JP2842430B2 - TAB tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TAB tape used for a probe test or the like.

[0002]

2. Description of the Related Art Conventionally, with an increase in demand for semiconductor devices,
Various methods have been proposed to perform the inspection efficiently. In particular, an inspection method using a TAB tape is effective. FIG. 6 shows the structure of a conventional TAB tape used for this inspection as a first conventional technique.

This TAB tape 1 is composed of a TAB carrier 5
The semiconductor chip 6 includes a plurality of test pads 2 formed on a TAB tape 1, wiring patterns 3 extending from the test pads 2, and device holes 4 for setting semiconductor chips and the like. The bonding pad 7 serving as a connection electrode of the above and the wiring pattern 3 extending from the test pad 2 are connected by a TAB lead 8.

[0004] The semiconductor chip 6 is set in the device hole 4 and connects the bonding pads 7 on the semiconductor chip 6 to the wiring patterns 3 extending from the respective test pads 2 on the TAB tape 1 by TAB leads 8. On the TAB tape. As will be described later, each test pad 2 on the conventional TAB tape 1 is larger in size than the bonding pad 7 on the semiconductor chip 6, and the size of the bonding pad 7 on the semiconductor chip 6 is larger. The arrangement intervals are wider than the respective arrangement intervals. This is for facilitating the probe test on the TAB tape 1.

FIG. 7 is a view showing the structure of the test pad section 9a shown in FIG. 6, (a) is an enlarged view of the test pad section 9a shown in FIG. 6, and (b) is a broken line of (a). cc '
It is sectional drawing of a part. Here, 10 is an insulating film, and 2 is a test pad formed on the insulating film.

The test of the semiconductor chip 6 mounted using such a TAB tape 1 is performed by using the TAB tape 1
This is performed by a probe test in which the probe is brought into contact with the test pad 2 formed above.

FIG. 8 is a cross-sectional view of the test pad portion showing the state of the probe and the test pad 2 when the above-mentioned probe test is performed. 10 is an insulating film, and 2 is formed on the insulating film. The test pad 12 is a probe.

Here, the interval 13 between the test pads 2 is a reference interval determined in manufacturing the TAB tape 1. Reference numeral 14 denotes a margin at the time of the probe, which is determined in consideration of the assembly accuracy of the TAB tape 1 and the TAB carrier 5 and the probe accuracy at the time of the probe shown in FIG. Is determined.

Therefore, in the first prior art, by adding the margin 14 to the test pad 2, it is possible to prevent a contact error of the probe 12 with the test pad 12 due to a displacement of the probe 12, and The probe accuracy at the time of the probe can be improved, and the work efficiency at the time of the inspection can be increased.

Next, FIG. 9 shows a second conventional technique, T
FIG. 1 is a cross-sectional view of a semiconductor integrated circuit device disclosed in Japanese Patent Application Laid-Open No. 4-152634 as a method for improving the probe accuracy when inspecting a semiconductor device without using an AB tape and improving the inspection efficiency.

This semiconductor integrated circuit device has an electrode pad 3
00, the wafer substrate 400 and the passivation film 50
The semiconductor chip 200 is composed of 0 and the surface of the electrode pad 300 is formed in a mortar shape, so that the accuracy of applying a needle to the electrode pad 300 is improved.

[0012]

As described above, in the TAB tape 1 of the first prior art, the margin 14 at the time of the probe is set to the test pad 2 in order to secure the probe property to the test pad 2 at the time of the test. 11 needs to be added.
For this reason, the size of the test pads 2 increases, and the required number of test pads 2
In order to arrange the test pads 2 on the B tape 1, the test pads 2 had to be far away from the semiconductor chip 6.

As a result, the bonding pads 7 of the semiconductor chip 6 and the test pads 2 on the TAB tape 1
There is a problem that the length of the wiring pattern 3 for connecting to the semiconductor device becomes longer, which deteriorates the electrical characteristics at the time of the test.

In the second prior art disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 4-152634, the electrode pad 30 of the semiconductor chip 200 is used to improve the probe accuracy.
Although the shape of 0 is directly formed in a mortar shape and its probe accuracy is improved without using a TAB tape, in this technique, all the electrode pads 300 on the semiconductor chip 200 need to be directly formed in a mortar shape. There is a problem that the production is troublesome, and it is more effective to improve the probe accuracy using a TAB tape.

The present invention has been made in view of the above circumstances,
It is an object of the present invention to provide a TAB tape capable of improving inspection efficiency and improving its electrical characteristics.

[0016]

According to the first aspect of the present invention,
In a TAB tape having a plurality of test pads and leads connecting the test pads and the LSI pads formed on a first insulating film, a second pad is formed around the test pads.
Is formed.

Therefore, according to the present invention, when the probe for inspection is brought into contact with the test pad by the insulating film formed around the test pad, the position of the probe is shifted to the test pad by the insulating film. And the accuracy of the probe is improved by the presence of an insulating film, so the test pad does not need an extra margin for improving the probe accuracy, and the test pad can be downsized. Therefore, the test pad can be arranged in the vicinity of the LSI, and therefore, the lead connecting the test pad and the LSI can be shortened. Therefore, it is possible to prevent the deterioration of the electrical characteristics at the time of the test. .

According to a second aspect of the present invention, in the first aspect of the present invention, the second pad formed around the test pad is provided.
The shape of the insulating film is characterized in that the opening surface of the second insulating film around the test pad becomes wider as going upward from the bottom surface with the test pad as the bottom surface.

Therefore, according to the present invention, the effect of the first aspect of the present invention can be obtained, and the opening surface of the insulating film formed around the test pad becomes wider as it goes upward. Therefore, when the probe for inspection is brought into contact with the test pad, the position of the probe is corrected by the insulating film so that the probe comes into contact with the test pad, the probe accuracy is improved, and the size of the test pad is improved. Can be reduced, so that the test pad can be arranged in the vicinity of the LSI.
Can be shortened, so that it is possible to prevent electrical characteristics from deteriorating during a test.

According to a third aspect of the present invention, in the second aspect of the present invention, the shape of the opening surface formed by the second insulating film around the test pad is a mortar-like shape or the vertex angle portion thereof is It has the shape of an inverted quadrangular pyramid cut by a test pad.

Therefore, according to the present invention, the operation of the invention described in claim 2 can be obtained, and the shape of the opening surface formed by the insulating film around the test pad can be a mortar-like shape, or the vertex angle portion thereof can be formed. Since the probe has an inverted quadrangular pyramid shape cut by the test pad, even if the probe does not contact the test pad during the inspection, even if the probe contacts the insulator, the insulator serves as a guide and the test pad Therefore, the probe accuracy can be improved without increasing the size of the test pad, and the test pad can be arranged near the LSI. Therefore, the test pad is connected to the LSI. Since the leads can be shortened, it is possible to prevent the deterioration of the electrical characteristics at the time of the test.

[0022]

Next, an embodiment of a TAB tape according to the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a TAB tape according to a first embodiment of the present invention. However, the same members as those of the TAB tape described in the first prior art in FIG. 6 are given the same numbers.

In the TAB tape 1 of this embodiment, a plurality of test pads 2 are formed on an insulating film, and each test pad 2 and a bonding pad 7 serving as a connection electrode of the semiconductor chip 6 are connected to a wiring pattern 3. And TA
The connection is made using the B lead 8.

The wiring pattern 3 in this embodiment is
It is shorter than the wiring pattern 3 in the conventional TAB tape shown in FIG. 6, and the size of the test pad 2 is smaller than the size of the test pad 2 in the conventional TAB tape shown in FIG. . They are,
This is because the insulating film 20 was formed around the test pad 2 formed on the upper surface of the TAB tape.

The above-mentioned peripheral insulating film 20 is formed, for example, by forming the insulating film 20 on the test pad 2 and then forming the opening 16
Are formed to expose the test pad 2. Although the insulating film 20 may be, for example, an oxide film, the role of the insulating film 20 in the present invention is as described below.
Since it is formed to correct the position of the probe at the time of inspection, it is not particularly limited to an oxide film, and an appropriate insulating film can be used.

FIGS. 2A and 2B are views showing the structure of the test pad 9b shown in FIG. 1. FIG. 2A is an enlarged view of the test pad 9b shown in FIG. 1, and FIG. () Is a cross-sectional view taken along the broken line cc '. 10 is an insulating film,
2 is a test pad formed on the insulating film, 20 is TAB
An insulating film around the test pad 2 formed on the tape,
Reference numeral 16 denotes an opening formed on the test pad. Here, the opening 16 has a circular shape, and has a so-called mortar shape with a narrow bottom surface of the insulating film and a wide top surface.

FIGS. 3A and 3B are cross-sectional views of a test pad portion showing a state where a probe test of the test pad 2 is performed by the probe 12, and FIG. 3A shows a mortar-shaped opening portion. FIG. 16B is a diagram showing a state in contact with the insulating film 20 of 16, that is, a state where the position of the probe is inappropriate, and FIG.
6 is a diagram showing a state in which the position is corrected by using the mortar-shaped insulating film 20 of No. 6 as a guide, and the probe 12 is in contact with the test pad 2. FIG.

As shown in FIG. 3, since the mortar-shaped opening 16 is formed by the insulating film 20 around the test pad 2, the insulating film 20 serves as a guide to prevent positional displacement during probe. Can be corrected. For this reason, it is not necessary to provide the test pad with a margin for displacement at the time of probe as described in the related art, and the size of the test pad 2 can be reduced.
The entire arrangement position can be made closer to the semiconductor chip 6.

Therefore, according to the TAB tape of the first embodiment, since the arrangement position of the entire test pad 2 can be made closer to the semiconductor chip 6, the wiring pattern 3 on the TAB tape can be shortened. The electrical characteristics at the time can be improved.

Next, a second embodiment of the TAB tape according to the present invention will be described. FIG. 4 is a plan view of a TAB tape according to a second embodiment of the present invention. However, the same members as those of the TAB tape described in the first embodiment in FIG.

FIG. 5 is a view showing the structure of the test pad section 9c shown in FIG. 4, (a) is an enlarged view of the test pad section 9c shown in FIG. 4, and (b) is a view (a) of FIG. () Is a cross-sectional view taken along the broken line cc '. 10 is an insulating film,
2 is a test pad formed on the insulating film, 20 is TAB
An insulating film around the test pad 2 formed on the tape,
Reference numeral 17 denotes a hole formed on the test pad 2. This second embodiment and the first embodiment shown in FIG.
The difference is that the shape of the opening 17 formed in the insulating film on the test pad 2 is quadrangular, and therefore, the test pad 2 has the shape of an inverted quadrangular pyramid whose apex is cut off. The cross section shown in FIG. 5B has the same shape as the cross section shown in FIG.

The description of conducting the probe test on the TAB tape of the second embodiment is the same as that of the first embodiment described above with reference to FIG.

Accordingly, in the second embodiment, as shown in the cross section shown in FIG. 5B, the insulating film 20 can guide the probe and assist the contact with the test pad 2. The same effects as in the first embodiment can be obtained.

[0035]

As is clear from the above description, according to the present invention, when the probe for inspection is brought into contact with the test pad, the insulating film is formed by the insulating film formed around the test pad. As a result, the position of the probe is prevented from being displaced on the test pad, and the probe accuracy is improved.In addition, since the probe accuracy is improved by the shape of the insulating film, there is no extra margin for improving the probe accuracy on the test pad. Not needed,
The size of the test pad can be reduced, and the test pad can be arranged near the LSI. Therefore, the lead connecting the test pad and the LSI can be shortened. A TAB tape that can be prevented can be provided.

Further, since the opening surface of the insulating film formed around the test pad becomes wider as it goes upward, when the probe for inspection is brought into contact with the test pad, the insulating film becomes thicker. The position of the probe is corrected by the film so that the probe comes into contact with the test pad, so that the probe accuracy can be improved, and the test pad can be arranged near the LSI. Can shorten the lead connecting to the TAB tape, so that it is possible to provide a TAB tape capable of preventing the deterioration of the electrical characteristics at the time of the test.

Further, since the shape of the opening surface formed by the insulating film around the test pad is a mortar shape or the shape of an inverted quadrangular pyramid whose apex portion is cut by the test pad, the shape during the inspection is Even if the probe does not touch the test pad but touches the insulator, the insulator guides the probe to the test pad, so increase the probe accuracy by increasing the size of the test pad. And the test pad can be arranged in the vicinity of the LSI, so that the lead connecting the test pad and the LSI can be shortened, thereby preventing the deterioration of the electrical characteristics during the test. A TAB tape capable of performing the above can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of a TAB tape according to the present invention.

2A and 2B are diagrams showing the structure of the TAB tape shown in FIG. 1, wherein FIG. 2A is an enlarged view and FIG. 2B is a sectional view.

3A and 3B are cross-sectional views of a test pad portion showing a state of a probe test of a TAB tape according to the present invention, wherein FIG. 3A is a diagram showing a state when a probe is not in contact, and FIG. It is a figure showing the state at the time of needle contact.

FIG. 4 is a plan view showing a TAB tape according to a second embodiment of the present invention.

5A and 5B are diagrams showing the structure of the TAB tape shown in FIG. 4, wherein FIG. 5A is an enlarged view and FIG. 5B is a sectional view.

FIG. 6 is a plan view of a conventional TAB tape.

7A and 7B are diagrams showing the structure of the TAB tape shown in FIG. 6, wherein FIG. 7A is an enlarged view and FIG. 7B is a sectional view.

FIG. 8 is a cross-sectional view of a test pad portion showing a state of a probe test of a conventional TAB tape.

FIG. 9 is a sectional view of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

 Reference Signs List 1 TAB tape 2 Test pad 3 Wiring pattern 4 Device hole 5 TAB carrier 6 Semiconductor chip 7 Bonding pad 8 TAB lead 9a, 9b, 9c Test pad portion 10, 20 Insulating film 12 Probe 13 Test pad interval 14 Margin 15 Test pad size 16, 17 hole

──────────────────────────────────────────────────の Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60 321 H01L 21/60 311 G01R 31/26 H01L 21/66

Claims (3)

(57) [Claims] 1. A TAB tape in which a plurality of test pads and leads for connecting the test pads and an LSI pad are formed on a first insulating film, wherein a second insulating film is provided around the test pads. A TAB tape, characterized in that a tape is formed. 2. The shape of a second insulating film formed around the test pad is such that:
2. The TAB tape according to claim 1, wherein an opening surface of the second insulating film around the test pad becomes wider as going upward from the bottom surface. 3. A shape of an opening surface formed by a second insulating film around the test pad is a mortar shape or an inverted quadrangular pyramid whose apex portion is cut by the test pad. The TAB tape according to claim 2, wherein: