JP2802871B2 - Semiconductor chip pickup device and semiconductor chip pickup method using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip pickup device and a semiconductor chip pickup method using the same.

[0002]

2. Description of the Related Art ICs
In semiconductor devices such as LSIs and LSIs, a large number of devices fabricated together on a silicon wafer are separated into individual semiconductor chips by a die sink, picked up one by one, and bonded to a predetermined position on a lead frame. Then, it is manufactured through various processes such as wire bonding, resin mold packaging, marking, inspection, lead form cutting, and the like.

[0003] Among these, an apparatus for picking up individual semiconductor chips one by one and transferring them to a predetermined intermediate positioning table or a bonding position for a lead frame is called a pick-up apparatus and usually has the following configuration. I have.

As shown in FIGS. 4 to 6, a large number of semiconductor chips g divided from a silicon wafer are supported on an elastic sheet called an expanded tape f so as to increase the space between the individual chips. The expand tape is elastically extended. The expanded tape thus expanded is stretched on the holding frame k.

The holding frame k on which the expand tape f is stretched is mounted on an XY actuator m such as an XY table. Below the expand tape, a mechanism called a tape guide a for detaching the individual semiconductor chips temporarily held thereon from the expand tape due to the viscosity or the like of the expand tape is fixedly arranged.

As shown in FIG. 5, a conventional tape guide a has a cylindrical member d having a flat guide surface c with a vacuum hole b formed at the center on the top, and is vertically moved inside. Pickup needle e is incorporated. Further, inside the tape guide a, a vacuum pressure can be applied as appropriate so that a negative pressure is applied to the vacuum hole b to bring the back surface of the expanded tape f into close contact with the guide surface c. .

Above the expanding tape f, a suction collet h for vacuum-sucking and transporting the semiconductor chip g mounted on the expanding tape f located on the tape guide a is arranged. An optical recognition system (FIG. 4) j for detecting whether or not the target semiconductor chip g is accurately positioned at the center of the tape guide a is disposed above the expand tape f.

In accordance with the information from the optical recognition system j, the control device drives the XY actuator m to sequentially guide the semiconductor chips g on the expand tape f so as to be located at the center of the tape guide a.

When the position adjustment is completed, as shown in FIG. 5, a negative pressure is applied to the vacuum hole b, and the expanding tape f is brought into close contact with the guide surface c. Then, as shown in FIG. 6, the pickup needle e is moved upward relative to the cylindrical member d,
The tip penetrates through the expanding tape f, and the semiconductor chip g is peeled off from the expanding tape f. Then, the semiconductor chip g thus peeled is sucked by the suction collet h, and is conveyed to a predetermined positioning table or a bonding position on the lead frame.

The above-described conventional semiconductor chip pickup device has the following problems.

First, the pickup needle e in the tape guide body (cylindrical member d) moves up and down relatively to the tape guide body (cylindrical member d), which complicates the structure and causes failure. Many.

Second, the vertical movement of the pickup needle e with respect to the tape guide main body tends to cause the separated semiconductor chip 8 to be misaligned, and the suction collet h is used to bond the semiconductor chip to the lead frame. X direction at the time of carrying away,
Positional displacement in the Y direction or the θ direction is likely to occur.

There are two ways to push up the pick-up needle e from the vacuum hole b: moving the pick-up needle upward and moving the tape guide body downward. The positional displacement of the semiconductor chip 8 due to the relative movement between the guide and the pickup needle is likely to occur.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to efficiently pick up a semiconductor chip by using a simpler mechanism and eliminating the displacement of the semiconductor chip. It is an object of the present invention to provide a semiconductor chip pickup device and a semiconductor chip pickup method using the same.

[0015]

Means for Solving the Problems To solve the above problems, the present invention takes the following technical means.

