JPH04159792A - Metallic core substrate - Google Patents

Metallic core substrate

Info

Publication number
JPH04159792A
JPH04159792A JP28496790A JP28496790A JPH04159792A JP H04159792 A JPH04159792 A JP H04159792A JP 28496790 A JP28496790 A JP 28496790A JP 28496790 A JP28496790 A JP 28496790A JP H04159792 A JPH04159792 A JP H04159792A
Authority
JP
Japan
Prior art keywords
stress
land
metal core
absorbing
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28496790A
Other languages
Japanese (ja)
Inventor
Takao Takahashi
孝夫 高橋
Toshihiro Obara
小原　俊浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP28496790A priority Critical patent/JPH04159792A/en
Publication of JPH04159792A publication Critical patent/JPH04159792A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE:To prevent the occurrence of cracks in a conductive coupling so as to extend the service life of the coupling by forming stress absorbing projecting sections inside a stress absorbing opening opened around the land of a metallic core and the land on the projecting sections. CONSTITUTION:A stress absorbing opening 21 is opened in an inverted-S shape around part of lands 13 of a metallic core 11 front one land 13 to the other land 13 and a pair of stress absorbing projecting sections 22 are formed inside the opening 21. Since the opening 21 does not completely surround the land, leaving part of the land unopened, the projecting sections 22 are formed and the lands 13 are formed on the end sections of the sections 22. Because of the opening 21, the projecting sections 22 are bent by stress like leads of an IC package and absorb the stress. Therefore, the occurrence of cracks in a conductive coupling can be reduced and the service life of the coupling can be extended, since the stress applied to a conductive coupling can be reduced.

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、表面実装部品が表面実装される金属コア基板
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a metal core substrate on which surface-mounted components are surface-mounted.

（従来の技術） 従来、この種の金属コア基板は、第３図に示されるよう
に、放熱性に優れたアルミニウム板からなる金属コア（
アルミコア）１１の表面に粘着絶縁層１２を介して、ラ
ンド１３を含む導電パターンが金属箔（銅箔）により形
成され、このランド１３上にリフローはんだ付けにより
形成されたはんだ継手１４または導電性樹脂（接着剤）
等の導電性継手によって、表面実装部品（チップ部品等
）１５の導電部（電極）１６が固着されている。(Prior Art) Conventionally, this type of metal core substrate has a metal core (made of an aluminum plate with excellent heat dissipation) as shown in FIG.
A conductive pattern including a land 13 is formed of metal foil (copper foil) on the surface of the aluminum core) 11 via an adhesive insulating layer 12, and a solder joint 14 or conductive resin is formed on the land 13 by reflow soldering. (glue)
A conductive part (electrode) 16 of a surface mount component (chip component, etc.) 15 is fixed by a conductive joint such as the above.

（発明が解決しようとする課題） この従来の金属コア基板は、電源回路等の高温になりや
すい部分に使用されると、線膨張率の大きい金属コア（
アルミニウム）１１と、線膨張率の小さい表面実装部品
（例えばセラミックス・チップ・コンデンサ等）１５と
の間で剪断応力が発生する。この剪断応力は、ランド１
３上に表面実装部品１５を固着している弾性率の低い導
電性継手（はんだ継手）１４に集中してクラック１７を
発生させ、電源回路等にて温度ザイクルが繰返される段
階で、このはんだ継手１４に発生したクラック１７が成
長し、はんだ継手１４が破損して回路が断線するなど、
継手寿命が短くなるという欠点がある。信頼性も損なわ
れる。(Problems to be Solved by the Invention) When this conventional metal core substrate is used in parts that are prone to high temperatures such as power supply circuits, the metal core (with a high coefficient of linear expansion)
Shear stress is generated between the aluminum (aluminum) 11 and the surface-mounted component (for example, a ceramic chip capacitor, etc.) 15 having a small coefficient of linear expansion. This shear stress is
Cracks 17 are generated concentratedly in the conductive joint (solder joint) 14 with a low elastic modulus that fixes the surface mount component 15 on the surface mount component 15, and when the temperature cycle is repeated in the power supply circuit etc., this solder joint The crack 17 generated in the solder joint 14 grows, the solder joint 14 is damaged, the circuit is disconnected, etc.
The disadvantage is that the joint life is shortened. Reliability also suffers.

