A display device according to claim 4 , wherein the second electrode comprises a transparent conductive oxide.
9. A display device according to claim 2 , wherein the circuit comprises a glass substrate and an integrated circuit chip over the glass substrate.
10. A display device according to claim 4 , wherein the circuit comprises a glass substrate and an integrated circuit chip over the glass substrate.
11. A display device according to claim 6 , wherein the circuit comprises a glass substrate and an integrated circuit chip over the glass substrate.
12. A display device according to claim 1 , wherein the metal film comprises Au.
13. A display device according to claim 2 , wherein the metal film comprises Au.
14. A display device according to claim 3 , wherein the metal film comprises Au.
15. A display device according to claim 4 , wherein the metal film comprises Au.
16. A display device according to claim 5 , wherein the metal film comprises Au.
17. A display device according to claim 6 , wherein the metal film comprises Au.
18. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
at least one second electrode, wherein the second electrode is coated with Ni and Au, electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles by applying a pressure,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive,
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate, and
wherein a thickness of the conductive particle decreases at least 35% after applying a pressure.
19. A display device comprising:
at least one first electrode comprising transparent conductive oxide over a substrate;
a circuit for supplying a driving signal to the at least one first electrode, the circuit having at least one second electrode, wherein the second electrode is coated with Ni and Au, electrically connected to the first electrode with a conductive adhesive interposed therebetween wherein the conductive adhesive includes conductive particles by applying a pressure,
wherein the conductive particles, each comprises a resin particle coated with a metal film,
wherein the first electrode has a first end and a second end and the second electrode has a first end and a second end,
wherein the first end or said second end of the first electrode and the first end or the second end of the second electrode are covered by the conductive adhesive,
wherein the first end or the second end of the first electrode which is covered by the conductive adhesive, is inside of an edge of the substrate, and
wherein a thickness of the conductive particle decreases at least 35% after applying a pressure.
20. A display device according to claim 18 , wherein the second electrode comprises a transparent conductive oxide.
21. A display device according to claim 19 , wherein the second electrode comprises a transparent conductive oxide.
22. A display device according to claim 19 , wherein the circuit comprises a glass substrate and an integrated circuit chip over the glass substrate.
23. A display device according to claim 18 , wherein the metal film comprises Au.
24. A display device according to claim 19 , wherein the metal film comprises Au.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/250,426 US20060033873A1 (en) | 1989-09-01 | 2005-10-17 | Liquid crystal device and manufacturing method therefor |
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-226664 | 1989-09-01 | ||
JP1226664A JP2893070B2 (en) | 1989-09-01 | 1989-09-01 | Liquid crystal electro-optical device |
JP23230889A JPH0394219A (en) | 1989-09-06 | 1989-09-06 | Manufacture of liquid crystal electrooptical device |
JP1-232308 | 1989-09-06 | ||
US07/575,442 US5130833A (en) | 1989-09-01 | 1990-08-30 | Liquid crystal device and manufacturing method therefor |
US07/851,659 US5710612A (en) | 1989-09-01 | 1992-03-16 | Liquid crystal device and manufacturing method therefor with anisotropic conductive adhesive connecting glass substrate and glass auxiliary substrate |
US08/962,448 US6404476B1 (en) | 1989-09-01 | 1997-10-31 | Device having an improved connective structure between two electrodes |
US09/988,408 US6956635B2 (en) | 1989-09-01 | 2001-11-19 | Liquid crystal device and manufacturing method therefor |
US11/250,426 US20060033873A1 (en) | 1989-09-01 | 2005-10-17 | Liquid crystal device and manufacturing method therefor |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/988,408 Division US6956635B2 (en) | 1989-09-01 | 2001-11-19 | Liquid crystal device and manufacturing method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060033873A1 true US20060033873A1 (en) | 2006-02-16 |
Family
ID=26527292
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/575,442 Expired - Lifetime US5130833A (en) | 1989-09-01 | 1990-08-30 | Liquid crystal device and manufacturing method therefor |
US07/851,659 Expired - Lifetime US5710612A (en) | 1989-09-01 | 1992-03-16 | Liquid crystal device and manufacturing method therefor with anisotropic conductive adhesive connecting glass substrate and glass auxiliary substrate |
US08/962,448 Expired - Fee Related US6404476B1 (en) | 1989-09-01 | 1997-10-31 | Device having an improved connective structure between two electrodes |
US09/988,408 Expired - Fee Related US6956635B2 (en) | 1989-09-01 | 2001-11-19 | Liquid crystal device and manufacturing method therefor |
US11/250,426 Abandoned US20060033873A1 (en) | 1989-09-01 | 2005-10-17 | Liquid crystal device and manufacturing method therefor |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/575,442 Expired - Lifetime US5130833A (en) | 1989-09-01 | 1990-08-30 | Liquid crystal device and manufacturing method therefor |
US07/851,659 Expired - Lifetime US5710612A (en) | 1989-09-01 | 1992-03-16 | Liquid crystal device and manufacturing method therefor with anisotropic conductive adhesive connecting glass substrate and glass auxiliary substrate |
US08/962,448 Expired - Fee Related US6404476B1 (en) | 1989-09-01 | 1997-10-31 | Device having an improved connective structure between two electrodes |
US09/988,408 Expired - Fee Related US6956635B2 (en) | 1989-09-01 | 2001-11-19 | Liquid crystal device and manufacturing method therefor |
Country Status (1)
Country | Link |
---|---|
US (5) | US5130833A (en) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130833A (en) * | 1989-09-01 | 1992-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device and manufacturing method therefor |
DE69112026T2 (en) * | 1990-09-29 | 1996-03-28 | Sekisui Fine Chemical Co | SMALL BALL, SPHERICAL SPACER FOR A LIQUID CRYSTAL DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE USING THIS. |
JP3205373B2 (en) * | 1992-03-12 | 2001-09-04 | 株式会社日立製作所 | Liquid crystal display |
TW232065B (en) * | 1992-04-16 | 1994-10-11 | Sharp Kk | |
JP2801487B2 (en) * | 1992-04-30 | 1998-09-21 | シャープ株式会社 | Panel mounting structure, mounting method, and resin supply curing method |
DE9217429U1 (en) * | 1992-12-19 | 1994-01-27 | Schauer Gernot | Liquid crystal display device |
US6980275B1 (en) | 1993-09-20 | 2005-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |
US7081938B1 (en) * | 1993-12-03 | 2006-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
US5757456A (en) * | 1995-03-10 | 1998-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating involving peeling circuits from one substrate and mounting on other |
GB2307598B (en) * | 1995-11-24 | 2000-02-23 | Varintelligent | Combined printed circuit board and integrated circuit driver |
US5699073A (en) * | 1996-03-04 | 1997-12-16 | Motorola | Integrated electro-optical package with carrier ring and method of fabrication |
JPH10268361A (en) | 1997-03-27 | 1998-10-09 | Semiconductor Energy Lab Co Ltd | Liquid crystal display device and its manufacture |
JP3883641B2 (en) * | 1997-03-27 | 2007-02-21 | 株式会社半導体エネルギー研究所 | Contact structure and active matrix display device |
JPH11160734A (en) * | 1997-11-28 | 1999-06-18 | Semiconductor Energy Lab Co Ltd | Liquid crystal electrooptical device |
US6052171A (en) * | 1998-03-05 | 2000-04-18 | Sharp Kabushiki Kaisha | Liquid crystal display with electrically connected integrated circuits and opposite voltage line between input and output wirings |
JP2000199915A (en) * | 1999-01-06 | 2000-07-18 | Matsushita Electric Ind Co Ltd | Liquid crystal display panel |
JP3054135B1 (en) * | 1999-02-05 | 2000-06-19 | シャープ株式会社 | Liquid crystal display |
US6556268B1 (en) * | 1999-03-31 | 2003-04-29 | Industrial Technology Research Institute | Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB |
CN1192338C (en) * | 1999-07-22 | 2005-03-09 | 精工爱普生株式会社 | Electro-optical device, method of manufacture thereof, and electronic device |
US6882012B2 (en) * | 2000-02-28 | 2005-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and a method of manufacturing the same |
JP4118484B2 (en) * | 2000-03-06 | 2008-07-16 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP2001257350A (en) | 2000-03-08 | 2001-09-21 | Semiconductor Energy Lab Co Ltd | Semiconductor device and its preparation method |
JP4700160B2 (en) * | 2000-03-13 | 2011-06-15 | 株式会社半導体エネルギー研究所 | Semiconductor device |
JP4683688B2 (en) | 2000-03-16 | 2011-05-18 | 株式会社半導体エネルギー研究所 | Method for manufacturing liquid crystal display device |
JP4393662B2 (en) | 2000-03-17 | 2010-01-06 | 株式会社半導体エネルギー研究所 | Method for manufacturing liquid crystal display device |
JP4785229B2 (en) | 2000-05-09 | 2011-10-05 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
US7088322B2 (en) | 2000-05-12 | 2006-08-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
CN1498417A (en) | 2000-09-19 | 2004-05-19 | 纳诺皮尔斯技术公司 | Method for assembling components and antenna in radio frequency identification devices |
US20040087128A1 (en) * | 2000-10-24 | 2004-05-06 | Neuhaus Herbert J | Method and materials for printing particle-enhanced electrical contacts |
US6703566B1 (en) | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
KR100634109B1 (en) * | 2001-12-18 | 2006-10-17 | 세이코 엡슨 가부시키가이샤 | Light-emitting device, its manufacturing method, electro-optical device, and electronic device |
JP4027691B2 (en) * | 2002-03-18 | 2007-12-26 | 株式会社日立製作所 | Liquid crystal display |
TWI362128B (en) * | 2002-03-26 | 2012-04-11 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
KR100531591B1 (en) * | 2002-06-17 | 2005-11-28 | 알프스 덴키 가부시키가이샤 | Liquid crystal display |
JP2004117937A (en) * | 2002-09-27 | 2004-04-15 | Sharp Corp | Display device |
US7361027B2 (en) * | 2002-12-25 | 2008-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure, display device and electronic device |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
WO2005096003A1 (en) * | 2004-03-30 | 2005-10-13 | Quanta Display Inc. | A method of testing the defect of a display panel |
JP4480646B2 (en) * | 2005-08-25 | 2010-06-16 | 日本電気株式会社 | Optical element, light source and display device |
EP2637058B1 (en) * | 2007-12-21 | 2015-09-16 | Mitsui Chemicals, Inc. | Lens for electronic spectacles and electronic spectacles |
WO2010113533A1 (en) * | 2009-03-31 | 2010-10-07 | シャープ株式会社 | Liquid crystal panel |
KR101732397B1 (en) * | 2009-06-05 | 2017-05-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Photoelectric conversion device and manufacturing method thereof |
KR101677076B1 (en) * | 2009-06-05 | 2016-11-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Photoelectric conversion device and method for manufacturing the same |
CN102460722B (en) * | 2009-06-05 | 2015-04-01 | 株式会社半导体能源研究所 | Photoelectric conversion device and method for manufacturing the same |
US20110151202A1 (en) * | 2009-12-18 | 2011-06-23 | Feinstein Casey J | Controllable Placement of Liquid Adhesive on Substrate |
CN102674669B (en) * | 2011-03-16 | 2014-12-03 | 京东方科技集团股份有限公司 | Fixing method for glass substrates |
US20130140083A1 (en) * | 2011-09-20 | 2013-06-06 | Hitachi Chemical Company, Ltd. | Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheet |
US9721912B2 (en) * | 2011-11-02 | 2017-08-01 | Maxim Integrated Products, Inc. | Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality |
US10804233B1 (en) | 2011-11-02 | 2020-10-13 | Maxim Integrated Products, Inc. | Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height |
CN103296489B (en) * | 2012-04-13 | 2015-08-26 | 上海天马微电子有限公司 | Jockey, board device, imageing sensor, display and touch apparatus |
KR101909436B1 (en) * | 2012-08-10 | 2018-10-18 | 엘지디스플레이 주식회사 | Display apparatus and method for manufacturing the same |
CN110473654B (en) * | 2019-06-11 | 2021-08-06 | 惠科股份有限公司 | Conductive particle, preparation method thereof and display panel |
