JP2802531B2 - Mounting structure between electronic components and printed wiring - Google Patents
Mounting structure between electronic components and printed wiringInfo
- Publication number
- JP2802531B2 JP2802531B2 JP2032559A JP3255990A JP2802531B2 JP 2802531 B2 JP2802531 B2 JP 2802531B2 JP 2032559 A JP2032559 A JP 2032559A JP 3255990 A JP3255990 A JP 3255990A JP 2802531 B2 JP2802531 B2 JP 2802531B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- electronic component
- hole
- substrate
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、接続不良が発生しないように形成された電
子部品とプリント配線との取り付け構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for an electronic component and a printed wiring formed so as not to cause a connection failure.
［従来の技術］ 従来のプリント基板に電子部品を実装する方法は、絶
縁物で構成された基板の一面にプリント配線を装着し、
このプリント配線と基板とを同時に貫通する透孔を形成
し、この透孔に電子部品を接続するピンを嵌挿させ、嵌
挿先でピンとプリント配線をハンダ付けで接続固定して
いた。[Prior art] A conventional method of mounting electronic components on a printed circuit board is to mount printed wiring on one surface of a board made of an insulator,
A through-hole penetrating the printed wiring and the substrate is formed at the same time, and a pin for connecting an electronic component is inserted into the through-hole, and the pin and the printed wiring are connected and fixed at the insertion destination by soldering.
すなわち、第３図に示されるように絶縁物からなる基
板１にプリント配線２が施され、この基板１およびプリ
ント配線２を貫通する透孔３に電子部品４のピン５が嵌
挿されている。That is, as shown in FIG. 3, a printed wiring 2 is provided on a substrate 1 made of an insulating material, and a pin 5 of an electronic component 4 is inserted into a through hole 3 passing through the substrate 1 and the printed wiring 2. .
そして、接着剤６を介して装着された電子部品４がピ
ン５とプリント配線２とハンダ７によって接続してい
る。Then, the electronic component 4 mounted via the adhesive 6 is connected to the pins 5, the printed wiring 2 and the solder 7.
［発明が解決しようとする問題点］ しかしながら、この様な構成では、温度環境が変化す
ると絶縁物からなる基板１と導体からなるピン４の熱膨
張係数が異なることなどに起因してハンダ７に応力が加
わる。[Problems to be Solved by the Invention] However, in such a configuration, when the temperature environment changes, the solder 7 has a different thermal expansion coefficient between the substrate 1 made of an insulator and the pin 4 made of a conductor. Stress is applied.
その結果、ハンダ７にひび割れ８を生じて電子部品３
の取り付け強度が低下することが起こる。この様な問題
を解決するため、電子部品３と基板１とを接着剤６など
によって固定することが試みられている。As a result, cracks 8 occur in the solder 7 and the electronic component 3
The mounting strength of the device may decrease. In order to solve such a problem, attempts have been made to fix the electronic component 3 and the substrate 1 with an adhesive 6 or the like.
しかし、電子部品３が脱落しなくなっても、ハンダ７
にひび割れ８を生じるとこの部分でピン４とプリント配
線２との接続が遮断され、導通がなくなることが起こ
る。However, even if the electronic component 3 does not fall off, the solder 7
When the crack 8 is formed, the connection between the pin 4 and the printed wiring 2 is cut off at this portion, and the conduction is lost.
しかもこの様な現象は、温度環境によってひび割れ部
分が接触したり離れたりするため、故障状態を発見する
ことが困難になる。Moreover, in such a phenomenon, the cracked portion comes in contact with or separates from each other depending on the temperature environment, so that it becomes difficult to find a failure state.
従って、電子回路の信頼性をきわめて悪くするといっ
た結果を生じる。Therefore, the result is that the reliability of the electronic circuit is extremely deteriorated.
