JP2748778B2 - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JP2748778B2 JP2748778B2 JP4161771A JP16177192A JP2748778B2 JP 2748778 B2 JP2748778 B2 JP 2748778B2 JP 4161771 A JP4161771 A JP 4161771A JP 16177192 A JP16177192 A JP 16177192A JP 2748778 B2 JP2748778 B2 JP 2748778B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- metal plate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Description
【０００１】[0001]
【産業上の利用分野】本発明は混成集積回路装置に関
し、特に表面実装タイプのモールドＩＣを基板上に搭載
する混成集積回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly, to a hybrid integrated circuit device having a surface-mounted mold IC mounted on a substrate.
【０００２】[0002]
【従来の技術】従来のこの種の混成集積回路装置では、
その厚さ寸法を低減するために、図３に一例を示すよう
に、例えばガラスエポキシを使用した配線基板１に開口
部１ａを設け、この開口部１ａ内にリード成形した表面
実装タイプのモールドＩＣ５を落とし入れている。そし
て、開口部上の両側にある例えばＣｕを材質とした部品
搭載ランド６にはんだペースト４を使用してモールドＩ
Ｃ５のリード５ａを接続する構造がとられている。2. Description of the Related Art In a conventional hybrid integrated circuit device of this type,
In order to reduce the thickness, as shown in an example in FIG. 3, an opening 1a is provided in a wiring board 1 using, for example, glass epoxy, and a surface mounting type mold IC 5 formed by lead molding in the opening 1a. Has been dropped. Then, a mold I is formed on the component mounting lands 6 made of, for example, Cu on both sides of the opening by using the solder paste 4.
A structure for connecting the lead 5a of C5 is adopted.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来の混成集
積回路装置は、配線基板１の開口部内に表面実装タイプ
のモールドＩＣ５を落とし入れて搭載しているために、
モールドＩＣ５の周囲は空気に囲まれた状態となる。一
般に空気は熱伝導率が悪いために、モールドＩＣ５で発
生した熱が効率良く放熱されないという問題点があっ
た。本発明の目的は、表面実装されたモールドＩＣの放
熱性を改善した混成集積回路装置を提供することにあ
る。In the above-described conventional hybrid integrated circuit device, the surface-mount type molded IC 5 is dropped into the opening of the wiring board 1 and mounted.
The periphery of the mold IC 5 is surrounded by air. Generally, since air has a poor thermal conductivity, there is a problem that heat generated in the mold IC 5 is not efficiently radiated. SUMMARY OF THE INVENTION It is an object of the present invention to provide a hybrid integrated circuit device with improved heat dissipation of a surface-mounted molded IC.
【０００４】[0004]
【課題を解決するための手段】本発明は、一部に開口部
が設けられ、かつその片面に金属板が貼付けられた配線
基板と、この配線基板の開口部内に落とし入れるように
して搭載した表面実装タイプのモールドＩＣと、このモ
ールドＩＣと前記金属板との隙間に充填した放熱用グリ
ースとで構成される。According to the present invention, there is provided a wiring board having an opening in a part thereof and a metal plate adhered to one side of the wiring board, and the wiring board is mounted so as to be dropped into the opening of the wiring board. It is composed of a surface mounted type molded IC, and a heat radiation grease filled in a gap between the molded IC and the metal plate.
【０００５】[0005]
【実施例】次に、本発明について図面を参照して説明す
る。図１は本発明の第１の実施例の断面図である。同図
のように配線基板１の一部には開口部１ａが設けてあ
り、この開口部１ａ内に表面実装タイプのモールドＩＣ
５の一部或いは全体がリード５ａの先端部より下に位置
するように落とし入れ、かつそのリード５ａを配線基板
１に設けた部品搭載ランド６にはんだペースト４を使用
して接続する。又、前記配線基板１の反対側の表面に
は、前記開口部１ａを含む領域にわたって金属板２を貼
付けており、かつ前記開口部１ａ内においては前記金属
板２と前記モールドＩＣ５との隙間に放熱用グリース３
を充填させている。Next, the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a first embodiment of the present invention. As shown in the figure, an opening 1a is provided in a part of the wiring board 1, and a surface-mounted mold IC is provided in the opening 1a.
5 is dropped so as to be located below the tip of the lead 5a, and the lead 5a is connected to the component mounting land 6 provided on the wiring board 1 using the solder paste 4. A metal plate 2 is adhered to the surface on the opposite side of the wiring board 1 over a region including the opening 1a, and a gap between the metal plate 2 and the mold IC 5 is formed in the opening 1a. Heat radiation grease 3
Is filled.
【０００６】このため、モールドＩＣ５で発生した熱
は、放熱用グリース３を通して金属板２に伝達され、こ
の金属板２の表面から効率良く放熱されることになる。
尚、この構造においても金属板２を薄くすることによ
り、混成集積回路装置全体としての厚さは従来レベルに
抑えることができる。For this reason, the heat generated in the mold IC 5 is transmitted to the metal plate 2 through the heat radiation grease 3 and is efficiently radiated from the surface of the metal plate 2.
In this structure, the thickness of the entire hybrid integrated circuit device can be suppressed to a conventional level by making the metal plate 2 thin.
【０００７】図２は本発明の第２の実施例の断面図であ
り、図１と同一部分には同一符号を付してある。同図の
ように、配線基板１に貼付けた金属板２の表面には凹凸
の溝７を設けて金属板２の表面積を増加させ、放熱効果
を向上させている。又、図示は省略するが、金属板２の
表面に黒色の塗装膜を設けることにより、更に放熱性を
向上させることができる。尚、この構造においても、混
成集積回路装置全体としての厚さ寸法は、金属板２の厚
みを調整することにより、10％程度の増加で抑えること
ができる。FIG. 2 is a sectional view of a second embodiment of the present invention, and the same parts as those in FIG. 1 are denoted by the same reference numerals. As shown in the drawing, grooves 7 having irregularities are provided on the surface of the metal plate 2 attached to the wiring board 1 to increase the surface area of the metal plate 2 and improve the heat radiation effect. Although not shown, the heat dissipation can be further improved by providing a black coating film on the surface of the metal plate 2. Also in this structure, the thickness of the entire hybrid integrated circuit device can be suppressed by increasing the thickness of the metal plate 2 by about 10%.
【０００８】[0008]
【発明の効果】以上説明したように本発明は、配線基板
に設けられた開口部内に搭載されたモールドＩＣと、配
線基板の片面に貼付けられた金属板との間に放熱用グリ
ースを充填しているので、モールドＩＣで発生した熱が
放熱用グリースを通して金属板に伝達され、この金属板
から効率良く放熱されるので、混成集積回路装置の放熱
効果を高めることができるという効果を有する。As described above, according to the present invention, the heat dissipating grease is filled between the mold IC mounted in the opening provided in the wiring board and the metal plate attached to one side of the wiring board. As a result, the heat generated in the molded IC is transmitted to the metal plate through the grease for heat radiation, and is radiated efficiently from the metal plate, so that the heat radiation effect of the hybrid integrated circuit device can be enhanced.
【図１】本発明の混成集積回路装置の第１実施例の断面
図である。FIG. 1 is a sectional view of a first embodiment of a hybrid integrated circuit device according to the present invention.
【図２】本発明の混成集積回路装置の第２実施例の断面
図である。FIG. 2 is a cross-sectional view of a hybrid integrated circuit device according to a second embodiment of the present invention.
【図３】従来の混成集積回路装置の一例の断面図であ
る。FIG. 3 is a cross-sectional view of an example of a conventional hybrid integrated circuit device.
１ 配線基板 １ａ 開口部 ２ 金属板 ３ 放熱用グリース ５ モールドＩＣ ７ 溝 DESCRIPTION OF SYMBOLS 1 Wiring board 1a Opening 2 Metal plate 3 Heat dissipation grease 5 Mold IC 7 Groove
Claims (1)
に金属板が貼付けられた配線基板と、前記配線基板の開
口部内に落とし入れるようにして搭載した表面実装タイ
プのモールドＩＣと、前記モールドＩＣと前記金属板と
の隙間に充填した放熱用グリースとを備えることを特徴
とする混成集積回路装置。A wiring board having an opening in a part thereof and a metal plate adhered to one side thereof; a surface-mounted mold IC mounted so as to be dropped into the opening of the wiring board; A hybrid integrated circuit device comprising: a heat-dissipating grease filled in a gap between the mold IC and the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4161771A JP2748778B2 (en) | 1992-05-29 | 1992-05-29 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4161771A JP2748778B2 (en) | 1992-05-29 | 1992-05-29 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05335452A JPH05335452A (en) | 1993-12-17 |
| JP2748778B2 true JP2748778B2 (en) | 1998-05-13 |
Family
ID=15741593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4161771A Expired - Lifetime JP2748778B2 (en) | 1992-05-29 | 1992-05-29 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2748778B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5670749A (en) * | 1995-09-29 | 1997-09-23 | Allen-Bradley Company, Inc. | Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
| JP4457694B2 (en) | 2003-05-19 | 2010-04-28 | 株式会社デンソー | Heat dissipation structure for electronic components |
| JP2007234886A (en) * | 2006-03-01 | 2007-09-13 | Compal Communications Inc | Electronic element assembly with thermal dissipation constitution |
| CN110139462A (en) * | 2018-02-09 | 2019-08-16 | 深南电路股份有限公司 | A kind of printed circuit board and preparation method thereof and electronic device |
-
1992
- 1992-05-29 JP JP4161771A patent/JP2748778B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05335452A (en) | 1993-12-17 |
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