JPS63102330A - Inspection apparatus of semiconductor device - Google Patents
Inspection apparatus of semiconductor deviceInfo
- Publication number
- JPS63102330A JPS63102330A JP24874086A JP24874086A JPS63102330A JP S63102330 A JPS63102330 A JP S63102330A JP 24874086 A JP24874086 A JP 24874086A JP 24874086 A JP24874086 A JP 24874086A JP S63102330 A JPS63102330 A JP S63102330A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- chip
- electrode
- integrated circuit
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000007689 inspection Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000012360 testing method Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims 2
- 239000000523 sample Substances 0.000 abstract description 4
- 230000005684 electric field Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000006748 scratching Methods 0.000 abstract 2
- 230000002393 scratching effect Effects 0.000 abstract 2
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Ink Jet (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体装置の検査装置、詳しくは、検査装置
用インカーに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inspection apparatus for semiconductor devices, and more particularly to an inker for an inspection apparatus.
従来の技術
従来、半導体装置、とくに、集積回路の検査工程におい
て、ウェハ一段階で、電気的な機能検査を、ＩＣテスタ
ーで行ない、所定の機能がない半導体集積回路チップを
不良として認識するために、第２図の概要断面図に示す
ようなインカーで、インクを付着させていた。同図にお
いて、半導体集積回路チップ１に、プローブ２を立てで
、ＩＣテスターと、チップとの電気的な接続を行ない、
電気的な機能検査を行った後不良品の場合、インクつぼ
３の中の針５を電磁コイルを利用した駆動部６により、
下方に動かしてインク４を、半導体基板ｌ上のチップ面
に付着させるものであった。Conventionally, in the testing process of semiconductor devices, especially integrated circuits, an IC tester is used to conduct electrical function tests at one wafer stage, in order to recognize semiconductor integrated circuit chips that do not have a predetermined function as defective. , ink was applied using an inker as shown in the schematic cross-sectional view of FIG. In the figure, a probe 2 is placed upright on a semiconductor integrated circuit chip 1, and an electrical connection is made between the IC tester and the chip.
If the product is defective after conducting an electrical function test, the needle 5 in the ink fountain 3 is moved by a drive unit 6 using an electromagnetic coil.
The ink 4 was moved downward to adhere to the chip surface on the semiconductor substrate l.
発明が解決しようとする問題点
このような従来の構成では、インクつぼ３の先端の位置
は、測定ウェハーと、一定の距離をあけて、チップの所
定の位置にインクが付着するように設定する必要があっ
た。このインクつぼ３の位置設定は、熟練を要するもの
であり、時間がかかるという問題があった。Problems to be Solved by the Invention In such a conventional configuration, the position of the tip of the ink fountain 3 is set at a certain distance from the measurement wafer so that ink adheres to a predetermined position on the chip. There was a need. Setting the position of the ink fountain 3 requires skill and is time consuming.
また、インクを半導体集積回路の基板１上のチップ面に
付着させる時、インカーの針５が、半導体基板１のチッ
プ面に接触することがあると、同チップ面の配線が切断
されたり、同チップ面の保護膜にクラックが入ったりす
ることがある。それゆえ、不良チップにインクを付着さ
せるのとは逆に、良品チップにインクを付着させて良品
を認識するのに用いる場合には、このような検査装置の
利用は不可能であるという問題があった。Furthermore, when applying ink to the chip surface of the semiconductor integrated circuit substrate 1, if the inker needle 5 comes into contact with the chip surface of the semiconductor substrate 1, the wiring on the chip surface may be cut or the same may occur. Cracks may appear in the protective film on the chip surface. Therefore, there is a problem in that it is impossible to use such an inspection device when it is used to recognize good chips by applying ink to good chips, as opposed to applying ink to defective chips. there were.
問題点を解決するための手段
この問題点を解決するために本発明は、半導体装置の検
査工程に使用するインカーにおいて、インクつぼを一つ
の電極とするとともに、他方の電極をインクつぼの先端
方向に設けたものである。Means for Solving the Problem In order to solve this problem, the present invention provides an inker used in the testing process of semiconductor devices, in which the ink fountain is used as one electrode, and the other electrode is connected toward the tip of the ink fountain. It was established in
作用
この構成により、インクっぽの先端部にあるインクは、
インクつぼの先端方向にある電極に加わった電圧による
電界によってインクっぽの先端部から飛び出し、チップ
にインクを付着させることができる。Effect: With this configuration, the ink at the tip of the inky tip is
The electric field generated by the voltage applied to the electrodes toward the tip of the inkpot allows ink to fly out from the tip of the inkpot and adhere to the tip.
