JP2779143B2 - Semiconductor wafer storage container - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor wafer (hereinafter referred to as a semiconductor wafer).
The present invention relates to a wafer container that is useful for safely transporting, storing and handling while preventing damage and contamination.

[0002]

2. Description of the Related Art Wafers obtained by slicing semiconductor single crystal rods are often transported in large quantities to users in order to make integrated circuits. At this time, sufficient care must be taken to protect thin and brittle wafers from damage and contamination. Needed. Therefore, as a wafer container, for example, as described in JP-A-48-21466, JP-A-52-148043 and JP-A-58-175627, a plurality of wafers are placed on the inner surface of the container body at regular intervals. In addition to providing a guide means for separating and arranging by means of, a foam plate, an elastic buffer plate, a rubber-like elastic rod-like body or the like is provided between the wafer and the container body and / or the lid in a direction crossing the guide means. was suggested. Although these storage containers are structurally simple, they cannot be said to be completely resistant to wafer damage and contamination due to external vibrations and the like, and it is difficult to automatically insert and remove wafers from the storage container.

For this reason, recently, a storage container having a structure as shown in FIG. 4 , that is, an inner box b having a pleated side wall a for supporting a large number of wafers W to be stored at a peripheral edge, and an inner box b A lower buffer plate (cradle) c mounted on the inner bottom of the container W to support the lower edge of the wafer W, a container body d for housing and locking the inner box b in a predetermined place, and a container body via a packing e and a cover g that covers the upper surface of the wafer W and holds the upper edge of the wafer W stored in the inner box b by the upper buffer plate (wafer restraint) f mounted on the inner surface. It is becoming widely used.

[0004]

In addition to the above, various shapes such as a cylindrical shape, a screen shape, a triangular prism shape, a bellows shape and the like have been proposed for the cushioning plate. Demonstrates buffering capacity against such vibrations and shocks, but is incomplete with respect to vibrations and shocks in the thickness direction of the wafer, preventing damage to the wafer and generation of fine particles and maintaining the cleanliness of the wafer However, it was insufficient for safe transportation. In addition, as a method of indicating a reference position, there are a notch type having a cutout only at a part of a top portion and an orientation flat type having a flat upper portion. There is a problem in that a difference occurs in the holding power of the methods, and even if one is satisfied, on the other hand, dust contamination due to rotation or rattling of the wafer occurs.

It is therefore an object of the present invention, without affecting the retention and workability even change the shape of the wafer, the wafer cleanliness to absorb vibration and impact from any direction experienced during transport It is intended to provide a wafer container which can be transported safely while holding the wafer.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a wafer is held and fixed to each of a top lid and a container constituting a semiconductor wafer storage container while protecting the wafer from contamination. If a stretchable film made of a material with sufficient strength and elongation is provided and the semiconductor wafer is held at the peripheral edge, vibration and shock from all directions received during transportation can be absorbed and the wafer damaged or damaged. They have found that they can be protected from contamination and can be transported safely and arrived at the present invention.

Namely, the wafer carrier according to the invention, the upper lid and the container body is engaged and closed in each of the opening edge
A wafer storage container, each of the upper lid and the container
A stretchable film is stretched between inner walls in the width direction of the wafer.
The peripheral edge of the wafer from both directions
It is characterized by being able to hold and store wafers
You.

[0008] Also, for the same wafer storage container as above,
The wafer is collected between the two stretched films in the same manner.
Inner box, upper part supporting upper or lower edge of wafer
At least one member of the buffer plate or the lower buffer plate
To be able to accommodate wafers
It is characterized by.

[0009] Furthermore, the same wafer storage container as above
In the width direction of each wafer of the upper lid and the container
Arrange frames with stretchable films stretched between the side walls, each
The upper and lower sides of the peripheral edge of the wafer by the elastic film of the frame
The feature is that the wafer can be stored by holding from the
And

[0010] Hereinafter, will be described with reference to FIG. 1 illustrating an embodiment of a wafer carrier of the present invention (a) ~ (b).
The wafer carrier consists upper cover 1 and the container body 2 which is adapted to the upper cover 1 and the container body 2 can engage, it closed with respect to each other with the opening peripheral edge. Top lid 1 and container 2
Appropriate position between the inner walls in the width direction, open end in the figure
, Stretchable films 3a, 3b are stretched up and down.
The upper and lower peripheral edges of the wafer W with the elastic films 3a and 3b
The wafer W can be stored while being held from the front. this
Has a simple structure, especially for a small number of wafers
Suitable as a container for storing.

In the wafer container of the present invention, as an application example of an elastic film to an existing part used in a conventional wafer container, a peripheral portion of a wafer W is provided inside an upper lid 1 or a container 2 via an elastic film 3. Existing parts that support the side edges , i.e.
Equipped with pleated side walls that support a large number of wafers at the peripheral edge
Inner box, attached to the bottom of the inner box to support the lower edge of the wafer
Attached to the lower cushion plate (cradle) to be held and the back of the upper lid 1
To hold the upper edge of the wafer stored in the inner box b
A partial buffer plate (wafer holding) can be provided.

