CN110139462A

CN110139462A - A kind of printed circuit board and preparation method thereof and electronic device

Info

Publication number: CN110139462A
Application number: CN201810136809.5A
Authority: CN
Inventors: 谢占昊; 缪桦; 李传智; 陈绪东
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2018-02-09
Filing date: 2018-02-09
Publication date: 2019-08-16
Also published as: WO2019153452A1

Abstract

This application discloses a kind of printed circuit board and preparation method thereof and electronic devices, the printed circuit board includes: core plate component, including the first core plate and the second core plate stacked gradually, side on second core plate close to first core plate is provided with metal layer, and first core plate offers the through slot through first core plate；Radiator is accommodated in the through slot；And conductive adhesion layer, it is set between the metal layer and the radiator of second core plate, for the radiator to be electrically connected with the metal layer.First radiator is connected directly by the application using conductive adhesion layer with metal layer, while strengthening the ground connection performance of metal layer, metal layer can also be helped to radiate, it is possible thereby to promote the heat dissipation performance of printed circuit board.

Description

A kind of printed circuit board and preparation method thereof and electronic device

Technical field

This application involves technical field of integrated circuits, more particularly to a kind of printed circuit board and preparation method thereof and electronics Device.

Background technique

Printed circuit board (Printed Circuit Board, abbreviation PCB) is important electronic component, is electronics industry One of critical elements.Almost every kind of electronic equipment, it is small arrive electronic watch, calculator, arrive greatly computer, communication electronic device, Military issue weapons system, to realize the electric interconnection between them, will use printing as long as there is the electronic components such as integrated circuit Circuit board.Therefore, printed circuit board role in field of circuit technology is more and more important.And with electronic equipment volume Continuous diminution, the function of electronic device is gradually perfect, to realize the peace of more electronic components in a lesser space Dress, the fever that certainly will will cause circuit board are continuously increased, so solving the heat dissipation problem of circuit board becomes especially urgent.

Summary of the invention

The application mainly solving the technical problems that provide a kind of printed circuit board and preparation method thereof and electronic device, with Solve the problems, such as heat dissipation for circuit board caused by reducing because of electronic equipment volume.

In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of printed circuit board, wrap It includes: core plate component, including the first core plate and the second core plate stacked gradually, close first core plate on second core plate Side is provided with metal layer, and first core plate offers the through slot through first core plate；Radiator is accommodated in described In through slot；And conductive adhesion layer, it is set between the metal layer and the radiator of second core plate, is used for institute Radiator is stated to be electrically connected with the metal layer.

In order to solve the above technical problems, another technical solution that the application uses is: providing a kind of electronic device, wrap It includes: printed circuit board, comprising: core plate component leans on second core plate including the first core plate and the second core plate stacked gradually The side of nearly first core plate is provided with metal layer, and the through slot through first core plate is offered on first core plate, The mounting groove through second core plate is offered on second core plate；First radiator is accommodated in the through slot；It leads Electric adhesive layer is set between the metal layer of second core plate and first radiator, is used for described first Radiator is electrically connected with the metal layer；And heating device, it is installed in the mounting groove, and the maximum of the heating device Cross-sectional area is less than the area that the bottom surface of the mounting groove is constituted on first radiator.

In order to solve the above technical problems, another technical solution that the application uses is: providing the first core plate, the second core The side of plate, radiator and conductive bonding material, second core plate is provided with metal layer；First core plate is opened Slot processing is to form the first through slot for running through first core plate；The radiator is placed in first through slot；And it is right First core plate and second core plate are pressed to form the printed circuit board, so that the radiator passes through institute State conductive bonding material connection on the metal layer.

Having the beneficial effect that for above-described embodiment is placed by opening up through slot on core plate component, and by the first radiator In the through slot on core plate component, then the metal layer on the first radiator and the second core plate is carried out using conductive adhesion layer It connecting and is connected, the heat for realizing the metal layer on the second core plate passes to the first radiator by conductive adhesion layer, by This can accelerate to radiate by the first radiator, promote the heat dissipation performance of printed circuit board.

Detailed description of the invention

In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.

Fig. 1 is the overall structure schematic cross-sectional view of the printed circuit board in one embodiment of the application；

Fig. 2 is the schematic perspective view of another the first radiator of embodiment of the application；

Fig. 3 is the schematic perspective view of another embodiment electronic device of the application；

Fig. 4-6 is the flow chart of the production method of the printed circuit board of the another embodiment of the application；

Fig. 7-11 is the fabrication processing figure of the printed circuit board of the another embodiment of the application.

Main element symbol description

Printed circuit board 100

Core plate component 10

Radiator 20

Conductive adhesion layer 30

First core plate 12

Second core plate 14

Core plate medium 120

Metal layer 122

Second core plate medium 140

Ground plane 142

Signals layer 144

Through slot 16

First articulamentum 18

Second articulamentum 19

Mounting groove 40

Via hole 50

Conductive layer 52

Electronic device 300

Heating device 200

First radiator 20a

Electronic device 210

Second radiator 220

Conductive bonding material layer 80

Specific embodiment

Below by the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described implementation Example is merely a part but not all of the embodiments of the present application.Based on the embodiment in the application, this field is common Technical staff's every other embodiment obtained without making creative work belongs to the model of the application protection It encloses.

Term " first ", " second " in the application are used for description purposes only, and are not understood to indicate or imply opposite Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright Show or implicitly include at least one this feature.In the description of the present application, the meaning of " plurality " is at least two, such as two It is a, three etc., unless otherwise specifically defined.The directional instruction of institute in the embodiment of the present application (such as upper and lower, left, It is right, forward and backward ...) be only used for explain under a certain particular pose (as shown in the picture) between each element relative positional relationship, Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as contain series of steps Or the process, method, system, product or equipment of element, it is not limited to listed step or element, but is optionally also wrapped Include the step of not listing or element, or optionally further comprising other steps intrinsic for these process, methods, product or equipment Rapid or element.

In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection ", " be arranged exist ... on " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to removably connect It connects, or is integrally connected；It can be mechanical connection；It can be and be directly connected to, can also indirectly connected through an intermediary, it can To be the connection inside two elements.For the ordinary skill in the art, concrete condition can be regarded and understand above-mentioned art The concrete meaning of language in this application.

In the description of the present application, unless otherwise indicated, the meaning of " plurality " is two or more.If this specification The middle term for " process " occur, refers not only to independent process, when can not clearly distinguish with other process, as long as being able to achieve Effect desired by the process is then also included in this term.In addition, in this specification with the numberical range that "-" indicates refer to by The range that the numerical value recorded before and after "-" is included respectively as minimum value and maximum value.In the accompanying drawings, structure is similar or identical Element be indicated by the same numeral.

In addition, electronic device for example may include smart phone, tablet personal computer, shifting in the description of the present application Mobile phone, visual telephone, E-book reader, desktop computer, on knee, netbook computer, work station, server, individual One in digital assistants, portable media player, player, Medical Instruments, camera and wearable device.It is wearable Device may include that accessory (such as wrist-watch, ring, bracelet, foot chain, glasses, contact lenses or wear-type device), clothes are integrated Type (such as electronics clothes), body attached type (such as pad skin or tatoo) or implantable (such as implantable circuit).One In a little embodiments, household electrical appliance may include such as digital versatile disk player, audio, refrigerator, air-conditioning, cleaner, bake Case, micro-wave oven, washing machine, air filter, set-top box, home automation controlling panel, security control panel, TV box, trip Play console, electronic dictionary, electron key, video camera and electronic panel etc..