本発明は、このような点に鑑みなされたものであり、金
属コア基板の簡単な改良によって、線膨張率の差により
導電性継手にかかる応力を減少させ、導電性継手のクラ
ック防止、長寿命化を図ることを目的とするものである
。The present invention was made in view of these points, and it is possible to reduce the stress applied to conductive joints due to the difference in coefficient of linear expansion by simply improving the metal core substrate, thereby preventing cracks in the conductive joints and extending the service life of the conductive joints. The purpose is to promote

［発明の構成Ｊ （課題を解決するための手段） 本発明は、金属コアｌｌ上のランド１３に表面実装部品
１５が表面実装される金属コア基板において、金属コア
１１のランド周囲に応力吸収間「１２１が穿設されるこ
とにより、この応力吸収開口２１の内側に応力吸収凸部
２２が形成され、この応力吸収凸部２２上に前記ランド
１３が形成された金属コア基板である。[Structure J of the Invention (Means for Solving the Problems) The present invention provides a metal core board on which a surface mount component 15 is surface mounted on a land 13 on a metal core 11, in which a stress absorbing space is provided around the land of the metal core 11. 121, a stress absorbing convex portion 22 is formed inside the stress absorbing opening 21, and the land 13 is formed on the stress absorbing convex portion 22.

（作用） 本発明は、金属コア１１が熱膨張して、ランドＩＣ１３
間を引離そうとする応力が働いても、応力吸収凸部２２
が応力吸収間１１２１内で変形して前記応力を吸収する
から、線膨張率の大きな金属コア１１と線膨張率の小さ
な表面実装部品１５との間に発生する応力が小さくなり
、導電性継手１４にかかる応力が軽減される。(Function) In the present invention, the metal core 11 thermally expands and the land IC 13
Even if a stress that tries to separate the space is applied, the stress-absorbing convex portion 22
deforms within the stress absorption gap 1121 and absorbs the stress, so the stress generated between the metal core 11 with a large linear expansion coefficient and the surface mount component 15 with a small linear expansion coefficient becomes small, and the conductive joint 14 The stress applied to is reduced.

（実施例） 以下、本発明を第１図および第２図に示される実施例を
参照して詳細に説明する。なお、第３図の従来例と同様
の部分には同一符号を付する。(Example) Hereinafter, the present invention will be described in detail with reference to an example shown in FIGS. 1 and 2. Note that the same parts as in the conventional example shown in FIG. 3 are given the same reference numerals.

金属コア１１は、放熱性に優れたアルミニウム板からな
るアルミコアである。この金属コア１１の表面に粘着絶
縁層１２を介して、ランド１３を含む導電パターンが金
属箔（銅箔）により形成され、このランド１３上にリフ
ローはんだ付けにより形成された導電性継手（はんだ継
手）１４によって、表面実装部品（セラミックス・チッ
プ部品）１５の導電部（電極）１６が固着されている。The metal core 11 is an aluminum core made of an aluminum plate with excellent heat dissipation. A conductive pattern including a land 13 is formed of metal foil (copper foil) on the surface of this metal core 11 via an adhesive insulating layer 12, and a conductive joint (solder joint) is formed on this land 13 by reflow soldering. ) 14, a conductive part (electrode) 16 of a surface mount component (ceramic chip component) 15 is fixed.

前記金属コア１１のランド周囲には、一方のランド周囲
から他方のランド周囲にわたって応力吸収開口２１が逆
Ｓ字形に穿設されることにより、この応力吸収開口２１
の内側に一対の応力吸収凸部２２が形成されている。Stress-absorbing openings 21 are formed around the lands of the metal core 11 in an inverted S-shape from the periphery of one land to the periphery of the other land.
A pair of stress absorbing convex portions 22 are formed inside.

上記のようにランド周囲に応力吸収間１］２１を穿設す
ると言っても全周囲に穿設するものではなく、ランド周
囲の一部は開口しないので、前記応力吸収凸部２２が形
成され、この応力吸収面Ｍ（２２の先端部」二に前記ラ
ンド１３が形成されている。As mentioned above, even though the stress-absorbing gap 1] 21 is bored around the land, it does not mean that it is drilled all around the land, and a part of the periphery of the land is not opened, so the stress-absorbing convex part 22 is formed. The land 13 is formed on the stress absorbing surface M (the tip of the stress absorbing surface 22).