実施例
第１図は本発明の一実施例による半導体集積回路の検査
装置の概要断面図であり、導電性の材質でできたインク
っぽ３を接地しておき、インクっぽの先端方向に円筒形
の電極７を設け、電気スイッチ８を経て、プラス電源に
接続したものである。半導体基板１の集積回路チップ面
に、プローブ２をあて、検査後、インク４をチップに付
着させる場合スイッチ８を閉じて、電極７に高電圧を印
加し、インクつぼ３の先端部と、電極７との間にできる
電界により、インクがインクつぼ３より飛び出し、チッ
プ面にインク４を付着させるようにしたものである。Embodiment FIG. 1 is a schematic cross-sectional view of a semiconductor integrated circuit testing apparatus according to an embodiment of the present invention, in which an ink tip 3 made of a conductive material is grounded and A cylindrical electrode 7 is provided and connected to a positive power source via an electric switch 8. If the probe 2 is applied to the integrated circuit chip surface of the semiconductor substrate 1 and the ink 4 is applied to the chip after inspection, the switch 8 is closed and a high voltage is applied to the electrode 7. Due to the electric field created between the ink and the ink fountain 7, the ink is ejected from the ink fountain 3 and the ink 4 is attached to the chip surface.
発明の効果
以上のように本発明によれば、インクつぼの先端と、半
導体基板上の集積回路チップとの距離の調整が容易であ
り、また、チップにきすを与えずにインクをチップに付
着させることが可能となる。Effects of the Invention As described above, according to the present invention, the distance between the tip of the ink fountain and the integrated circuit chip on the semiconductor substrate can be easily adjusted, and ink can be attached to the chip without causing scratches on the chip. It becomes possible to do so.
第１図は本発明の一実施例による半導体集積回路の検査
装置を示す概要断面図、第２図は従来の半導体集積回路
の検査装置を示す概要断面図である。
１・・・・・・半導体基板、２・・・・・・プローブ、
３・・・・・・インクつぼ、４・・・・・・インク、７
・・・・・・電極、８・・・・・・スイッチ。
代理人の氏名 弁理士 中尾敏男 はが１名イ°−“を
埠４ト第４々
２−−−７加−グ′
第 １ 図 ３゛−イ
〉クツ（！゛ンク一一ノミ１シ締FIG. 1 is a schematic sectional view showing a semiconductor integrated circuit testing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic sectional view showing a conventional semiconductor integrated circuit testing apparatus. 1... Semiconductor substrate, 2... Probe,
3... Ink pot, 4... Ink, 7
...electrode, 8...switch. Name of agent Patent attorney Toshio Nakao Tighten
Claims (1)
、滴下端部を有するインクつぼの前記滴下端と半導体基
板との間に電極をもうけ、同電極とインクつぼの先端と
の間に電圧を印加することによってインクを飛ばすこと
を特徴とする半導体装置の検査装置。In an inker used in the testing process of semiconductor integrated circuits, an electrode is provided between the dropping end of an ink fountain having a dripping end and a semiconductor substrate, and a voltage is applied between the electrode and the tip of the ink fountain. An inspection device for semiconductor devices characterized by spraying ink by spraying the ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24874086A JPS63102330A (en) | 1986-10-20 | 1986-10-20 | Inspection apparatus of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24874086A JPS63102330A (en) | 1986-10-20 | 1986-10-20 | Inspection apparatus of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63102330A true JPS63102330A (en) | 1988-05-07 |
Family
ID=17182658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24874086A Pending JPS63102330A (en) | 1986-10-20 | 1986-10-20 | Inspection apparatus of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102330A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19523597A1 (en) * | 1995-06-30 | 1997-01-02 | Hans Damm | Window of module housing opaque covering method for UV-EPROM |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165648A (en) * | 1979-06-12 | 1980-12-24 | Nec Corp | Method of sorting and inspecting semiconductor device |
| JPS58139437A (en) * | 1982-02-15 | 1983-08-18 | Nec Home Electronics Ltd | Sorting and indicating method for semiconductor element |
-
1986
- 1986-10-20 JP JP24874086A patent/JPS63102330A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165648A (en) * | 1979-06-12 | 1980-12-24 | Nec Corp | Method of sorting and inspecting semiconductor device |
| JPS58139437A (en) * | 1982-02-15 | 1983-08-18 | Nec Home Electronics Ltd | Sorting and indicating method for semiconductor element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19523597A1 (en) * | 1995-06-30 | 1997-01-02 | Hans Damm | Window of module housing opaque covering method for UV-EPROM |
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