JP2853317B2 - Wafer processing equipment - Google Patents
Wafer processing equipmentInfo
- Publication number
- JP2853317B2 JP2853317B2 JP2303455A JP30345590A JP2853317B2 JP 2853317 B2 JP2853317 B2 JP 2853317B2 JP 2303455 A JP2303455 A JP 2303455A JP 30345590 A JP30345590 A JP 30345590A JP 2853317 B2 JP2853317 B2 JP 2853317B2
- Authority
- JP
- Japan
- Prior art keywords
- chemical solution
- filter
- inner tank
- tank
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000126 substance Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000010349 pulsation Effects 0.000 description 6
- 239000000428 dust Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Filtration Of Liquid (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はウェハー処理装置に関し、特に薬液の移送方
法に関する。The present invention relates to a wafer processing apparatus, and more particularly, to a method for transferring a chemical solution.
従来の半導体ウェハー（以下単にウェハーと記す）の
処理装置は、第２図に示すように、ウェハーを入れフッ
酸や硫酸等の薬液10で処理を行うための内槽２と、内槽
２からオーバーフローした薬液10を貯める外槽３と、外
槽３に貯まった薬液10をフィルター６を通過させて内槽
２に流入させるエアー駆動式ポンプ４と、薬液を高温に
加熱するヒーター１とから主に構成されていた。2. Description of the Related Art As shown in FIG. 2, a conventional semiconductor wafer (hereinafter simply referred to as a wafer) processing apparatus includes an inner tank 2 for placing a wafer and performing a treatment with a chemical solution 10 such as hydrofluoric acid or sulfuric acid. An outer tank 3 for storing the overflowed chemical solution 10, an air-driven pump 4 for passing the chemical solution 10 stored in the outer tank 3 into the inner tank 2 through the filter 6, and a heater 1 for heating the chemical solution to a high temperature. Was configured to.
次に動作について説明する。内槽２の高温薬液は、ウ
ェハー処理時オーバーフローして外槽３に貯まる。この
薬液10はエアー駆動式ポンプ４によりフィルター６を通
過して内槽２に戻される。この一連の動作により、内槽
２に存在する塵埃等を低減させることができる。Next, the operation will be described. The high temperature chemical in the inner tank 2 overflows during wafer processing and is stored in the outer tank 3. The chemical 10 is returned to the inner tank 2 through the filter 6 by the air-driven pump 4. By this series of operations, dust and the like existing in the inner tank 2 can be reduced.
この従来のウェハー処理装置では、主にエアー駆動式
ポンプが用いられるが、このエアー駆動式ポンプは、吐
出側で大きい脈動が生じるため、一度はフィルターで捕
獲された埃塵がフィルターの膜から離脱し通り抜けるた
め、内槽が汚染されるという問題があった。In this conventional wafer processing apparatus, an air-driven pump is mainly used. Since the air-driven pump generates a large pulsation on the discharge side, dust captured by the filter once separates from the filter film. There is a problem in that the inner tank is contaminated because it passes through.
本発明のウェハー処理装置は、薬液を満たし半導体ウ
ェハーを処理する内槽と、この内槽から流出した薬液を
入れる外槽と、この外槽の薬液をフィルターを通過させ
て内槽に流入させるポンプとを有するウェハー処理装置
に於いて、前記ポンプから吐出される薬液の脈流を減衰
させるため、前記ポンプと前記フィルターとの間にフィ
ルターエレメントを取り除いたフィルターからなるダン
パーを設けたことを特徴とするものである。The wafer processing apparatus of the present invention includes an inner tank for processing a semiconductor wafer filled with a chemical solution, an outer tank for containing a chemical solution flowing out of the inner tank, and a pump for allowing the chemical solution in the outer tank to pass through a filter and flow into the inner tank. In the wafer processing apparatus having the above, in order to attenuate the pulsating flow of the chemical solution discharged from the pump, a damper comprising a filter with a filter element removed between the pump and the filter is provided. Is what you do.
次に本発明について図面を参照して説明する。第１図
は本発明の一実施例の模式断面図である。Next, the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view of one embodiment of the present invention.
第１図においてウェハー処理装置は、薬液10を満たし
ウェハーを処理するための内槽２と、この内槽２に接続
して設けられ、内槽２からオーバーフローした薬液を貯
める外槽３と、外槽３に貯った薬液をフィルター６を介
して内槽２に流入させるエアー駆動式ポンプ４と、この
ポンプ４とフィルター６の間に設けられポンプから吐出
される薬液の脈動を減衰させるためのダンパー５とから
主に構成されている。以下動作について説明する。In FIG. 1, a wafer processing apparatus includes an inner tank 2 for filling a chemical solution 10 and processing a wafer, an outer tank 3 connected to the inner tank 2 for storing a chemical solution overflowing from the inner tank 2, and an outer tank 3. An air-driven pump 4 for allowing the chemical solution stored in the tank 3 to flow into the inner tank 2 via the filter 6, and provided between the pump 4 and the filter 6 to attenuate pulsation of the chemical solution discharged from the pump. It mainly comprises a damper 5. The operation will be described below.