That is, the invention described in claim 1 of the present application provides an XY actuator for moving a holding frame, on which an expand tape on which a semiconductor chip is temporarily held, is stretched, in an XY direction, and a fixed frame below the expand tape. And a tape guide that has a guide surface that slides on the lower surface of the expandable tape and has a vacuum hole formed in the guide surface, and is disposed so as to face the inside of the vacuum hole, and penetrates the expandable tape. In a semiconductor chip pickup device comprising a pickup needle capable of picking up and a suction collet for sucking and conveying the semiconductor chip on the expandable tape, the pickup needle is adjusted so that the upper end height thereof substantially coincides with the guide surface. Relative to the above tape guide On the other hand, while fixing, the size of the vacuum hole is set to be sufficiently large for the semiconductor chip to be picked up, and the vacuum pressure to be applied to the vacuum hole covers the vacuum hole when the vacuum pressure is applied. The expansion tape is set so as to be drawn into the vacuum hole in a concave shape.

According to a second aspect of the present invention, there is provided a method for picking up a semiconductor chip using the apparatus according to the first aspect, wherein the method includes the following steps. (a) adjusting the position of the expand tape so that one semiconductor chip temporarily held thereon is positioned at the center of the vacuum hole, (b) applying a predetermined negative pressure to the vacuum hole (C) peeling the semiconductor chip from the expanded tape by pulling the expanded tape on which the semiconductor chip is mounted into the vacuum hole, and at this time, the pickup needle penetrating the expanded tape relatively from below to above; A step of sucking the made semiconductor chip by the suction collet.

Further, the invention described in claim 3 of the present application is a method of picking up a semiconductor chip temporarily held on an expandable tape by a suction collet on a tape guide, wherein a vacuum hole is provided on a guide surface of the tape guide. While the pickup needle is fixedly provided so as to face the inside of the vacuum hole so that the upper end height is substantially coincident with the guide surface, the expand tape is temporarily held on one of the expandable tapes. Adjust the position so that the semiconductor chip is located at the center of the vacuum hole, move the suction collet down to bring the lower end into contact with the upper surface of the semiconductor chip, and apply suction to hold the semiconductor chip by suction. Meanwhile, the semiconductor chip is mounted by applying a predetermined negative pressure to the vacuum hole. The expanding tape is pulled into the vacuum hole, and at this time, the semiconductor chip is peeled off from the expanding tape by the pickup needle penetrating the expanding tape relatively downward from above, and the semiconductor chip thus peeled off from the expanding tape is removed. The pickup is performed by moving the suction collet upward.

[0019]

In order to separate the semiconductor chip adhering on the expanding tape from the expanding tape, it is necessary to penetrate a pickup needle below the expanding tape from below to above the expanding tape. Conventionally, the movement of the pickup needle with respect to the expanding tape has been obtained by moving the pickup needle relatively upward with respect to the tape guide, but in the present invention, by applying a negative pressure in the tape guide. This is accomplished by drawing an expandable tape carrying a semiconductor chip into a vacuum hole.

Therefore, in the present invention, a mechanism for moving the pickup needle up and down relatively to the tape guide is not required at all, and the structure of the tape guide itself is simplified, and the occurrence of trouble is reduced. Become.

Since the planar positional relationship of the pickup needle with respect to the tape guide, more specifically, the planar position of the tip of the pickup needle facing the vacuum hole is maintained with high accuracy, the expand tape is drawn into the vacuum hole. In this case, when the pickup needle penetrates through the expanding tape to peel the semiconductor chip, the semiconductor chip is less likely to be displaced. As a result, when the separated semiconductor chip is transported to the bonding position on the lead frame by the suction collet, the position accuracy of the semiconductor chip on the lead frame is maintained at a high level. As a result, the bonding accuracy of the semiconductor chip to the lead frame is improved, so that the quality characteristics of the manufactured semiconductor device are stabilized.

Further, since it is not necessary to position the semiconductor device picked up from the expanding tape in the middle, the semiconductor chip can be more easily bonded on the lead frame.

As described above, according to the semiconductor chip pickup apparatus and the semiconductor chip pickup method using the same of the present invention, the semiconductor chip can be efficiently and accurately picked up from the expanded tape by a simpler mechanism. it can.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below.
This will be specifically described with reference to FIGS.