特に、この様な状態でプリミックスなどによって全体
がモールドされる場合は、モールドに差異して流動する
プリミックスによって発生する外力に部品やプリント配
線が対抗できず、しかも、モールド後では修理ができな
くなり電動機を含む全体が不良品になるといった問題を
有していた。In particular, when the whole is molded by premixing in such a state, parts and printed wiring cannot counteract the external force generated by the premix flowing differently from the mold, and can be repaired after molding. There was a problem that the entire motor including the motor became defective.
本発明は、この様な事情に鑑みてなされたものであ
り、ハンダのひび割れなどを生じないように構成し、信
頼性の高い回路が組み立てられる電子部品とプリント配
線との取り付け構造を提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an object to provide a mounting structure of an electronic component and a printed wiring, which are configured so as not to cause cracking of solder and the like, and that can assemble a highly reliable circuit. It is an object.
［問題点を解決するための手段］ 本発明は、プリント配線側から電子部品を装着すると
共に、前記透孔に前記ピンを嵌合させ、さらに、このピ
ンの中央部と前記プリント配線とをハンダ付けすること
で前記透孔の一方の開口部を閉鎖し、前記基板の他方に
絶縁物を装着して前記透孔の他方の開口部を閉鎖して、
透孔内に空間を設けることによって問題点を解決してい
る。[Means for Solving the Problems] According to the present invention, an electronic component is mounted from the printed wiring side, the pin is fitted into the through hole, and furthermore, the center of the pin and the printed wiring are soldered. Closing one opening of the through-hole by attaching, closing the other opening of the through-hole by attaching an insulator to the other of the substrate,
The problem is solved by providing a space in the through hole.
［作用］ 温度環境が変化した際、基板とピンとの膨脹係数が異
なってもピンと基板との間に応力が発生しなく、ハンダ
に外力が加わらない。[Operation] When the temperature environment changes, no stress is generated between the pins and the substrate even when the expansion coefficients of the substrate and the pins are different, and no external force is applied to the solder.
そして、透孔の両側が閉鎖されているため、透光内部
には、空間が形成され、全体がプリミックスでモールド
されてもピンの端部に外力が発生しないことからピンを
介してプリント配線にも外力が加わらなくなる。Since both sides of the through-hole are closed, a space is formed inside the light-transmitting part, and no external force is generated at the end of the pin even if the whole is molded by premixing. No external force is applied.
［実施例］ 本発明を図面に示された一実施例に基づいて説明する
と、第１図は、本発明の一実施例による電子部品の実装
方法を示す要部縦断面図であり、第２図は、その要部斜
視図である。Embodiments The present invention will be described based on an embodiment shown in the drawings. FIG. 1 is a vertical sectional view of a main part showing a method of mounting an electronic component according to an embodiment of the present invention. The figure is a perspective view of the main part.
第１図において、電子部品の実装方法は、基板９の一
方の面にプリント配線10が装着されており、基板９およ
びプリント配線10を夫々貫通する透孔11が形成されてい
る。In FIG. 1, in a method of mounting an electronic component, a printed wiring 10 is mounted on one surface of a substrate 9, and a through hole 11 penetrating the substrate 9 and the printed wiring 10 is formed.
そして、電子部品12がプリント配線10側に装着されて
おり、その配線用のピン13が透孔11に嵌合されている。The electronic component 12 is mounted on the printed wiring 10 side, and the wiring pin 13 is fitted in the through hole 11.
さらに、プリント配線10とピン13とがハンダ14によっ
て接続されており、そのハンダ14の外側がコンパウンド
などの硬化する接着剤15で固められている。Further, the printed wiring 10 and the pins 13 are connected by solder 14, and the outside of the solder 14 is hardened by a hardening adhesive 15 such as a compound.
また、基板９の他方の面には、絶縁物16が装着されて
おり、透孔11の他方を閉鎖し、透孔11の一方を閉鎖する
のハンダ14と共に透孔11に空間を形成している。An insulator 16 is mounted on the other surface of the substrate 9 to close the other of the through holes 11 and form a space in the through hole 11 together with the solder 14 that closes one of the through holes 11. I have.
第２図において、基板９の上面にプリント配線10が施
されており、電子部品12が装着されている。In FIG. 2, a printed wiring 10 is provided on the upper surface of a substrate 9, and an electronic component 12 is mounted.