[0012] FIG. 2 (a) upper cover 1 and after stretched stretch film 3 a, 3 b, respectively the opening edge of the container body 2, the inner box 11 housing the wafer W, stretchable film 3 receptor 2 From side b,
By pushing in through this, the upper lid 1 is closed, and the peripheral edge of the wafer W is suppressed by the elastic films 3 a and 3 b from both the upper and lower directions.
It is those you so that you retain Te. In addition, this inner box 11
The vertical cross section in the width direction is bowl-shaped, and
-Many folds are provided symmetrically to each other in the arrangement direction of
Each wafer W between adjacent folds.
Structure that can be individually housed and supported on both left and right edges of
You.

FIG . 2 (b) shows a similar upper cover 1 with an upper buffer plate 12
The inner box 3 containing the wafer W in the container 2 is pushed through the elastic films 3 a and 3 b, respectively ,
After placing the upper buffer plate 12 to the plane, by the upper lid 1 on condition 2, the peripheral edge of the wafer W in the upper buffer plate via the 1 2 and inner box 11 stretchable film 3 a, 3 b It is designed to be held from both upper and lower directions .

Although not shown, FIG.2Used in (a)
In the same top lid 1 and / or container 2 as
Extend the upper and / or lower shock absorber
Membrane3a and / or3b through the b
The upper lid 1 is placed on the periphery of the wafer W.~ sideThe edge,Upper loose
Via the impact board and / or the lower shock absorber,Stretchable membrane3
a,3in bHold from both upper and lower directionsYou can also do
Wear.

[0015] As a method of this addition, individually housed wafers in a container, stretch film to an elongated frame 20 shown in FIG. 3 (a)
The buffer plate 21 stretched 3, attached to the respective side walls of the upper cover 1 and the container body 2, the two buffer plate 21a, is interposed wafer W between stretch film 3 a, 3 b and 21b holds [See FIG. 3 (b)]. Fig. 3 (c)-(d)
Is a case in which buffer plates 22 and 23 each having a semicircular portion having a curvature approximating that of the wafer W are used as the side surfaces of the elongated frame. A relatively uniform load can be maintained over the outer periphery without applying stress. Required number of such frame 20 in the thickness direction of the wafer, by using the buffer plate 24 of the stacking-the aligned structure [FIG. 3 (e) Reference may also be stored a number of wafers simultaneously.

The embodiments shown in FIGS. 1 to 3 are summarized as follows. 1) stretch film stretched between the inner side wall of each of the upper lid and condition
Is, the semiconductor wafer can be accommodated between the two stretchable film
And the semiconductor wafer storage container (Figure 1). 2) The semiconductor wafer container described in 1) above (FIG. 2 ) in which the semiconductor wafer can be stored together with at least one member of the inner box, the upper buffer plate, and the lower buffer plate. 3) A rectangular frame is attached between the side walls of the upper lid and the container, and an elastic film is stretched on at least both sides of both frames, and the semiconductor wafer is stored between the two elastic films.
Possible and the semiconductor wafer storage container (Fig. 3 b). 4) rectangular frame body, the 4 exhibits Rising Sun-like side shape having a semicircular portion of curvature approximate to the semiconductor wafer), wherein the semiconductor wafer storage container (Fig. 3 c). 5) The rectangular frame has a V-shaped side shape.
4), wherein the semiconductor wafer storage container (Figure 3 d). 6) rectangular frame body exhibits a palisade and many aligned, the 4 stretchable film to each thin groove is stretched), wherein the semiconductor wafer storage container (FIG. 3 e).

Examples of the material of the stretchable film used in the present invention include PE, PP, cellulose acetate, ethylene fluoride, polycarbonate, nylon, polyvinyl alcohol, vinyl chloride, polystyrene, ionomer, polyimide, polyurethane and the like. And thermoplastic materials such as various rubber materials such as silicone rubber. Among these, urethane and ionomer films (films) are particularly preferable because they are less likely to be deformed or distorted by holding for a long time. Since these are also transparent, if the upper lid and the container are made of a transparent material, the stored wafer can be seen through from the outside. In addition, as a mechanical property to satisfy the flexibility and strength enough to absorb external vibrations and shocks, the tensile strength is 100 kg / cm ² or more, especially 3
00kg / cm ² or more, elongation at break 100% or more, especially 300%
More than 10gm / 25μm, especially 30g
m / 25μm or more, tear strength 1kg / mm or more, especially
10 kg / mm or more, bending strength 1,000 times or more, especially 10,000
More than 00 times are desirable.

In the case where the wafer has a tensile strength of less than 100 kg / cm ² , when the wafer is held directly or through a component such as an inner box, the holding force and the load of the elastic film are reduced . There is a risk of breaking beyond the strength of Elongation at break
If it is less than 100%, when holding a wafer or component parts, it is not possible to obtain a sufficient elongation stroke, so the contact area will decrease, holding will be insufficient, and sufficient vibration and shock received from the outside Cannot be absorbed. If the tear propagation is less than 10gm / 25μm, it will expand or contract for some reason.
When a crack occurs in the conductive film, the crack propagates due to a holding force for supporting the wafer or a load for supporting the components, and there is a possibility that the stored wafer may be broken. 1 kg / m tear strength
It is less than m, for example to thereby crack the stretch film when in contact with the edge or the like sharp edges of the wafer, folding endurance is low utility against repeated use is less than 1,000 times.

In producing a stretchable film, it is desirable to increase the purity of the material as much as possible and to minimize the effect on the wafer. For forming the stretchable film, any method such as extrusion, casting, blowing, and stretching may be used. Examples of a method for fixing the elastic film to each component of the container include heat welding and ultrasonic welding, use of an adhesive, various mechanical methods, and the like. The degree of tension of the stretchable film is adjusted according to the load received when mounting the wafer or the component. When a larger load is required, a means such as perforating the elastic membrane with pores to maintain the flow of gas inside and outside the elastic membrane or inserting a pressurized fluid into one area through the elastic membrane is used. Can also be taken. The upper lid other than the stretchable film used for the wafer container of the present invention, components such as containers,
A rigid structure with ribs as necessary to respond to changes in internal and external pressures, impacts, etc., and a highly rigid material made of resin such as polycarbonate, polypropylene, or acrylic, whose contents are transparent. Are generally adopted.

[0020]

According to the wafer container of the present invention, the stretchable film functions as a suspension absorbing shocks and vibrations in all directions, and holds the wafer safely.
Fix it. Further, since the wafer surface contact, the contact area with the other wafer relative movement between the wafer and the elastic membrane is reduced is increased. For this reason, the contact pressure per unit area is reduced, aggregation and wear are suppressed, and the amount of generated fine particles is reduced. Since the stretchable film follows the shape of any part of the wafer or other parts, complicated dimensions and shape design are not required.
Positioning is easy.

[0021]

The wafer container of the present invention has a structure in which the wafer is directly held by the stretchable film, thereby absorbing vibrations and shocks from all directions received during transportation and protecting the wafer from damage and contamination. And can be transported safely. To direct contact holding the wafer by the expansion and contraction film, to minimize particle generation due to the relative movement between the elastic film and the wafer during wafer housing, contributing to a reduction in pollution. The wafer can be securely held, fixed, and transported with a relatively simple structure regardless of the notch type wafer and the orientation flat type wafer. Because of high resistance to external vibration and shock,
External packaging can be simplified, contributing to a reduction in transportation costs.

[Brief description of the drawings]

Engaged to one embodiment of the wafer carrier of the present invention; FIG
(A) is a longitudinal sectional view, and (b) is BB in FIG.
It is a cross-sectional view in a line.

2 (a) and 2 (b) are longitudinal sectional views according to different embodiments of the wafer storage container of the present invention, respectively.

FIG. 3A is a plan view of an example of a member in a wafer storage container of the present invention, and FIGS. 3B to 3D are longitudinal cross-sectional views of another different embodiment of the wafer storage container of the present invention, respectively. FIG. 7 (e) is a plan view of still another different member.

FIG. 4 is an exploded perspective view showing an example of a conventional wafer storage container.

[Explanation of symbols]

1 ‥ lid, 2 ‥ container,
3 ‥ stretchable membrane, 11 ‥ inner box, 1 2 ‥ upper cushion plate,
20mm frame, 21, 22, 23, 24mm buffer plate, W wafer.

────────────────────────────────────────────────── (5) References JP-A-55-18053 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/68 B65D 85/86

Claims (3)

(57) [Claims] An upper cover and a container are engaged with each other at their opening edges.
A semiconductor wafer container to be closed, comprising a top lid and a container.
Between the inner walls in the width direction of each semiconductor wafer
A stretchable film is stretched and the semiconductor stretch is formed by these two stretchable films.
Hold the peripheral edge of c from both upper and lower directions
Semiconductor wafer storage characterized by being able to be stored
Container. 2. An upper cover and a container are engaged at respective opening edges.
A semiconductor wafer container to be closed, comprising a top lid and a container.
Between the inner walls in the width direction of each semiconductor wafer
A stretchable film is stretched, and a semiconductor wafer is placed between the two stretchable films.
Inner box for storing wafers, upper or lower edge of semiconductor wafer
Support at least one of the upper and lower buffer plates
Also arranges one member and collects the semiconductor wafer with it.
Semiconductor wafer storage characterized by being able to be stored
container. 3. An upper cover and a container are engaged with each other at their opening edges.
A semiconductor wafer container to be closed, comprising a top lid and a container.
Between the inner walls in the width direction of each semiconductor wafer
The frames with stretchable membranes are arranged, and the expansion and contraction of each frame
The peripheral edge of the semiconductor wafer is maintained from both directions by the conductive film.
The feature is that the semiconductor wafer can be stored by holding
Semiconductor wafer storage container.