前記応力吸収間「１２１があるため、前記応力吸収凸部
２２は、いわばＩＣパッケージにおけるリードのように
応力により曲り、応力を吸収する。Because of the stress absorbing gap 121, the stress absorbing convex portion 22 bends due to stress and absorbs stress, like a lead in an IC package.

なお、前記応力吸収間［１２１は、第１図および第２図
に示された実施例では一方のランド周囲から他方のラン
ド周囲にわたって設けられているが、一方のランド周囲
のみに設けても良いし、また、ランド１３が金属コア１
１の周辺部にある場合は、金属コア１１の縁部からラン
ド周囲に応力吸収間りとしての切込溝を設けても良い。In addition, in the embodiment shown in FIGS. 1 and 2, the stress absorbing space [121] is provided from the periphery of one land to the periphery of the other land, but it may be provided only around one land. Also, the land 13 is connected to the metal core 1.
1, a cut groove may be provided as a stress absorbing space from the edge of the metal core 11 to the periphery of the land.

要するに、導電パターン（銅箔）の位置等を考慮して、
応力吸収間１１２１の形状を決定する。In short, considering the position of the conductive pattern (copper foil),
The shape of the stress absorbing space 1121 is determined.

そうして、金属コア１１が電源回路等に使用され熱を持
つと、この金属コア１１が全体的に熱膨張し７て、ラン
＋−＋３．＋３間を引離そうとする応力が働くか、ラン
ド＋３．　　Ｎ間に作用する引張応力は、応力吸収凸部
２２の変形によって吸収される。その結果、線膨張率の
大きな金属コア１１と線膨張率の小さな表面実装部品（
セラミックス・チップ部品）１５との間に発生する剪断
応力も減少され、結果的には、線膨張率の差より生じた
剪断応力が応力吸収凸部２２によって吸収され、はんだ
継手１４にかかる剪断応力が軽減される。Then, when the metal core 11 is used in a power supply circuit or the like and heats up, the entire metal core 11 thermally expands 7 and runs +-+3. +3.Is there a stress that tries to pull the land +3. The tensile stress acting between N is absorbed by the deformation of the stress absorbing convex portion 22. As a result, a metal core 11 with a large coefficient of linear expansion and a surface mount component (
The shear stress generated between the ceramic chip component) 15 is also reduced, and as a result, the shear stress generated due to the difference in coefficient of linear expansion is absorbed by the stress absorbing convex portion 22, and the shear stress applied to the solder joint 14 is reduced. is reduced.

［発明の効果］ 本発明によれば、金属コアのランド周囲に応力吸収開口
が穿設されることにより、この応力吸収開口の内側に応
力吸収凸部が形成され、この応力吸収凸部上にランドが
形成されたから、応力吸収凸部が応力吸収開口内にて変
形することにより熱応力を吸収して、導電性継手にかか
る応力を軽減でき、導電性継手のクラック発生を防Ｉに
して寿命を延ばすことができる。[Effects of the Invention] According to the present invention, by forming a stress-absorbing opening around the land of a metal core, a stress-absorbing convex portion is formed inside the stress-absorbing opening, and a stress-absorbing convex portion is formed on the stress-absorbing convex portion. Since the land is formed, the stress-absorbing convex portion deforms within the stress-absorbing opening, absorbing thermal stress and reducing the stress applied to the conductive joint, preventing cracks in the conductive joint and extending its life. can be extended.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の金属コア基板の一実施例を示す断面図
、第２図はその平面図、第３図は従来の金属コア基板を
示す断面図である。 −〇　− １１・・金属コア、１３・・ランド、１５・・表面実装
部品、２１・・応力吸収量「］、２２・・応力吸収凸部
。 平成２年１０月２３日FIG. 1 is a sectional view showing an embodiment of the metal core substrate of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a sectional view showing a conventional metal core substrate. -〇 - 11...Metal core, 13...Land, 15...Surface mount component, 21...Stress absorption amount "], 22...Stress absorption convex portion. October 23, 1990