そして、基板９およびプリント配線10のピン13の部分
が接着剤15によって被われ固められている。The portions of the substrate 9 and the pins 13 of the printed wiring 10 are covered with an adhesive 15 and are solidified.
この様な構成において、電子部品の実装方法は、透孔
11にピン13を嵌合するようにして電子部品12を装着し、
プリント配線10とピン13とをハンダ14によってハンダ付
けし接続すると共に透孔11の一方を閉鎖する。In such a configuration, the mounting method of the electronic component is a through hole.
Attach the electronic component 12 so as to fit the pin 13 to 11,
The printed wiring 10 and the pins 13 are soldered and connected by the solder 14 and one of the through holes 11 is closed.
さらに、接着剤15によってピン13の部分を基板９およ
びプリント配線10と共に固める。Further, the portion of the pin 13 is fixed together with the substrate 9 and the printed wiring 10 by the adhesive 15.
この様な接着剤15は、硬化剤を含む２液性のボンドで
良いが硬化してピン13の部分を全体的に被うものであれ
ば外のものでも良い。Such an adhesive 15 may be a two-liquid bond containing a hardener, but may be an external adhesive as long as it hardens and covers the entire pin 13 portion.
さらに、基板９の他方の面に絶縁物16を装着して透孔
11の他方を閉鎖する。Further, an insulator 16 is attached to the other surface of the substrate 9 to form a through hole.
Close the other eleven.
この様に組み立てられると温度環境が変化し、ピン13
や基板９が熱膨張しても、ピン13と基板９とが引っ張り
合う構造にはなっておらず、ハンダ14に外力が加わらな
いため、従前発生したハンダ14のひび割れなどが発生し
なくなる。When assembled in this way, the temperature environment changes, and pin 13
Even when the substrate 9 thermally expands, the pins 13 and the substrate 9 are not structured to be pulled, and no external force is applied to the solder 14, so that the previously generated cracks of the solder 14 do not occur.
また、この様に電子部品12が実装された基板９を電動
機等に装着して一体にプリミックスなどによって固めた
場合、プリミックスで成形される際、流動するプリミッ
クスによって受ける外力に接着剤15で十分対抗すること
ができる。When the substrate 9 on which the electronic components 12 are mounted is mounted on an electric motor or the like and integrally solidified by a premix or the like, when molded by the premix, the adhesive 15 is applied to the external force received by the flowing premix. Can be enough.
従って、電子部品12に受ける外力がプリント配線10を
引っ張って基板９から剥がすといった心配もなくなる。Therefore, there is no fear that an external force applied to the electronic component 12 pulls the printed wiring 10 and peels it off the substrate 9.
また、透孔11が基板９の両面で閉鎖されているため、
透孔11にプリミックスが侵入しなく、モールドされても
ピン13に外力が作用しなくなる。Further, since the through holes 11 are closed on both sides of the substrate 9,
The premix does not enter the through-hole 11, and no external force acts on the pin 13 even when molded.
勿論、この電子部品12と基板９とを接着剤15で固定し
なくともハンダ14に基板９やピン13との応力が作用しな
いことから効果が得られるものである。Of course, even if the electronic component 12 and the substrate 9 are not fixed with the adhesive 15, the effect can be obtained because the stress of the substrate 9 and the pins 13 does not act on the solder 14.
［発明の効果］ 本発明によれば、電子部品のピンが基板に形成される
透孔の空間で開放されるため、温度環境の変化によって
応力などが発生しなくなり、ハンダのひび割れ等が発生
せず、また、接着剤で固めれば、プリミックスなどのモ
ールド部材でフレームが形成される電動機に組み込まれ
た場合にもプリント配線が剥がれるなどの不良の発生が
なく、きわめて信頼性の高い電子部品とプリント配線と
の取り付け構造を得ることができ、その効果はきわめて
大きいものである。[Effects of the Invention] According to the present invention, since the pins of the electronic component are opened in the space of the through-hole formed in the substrate, stress or the like is not generated due to a change in the temperature environment, and cracks or the like of the solder are generated. Also, if it is hardened with an adhesive, it will not cause defects such as peeling of printed wiring even when incorporated into a motor whose frame is formed by a premixed mold member, and it is an extremely reliable electronic component And a printed wiring can be obtained, and the effect is extremely large.
第１図は、本発明の一実施例による電子部品の実装方法
を示す要部縦断面図であり、第２図は、その要部斜視図
である。 第３図は、従来の電子部品の実装方法を示す図である。 ９……基板、10……プリント配線、11……透孔、12……
電子部品、13……ピン、14……ハンダ、15……接着剤、
16……絶縁物。FIG. 1 is a vertical sectional view of a main part showing a method for mounting an electronic component according to an embodiment of the present invention, and FIG. 2 is a perspective view of the main part. FIG. 3 is a diagram showing a conventional method of mounting an electronic component. 9 ... board, 10 ... printed wiring, 11 ... through-hole, 12 ...
Electronic components, 13 pins, 14 solder, 15 adhesive
16 …… Insulator.
Claims (2)
の基板の任意の箇所には、基板の一方の面のみに施され
たプリント配線、および基板を貫通する透孔が設けら
れ、 この基板に電子部品が搭載され、この電子部品から延出
したピンは、電子部品が配設された基板面とは反対の基
板面に突出させ、この基板面でピンの先端部をハンダ付
けできるように形成されたピンであって、 この電子部品と前記プリント配線との取り付け構造にお
いて、 前記プリント配線側から電子部品を装着すると共に、前
記透孔に前記ピンを嵌合させ、 さらに、このピンの中央部と前記プリント配線とをハン
ダ付けすることで前記透孔の一方の開口部を閉鎖し、前
記基板の他方に絶縁物を装着して前記透孔の他方の開口
部を閉鎖して、透孔内に空間を設けたことを特徴とする
電子部品とプリント配線との取り付け構造。1. A printed circuit board provided with a printed wiring provided only on one surface of the board and a through hole penetrating the board at an arbitrary position on the board. An electronic component is mounted on a substrate, and pins extending from the electronic component are projected on a substrate surface opposite to the substrate surface on which the electronic component is provided, so that the tip of the pin can be soldered on the substrate surface. A mounting structure for mounting the electronic component and the printed wiring, wherein the electronic component is mounted from the printed wiring side, and the pin is fitted into the through hole; One opening of the through hole is closed by soldering a center portion and the printed wiring, an insulator is attached to the other of the substrates, and the other opening of the through hole is closed, so that the through hole is closed. That there was space inside the hole The mounting structure of electronic parts and printed wiring, which is a feature.
で固めたことを特徴とする前記特許請求の範囲第１項記
載の電子部品とプリント配線との取り付け構造。2. The mounting structure according to claim 1, wherein a connecting portion between the printed wiring and the pin is fixed with an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2032559A JP2802531B2 (en) | 1990-02-15 | 1990-02-15 | Mounting structure between electronic components and printed wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2032559A JP2802531B2 (en) | 1990-02-15 | 1990-02-15 | Mounting structure between electronic components and printed wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03237796A JPH03237796A (en) | 1991-10-23 |
| JP2802531B2 true JP2802531B2 (en) | 1998-09-24 |
Family
ID=12362268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2032559A Expired - Fee Related JP2802531B2 (en) | 1990-02-15 | 1990-02-15 | Mounting structure between electronic components and printed wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2802531B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19942631A1 (en) * | 1999-09-07 | 2001-03-08 | Endress Hauser Gmbh Co | Process for assembling a printed circuit board |
| JP2019095338A (en) * | 2017-11-24 | 2019-06-20 | ミネベアミツミ株式会社 | Strain gauge and sensor module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5916261B2 (en) * | 1978-12-20 | 1984-04-14 | 富士写真フイルム株式会社 | Color image forming method |
-
1990
- 1990-02-15 JP JP2032559A patent/JP2802531B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03237796A (en) | 1991-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |