JP2836647B2 - Defect recognition mark attaching device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a defect recognition mark providing apparatus for providing a defect recognition mark to a semiconductor chip determined to be defective in a semiconductor wafer inspection carried out in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, an electrical inspection of a semiconductor integrated circuit is performed at the stage of a semiconductor wafer using an inspection device (hereinafter, referred to as an IC tester). A defect recognition mark is added to an IC chip.

A conventional defect recognition mark providing apparatus will be described below. FIG. 2 is a configuration diagram of a conventional defect recognition mark providing apparatus. As shown in FIG. 2, a probe 12 is brought into contact with an electrode (not shown) of the IC chip 11 to make an electrical connection between the IC tester (not shown) and the IC chip 11, and as a result of the inspection, the IC chip 11 Is defective, the needle 14 arranged in the ink fountain 13 is lowered by energizing the electromagnetic coil 15, and the ink 16 in the ink fountain 13 is
The defect recognition mark 17 is provided on the surface of the chip 11.

[0004]

However, the above conventional configuration has a problem that the clay adjustment of the ink 16 is indispensable in order to provide the defective IC chip 11 with the defect recognition mark 17 in a stable state. Was. That is, if the viscosity of the ink 16 is higher than the optimum viscosity,
When the needle 14 is raised, a stringing phenomenon of the ink 16 occurs, and the ink 16 adheres to the adjacent IC chip 11. Such clay adjustment of the ink 16 or height adjustment of the needles 14 requires skill and is very time-consuming.
The needle 14 often damages the IC chip 11 when the IC chip 11 is adhered on the C chip 11, and has a problem that analysis of a defective IC chip 11 becomes impossible.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a defect recognition mark providing apparatus which does not require viscosity adjustment of ink and height adjustment of a needle.

[0006]

In order to achieve this object, a defect recognition mark providing apparatus according to the present invention comprises an ink bottle, a tubular needle connected to the ink bottle, and a heating means provided on a part of the tubular needle. The heating means heats the ink inside the tubular needle according to a signal from the inspection device to generate bubbles, and the pressure of the bubbles causes the ink to be ejected from the tip of the tubular needle. It has a configuration in which ink is attached to the surface of the chip.

[0007]

With this configuration, a defect recognition mark can be provided in a state in which the tubular needle containing ink is separated from the surface of the semiconductor chip, so that stringing of the ink can be prevented, and the tubular needle impacts the surface of the semiconductor chip. Disappears.

[0008]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a defect recognition mark providing apparatus according to an embodiment of the present invention. In FIG. 1, 1 is I
C chip, 2 probe, 3 ink, 4 tubular needle containing ink 3 inside, 5 heater for heating part of tubular needle 4, 6 bubble generated by heating by heater 5, 7 Denotes a defect recognition mark, and 8 denotes an ink bottle for storing the ink 3.

The operation of the defect recognition mark providing apparatus configured as described above will be described below. An electrode (not shown) of the IC chip 1 and an IC tester (not shown) are electrically connected by a probe 2 to perform a function test. The IC chip 1 that has been determined to be defective by this function test
When the defect recognition mark 7 is given to the heater 3, the heater 5 installed in a part of the tubular needle 4 containing the ink 3 is energized to generate bubbles 6 inside the ink 3.
Pushes out the ink 3 at the tip of the tubular needle 4. The extruded ink 3 protrudes from the tip of the tubular needle 4 and forms a defect recognition mark 7 on the surface of the IC chip 1.

In the present embodiment, an example in which the defect recognition mark 7 is provided to the IC chip 1 has been described.
The same effect can be obtained by using another semiconductor chip such as a transistor chip instead of.

[0012]

As described above, according to the present invention, a portion of the tubular needle is heated to generate bubbles in the ink, and the ink is ejected by the pressure of the bubbles to form a defect recognition mark on the surface of the semiconductor chip. Since the tubular needle is away from the surface of the semiconductor chip, an excellent defect recognition mark providing apparatus which does not cause stringing of ink and does not damage the semiconductor chip can be realized.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a defect recognition mark providing apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a conventional defect recognition mark providing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip (semiconductor chip) 3 Ink 4 Tubular needle 5 Heater (heating means) 6 Air bubble 7 Defect recognition mark

Claims (1)

(57) [Claims] An ink fountain, a tubular needle connected to the ink fountain, and heating means provided on a part of the tubular needle,
The heating means heats the ink inside the tubular needle in accordance with a signal from the inspection device to generate bubbles, and causes the pressure of the bubbles to eject ink from the tip of the tubular needle. Defect marking device that attaches ink to the surface.