Electronic device can also include various medical devices (such as various portable medical measuring device (blood glucose meters, heart rate Measuring device, blood pressure measuring device and body temperature measuring device), magnetic resonance angiography, MR imaging apparatus, computerized tomography Camera, camera and ultrasonic unit), navigation system, Global Navigation Satellite System), event data recorder, flight Data logger, vehicle infotainment device, electronic device (such as navigation device and gyro sieve for ship for ship Disk), avionic unit, safety device, vehicle head unit, industry or domestic robot, financing corporation ATM, The point of sale in shop and Internet of Things (such as light bulb, various sensors, ammeter or gas meter, water sprinkler device, fire alarm installation, At least one of thermostat, electric pole, bread baker, telecontrol equipment, boiler, heater and boiler).According to the disclosure Various embodiments, electronic device may include furniture or building/structure or a part of vehicle, electron plate, electronic signature Reception device, projector or various measuring devices (such as water service, electric energy, combustion gas or wave measuring device).The application's In various embodiments, electronic device can be flexible or electronic device can be various devices two or more Combination.Above-mentioned apparatus is not limited to according to the electronic device of presently filed embodiment.

Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.

Referring to Fig. 1, Fig. 1 is the overall structure schematic cross-sectional view of the printed circuit board in one embodiment of the application.

As shown in Figure 1, in the present embodiment, the printed circuit board 100 is generally can include: core plate component 10 is embedded at Radiator 20 and conductive adhesion layer 30 in core plate component 10, and radiator 20 passes through the conductive adhesion layer 30 and core plate group Part 10 connects.

Wherein, core plate component 10 may include the first core plate 12 and the second core plate 14 being cascading.

As shown in Figure 1, in the present embodiment, the first core plate 12 may include core plate medium 120 and be located at core plate medium 120 to The metal layer 122 of few side.

Similarly, the second core plate 14 may include core plate medium 140 and the metal layer positioned at at least side of core plate medium 140 142。

The selection of the material of core plate medium 120 and 140 can be selected according to the Functional Design of each layer of core plate.It is also possible to Be fissipation factor (DF, Damping Factor) lesser material suitable for radio circuit, such as ceramic base high frequency material or Polytetrafluoroethylene (PTFE) etc..It can also be the biggish material of fissipation factor suitable for custom circuit, such as FR-4 (including asphalt mixtures modified by epoxy resin Rouge).

In the present embodiment, core plate medium 120 and 140 removes the material system that can be passed through by the radiofrequency signal of permission certain frequency At outer, which can also be thermosetting material, and core plate medium 120 and 140 first passes through heat treatment for solidification, therefore its shape in advance Fixed, during subsequent heat, core plate medium 120 and 140 will not deformation occurs again for this.The core plate medium may be to add The thermoplastic material softened after heat.

Wherein, thermosetting material refers to: the material can soften flowing when heating for the first time, be heated to certain temperature, produce Biochemical reaction makes interlinkage solidify and be hardened；It is this variation be it is irreversible, hereafter, when heating again, which cannot be again Softening is flowed.

Common thermosetting material include but is not limited to allyl resin, epoxy resin, heat-curable urethane, organosilicon or Polysiloxanes etc..These resins can be formed by the reaction product of polymerisable compound, and the polymerisable compound includes at least A kind of oligomeric urethane (methyl) acrylate.In general, oligomeric urethane (methyl) acrylate is more (methyl) propylene Acid esters.Term " (methyl) acrylate " is used to refer to the ester of acrylic acid and methacrylic acid, and with generally refer to (methyl) " poly- (methyl) acrylate " of acrylate polymer compares, and " more (methyl) acrylate " refers to including more than one The molecule of (methyl) acrylate group.Most commonly, more (methyl) acrylate are two (methyl) acrylate, but It is contemplated that using three (methyl) acrylate, four (methyl) acrylate etc..

Further, metal layer 142 is arranged in the first core plate 12 adjacent to 14 side of the second core plate.

In the present embodiment, the metal layer 122,142 on first core plate 12 and the second core plate 14 all can be layers of copper.Its In, copper has good conductive property, and is the most common line material of printed circuit board 100.To every one first core plate 12 and Two core plates 14 carry out patterned process, required line pattern can be obtained, and can be by metal layer 122 according to Functional Design It is signals layer 144 and ground plane 142 with 142 points；Wherein the pattern of signals layer 144 is complicated compared with the pattern of ground plane.In general, signal Layer 144 is the layer being used to form where a plurality of metallic circuit of the electrical connection between electronic device；Ground plane 142 is used to connect with ground It connects, usually the layer in large area continuous metal region.

Optionally, it is grounded with radiator 20 by the metal layer 142 that conductive adhesion layer 30 is connect on the second core plate 14 Layer 142, i.e., realize indirect be electrically connected with the ground plane 142 on the second core plate 14 for radiator 20.In this way, may be used It is electrically connected ground plane 142 directly by the stepped construction of sandwich with radiator 20, to be directly grounded, can contract Thus short grounding path promotes the earthing effect of the electronic device to be grounded on printed circuit board 100, and ground connection stability.

Optionally, refering to fig. 1, the opposite two sides of the core plate medium 140 of second core plate 14 are provided with metal layer 142. Wherein, the metal layer 142 on the second core plate 14 close to 12 side of the first core plate is ground plane 142, and deviates from first core plate 12 The other side metal layer 144 be the first signals layer 144.

The quantity of first core plate 12 can be multiple, and multiple first core plates 12 can be cascading.For example, diagram Embodiment in the first core plate 12 quantity be two.Certainly, in other embodiments, the quantity of second core plate 14 can also be with It is multiple.

In one embodiment, which can also include at least one third core plate, and at least one third Core plate is stacked at second core plate 14 away from 12 side of the first core plate.Each third core plate may include core plate medium and be located at the core The metal layer of plate medium at least side.

In the present embodiment, when the quantity of the third core plate is multiple, in all third core plates 13 with the second core plate The metal layer on the side of the second core plate 14 of the maximum third core plate of 14 distance is second signal layer (that is, outermost The outer metal layers of layer third core plate are signals layer).

In embodiment shown in FIG. 1, which includes two layers of first core plates 12 and one layer of second core plate 14, and the The sequence of one core plate 12 and the second core plate 14 stacked gradually is the first core plate 12, the first core plate 12 and the second core plate 14.

Fig. 1 is further regarded to, in the present embodiment, through slot 16 can be offered on the core plate component 10, is dissipated for accommodating this Thermal 20 and conducting adhesive layer 30.Wherein, which runs through entire first core plate 12 along the thickness direction of the first core plate 12, But it is not extended to any part of the second core plate 14.

In the present embodiment, through slot (showing in Fig. 8) is offered on multiple first core plates 12, in the first core plate 12 and When two core plates 14 stack gradually, all through slots 124 on the first core plate 12 correspond to each other setting, and contact with the second core plate 14 Metal layer 142 at end, to form the accommodation space for accommodating radiator 20, and radiator is at least partially housed in In accommodation space.

In the present embodiment, the maximum cross-section area of through slot 16 is greater than the maximum cross-section area of radiator 20, so as to dissipate Gap 17 can be formed between the side wall of through slot 16 by surrounding on the outer wall of thermal 20 and the first core plate 12.The maximum of the through slot 16 is horizontal Sectional area refers to the through slot 16 in the largest face perpendicular to the projection on the stacking direction of first core plate 12 and the second core plate 14 Product.And the maximum cross-section area of radiator 20 then refers to the radiator 20 along perpendicular to first core plate 12 and the second core plate The maximum area of 14 stacking direction section.Wherein, radiator 20 is set in through slot 16, for the gold being in contact with it Belong to layer 142 to radiate.

Specifically, radiator 20 is the device with conductive and thermally conductive function, can be metal block, and metal block is whole A or partial being embedded in through slot 16 radiates to the metal layer 142 being electrically connected by conductive adhesion layer 30.

In one embodiment, which can be made of pure metal, the metal material used include but is not limited to copper, Copper alloy, aluminium, aluminium alloy, iron, ferroalloy, nickel, nickel alloy, gold, billon, silver, silver alloy, platinum family, platinum metal alloy, chromium, chromium Alloy, magnesium, magnesium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, lead, metal, tin, tin alloy, indium, indium alloy, zinc or kirsite Deng.

In another embodiment, the material of the metal block 20 can also be made of metal matrix and electrically conductive graphite piece.Due to The thermal resistance of electrically conductive graphite piece is small compared with common metal and alloy, can be embedded in a metal electrically conductive graphite piece make it is thermally conductive more fast Speed.The application to the material of the radiator 20 with no restriction.

The shape of radiator 20 can be cube, the regular shapes such as cylindrical body and regular cube, or no Regular shape, the application to the structure of the radiator 20 with no restriction.

When due to heat dissipation, there is close relationship, the i.e. surface area of object between the temperature of object and the surface area of object It is bigger, heat loss it is faster, the temperature of object reduces faster.Referring to Fig. 2, may be used also to further speed up heat dissipation The radiating fin 21 connecting with radiator 20 is set.Wherein, which may include base portion 211 and multiple fin portions 212.The base portion 211 of the radiating fin 21 is connect with radiator 20, and multiple fin portions 212 are then arranged at intervals on the heat radiating fin Deviate from the side of radiator 20 on piece 21.Therefore, base portion 211 can be by the heat transfer on radiator 20 to fin portion 212. Further, since two neighboring fin portion 212 is intervally installed with gap, which can form airflow channel, therefore can Increase the contact area of the radiating fin 21 and air, to accelerate to radiate.

In order to further speed up radiating rate, heat pipe can also be set on radiating fin 21.For example, in each fin portion At least one perforation can be offered on 212, and a heat pipe can be equipped in each perforation.By the setting of heat pipe, can further increase The contact area of big radiator 20 and air, accelerates radiating rate.Optionally, the heat dissipation effect to improve the radiator 20 Fruit can also be coated with heat-conducting glue between heat pipe and the hole wall of perforation.Since the pyroconductivity of heat pipe is much higher than such as copper, aluminium Pure metal, and the non-directional that conducts heat, have certain length, can transfer heat to relatively remote, therefore, have obviously to heat dissipation performance Castering action.

Certainly, also other that can be used can increase the heat dissipation area of radiator 20 to accelerate radiating rate for the application Embodiment, these embodiments are similar with the structure of the application and principle, belong to the protection scope of the application.

With continued reference to Fig. 1, in the present embodiment, conductive adhesion layer 30 is set to the metal layer 142 of the second core plate 14 and dissipates Between thermal 20, for radiator 20 to be electrically connected with the metal layer 142 on the second core plate 14.

Wherein, which is the adhesive layer with conductive and adhesive effect.Conductive bonding material can be packet Include the mixture of conductive material and cohesive material, wherein conductive material can be metal or graphite；Cohesive material can be epoxy Resin.

Therefore, conductive adhesion layer 30 is arranged between radiator 20 and core plate component 10 and forms Sanming City of stacking When controlling structure, on the one hand can make radiator 20 and the metal layer 142 on the second core plate 14 realize it is indirect be electrically connected, realize the Metal layer 142 on two core plates 14 is grounded.On the other hand, since the conductive adhesion layer 30 has caking property, heat dissipation can be filled It sets 20 to be closely bonded together with metal layer 142, guarantees connecing between radiator 20 and the metal layer 142 of the second core plate 14 Touch effect.In addition, the conductive bond piece 30 also has heat-conductive characteristic, it can be by the heat transfer generated on metal layer 142 to scattered Thermal 20, to accelerate the heat dissipation of metal layer 142.

Specifically, the indirect of radiators 20 and the metal layer 142 on the second core plate 14 is realized using 30 layers of conductive bond Electrical connection, since the contact area of conductive adhesion layer 30 and metal layer 142 is greater than hole and the metal layer 142 of conventional borehole ground connection Contact area, so using conductive adhesion layer 30 increase contact area, the ground connection stability of metal layer 142 can be made more It is good.

Further regard to Fig. 1, the cross-sectional area of the conductive adhesion layer 30 may be less than or equal on radiator 20 with conduction The area on the surface that adhesive layer 30 contacts.Specifically, the cross-sectional area of conductive adhesion layer 30 refer to on radiator 20 with conduction The area in the parallel direction of surface that adhesive layer 30 contacts.

In one embodiment, for example, conductive adhesion layer 30 can be conductive bonding material.So-called conductive bonding material It can be the form of paste or pulpous state with certain fluidity, can also be semi-solid preparation form.Wherein, semifixedization form is normal Lower temperature is solid-state, but has certain mobility after being heated to certain temperature, then forms final solidification at a certain temperature.

Can be first passed through in production the mode of printing or coating conductive material is bonded on radiator 20 or with dissipate On the metal layer 142 for the second core plate 14 that thermal 20 connects, it is then put into radiator 20, and by the first core plate 12 and the When the pressing of two core plates 14 forms the sandwich structure of stacking, radiator 20 and the metal layer 142 of the second core plate 14 are bonded.

Wherein, the conduction which is for example made of resin matrix, conducting particles and dispersing additive, auxiliary agent etc. Glue.Wherein, resin matrix can be epoxy resin, organic siliconresin, polyimide resin, phenolic resin, polyurethane, acrylic acid The adhesive systems such as resin.These adhesives form the molecular structure of conducting resinl after hardening, provide mechanical property With adhesive property guarantee, and make conductive filler particles formed channel.And conducting particles can be gold, silver, copper, aluminium, zinc, iron, nickel Powder and graphite and some conductive compounds, for realizing electric conductivity.

In addition, the conductive material can also be conductive silver paste, conductive copper paste or electrically conductive paste etc..By taking conductive silver paste as an example, When in use, can be by conductive silver paste coated on radiator 20 and the metal layer 142 that is connect with radiator 20, and lead at this The region for coating conductive silver paste is mutually bonded before electric silver paste is uncured, the conductive silver paste can be consolidated by solidification process later Change forms conductive adhesion layer 30, thus can bond radiator 20 and the metal layer 142 of the second core plate 14.

In another embodiment, conductive adhesion layer 30 can also be the bonding sheet of semi-solid preparation.In production, by semi-solid preparation Bonding sheet is bonded on the metal layer 142 on radiator 20 or the second core plate, and radiator 20 is then attached with semi-solid preparation The side of bonding sheet be put into the through slot 16 on core plate component 10, and form three in the first core plate 12 and the pressing of the second core plate 14 Radiator 20 is bonded on the metal layer 142 of the second core plate 14 when Mingzhi's structure.It is to be understood that all using conductive Radiator 20 is realized the mode being electrically connected indirectly the application's by adhesive layer 30 with the metal layer 142 on the second core plate 14 In protection scope.

In one embodiment, which can be conducting foam.Wherein, the opposite sides face of the conducting foam On may be provided with conductive double sided adhesive tape so that the conducting foam can be pasted on respectively heat dissipation by the double-sided adhesive in opposite sides face On device 20 and metal layer 142, and then realizes the bonding of radiator 20 and the metal layer 142 on the second core plate 14 and be electrically connected It connects.Wherein, conducting foam has the characteristics that satisfactory electrical conductivity and elasticity are big, can effectively fill up radiator 20 and metal layer Minim gap between 142 makes adequately to contact between radiator 20 and metal layer 142, so as to efficiently against The problem of insufficient contact in installation process between radiator 20 and metal layer 142 leads to imperfect earth.

Since epoxy resin can be in room temperature or lower than 150 DEG C solidifications, and there is formula designability energy abundant, In another embodiment, which can also be solid viscous to obtain by adding the method production of metallic silver in epoxy resin Sheeting, to realize the bonding between radiator 20 and the metal layer 142 on the second core plate 14 and be electrically connected.

Further as shown in Figure 1, in the present embodiment, which can also include the first articulamentum 18.Its In, which is arranged between the first core plate 12 and the second core plate 14, and is arranged around the conductive adhesion layer 30, uses It is bonded in by the first core plate 12 and the second core plate 14.In addition, when being provided with multiple first core plates 12 and multiple second core plates 14, Also first articulamentum 18 can be set between two neighboring first core plate 12 and between two neighboring second core plate 14, from And multiple core plates of core plate component 10 12 and 14 are bonded to each other.

In the present embodiment, which can be cohesive material, and be specifically as follows thermosetting material.Its In, the difference of the first articulamentum 18 and core plate medium 120 and 140 is, the first articulamentum 18 is the thermosetting without Overheating Treatment Property material.Therefore, to the first articulamentum 18 heat when, the first articulamentum 18 can melt, so by two neighboring first core plate 12, Two neighboring second core plate 14 and the first core plate 12 adjacent to each other and the bonding of the second core plate 14.

In other embodiments, which can also be made of thermoplastic material.Wherein, thermoplastic material is Refer to: thermoplastic refers to the plastics with heating and softening, hardening by cooling characteristic.Softening when heating so that flowing, cooling is hardened, this Kind process is reversible, and can be repeated.Common thermoplastic material includes but is not limited to polyethylene, polypropylene, polychlorostyrene second Alkene, polystyrene, polyformaldehyde, poly- carbonic acid junket, polyamide, acrylics, other polyenes invade its copolymer, gather and mock, gather Phenylate, chlorinated polyether etc..Molecular resin chain is all line style or branched structure in thermoplastic, without chemistry between strand Key generates, and softening flowing when heating, the cooling process being hardened is physical change.

In an example, the thermoplastic material may include: polyketone, Nomex, polyimides, polyetherimide, Polyamidoimide, polyphenylene sulfide, polyphenylsulfone, fluoropolymer, polybenzimidazoles, their derivative or their combination.

In another example, which may include a kind of polymer, such as polyketone, thermoplastic polyimide, gather Etherimide, polyphenylene sulfide, polyether sulfone, polysulfones, polyamidoimide, their derivative or their combination.

In a further example, which can also include polyketone, such as polyether-ether-ketone, polyether-ketone, polyether ketone ketone, gather Ether ether ketone ketone, their derivative or their combination.A kind of illustrative thermoplastic fluoropolymer includes: fluorinated ethylene Propylene, polytetrafluoroethylene (PTFE), polyvinylidene fluoride, perfluoro alkoxy, the one of tetrafluoroethene, hexafluoropropene and vinylidene fluoride Kind trimer, polychlorotrifluoroethylene, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoro-ethylene copolymer or their times What is combined.

In addition, the inner sidewall bonding of lateral wall and the first core plate 12 to make radiator 20, can also fill in the heat dissipation It sets and the second articulamentum 19 is set in the gap 17 between the inner sidewall for surrounding the through slot 16 on 20 lateral wall and the first core plate 12. Wherein, which can equally be made of untreated thermosetting material or thermoplastic material.Therefore, to core plate group When part 10 is heated, it can be uniformly filled in gap 17 after the heated thawing of the second articulamentum 19, heat dissipation can not only filled 20 and 12 close adhesion of the first core plate are set, to reduce a possibility that falling off.

In one embodiment, the first articulamentum 18 and the second articulamentum 19 can be structure as a whole.Specifically, when being provided with When multiple first core plates 12 and multiple second core plates 14, using the first articulamentum 18 by two neighboring first core plate 12, Yi Jixiang Adjacent two the second core plates 14 are bonded to each other.When the sandwich structure to stratiform heats, the first articulamentum 18 melts, cocurrent Enter in the gap 17 between the inner sidewall for surrounding the through slot 16 on the lateral wall and the first core plate 12 of radiator 20, after cooling, Form the gap between the lateral wall for being accommodated in radiator 20 and the inner sidewall for surrounding the through slot 16 on the first core plate 12 The second articulamentum 19 at 17.

Continue as shown in Figure 1, be also provided with the mounting groove 40 through the second core plate 14 on the second core plate 14, and the installation Slot 40 is for further installing heating device (showing in Fig. 3).In the present embodiment, which corresponds to radiator 20 Position setting, and mounting groove 40 passes through conductive adhesion layer 30 and extends to the surface or inside of radiator 20, but its depth is small In the height of printed circuit board 100.It, should when the side for deviating from the first core plate 12 on the second core plate 14 is provided with signals layer 144 Mounting groove 40 can also extend to the surface or inside of the radiator 20 from the signals layer 144 on the second core plate 14.

Wherein, the inside that mounting groove 40 extends to radiator 20 specifically refers to, and the depth of mounting groove 40 is greater than the second core The thickness of plate 14 and the thickness for being less than printed circuit board 100.In addition, the area for the conductive adhesion layer 30 that mounting groove 40 occupies is less than The cross-sectional area of conductive adhesion layer 30, so that radiator 20 can be by remaining conductive adhesion layer 30 and the second core plate 14 Metal layer 142 connect.

In the present embodiment, it can directly be milled out on the second core plate 14 on the second core plate 14 by controlled depth milling technique default The mounting groove 40 of depth.Using the controlled depth milling technique, can on the second core plate 14 and radiator 20 primary property process it is default The mounting groove 40 of depth；Its forming step is few, only need to select that machining benchmark is primary, and the machining accuracy of product can be improved.

Continue as shown in Figure 1, via hole 50 can also be opened up on printed circuit board 100.In the present embodiment, the conducting The second core plate 14 is run through in hole 50, and extends to heat dissipation from the first signals layer 144 of the second core plate 14 by conductive adhesion layer 30 The inside of device 20.In addition, being additionally provided with the first signals layer and the second core for being electrically connected second core plate 14 in the via hole 50 The conductive layer 52 of the ground plane of plate 14.

When the core plate component 10 further includes third core plate, the via hole 50 is from the second signal layer of third core plate by the Two core plates 14 extend to the inside of radiator 20.The of the third core plate is electrically connected in addition, being additionally provided in the via hole 50 The conductive layer 52 of the ground plane of binary signal layer and the second core plate 14.

Specifically, the conductive layer 52 in the via hole 50 can be from the first signals layer 144 or third core plate of the second core plate 14 Second signal layer extend on radiator 20, therefore can be by the metal layer 142 or third core plate in the second core plate 14 Second signal layer be connected directly with radiator 20, reinforce the ground connection performance of first signals layer or second signal layer, simultaneously The heat dissipation of metal layer 142 on the second core plate 14 is further speeded up, to improve the heat dissipation performance of printed circuit board 100.

In another embodiment, which can also be from the of the signals layer 144 of the second core plate 14 or third core plate Binary signal layer extends to conductive adhesion layer 30 and does not pass through the conductive adhesion layer 30 and radiator 20.And in another embodiment In, the maximum cross-section area of the conductive adhesion layer 30 is less than the area on the surface contacted on radiator 20 with conductive adhesion layer 30 When, which can also extend to heat dissipation dress from the signals layer 144 of the second core plate 14 or the second signal layer of third core plate 20 are set, but is not passed through the conductive adhesion layer 30.The material of the metal of conductive layer 52 can include but is not limited to titanium palladium, zinc, cadmium, Gold or brass, bronze etc.；It may be diffusion layer, such as nickel-silicon carbide, nickel-fluorographite；It can also be laminating layer, such as copper- Nickel-chrome layer, silver-indium layer etc..It is not construed as limiting in the present embodiment.

Referring to Fig. 3, the electronic device 300 includes: printed circuit board present invention also provides a kind of electronic device 300 100 and heating device 200.

Wherein, the printed circuit board 100 in the present embodiment includes: that core plate component 10, the first radiator 20a and conduction are viscous Tie layer 30.

Printed circuit board 100 in the present embodiment is similar with the structure of printed circuit board 100 in a upper embodiment, this reality It applies in example, only describes the structure different from the printed circuit board 100 in a upper embodiment emphatically, identical structure is no longer superfluous herein It states.In addition, the first radiator 20a in the present embodiment is identical as 20 structure of radiator in a upper embodiment, herein no longer The specific structure of first radiator 20a is described in detail, the structure of radiator 20 in an embodiment is please referred to.

Wherein, which is installed in the mounting groove 40 of printed circuit board 100, and the heating device 200 is most Area of the big cross-sectional area less than the bottom surface for constituting the mounting groove 40 on the first radiator 20a.The maximum of the heating device 200 Cross-sectional area is the maximum area along the section perpendicular to the first core plate 12 and the stacking direction of the second core plate 14.

Wherein, heating device 200 can be to generate the component of heat or in which partially including the component of generation heat.E.g. Electric parts, application processor or IC chip etc..Heating device 200 is installed in mounting groove 40.By heating device 200 by leading Electric welding material layer 80 (tin cream, tin piece or copper slurry etc.) is connected with the first radiator 20a, heat-conducting resin spontaneous heating in 80 future device Effectively spontaneous thermal device 200 is transmitted to the first radiator 20a to the heat of part 200, realizes heat dissipation.

In one embodiment, which is the component for generating heat, and the heating device 200 and the first heat dissipation are filled 20a is set to be directly connected to.In this way, so that the surface area for heat dissipation further increases, printed circuit board 100 is improved Heat dissipation performance.

As shown in figure 3, in another embodiment, heating device 200 includes electronic device 210 and the second radiator 220.

Wherein, electronic device 210 can be encapsulation or the collection of unencapsulated (i.e. no metab, plastic packaging glue or ceramic case) At circuit, triode, IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) and MOS It manages (metal oxide semiconductor, field effect transistor).

Second radiator 220 is placed in mounting groove 40, and the second radiator 220 be located at the first radiator 20a and Between electronic device 210, the heat for distributing the electronic device 210 is transferred to first by second radiator 220 Radiator 20a, and then distributed by the first radiator 20a.Therefore, by radiating in electronic device 210 and first Second radiator 220 is set between device 20a, the heat of electronic device 210 can be made to be transferred to the first radiator 20a rapidly In, improve the heat dissipation performance of printed circuit board 100.Wherein, the maximum cross-section area of second radiator 220 is less than first The area of the bottom surface of the mounting groove 40 is constituted on radiator 20a.Similarly, the maximum cross-section area of second radiator 70 For along the maximum area in the section perpendicular to the first core plate 12 and the stacking direction of the second core plate 14.

In the present embodiment, second radiator 220 can be metal block, the metal for metal block to be made include but Copper, copper alloy, aluminium, aluminium alloy, iron, ferroalloy, nickel, nickel alloy, gold, billon, silver, silver alloy, platinum family, platinum family is not limited to close Gold, chromium, evanohm, magnesium, magnesium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, lead, metal, tin, tin alloy, indium, indium alloy, zinc or Kirsite etc..

In another embodiment, which can be made of metal matrix and electrically conductive graphite piece.Due to electrically conductive graphite piece Thermal resistance it is small compared with common metal and alloy, can be embedded in a metal electrically conductive graphite piece make it is thermally conductive more rapidly.The application With no restriction to the material of second radiator 220.

The shape of second radiator 220 can be cube, and the regular shapes such as cylindrical body and regular cube can also be with For irregular shape, the application to the structure of the second radiator 220 with no restriction.

Wherein, the method the second radiator 220 being connect with the first radiator 20a can there are many, such as can be with Directly the second radiator 220 and the first radiator 20a are bonded using double-sided adhesive；Also the mode of electric welding can be used, it will Second radiator 220 and the first radiator 20a link together by welding；Conductive solder material can also be used The bed of material 80 (tin cream, tin piece or copper slurry etc.) makes between the second radiator 220 and the first radiator 20a bonding etc..It can be with Understand ground, the second radiator 220 and the first radiator 20a can be attached by remaining, and can carry out heat transfer Mode is within the scope of protection of this application.

Fig. 4-10 is please referred to, Fig. 4-6 is the flow chart of the production method of the printed circuit board of the another embodiment of the application, figure 7-11 is the fabrication processing figure of the printed circuit board of the another embodiment of the application.

Make printed circuit board 100 the following steps are included:

S10: the first core plate 12, the second core plate 14, radiator 20 and conductive bonding material 30, and the second core plate 14 are provided The upper side close to the first core plate 12 is provided with metal layer 142.

Wherein, the quantity of the first core plate 12 and the second core plate 14 is at least one.First core plate 12 may include core plate medium 120 and the metal layer 122 positioned at at least side of core plate medium 120.Similarly, the second core plate 14 may include 140 He of core plate medium Metal layer 142 positioned at at least side of core plate medium 140.

In the present embodiment, metal layer 142 is arranged in the first core plate 12 adjacent to 14 side of the second core plate.

That is, every one second core plate 14 includes a core plate medium 140, and opposite the two of core plate medium 140 Side can be only arranged a metal layer 142, metal layer 142 can also be all arranged with two sides, but at least neighbouring in the second core plate 14 The side of radiator 20 is provided with metal layer 142.

In the present embodiment, refering to fig. 1, the opposite two sides of the core plate medium 140 of second core plate 14 are provided with metal Layer 142.Wherein, the metal layer 142 on the second core plate 14 close to 12 side of the first core plate is ground plane, and deviates from first core plate The metal layer 144 of 12 other side is signals layer.Every one first core plate 12 and the second core plate 14 are surface-treated, surface Processing includes:

It is electroplated on the surface of every one first core plate 12 and the second core plate 14 according to preset pattern, so that on its surface Form pattern.

Wherein, in actual production, the most commonly used is in every one first core plate 12 and 14 surface metal-layer of the second core plate Tin plating processing is carried out on partial region.The region soluble for the metal layer not being electroplated is fallen using chemical method.Utilize chemistry Reagent to after plating every one first core plate 12 and the second core plate 14 handle；Wherein, chemical reagent can be with metal layer not The region of plating reacts to each other, but does not react with coating.It therefore, can be by region soluble unplated on metal layer. Then, chemical-treated every one first core plate 12 and the second core plate 14 are carried out moving back tin processing, obtains being plated pattern covering Region metal layer 122 and 142, formed metal pattern.

It obtains to follow the steps below after surface has figuratum first core plate 12 and the second core plate 14:

S20: slot treatment is carried out to form the first through slot 124 for running through the first core plate 12 to the first core plate 12.

The step specifically includes:

S210: it provides and has sticking first articulamentum 18.

S220: slot treatment is carried out to the first core plate 12 and the first articulamentum 18, to form first on the first core plate 12 Through slot 124, and the second through slot 182 is formed on the first articulamentum 18.

S230: by treated, the first articulamentum 18 is placed between the first core plate 12 and the second core plate 14, and makes first Through slot 124 is aligned with the second through slot 182.Wherein, which should be big with the maximum cross-section area of the second through slot 182 In the maximum cross-section area of radiator 20, so that heat dissipation fills 20 and can be put into the first through slot 124 and the second through slot 182.

In the present embodiment, which can be thermoplastic material.In one embodiment, the thermoplastic material packet Include: polyketone, polyimides, polyetherimide, polyamidoimide, polyphenylene sulfide, polyphenylsulfone, fluoropolymer, gathers Nomex Benzimidazole, their derivative or their combination.In another embodiment, which includes a kind of polymer, Such as polyketone, thermoplastic polyimide, polyetherimide, polyphenylene sulfide, polyether sulfone, polysulfones, polyamidoimide, their derivative Object or their combination.In other embodiments, which includes polyketone, such as polyether-ether-ketone, polyether-ketone, polyether-ketone Ketone, polyetherketoneetherketoneketone, their derivative or their combination.

First articulamentum 18 can be also thermosetting material, and in one embodiment, which includes: allyl tree Rouge, epoxy resin, heat-curable urethane, organosilicon or polysiloxanes etc..These resins can be produced by the reaction of polymerisable compound Object is formed, and the polymerisable compound includes at least one oligomeric urethane (methyl) acrylate.In general, the oligomeric poly- ammonia Ester (methyl) acrylate is more (methyl) acrylate.Term " (methyl) acrylate " is for referring to acrylic acid and methyl-prop The ester of olefin(e) acid, and compare with " poly- (methyl) acrylate " for generally referring to (methyl) acrylate polymer, " more (first Base) acrylate " refer to the molecule including more than one (methyl) acrylate group.Most commonly, more (methyl) propylene Acid esters is two (methyl) acrylate, but it is also contemplated that using three (methyl) acrylate, four (methyl) acrylate etc. Deng.

In other implementations, when the quantity of the first core plate 12 is multiple and 14 quantity of the second core plate is multiple, then to One core plate 12 carries out slot treatment and specifically includes:

S210a: multiple sticking first articulamentums 18 of tool are provided.

S220a: slot treatment is carried out to multiple first core plates 12 and multiple first articulamentums 18, in multiple first core plates The first through slot 124 is formed on 12, and the second through slot 182 is formed on multiple first articulamentums 18；

S230a: will treated that multiple first articulamentums 18 are placed between adjacent first core plate 12 of any two and appoint Between two adjacent second core plates 14 of meaning and between adjacent first core plate 12 and second core plate 14, and make multiple The second through slot 182 on first articulamentum 18 is aligned on multiple first core plates 12 the first through slot 124.

Specifically, the first core plate 12 and the second core plate 14 can be sequentially stacked in vertical direction, and by the first articulamentum 18 It is placed between adjacent multiple first core plates 12 and multiple second core plates 14, and in the first adjacent core plate 12 and the second core plate Between 14.For example, the quantity that the first core plate 12 is added is two and second quantity of core plate 14 when being two, the sequence being sequentially stacked Are as follows: the first core plate 12, the first articulamentum 18, the first core plate 12, the first articulamentum 18, the second core plate 12, the first articulamentum 18, Two core plates 14.

S30: radiator 20 is placed in the first through slot 124.

In one embodiment, conductive bonding material 30 can be paste or the conductive material of pulpous state.When conductive bond material Material 30 for paste or pulpous state conductive material when, radiator 20 is connected to the second core plate 14 by conductive bonding material 30 Metal layer 142 on step include: that conductive material is first bonded to radiator 20 or the second by way of printing or coating On the metal layer 142 of core plate 14, then radiator 20 is placed in fluting, to realize radiator 20 and the second core plate 14 The connection of metal layer 142.

Wherein, the conduction which is for example made of resin matrix, conducting particles and dispersing additive, auxiliary agent etc. Glue.Wherein, resin matrix can be epoxy resin, organic siliconresin, polyimide resin, phenolic resin, polyurethane, acrylic acid The adhesive systems such as resin.These adhesives form the molecular structure of conducting resinl after hardening, provide mechanical property With adhesive property guarantee, and make conductive filler particles formed channel.And conducting particles can be gold, silver, copper, aluminium, zinc, iron, nickel Powder and graphite and some conductive compounds, for realizing electric conductivity.In addition, the conductive material of the liquid can also be to lead Electric silver paste, conductive copper paste or electrically conductive paste etc..