KR20240046709A (en) | 2021-08-23 | 2024-04-09 | 파커-한니핀 코포레이션 | Fuel Cell Humidification Potting Adhesive Shroud |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4483591A (en) * | 1981-09-26 | 1984-11-20 | Vdo Adolf Schindling Ag | Electro-optical display element and method for its manufacture |
US4586789A (en) * | 1982-10-08 | 1986-05-06 | Hitachi, Ltd. | Liquid crystal display unit with particular electrode terminal groupings |
US4721365A (en) * | 1984-11-21 | 1988-01-26 | Canon Kabushiki Kaisha | Electronic device including panels with electrical alignment means |
US4964700A (en) * | 1987-06-19 | 1990-10-23 | Canon Kabushiki Kaisha | Connection structure between a liquid crystal panel and an external circuit |
US4985663A (en) * | 1987-09-09 | 1991-01-15 | Sharp Kabushiki Kaisha | Display device |
US5038251A (en) * | 1987-04-08 | 1991-08-06 | Casio Computer Co., Ltd. | Electronic apparatus and a method for manufacturing the same |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057458A (en) | 1973-09-19 | 1975-05-19 | ||
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
JPS5247686A (en) * | 1975-10-15 | 1977-04-15 | Toshiba Corp | Semiconductor device and process for production of same |
JPS5252582A (en) * | 1975-10-25 | 1977-04-27 | Toshiba Corp | Device and production for semiconductor |
JPS5823612B2 (en) | 1977-06-29 | 1983-05-16 | エプソン株式会社 | Manufacturing method of LCD panel |
JPS58173718A (en) * | 1982-04-07 | 1983-10-12 | Hitachi Ltd | Optical modulating device of liquid crystal and its production |
US4526818A (en) * | 1982-12-23 | 1985-07-02 | Epson Corporation | Liquid crystal display panel and process for the production thereof |
FR2549627B1 (en) * | 1983-07-19 | 1986-02-07 | Thomson Csf | DEVICE FOR CONNECTING A DISPLAY SCREEN AND DISPLAY SCREEN COMPRISING SUCH A DEVICE |
JPS6067984A (en) | 1983-09-24 | 1985-04-18 | シャープ株式会社 | Electrode terminal pick up construction of flat display panel |
JPS60149079A (en) * | 1984-01-13 | 1985-08-06 | シャープ株式会社 | Connector for display body unit |
JPS60260393A (en) | 1984-06-08 | 1985-12-23 | Semiconductor Energy Lab Co Ltd | Optical processing of light-transmitting conductive film |
US4654965A (en) * | 1984-07-16 | 1987-04-07 | Ricoh Company, Ltd. | Method of manufacturing liquid crystal display unit |
US4642421A (en) | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4588456A (en) | 1984-10-04 | 1986-05-13 | Amp Incorporated | Method of making adhesive electrical interconnecting means |
DE3616046C2 (en) * | 1985-05-13 | 1996-04-25 | Ricoh Kk | Liquid crystal display device with a printed circuit board |
JPS61294783A (en) | 1985-06-21 | 1986-12-25 | 日立化成工業株式会社 | Connection of circuit |
JPS6294379A (en) | 1985-10-21 | 1987-04-30 | Mitsubishi Yuka Fine Chem Co Ltd | Aqueous base ink recording sheet |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
EP0261712A1 (en) * | 1986-09-04 | 1988-03-30 | Koninklijke Philips Electronics N.V. | Picture display cell, method of forming an orientation layer on a substrate of the picture display cell and monomeric compounds for use in the orientation layer |
JP2527766B2 (en) * | 1986-10-09 | 1996-08-28 | 沖電気工業株式会社 | Liquid crystal display |
US5089750A (en) * | 1986-12-18 | 1992-02-18 | Matsushita Electric Industrial Co., Ltd. | Lead connection structure |
JPS63175495A (en) * | 1987-01-14 | 1988-07-19 | 日本電気株式会社 | Printed wiring board and manufacture of the same |
JPS63175485A (en) | 1987-01-16 | 1988-07-19 | Hitachi Ltd | Thin film light-emitting element |
US4959178A (en) * | 1987-01-27 | 1990-09-25 | Advanced Products Inc. | Actinic radiation-curable conductive polymer thick film compositions and their use thereof |
JPS63241523A (en) | 1987-03-30 | 1988-10-06 | Toshiba Corp | Substrate device for liquid crystal panel |
JPS63249393A (en) | 1987-04-03 | 1988-10-17 | シャープ株式会社 | Method of connecting electronic component |
JPS63284591A (en) | 1987-05-15 | 1988-11-21 | 松下電器産業株式会社 | Display panel module |
JPS63300224A (en) * | 1987-05-29 | 1988-12-07 | Nec Corp | Liquid crystal display device |
US4930876A (en) * | 1987-10-30 | 1990-06-05 | Ricoh Company, Ltd. | Liquid crystal display device |
JPH01125485A (en) | 1987-11-11 | 1989-05-17 | Shin Nikkei Co Ltd | Drive for electric blind |
JPH01152489A (en) | 1987-12-09 | 1989-06-14 | Toshiba Corp | Liquid crystal display panel |
JPH01281487A (en) | 1988-05-07 | 1989-11-13 | Seiko Epson Corp | Display body |
JPH0291360U (en) * | 1988-12-29 | 1990-07-19 | ||
KR900018804A (en) * | 1989-05-31 | 1990-12-22 | 야마무라 가쯔미 | Input device |
US4999460A (en) | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
JPH0817109B2 (en) * | 1989-08-18 | 1996-02-21 | 株式会社半導体エネルギー研究所 | Electric wiring and connection method |
US5130833A (en) * | 1989-09-01 | 1992-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device and manufacturing method therefor |
JP2722832B2 (en) * | 1991-02-22 | 1998-03-09 | 日本電気株式会社 | Liquid crystal display device |
-
1990
- 1990-08-30 US US07/575,442 patent/US5130833A/en not_active Expired - Lifetime
-
1992
- 1992-03-16 US US07/851,659 patent/US5710612A/en not_active Expired - Lifetime
-
1997
- 1997-10-31 US US08/962,448 patent/US6404476B1/en not_active Expired - Fee Related
-
2001
- 2001-11-19 US US09/988,408 patent/US6956635B2/en not_active Expired - Fee Related
-
2005
- 2005-10-17 US US11/250,426 patent/US20060033873A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4483591A (en) * | 1981-09-26 | 1984-11-20 | Vdo Adolf Schindling Ag | Electro-optical display element and method for its manufacture |
US4586789A (en) * | 1982-10-08 | 1986-05-06 | Hitachi, Ltd. | Liquid crystal display unit with particular electrode terminal groupings |
US4721365A (en) * | 1984-11-21 | 1988-01-26 | Canon Kabushiki Kaisha | Electronic device including panels with electrical alignment means |
US5038251A (en) * | 1987-04-08 | 1991-08-06 | Casio Computer Co., Ltd. | Electronic apparatus and a method for manufacturing the same |
US4964700A (en) * | 1987-06-19 | 1990-10-23 | Canon Kabushiki Kaisha | Connection structure between a liquid crystal panel and an external circuit |
US4985663A (en) * | 1987-09-09 | 1991-01-15 | Sharp Kabushiki Kaisha | Display device |
Also Published As
Publication number | Publication date |
---|---|
US20020067457A1 (en) | 2002-06-06 |
US6404476B1 (en) | 2002-06-11 |
US6956635B2 (en) | 2005-10-18 |
US5710612A (en) | 1998-01-20 |
US5130833A (en) | 1992-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6956635B2 (en) | Liquid crystal device and manufacturing method therefor | |
US6952250B2 (en) | Pressure-welded structure of flexible circuit boards | |
US7388641B2 (en) | Liquid crystal display and method for manufacturing the same having particular pad unit | |
US5235741A (en) | Electrical connection and method for making the same | |
US7164460B2 (en) | Mounting structure for semiconductor device, electro-optical device, and electronic apparatus | |
US5155301A (en) | Electrical connection and method for making the same | |
EP0794451B1 (en) | Liquid crystal device, method of manufacturing the same and electronic apparatus | |
JPH025375A (en) | Actual fitting of electronic component | |
KR20090058987A (en) | Method for fabricating liquid crystal display device and method for fabricating film carrier tape in it | |
KR19980070717A (en) | LCD and its manufacturing method | |
US5525838A (en) | Semiconductor device with flow preventing member | |
JP2893070B2 (en) | Liquid crystal electro-optical device | |
JP2001264794A (en) | Method for manufacturing liquid crystal display device | |
US5860212A (en) | Method of coating a conductive substance on a transparent electrode formed on a substrate and method of mounting a semiconductor device or film substrate on the substrate | |
JP2000111939A (en) | Liquid crystal display device | |
JPH11135909A (en) | Electronic equipment and flexible wiring board | |
JP2995390B2 (en) | Liquid crystal electro-optical device | |
JP2995392B2 (en) | Liquid crystal electro-optical device | |
KR100258719B1 (en) | Pannel structure for chip on glass(cog) | |
JPH10144727A (en) | Mounting of semiconductor element and electronic device mounted with semiconductor element | |
JPS60225120A (en) | Liquid-crystal display device | |
JPH09127536A (en) | Liquid crystal display device | |
JPH10319419A (en) | Liquid crystal display device | |
KR100536947B1 (en) | Method of fabricating Film Carrier Tape | |
JPH04217228A (en) | Liquid crystal display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |