JP2814853B2 - Integrated circuit shield structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure of an integrated circuit, and more particularly to a shield structure of an integrated circuit effective at high frequencies.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 3, a shield structure of this kind of integrated circuit has a plurality of integrated circuits 11a and 11a.
b, a printed wiring 13 connecting an output part of the integrated circuit 11a and an input part of the integrated circuit 11b is formed, and a substrate 15 holding the above-mentioned integrated circuits 11a, 11b, an electric circuit and the like, and a substrate 15 is accommodated. A case 17 and the integrated circuits 11a and 11
The structure generally includes a partition plate 19 made of a conductor provided between the electrodes b.

The partition plate 19 shields the output of the integrated circuit 11a and the input of the integrated circuit 11b, so that there is no electromagnetic coupling between the integrated circuits 11a and 11b and no high-frequency interference occurs.

[0004]

However, in the above-mentioned conventional shield structure of an integrated circuit, since the partition plate 19 is provided between the integrated circuits 11a and 11b,
There is a problem that electromagnetic coupling occurs between input and output of one integrated circuit 11a or integrated circuit 11b and mutual interference occurs.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a shield structure for an integrated circuit which solves the above-mentioned drawbacks and eliminates interference between the input and output of the integrated circuit.

[0006]

According to the first aspect of the present invention,
In a shield structure of an integrated circuit comprising a substrate for forming an electric circuit by providing at least one or more integrated circuits for inputting and outputting a high-frequency signal, a case for accommodating the substrate, and a partition plate for reducing electromagnetic coupling, Integrated circuit is placed on the substrate
The case is made of a conductor and
It has a box-like shape with almost vertical walls.
The plate is also a rectangular shape made of a conductor,
The number of integrated circuits that input and output
The two sides of each partition are the two opposite walls of the case
Are inscribed one by one on the board side of each partition plate.
The edge is the signal on the opposite side of the substrate of the corresponding integrated circuit.
Close to the line separating the signal input and signal output.
It is characterized by being placed.

That is, according to the first aspect of the present invention, on the substrate
The integrated circuit is located in the
Box shape with a wall surface almost perpendicular to the substrate
In the shape of a rectangular
The number of each integrated circuit that inputs and outputs high-frequency signals through the cutting board
Only, both sides of each partition face the case
Inscribe one by one on the two wall surfaces
The end of the substrate side of
On the line that separates the signal input and signal output at
They are arranged close to each other. This allows
For each integrated circuit that inputs and outputs high-frequency signals within the
Effectively reduce the electromagnetic coupling between their input and output sides.
It becomes possible to reduce.

According to the second aspect of the present invention,
On the wall of the case corresponding to both sides of the partition plate in the invention
A groove is cut out, and both sides of the partition plate fit into this.
It is characterized by that. This allows the partition plate to be
It can be easily installed inside.

[0009]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of a shield structure of an integrated circuit according to the present invention. FIG. 2 is a sectional view of the embodiment.

The shield structure of the integrated circuit shown in these figures includes a plurality of integrated circuits 1a and 1b, an input section of the integrated circuit 1a, an output section of the integrated circuit 1a and an input section of the integrated circuit 1b, Printed wiring 3a for connecting the output section 1b, etc.
3b, 3c are formed, and the integrated circuits 1a, 1
b, a substrate 5 for holding an electric circuit, etc., a case 7 for accommodating the above-described substrate 5, and connected to and fixed to the case 7, provided substantially at the center of each of the integrated circuits 1a, 1b and made of a conductor. A structure having partition plates 9a and 9b is generally used.

Here, the substrate 5 has an electric circuit formed by thick-film printing on an alumina substrate. On the substrate 5, for example, two integrated circuits 1a and 1 in a pellet state are provided.
b is die-bonded by the bonding wire 10. Such a substrate 5 is housed in a case 7. The case 7 may be made of, for example, a metal plate having a surface of brass plated with nickel. A partition plate 9a is arranged substantially at the center of the integrated circuit 1a on the substrate 5 housed in the case 7, and the partition plate 9a is
Are fixed using, for example, solder, conductive paste, or screws. Further, a partition plate 9b is disposed substantially at the center of the integrated circuit 1b, and the partition plate 9b is fixed to the case 7 using, for example, solder, conductive paste, or screws. Note that the partition plates 9a and 9b may be made of a plate-like conductor.

The operation of such an embodiment will be described.

On the substrate 5 described above, for example, two integrated circuits 1a and 1b in a pellet state are die-bonded. Next, the board 5 is mounted in the case 7.

When the mounting of the board 5 is completed, the partition plates 9a, 9b are provided between the input and output of the integrated circuits 1a, 1b.
9b is arranged, and the partition plates 9a, 9b and the case 7 are electrically contacted and fixed by, for example, solder, conductive paste, screws or the like.

Thus, the input and output of the integrated circuit 1a are shielded by the partition plate 9a, and the integrated circuit 1b is shielded by the partition plate 9a.
Since the input and output are shielded by b, the electromagnetic coupling between the input and output of each of the integrated circuits 1a and 1b is eliminated, so that the mutual interference due to the electromagnetic coupling between the input and output can be reduced.

[0017]

As described above, the invention according to claim 1 is described above.
According to the case, the case and the partition plate are made of a conductor.
And the partition plate is placed in the case,
Effective in transmitting and receiving electromagnetic waves from inside the case where the circuit is located
Can be prevented. Moreover, electromagnetic waves in the case
Special shielding member outside the case
The shield structure of the integrated circuit itself is not required
Can be stored in the project. Moreover, the partition plate is a high-frequency signal
The number of each integrated circuit that inputs and outputs signals is prepared,
These board-side edges are opposite the corresponding integrated circuit board
The signal input and the signal output on the side surface
Since they are arranged close to each other on the line,
The input and output sections can be shielded electromagnetically for each road.
And the mutual coupling in the same integrated circuit due to electromagnetic coupling between input and output
It also has the effect of greatly reducing interference.
You.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a shield structure of an integrated circuit according to the present invention.

FIG. 2 is a sectional view showing an embodiment of the present invention.

FIG. 3 is a plan view showing a shield structure of a conventional integrated circuit.

[Explanation of symbols]

 1a, 1b Integrated circuit 3 Printed wiring 5 Substrate 7 Case 9a, 9b Partition plate

Claims (2)

(57) [Claims] 1. An integrated circuit comprising: a substrate on which at least one integrated circuit for inputting and outputting a high-frequency signal is provided to form an electric circuit; a case accommodating the substrate; and a partition plate for reducing electromagnetic coupling. In the shield structure, the integrated circuit is disposed on a substrate, and the case is
A wall made of a conductor and almost perpendicular to the substrate
The partition plate has the same shape as the
It has a rectangular body and inputs and outputs high-frequency signals
As many as the number of each integrated circuit, each partition
Each side of the plate is one on each of the two opposite walls of the case.
The end of each partition plate on the substrate side is paired.
Signal of the corresponding integrated circuit on the side opposite the substrate.
It is placed close to the line that separates the input section and the signal output section.
A shield structure for an integrated circuit, which is characterized in that: 2. A cable corresponding to the both sides of the partition plate.
A groove is cut in the wall of the
The shield structure for an integrated circuit according to claim 1, wherein the shield structure is fitted .