ヒーター１により高温加熱された薬液10は、処理槽の
内槽２からオーバーフローして外槽３に貯まり、エアー
駆動式ポンプ４によりダンパー５とフィルター６を通過
して内槽２に戻るという一連の動作を行う。The chemical solution 10 heated at a high temperature by the heater 1 overflows from the inner tank 2 of the processing tank, is stored in the outer tank 3, passes through the damper 5 and the filter 6 by the air-driven pump 4, and returns to the inner tank 2. Perform the operation.
ダンバー５は、エアー駆動式ポンプ４により生じた薬
液の脈動を減衰させるためのものであり、本実施例では
フィルターエレメントを取り除いたフィルターを用いて
いる。フィルターエレメントを取り除いたフィルターの
内部は空洞になっており、空気が充分に溜まる構造にな
っているが、エアー抜き口７とドレン口８があるので、
空気と薬液が洩れないようにバルブ９により流路をふさ
いでいる。The dam bar 5 is for attenuating the pulsation of the chemical solution generated by the air-driven pump 4, and in this embodiment, a filter from which the filter element is removed is used. The interior of the filter from which the filter element has been removed is hollow and has a structure in which sufficient air is stored. However, since there is an air vent 7 and a drain 8,
The flow path is closed by a valve 9 so that air and chemicals do not leak.
薬液10の脈動減衰メカニズムはダンパー５内部の空洞
部に残存する空気が圧縮系の気体であることから、エア
ー駆動式ポンプ４の吐出圧力である０〜2kg/cm2の圧力
変動に対して、充分に圧力の均一化が図られ脈動を減衰
できるものである。The pulsation damping mechanism of the chemical solution 10 is such that the air remaining in the cavity inside the damper 5 is a compression-type gas, so that the pressure fluctuation of 0 to 2 kg / cm 2 , which is the discharge pressure of the air-driven pump 4, The pressure can be sufficiently made uniform and the pulsation can be attenuated.
以上説明したように本発明は、ポンプにより生じた薬
液の脈動をダンパーにより減衰させることにより、フィ
ルターに大量に捕獲された塵埃がフィルターから離脱
し、通り抜ける確率を大幅に低減できる。このため処理
槽の汚染を防止することができるという効果を有する。As described above, according to the present invention, by damping the pulsation of the chemical solution generated by the pump by the damper, the probability that the dust captured in a large amount by the filter separates from the filter and passes through can be significantly reduced. Therefore, there is an effect that contamination of the processing tank can be prevented.
第１図は本発明の一実施例の模式断面図、第２図は従来
のウェハー処理装置の一例の模式断面図である。 １……ヒーター、２……内槽、３……外槽、４……エア
ー駆動式ポンプ、５……ダンパー、６……フィルター、
７……エアー抜き口、８……ドレン口、９……バルブ、
10……薬液。FIG. 1 is a schematic sectional view of one embodiment of the present invention, and FIG. 2 is a schematic sectional view of an example of a conventional wafer processing apparatus. 1 ... heater, 2 ... inner tank, 3 ... outer tank, 4 ... air-driven pump, 5 ... damper, 6 ... filter,
7 ... Air vent, 8 ... Drain, 9 ... Valve,
10 …… Chemical solution.
Claims (1)
槽と、この内槽から流出した薬液を入れる外槽と、この
外槽の薬液をフィルターを通過させて内槽に流入させる
ポンプとを有するウェハー処理装置に於いて、前記ポン
プから吐出される薬液の脈流を減衰させるため、前記ポ
ンプと前記フィルターとの間にフィルターエレメントを
取り除いたフィルターからなるダンパーを設けたことを
特徴とするウェハー処理装置。1. An inner tank for processing a semiconductor wafer filled with a chemical solution, an outer tank for containing a chemical solution flowing out of the inner tank, and a pump for allowing the chemical solution in the outer tank to pass through a filter and flow into the inner tank. In the wafer processing apparatus, in order to attenuate a pulsating flow of a chemical solution discharged from the pump, a damper including a filter from which a filter element is removed is provided between the pump and the filter. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303455A JP2853317B2 (en) | 1990-11-08 | 1990-11-08 | Wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303455A JP2853317B2 (en) | 1990-11-08 | 1990-11-08 | Wafer processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04176125A JPH04176125A (en) | 1992-06-23 |
| JP2853317B2 true JP2853317B2 (en) | 1999-02-03 |
Family
ID=17921190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2303455A Expired - Fee Related JP2853317B2 (en) | 1990-11-08 | 1990-11-08 | Wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2853317B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5339843A (en) * | 1993-04-16 | 1994-08-23 | Martin Marietta Corporation | Controlled agitation cleaning system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366116U (en) * | 1986-10-22 | 1988-05-02 | ||
| JPH0441704U (en) * | 1990-08-01 | 1992-04-09 |
-
1990
- 1990-11-08 JP JP2303455A patent/JP2853317B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04176125A (en) | 1992-06-23 |
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