An expandable tape 2 carrying a large number of semiconductor chips 1 by viscous adhesion or the like while widening the interval between them is stretched on a predetermined holding frame 3. The planar position (position on the XY plane) of the holding frame 3 or the expanding tape 2 can be appropriately adjusted by supporting the holding frame 3 on an XY actuator 4 such as an XY table.

Below the expand tape 2, a tape guide 5 for detaching the semiconductor chip 1 attached to the upper surface from the expand tape is fixedly arranged.

As shown in FIG. 2, the tape guide 5 has a flat guide surface 6 having a vertical height substantially corresponding to the lower surface of the expanding tape 2 properly held on an XY table. The guide surface 6 is formed on a hollow cylindrical member 7. Guide surface 6
Is also provided with a vacuum hole 8 of a predetermined size. That is, this vacuum hole 8
Is sufficiently large for the semiconductor chip 1 to be picked up.

Inside the cylindrical tape guide 5,
The pickup needle 9 is fixedly mounted. The pickup needle 9 has a sharp tip 9a, and the tip 9a faces the center of the vacuum hole 8. The tip 9a of the pickup needle 9 is located at substantially the same height as the guide surface 6. Preferably, the tip 9a of the pickup needle 9 is located slightly lower than the guide surface 6 in order for the expandable tape 2 to slide on the guide surface 6 smoothly.

The tape guide 5 has a control valve 10
Is connected to the vacuum source 11 via.

Above the expand tape 2, a suction collet 12 for vacuum-sucking and transporting the semiconductor chip 1 peeled from the expand tape 2 as described later is arranged.

The semiconductor chip 1 on the expanding tape 2 is further positioned above the expanding tape 2 at the center of the tape guide 5, more specifically, directly above the pickup needle 9 facing the vacuum hole 8. An optical recognition system 13 for confirming whether or not it is provided is provided.

The control valve 10 for turning on and off the negative pressure to the vacuum hole 8 of the XY actuator 4, the suction collet 12, and the tape guide is provided by a control device 14.
Is controlled by

The control input signal to the control device 14 includes recognition information from the optical recognition system 13.

The XY actuator 4 is controlled and driven so that a large number of semiconductor chips 1 carried on the expanding tape 2 are sequentially positioned on the tape guide 5. From the optical recognition system 13 is confirmed whether or not it is located at the center of the pickup needle 9 facing the vacuum hole 8, more specifically.

When one of the semiconductor chips 1 on the expanding tape 2 is positioned at the center of the guide surface of the tape guide 5 as described above by driving the XY actuator 4, a negative pressure is applied to the vacuum hole 8. Acted on.

Then, the expandable tape 2 having elasticity is attached to the vacuum hole 8 as shown in FIG.
It is drawn into a concave shape. Since the expand tape 2 is pushed down relatively to the pickup needle 9, the pickup needle 9 relatively penetrates the expand tape 2 and is attached to the expand tape 2 at this time. The semiconductor chip 1 is peeled.

The semiconductor chip 1 thus peeled off
Next, is sucked and held by the suction collet 12 and transported to a transport destination such as a lead frame.

While the suction collet 12 is carrying, the semiconductor chip to be picked up next is positioned at the center of the tape guide 5 in the same manner as described above, and peeled off from the expanded tape in the same manner as described above. Is carried out, and transport by the suction collet 12 is performed.

As apparent from the above description, in the semiconductor chip pickup device of the present invention, the tape guide body and the pickup needle incorporated therein have a fixed relationship with each other. A mechanism for relatively vertically moving the pickup needle and the pickup needle is not required, so that the configuration is simplified and troubles are reduced. In particular, in order to pick up a semiconductor chip without causing a positional shift, it is necessary to always accurately define the positional relationship between the chip and the pickup needle in the plane direction. Can be satisfied with a simple configuration.

As described above, in the semiconductor chip pickup device of the present invention, the semiconductor chip can be smoothly picked up from the expanded tape without causing a positional shift.

