JP2876447B2 - Manufacturing method of chip thermistor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thermistor element having a positive characteristic and a negative characteristic, in particular, a chip type thermistor element.

[0002]

2. Description of the Related Art With respect to the structure of a thermistor element, particularly a chip type positive temperature coefficient thermistor element, an attempt is made to reduce the electric resistance value by forming electrodes on both main surfaces of a flat positive temperature coefficient thermistor element taken in the thickness direction. Is known (actual fairness 5-1
2961, JP-A-56-150802).

[0003] The manufacturing method is disclosed in the above-mentioned JP-A-56-150802. In this method, divided grooves are formed in a grid pattern on both sides of a thermistor body sheet with reference to through holes, an electrode pattern is formed in a region surrounded by vertical and horizontal grooves, and after baking, a protective layer is formed on the surface of the pattern. Then, the thermistor assembly is divided along the vertical grooves, and a conductive layer serving as an end electrode is applied and baked. Then, the thermistor assembly is divided into individual elements along the horizontal grooves.

[0004]

According to the above-mentioned method, since the dividing groove is previously attached to the thermistor body,
While it seems easy to break it down into individual elements,
The formation of the electrode pattern on the main surface is performed for each of the sections surrounded by the lattice, the conduction between the electrode pattern on the main surface and the end electrodes, and the formation region of the protective layer covering the electrode pattern on the main surface. It seems that very fine work is required for setting of. In addition, the through holes used to set the main surface electrode formation areas on both sides are characterized by being used later as cutouts for eliminating interference between thermistor elements. Is not advantageous in that it increases the number of steps and simplifies the manufacturing process.

An object of the present invention is to provide a highly reliable chip thermistor, and to provide a chip thermistor suitable for automation of manufacturing and a method of manufacturing the same.

[0006]

Means for Solving the Problems To achieve the above object,
In the method for manufacturing a chip-type thermistor according to the present invention,
The main surface electrode forming process, the glass coating process, and the primary
Division processing, side electrode formation processing, and secondary division processing
A method of manufacturing a chip thermistor, comprising:
The forming process includes the first surface and the second surface of the main surface of the thermistor body.
And printing the main surface electrode pattern and printing
The main surface electrode pattern is fixed at regular intervals.
The main surface electrodes are printed in parallel rows with a width.
The main surface electrode pattern and the main surface electrode pattern on the second surface are:
Partial overlap and out of phase with each other
The glass coating process is the main surface electrode
The surface of the body exposed between turns and one of the main surface electrode patterns
Print the glass paste over the
The primary splitting process is a process of attaching a main surface electrode on the first surface.
Both the pattern and the main surface electrode pattern on the second surface are marked.
Cut the unprinted element and divide it into strips
The first side is cut on one side cut surface of each strip-shaped element body.
The edge of the main surface electrode pattern of the
The edges of the two main surface electrode patterns appear, and the side surface electrode forming process is performed.
The principle is that the cut surface on one side and the cut surface on the other side
This is the process of printing and burning the side electrode pattern.
One of the side surface electrode patterns is the main surface electrode pattern on the first surface.
And the other is connected to the main electrode pattern on the second surface,
In the splitting process, a chip-type thermistor of a desired size is obtained.
This is a process of dividing the strip-shaped body into required lengths.

Also, a first main surface electrode pattern and a second main surface
The phase deviation from the electrode pattern depends on the width to cut the body
And the body is not printed
To the width of the part exposed to the
Each end of the second main surface electrode pattern is
Appearing on the cut surface, each main surface electrode pattern is
Conduction to the side electrode pattern printed on the cut surface, both main surfaces
Due to the phase shift of the electrode pattern, both main surface electrode patterns
The short circuit between the terminals is prevented.

In the glass coating treatment, the phase is shifted by the same pitch as that of the main surface electrode patterns in each row to cover at least a part of the main surface electrode patterns and the exposed surface of the element.
This includes a process of printing a glass paste on each of the surface and the second surface.

[0009]

The main surface electrodes and the glass paste formed on the first and second surfaces of the thermistor body sheet are printed in parallel rows at regular intervals. An array of primary surface electrodes on the first surface;
The row of the main surface electrodes on the second surface is partially overlapped with the phase shift within the range of the width of the main surface electrode, and the main surface electrodes of the main electrodes on both surfaces do not overlap. On one side surface of the strip-shaped body obtained by cutting the exposed surface of the body at the width of the exposed portion, the end surface of the main surface of the first surface appears on the same plane, and on the other side, the main surface of the second surface is formed. Since the electrode end faces are represented on the same plane, conduction of the side electrodes is facilitated. The exposed surfaces of the thermistor body on the first surface and the second surface excluding the main surface electrodes are covered with the glass coat, so that the short-circuit between the two main surface electrodes does not occur due to the adhesion of the both side surface electrodes.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1A, reference numeral 1 denotes a thermistor element formed on a rectangular sheet. The thermistor body (hereinafter abbreviated to the body) may be a thermistor having either a positive characteristic or a negative characteristic.

A first main surface electrode pattern 3 is formed on a first surface 2 at a predetermined interval and parallel to a first surface 2 as a main surface electrode provided on both main surfaces in the thickness direction with reference to two orthogonal sides of the element body 1. Print in rows and dry it. Next, turn the body 1 over,
As shown in FIG. 1B, the second main surface electrode patterns 5 are printed on the second surface 4 of the element body 1 at regular intervals and in parallel rows with a constant width. When printing the second main surface electrode pattern 5, a part of the first main surface electrode pattern 3 and a part of the second main surface electrode pattern 5 are overlapped by shifting the phase.

In the drawing, the width δ of the portion where the element body 1 is exposed on the surface without printing any of the patterns 3 and 5 is the width to be cut later. After drying the second main surface electrode pattern 5, the pattern is baked.

In FIG. 1C, next, the printing and drying of the glass paste 6 are sequentially performed on the first surface 2 and the second surface 4. At the time of printing the glass paste 6, the phase is slightly shifted at the same pitch as the main surface electrode patterns 3 and 5 on each surface, and the glass paste 6 is adhered over the surface of the element body exposed between the patterns and a part of the patterns. , First and second
One side edge of each of the main surface electrode patterns 3 and 5 is exposed. The exposed portions of the first and second principal-surface electrode patterns 3 and 5 have different positions on the first surface 2 and the second surface 4 between one side (left side) and the other side (right side).

Next, the glass paste 6 is baked.
In FIG. 1D, the space between the two patterns of the element body 1 is cut at the interval of δ, and divided into strip-shaped element bodies 7 shown in FIG. 2A. One end surface of the first main surface electrode pattern 3 appears on the same plane on the left cut surface of the strip-shaped element body 7, and one end surface of the second main surface electrode pattern 5 is the same plane as the right cut end surface of the element body. Appears in.

The first main surface electrode pattern 3 is not provided on the right end on the first surface 2 of the element body 1, and the element body 1 is exposed, and its surface is covered with a glass coat 8 by baking a paste 6. On the second surface 4, the body 1 is exposed at the left end, and the surface is covered with the glass coat 8.

In FIG. 2 (b), first and second side electrode patterns 9, 10 are printed on both side surfaces of the strip-shaped element body 7, dried and baked, and the surface thereof is plated with Ni. Using this as a base, Sb-Pb plating is performed.
Next, the strip-shaped element body 7 is divided into required lengths to obtain a chip-type thermistor 11 having a required size as shown in FIG.

The obtained chip type thermistor 11 is
The main surface electrode pattern 3 is electrically connected to the first side surface electrode pattern 9, and the second main surface electrode pattern 5 is connected to the second side surface electrode pattern 1.
0, which becomes a thermistor utilizing bulk resistance in the thickness direction between both main surfaces of the element body 1. The first main surface electrode pattern 3 and the second side surface electrode pattern 10 and the second main surface electrode pattern 5 and the first side surface electrode pattern 9 are not short-circuited by the glass coat 8.

In the above embodiment, an example has been described in which the glass paste is printed in a row pattern by shifting the phase of the printing position between the main surface electrode pattern and the glass paste. According to this example, the surface of the main surface electrode pattern to be electrically connected to the side surface electrode pattern is exposed to facilitate the connection. However, the present invention is not limited to this example, and the entire surface of the first and second main surface electrode patterns is not limited to this example. , A glass paste may be printed on the entire first and second surfaces. However, according to this example,
The main surface electrode pattern and the side surface electrode pattern are electrically connected only through the end face exposed on the side surface of the main surface electrode pattern.

[0020]

According to the present invention, the thermistor body sheet is provided with a main-surface electrode pattern with both phases shifted from each other, coated with glass, cut into strips, and cut into strips. According to the present invention, a side surface electrode is attached to both side surfaces to divide the main body into required dimensions. By matching, each end of the first and second main surface electrode patterns can be represented as a cut surface of the strip-shaped element, and can be easily conducted to the side surface electrode patterns. Thereby, a short circuit between both main surface electrode patterns can be effectively prevented and reliability can be improved.

According to the present invention, the printing of the pattern is basically performed only by the parallel setting operation of the thermistor element body sheet, so that the manufacturing process can be easily automated and a method suitable for mass production can be provided. It is.

[Brief description of the drawings]

FIG. 1 is a diagram showing a precedent step of a manufacturing method of the present invention in the order of steps, (a) is a plan view of a thermistor body sheet,
(B)-(d) is the same front view.

FIGS. 2A and 2B are views showing a subsequent step of the manufacturing method of the present invention in the order of steps, and FIG. 2A is a perspective view of a strip-shaped thermistor body;
(B) is a figure which shows the state which attached the side surface electrode.

FIG. 3 is an enlarged perspective view of a chip thermistor obtained by the method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermistor body 2 1st surface 3 1st main surface electrode pattern 4 2nd surface 5 2nd main surface electrode pattern 6 Glass paste 7 Strip-shaped body 8 Glass coat 9 1st side electrode pattern 10 2nd side electrode pattern 11 Chip type thermistor

Claims (3)

(57) [Claims] 1. A main surface electrode forming process and a glass coating process
, Primary division processing, side electrode formation processing, and secondary division processing
A method for manufacturing a chip-type thermistor, comprising: forming a principal-surface electrode on a first surface of a principal surface of a thermistor body;
And the main surface electrode pattern is printed on each of the
The main surface electrode pattern is parallel with a certain width at a certain interval.
The main surface electrodes are printed in a simple row, and the main surface electrode pattern on the first surface and the main surface electrode pattern on the second surface
Is to shift the phase of each other by partially overlapping
The glass coating process is performed between the main surface electrode patterns on each surface.
Over the surface of the element body and a part of the main surface electrode pattern
This is the process of printing the lath paste and baking it on the body.
The primary division process is performed by using the main surface electrode pattern on the first surface and the second surface
Element where none of the main surface electrode patterns are printed
This is the process of cutting the part and dividing it into strip-shaped elements.
The main surface electrode pattern of the first surface is provided on one side cut surface of the book body.
The other side cut surface has a main surface electrode pattern of the second surface.
The edge of the strip appears, and the side surface electrode formation processing is performed by cutting one side of the strip-shaped body and the other side.
Printing and baking side electrode patterns on each cut surface
One of the side electrode patterns is the main surface of the first surface.
The other is in contact with the surface electrode pattern and the other is in contact with the main electrode pattern on the second surface.
Then, the secondary division process uses a chip-type thermistor of the desired size.
In the process of dividing the strip-shaped body into required lengths to obtain
A method for manufacturing a chip-type thermistor, comprising: 2. A first main surface electrode pattern and a second main surface electrode.
The phase deviation from the pattern is determined by the width of the body to be cut.
And the body is on the surface without printing either of the patterns.
According to the width of the exposed part, the first and
2 Each end of the main surface electrode pattern is cut
Appearing in the cross section, each main surface electrode pattern is
Conduction to the side electrode pattern printed on the cross-section
Due to the phase shift of the pole pattern, both main surface electrode patterns
Wherein a short circuit between the electrodes is prevented.
Item 2. A method for manufacturing a chip-type thermistor according to Item 1. 3. The glass coating process comprises the steps of:
At least part of a main surface electrode pattern by shifting the phase in turn the same pitch, the first surface overlying the exposed surface of the element body
When manufacturing method of a chip type thermistor according to claim 1, characterized in that on the second surface in which each include a process of printing a glass paste.