In another embodiment, conductive adhesion layer 30 can also be the bonding sheet of semi-solid preparation.When conductive adhesion layer 30 is solid When the bonding sheet of state, radiator 20 is connected to the step on the metal layer 142 of the second core plate 14 by conductive adhesion layer 30 Include: that conductive adhesion layer 30 is attached on radiator 20, then radiator 20 is attached with to one end of conductive adhesion layer 30 It is first put into fluting, so that radiator 20 is connect with the metal layer 142 of the second core plate 14.

In one embodiment, which can be conducting foam.Wherein, it can be set on the opposite sides face of the conducting foam Be equipped with conductive double sided adhesive tape so that the conducting foam can be pasted on respectively by the double-sided adhesive in opposite sides face radiator and On metal layer, and then realize the bonding and electrical connection of the first radiator and the metal layer on the second core plate.Wherein, conductive bubble Cotton has the characteristics that satisfactory electrical conductivity and elasticity are big, can effectively fill up the minim gap between radiator and metal layer, Make adequately to contact between radiator and metal layer, so as to efficiently against radiator during the installation process and metal The problem of insufficient contact between layer leads to imperfect earth.

Since epoxy resin can be in room temperature or lower than 150 DEG C solidifications, and there is formula designability energy abundant, In another embodiment, which can also be solid viscous to obtain by adding the method production of metallic silver in epoxy resin Sheeting, to realize the bonding between the first radiator 20 and the metal layer 142 on the second core plate 14 and be electrically connected.Wherein, it adopts Above-mentioned thickness can be easily made between 0.05-0.5mm with the mode of epoxy resin addition metallic silver, and volume resistance is small In the bonding sheet of 0.4m Ω.

The metal layer 142 of radiator 20 and the second core plate 14 is connected, and after being put into the first articulamentum 18, is continued Following steps:

S40: the first core plate 12 and the second core plate 14 are pressed to form printed circuit board 100, so that radiator 20 are connected on metal layer 142 by conductive bonding material 30.Step S40 is specifically included:

First core plate 12 and the second core plate 14 and the first articulamentum 18 are heated, so that the first articulamentum 18 melts After flow into and be filled between the first core plate 12 and the second core plate 14 and be filled in radiator 20 and the first through slot 124 and Between the inner sidewall of two through slots 182, and pressure is applied to the first core plate 12 and the second core plate 14 and the first articulamentum 18, with shape At the printed circuit board 100.

Specifically, hot pressing is carried out to the first core plate 12 and the second core plate 14 and the first articulamentum 18, due to the first connection Layer 18 is thermosetting material or thermoplastic material, when heated, the first articulamentum 18 softening flowing, due to 124 He of the first through slot The cross-sectional area of second through slot 182 is greater than the maximum cross-sectional area of radiator 20 so that the inner wall of the second through slot 182 with There are gap 17 between the outer wall of radiator 20, the thermosetting material of flowing is flowed at gap 17, fills up the second through slot 182 Gap 17 between inner wall and the outer wall of radiator 20 stops heating, the thermosetting material hardening by cooling of flowing, filling at this time At gap 17.

After forming printed circuit board 100, in order to further increase for installing heating device on printed circuit board 100 200 installation region opens up mounting groove 40 on the second core plate 14.Wherein, the corresponding radiator 20 of the mounting groove 40 is arranged, and Extend to the inside of radiator 20.The depth of the mounting groove 20 is less than the height of printed circuit board 100, and the bottom of mounting groove 40 Area is less than the cross-sectional area of conductive adhesion layer 30.When the side for deviating from the first core plate 12 on the second core plate 14 is provided with signals layer When 144, which can also extend to the inside of first radiator 20 from the signals layer 144 on the second core plate 14.

Wherein, the inside that mounting groove 40 extends to radiator 20 specifically refers to, and the depth of mounting groove 40 is greater than the second core The thickness of plate 14 and the thickness for being less than printed circuit board 100.The floor space of mounting groove 40 is less than the cross section of conductive adhesion layer 30 Product, so that radiator 20 can be connect by remaining conductive adhesion layer 30 with the metal layer 142 on the second core plate 14.

In the present embodiment, it can directly be milled out on the second core plate 14 on the second core plate 14 by controlled depth milling technique default The mounting groove 40 of depth.Using the controlled depth milling technique, primary property can be processed on the second core plate 14 and the first radiator 20 The mounting groove 40 of predetermined depth；Its forming step is few, and it is primary only need to select machining benchmark, and processing precision of products is high.

It can also be after pressing the first core plate 12 and the second core plate 14 to form printed circuit board 100, Via hole 50 is opened up on two core plates 14.Via hole 50 from the first signals layer 144 of the second core plate 14 by conductive adhesion layer 30 and Extend to the inside of radiator 20.Metalized can be carried out to via hole 50, so that 50 inner wall of via hole adheres to conductive layer 52, which is used to be electrically connected the first signals layer of second core plate 14 and the ground plane of the second core plate 14.

In other embodiments, when the core plate component 10 further includes third core plate, the via hole 50 is from third core plate Second signal layer extends to the inside of radiator 20 by the second core plate 14.It is electrically connected in addition, being additionally provided in the via hole 50 Connect the conductive layer 52 of the second signal layer of the third core plate and the ground plane of the second core plate 14.

Specifically, can be used the method for drilling drilling blind hole or through-hole on the second core plate 14 or third core plate, blind hole or Person's through-hole is contacted with radiator 20, to enhance the second signal layer of signals layer 144 or third core plate on the second core plate 14 Earthing effect.

In the present embodiment, metalized can be carried out to via hole 50 by way of plating.Specifically, can contain It is intended in the saline solution of plating metal, using the metal for pacifying via hole 50 as cathode, by electrolysis, makes to be intended to plating metal in plating solution Cation is deposited in the metal surface of via hole 50, to form conductive layer 52.Commonly the metal for plating includes But it is not limited to titanium palladium, zinc, cadmium, gold or brass, bronze etc..It certainly, in other embodiments, can also be for example, by the side of coating Formula realizes the metalized of the via hole 50.

In another embodiment, which can also be from the second core plate 14 or the letter of the second signal layer of third core plate Number floor extends to conductive adhesion layer 30 and does not pass through the conductive adhesion layer 30 and radiator 20.And in another embodiment, it should It, should when the maximum cross-section area of conductive adhesion layer 30 is less than the area on the surface contacted on radiator 20 with conductive adhesion layer 30 Via hole 50 can also extend to radiator 20 from the signals layer 144 of the second core plate 14 or the second signal layer of third core plate, But it is not passed through the conductive adhesion layer 30.Printed circuit board 100 is described in detail in this specification and printed circuit board 100 is made Make the exemplary embodiment of method.The printed circuit board 100 and method are not limited to specific embodiment described in this specification, On the contrary, the printed circuit board 100 element and/or method operation can with other elements described in this specification and/ Or operation independently and separately utilizes.In addition, the element and/or operation can also be limited to other systems, method and/or device In, or be used together with other systems, method and/or device, and be not limited to merely with printing electricity described in this specification Road plate 100 is implemented.

Unless otherwise designated, otherwise operation execution or the implementation sequence of the embodiment of the present invention described in this specification are not Necessary sequence.That is, unless otherwise specified, operation can execute in any order, and the embodiment of the present invention may include another The outer or operation fewer than those of this disclosure.Such as, it is contemplated that before another operation, simultaneously or later execute or into Row specific operation is within the scope of various aspects of the invention.

The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other Technical field similarly includes in the scope of patent protection of the application.

Claims

1. a kind of printed circuit board characterized by comprising

Core plate component, including the first core plate and the second core plate stacked gradually, close first core plate on second core plate Side be provided with metal layer, first core plate offers the through slot through first core plate；

Radiator is accommodated in the through slot；And

Conductive adhesion layer is set between the metal layer and the radiator of second core plate, for dissipating described Thermal is electrically connected with the metal layer.

2. printed circuit board according to claim 1, which is characterized in that the quantity of first core plate is multiple and more A first core plate stacks gradually；

All through slots of multiple first core plates are correspondingly arranged, and end in second core plate, to be formed for holding Receive the accommodation space of the radiator；The radiator is at least partially housed in the accommodation space.

3. printed circuit board according to claim 1, which is characterized in that further include positioned at first core plate and described the Between two core plates and around the first articulamentum of conductive adhesion layer setting；First articulamentum is cohesive material, is used for First core plate and second core plate are bonded.

4. printed circuit board according to claim 3, which is characterized in that the maximum cross-section area of the through slot is greater than described The maximum cross-section area of radiator, so as to surround the through slot on the lateral wall of the radiator and first core plate Gap is formed between inner sidewall.

5. printed circuit board according to claim 4, which is characterized in that the second articulamentum is additionally provided in the gap, And second articulamentum is made of adhesives, for the radiator and first core plate to be bonded.

6. printed circuit board according to claim 5, which is characterized in that second articulamentum and first articulamentum It is structure as a whole.

7. printed circuit board according to claim 1, which is characterized in that the cross-sectional area of the conductive adhesion layer be less than or Equal to the area on the surface contacted on the radiator with the conductive adhesion layer.

8. printed circuit board according to claim 1, which is characterized in that offered on second core plate through described Second core plate and the mounting groove for being used to install heating device；The mounting groove corresponds to the radiator setting, leads across described Electric adhesive layer and the surface or inside for extending to the radiator, and the depth of the mounting groove is less than the printed circuit board Height.

9. printed circuit board according to claim 1, which is characterized in that the metal layer is ground plane；Second core Side on plate away from first core plate is additionally provided with the first signals layer；

The printed circuit board further offers the via hole that the ground plane is at least extended to from first signals layer；Institute The conductive layer for being provided in via hole and being electrically connected first signals layer and the ground plane is stated, for reinforcing first signal The ground connection performance of layer.

10. printed circuit board according to claim 1, which is characterized in that further include being stacked at second core plate to deviate from At least one third core plate of first core plate side；

Deviate from the side of second core plate in all third core plates on maximum third core plate with second core plate It is additionally provided with second signal layer；The printed circuit board further offers from the second signal layer and at least extends to described connect The via hole on stratum；It is provided with the conductive layer for being electrically connected the second signal layer and the ground plane in the via hole, is used for Reinforce the ground connection performance of the second signal layer.

11. a kind of electronic device characterized by comprising

Printed circuit board, comprising:

Core plate component, including the first core plate and the second core plate stacked gradually, close first core plate on second core plate Side be provided with metal layer, the through slot through first core plate is offered on first core plate, on second core plate Offer the mounting groove through second core plate；

First radiator is accommodated in the through slot；

Conductive adhesion layer is set between the metal layer of second core plate and first radiator, is used for institute The first radiator is stated to be electrically connected with the metal layer；And

Heating device is installed in the mounting groove, and the maximum cross-section area of the heating device is less than first heat dissipation The area of the bottom surface of the mounting groove is constituted on device.

12. electronic device according to claim 11, which is characterized in that the heating device includes electronic device and second Radiator；Second radiator is set in the mounting groove, and is located at first radiator and the electronics Between device；The maximum cross-section area of second radiator, which is less than on first radiator, constitutes the mounting groove The area of bottom surface.

13. a kind of production method of printed circuit board, which is characterized in that the production method includes:

The first core plate, the second core plate, radiator and conductive bonding material are provided, the side of second core plate is provided with metal Layer；

Slot treatment is carried out to form the first through slot for running through first core plate to first core plate；

The radiator is placed in first through slot；And

First core plate and second core plate are pressed to form the printed circuit board, so that the radiator On the metal layer by conductive bonding material connection.

14. production method according to claim 13, which is characterized in that the conductive bonding material is paste or pulpous state； Described the step of connecting the radiator on the metal layer by the conductive bonding material includes: by the conduction Binding material is bonded on the metal layer or the radiator by way of printing or coating.

15. production method according to claim 13, which is characterized in that the conductive bonding material is semi-solid preparation shape；Make The step of radiator is connected on the metal layer by the conductive bonding material includes: by the conductive bond material Material be attached on the radiator, and by the radiator be attached with the conductive bonding material one end and the metal layer Connection.

16. production method according to claim 13, which is characterized in that carry out the step of slot treatment to first core plate Suddenly include:

It provides and has sticking first articulamentum；

Slot treatment is carried out to first core plate and first articulamentum, to form described first on first core plate Through slot, and the second through slot is formed on first articulamentum；

By treated, first articulamentum is placed between first core plate and second core plate, and makes described first Through slot is aligned with second through slot.

17. production method according to claim 16, which is characterized in that first core plate and second core plate into Row pressing to form the printed circuit board the step of include:

First core plate and second core plate and first articulamentum are heated, so that first articulamentum Flowed into after thawing and be filled between first core plate and second core plate and be filled in the radiator with it is described Between first through slot and the inner sidewall of second through slot, and to first core plate and second core plate and described first Articulamentum applies pressure, to form the printed circuit board.

18. production method according to claim 13, which is characterized in that first core plate and second core plate into Row pressing is to form after the printed circuit board further include:

The mounting groove through second core plate is opened up at the position for corresponding to the radiator on second core plate, makes institute Mounting groove is stated across the conductive bonding material and extends to the surface or inside of the radiator；Wherein, the mounting groove Depth be less than the printed circuit board height.

19. production method according to claim 17, which is characterized in that deviate from first core plate on second core plate Side be additionally provided on signals layer and second core plate close to first core plate side be arranged the metal layer be Ground plane；

First core plate and second core plate are pressed to be formed after the printed circuit board further include:

The via hole that the metal layer is at least extended to from the signals layer is opened up on second core plate；And

To the via hole carry out metalized so that the via hole inner sidewall attachment for be electrically connected the signals layer and The conductive layer of the ground plane.

20. production method according to claim 13, which is characterized in that first core plate and second core plate into The step of row pressing is to form the printed circuit board further include:

At least one third core plate is provided, and the first core plate, the second core plate and at least one third core plate are once laminated；Its In, it is set in all third core plates with side of second core plate on maximum third core plate away from second core plate It is equipped with signals layer；The metal layer on second core plate close to the setting of the side of first core plate is ground plane；

The via hole that the ground plane is at least extended to from the signals layer is opened up at least one described third core plate；And