Claims (1)

【特許請求の範囲】[Claims] （１）金属コア上のランドに表面実装部品が表面実装さ
れる金属コア基板において、 金属コアのランド周囲に応力吸収開口が穿設されること
により、この応力吸収開口の内側に応力吸収凸部が形成
され、この応力吸収凸部上に前記ランドが形成されたこ
とを特徴とする金属コア基板。(1) In a metal core substrate on which a surface mount component is surface mounted on a land on a metal core, a stress absorbing opening is formed around the land of the metal core, so that a stress absorbing convex portion is formed inside the stress absorbing opening. A metal core substrate characterized in that a metal core substrate is formed on the stress absorbing convex portion, and the land is formed on the stress absorbing convex portion.
JP28496790A 1990-10-23 1990-10-23 Metallic core substrate Pending JPH04159792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28496790A JPH04159792A (en) 1990-10-23 1990-10-23 Metallic core substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28496790A JPH04159792A (en) 1990-10-23 1990-10-23 Metallic core substrate

Publications (1)

Publication Number Publication Date
JPH04159792A true JPH04159792A (en) 1992-06-02

Family

ID=17685403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28496790A Pending JPH04159792A (en) 1990-10-23 1990-10-23 Metallic core substrate

Country Status (1)

Country Link
JP (1) JPH04159792A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667391A (en) * 1995-04-26 1997-09-16 Szczesny; David Stanley Electrical connector having a two part articulated housing
JP2010205772A (en) * 2009-02-27 2010-09-16 Denso Corp Integrated circuit mounted board, printed wiring board and method of manufacturing the integrated circuit mounted board
JP2016131164A (en) * 2015-01-13 2016-07-21 日立オートモティブシステムズ株式会社 Electronic control device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667391A (en) * 1995-04-26 1997-09-16 Szczesny; David Stanley Electrical connector having a two part articulated housing
US5822855A (en) * 1995-04-26 1998-10-20 The Whitaker Corporation Method of making electrical connector having a two part articulated housing
JP2010205772A (en) * 2009-02-27 2010-09-16 Denso Corp Integrated circuit mounted board, printed wiring board and method of manufacturing the integrated circuit mounted board
JP4760930B2 (en) * 2009-02-27 2011-08-31 株式会社デンソー IC mounting substrate, multilayer printed wiring board, and manufacturing method
US8247702B2 (en) 2009-02-27 2012-08-21 Denso Corporation Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
JP2016131164A (en) * 2015-01-13 2016-07-21 日立オートモティブシステムズ株式会社 Electronic control device

Similar Documents

Publication Publication Date Title
KR960019670A (en) Semiconductor chip package and manufacturing method thereof
US6188579B1 (en) Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
US6560110B1 (en) Corrosive resistant flip chip thermal management structure
JPH04159792A (en) Metallic core substrate
GB2345576A (en) Heat-sink of ICs and method of mounting to PCBs
JP2002016196A (en) Lead frame and resin sealed semiconductor device using it
KR20010057046A (en) Package substrate having cavity
JPH0548231A (en) Packaging structure of printed-circuit board with different density
JP2883435B2 (en) Metal core substrate
JP4770528B2 (en) Electronics
JPH0563053U (en) Hybrid integrated circuit board
KR960019675A (en) Packaged semiconductor, semiconductor device using same, and method for manufacturing same
JPH01132199A (en) Cooling structure for mounting of printed-circuit board
JPH11340589A (en) Flexible circuit board
JPH0513023Y2 (en)
JPH04152589A (en) Metal core circuit board
JP2912439B2 (en) Metal core substrate
JPS6321766A (en) Copper-ceramics joint for double side mounting
JPH04225296A (en) Ceramic board provided with copper circuit and manufacture thereof
JPS6226894A (en) Connection of flexible printed circuit
JPH10209213A (en) Semiconductor device and its production
JPS6276588A (en) Hybrid integrated circuit device
JP2004022711A (en) Electronic component with shielding cap
JPH04152590A (en) Metal core circuit board
JPH0287654A (en) Surface mounting semiconductor device