As described above, in the present invention, since neither the tape guide nor the pickup needle moves up and down, the pickup collet 12 is operated as follows to obtain a more accurate semiconductor chip pickup. It is possible to do.

That is, as shown in FIG. 2, when the position of the semiconductor chip 1 is adjusted, the suction collet 12 is moved downward to bring the lower end into contact with the upper surface of the semiconductor chip 1 and to apply the suction adhesion. In this state, as shown in FIG. 3, a negative pressure is generated in the vacuum hole 8 to cause the expanding tape 2 to be drawn into the vacuum hole, thereby separating the semiconductor chip from the expanding tape.

By doing so, the semiconductor chip 1 can be conveniently peeled off from the expand tape without changing its attitude or planar position at all.

Of course, the scope of the present invention is not limited to the embodiment described above. As a semiconductor chip to be picked up, the present invention can be applied to picking up any semiconductor chip including a relatively large chip such as an IC or an LSI and a small chip such as a diode or a transistor.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of an embodiment of the present invention.

FIG. 2 is a sectional view of a main part of the present invention, showing a state in which the position of a semiconductor chip on an expandable tape is adjusted with respect to a tape guide, and a suction collet is moved downward.

FIG. 3 is a sectional view of a main part of the present invention, showing a state in which a negative pressure is applied to a vacuum hole of the tape guide.

FIG. 4 is an overall configuration diagram of a conventional example.

FIG. 5 is a sectional view of a main part of a conventional example.

FIG. 6 is a cross-sectional view of a main part of a conventional example, showing a state where a pickup needle is relatively moved upward with respect to a tape guide main body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Expanding tape 3 Tape guide 8 Vacuum hole 9 Pickup needle 12 Suction collet

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/52 H01L 21/301 H01L 21/68

Claims (3)

(57) [Claims] 1. An X-movement mechanism for moving a holding frame on which an expand tape on which a semiconductor chip is temporarily held is stretched in an XY direction.
And Y actuators are arranged in a fixed form below the expand tape, together with the guide surface which slides on the lower surface of the expandable tape, a tape guide having a vacuum hole formed in the guide surface, said Baki
Is positioned so that it faces the inside of the
Pickup need that can penetrate the tape
And a suction collet for sucking and transporting the semiconductor chip on the expandable tape, wherein the pickup needle is attached to the tape guide such that the height of the upper end thereof substantially coincides with the guide surface. On the other hand, when the vacuum pressure is set to be sufficiently large for the semiconductor chip to be picked up and the vacuum pressure to be applied to the vacuum hole is applied, A semiconductor chip pickup device, wherein an expand tape covering the vacuum hole is set so as to be drawn into the vacuum hole in a concave shape. 2. A method for picking up a semiconductor chip using the device according to claim 1, wherein: (a) the expanding tape is placed in the center of the vacuum hole with one semiconductor chip temporarily held thereon. (B) applying a predetermined negative pressure to the vacuum hole to draw the expand tape on which the semiconductor chip is mounted into the vacuum hole, and at this time, the pickup needle relatively moves the expand tape. Separating the semiconductor chip from the expanded tape by penetrating from below to above, and (c) adsorbing the separated semiconductor chip by the suction collet. Method. 3. The half temporarily held on an expanding tape.
Pick the conductor chip on the tape guide with the suction collet.
How to clean up Vacuum holes are formed on the guide surface of the above tape guide
As well as facing the inside of this vacuum hall
So that the top edge height is approximately the same as the guide surface.
While the needle is fixedly provided, One of the above expanded tapes temporarily held on it
Semiconductor chip is located at the center of the vacuum hole.
Position so that The suction collet is moved down, and the lower end is moved to the semiconductor chip.
Contact with the top of the
Vacuum hole while holding semiconductor chip by suction
A predetermined negative pressure is applied to the
Pull the spand tape into the vacuum hole,
When the pickup needle expands the tape
The above semiconductor by relatively penetrating from below to above
Peel the chip from the expanding tape, Semiconductor separated from expanded tape in this way
The tip is moved by moving the tip
Pick up semiconductor chips,
Backup method.