CN110708864A - Printed circuit board containing heat dissipation medium and preparation method thereof - Google Patents
Printed circuit board containing heat dissipation medium and preparation method thereof Download PDFInfo
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- CN110708864A CN110708864A CN201910983582.2A CN201910983582A CN110708864A CN 110708864 A CN110708864 A CN 110708864A CN 201910983582 A CN201910983582 A CN 201910983582A CN 110708864 A CN110708864 A CN 110708864A
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- heat dissipation
- core
- medium
- dissipation medium
- groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention discloses a printed circuit board containing a heat dissipation medium and a preparation method thereof, wherein the printed circuit board comprises a plurality of layers of core boards, a core board adhesive sheet for adhering the core boards is arranged between two adjacent layers of core boards, a core board groove is formed in the position, needing to be embedded with the heat dissipation medium, on the core board adhesive sheet, a core board adhesive sheet groove is formed in the position needing to be embedded with the heat dissipation medium; the core plate groove and the core plate bonding sheet groove form a heat dissipation medium groove, and the heat dissipation medium is arranged in the heat dissipation medium groove; each core plate comprises a metal layer, the multiple metal layers comprise at least one grounding part, and the grounding part is exposed out of the side wall of the heat dissipation medium groove; the surface of the heat radiation medium groove is provided with a conductive part in a local area corresponding to the grounding part, and the grounding part is in contact with the corresponding conductive part to form electrical connection. The invention realizes the selective electric connection of the metal layer and the heat dissipation medium by selectively arranging the conductive part, and is suitable for the condition of laying different network circuits in the printed circuit board.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a printed circuit board containing a heat dissipation medium and a preparation method thereof.
Background
In the design of the printed circuit board, after the multi-layer board is generally pressed for realizing the interlayer interconnection, the interlayer interconnection is realized by drilling and metallizing holes, the mode can realize the circuit interconnection of different layers at the designated position, but the method has the following defects: 1) the direct connection at the drilling position can be realized only by the connection of the metallized holes, the transmission of a line path far away from the holes is far, and the stratum shielding effect is poor during high-frequency or high-speed signal transmission; 2) the manufacturing process flow is complex, the chemical liquid is used for realizing the process flow, the environment is harmed to a certain extent, the metallized holes are required to be electroplated, and energy is consumed.
Patent CN107734837A discloses a PCB capable of dissipating heat quickly, which specifically includes: and after hot pressing, the electric and heat conducting bonding sheet can flow to the neck of the stepped high-heat-conductivity metal block. However, the patent is only applicable to the situation that the corresponding metal layers above the electric and heat conductive bonding sheet all belong to the same network which needs to be connected with the metal block, and when part of the corresponding metal layers above the electric and heat conductive bonding sheet does not need to be connected with the metal block, the metal layers are not applicable, selectivity is not available, and the circuit for laying different networks on the inner layer is not facilitated.
Disclosure of Invention
The invention aims to provide a printed circuit board containing a heat dissipation medium and a preparation method thereof, and the printed circuit board and the preparation method thereof are used for solving the problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
a printed circuit board containing heat dissipation media comprises a plurality of layers of core boards, wherein a core board adhesive sheet for adhering the core boards is arranged between two adjacent layers of core boards, a core board groove is formed in the position, where the heat dissipation media need to be embedded, on each core board, and a core board adhesive sheet groove is formed in the position, where the heat dissipation media need to be embedded, on each core board adhesive sheet; the core plate groove and the core plate bonding sheet groove form a heat dissipation medium groove, and the heat dissipation medium is arranged in the heat dissipation medium groove;
each core plate comprises a metal layer, the multiple metal layers comprise at least one grounding part, and the grounding part is exposed out of the side wall of the heat dissipation medium groove; and a local area corresponding to the grounding part on the surface of the heat dissipation medium groove is provided with a conductive part, and the grounding part is in contact with the corresponding conductive part to form electrical connection.
Optionally, when the plurality of metal layers include a plurality of the grounding portions, the plurality of grounding portions are disposed on different metal layers, or/and a plurality of the grounding portions are disposed on one metal layer.
Optionally, the heat dissipation medium is a cuboid, a cylinder or a step.
Optionally, the stair-shaped heat dissipation medium comprises a heat dissipation base and a heat dissipation convex part which are fixedly connected, a stair surface is formed between the heat dissipation base and the heat dissipation convex part, and the conductive part is arranged on at least one of the stair surface, the side surface of the heat dissipation base and the side surface of the heat dissipation convex part.
Optionally, the conductive portion is a conductive adhesive coated on the heat dissipation medium.
Optionally, the core plate adhesive sheet is a semi-cured adhesive sheet, the heat dissipation medium is a metal block, and the metal layer is a copper foil.
Optionally, the heat dissipation medium groove and the heat dissipation medium are in clearance fit.
A method for preparing a printed circuit board containing a heat dissipation medium comprises the following steps:
providing a heat dissipation medium, a multi-layer core board and at least one layer of core board adhesive sheet, wherein the core board comprises a metal layer;
grooving the positions of the core plates, where the heat dissipation media need to be embedded, to form core plate grooves, wherein at least one metal layer is exposed out of the groove walls of the core plate grooves to form grounding parts;
grooving the position of the core plate bonding sheet where the heat dissipation medium needs to be embedded to form a core plate bonding groove;
combining a plurality of layers of the core plates and at least one layer of the core plate adhesive sheets according to the arrangement mode that the core plate adhesive sheets are arranged between two adjacent core plates, wherein the core plate grooves and the core plate adhesive grooves are combined to form radiating medium grooves;
a conductive part is arranged on a local area corresponding to the grounding part on the surface of the heat dissipation medium;
placing the heat dissipation medium in the heat dissipation medium groove, wherein the grounding part is in contact with the corresponding conductive part to form electrical connection;
and carrying out hot-pressing treatment on the heat dissipation medium, the multiple layers of the core plates and at least one layer of the core plate adhesive sheets together, and solidifying the core plate adhesive sheets to enable the heat dissipation medium, the multiple layers of the core plates and the at least one layer of the core plate adhesive sheets to form an integral structure, so that the printed circuit board containing the heat dissipation medium is obtained.
Optionally, the steps of: the disposing of the conductive portion in the local area corresponding to the grounding portion on the surface of the heat dissipation medium specifically includes:
and coating conductive adhesive on a local area corresponding to the grounding part on the surface of the heat dissipation medium to form a conductive part.
Optionally, after the heat dissipation medium, the plurality of layers of core plates, and at least one layer of core plate adhesive sheet are subjected to a hot pressing process together, the method further includes the steps of:
and sequentially carrying out drilling treatment, electroplating treatment, outer layer circuit manufacturing treatment, resistance welding treatment and surface treatment on the heat dissipation medium, the plurality of layers of the core plates and at least one layer of the core plate adhesive sheets which form an integral structure.
Compared with the prior art, the invention has the following beneficial effects:
the position of the metal layer to be grounded is exposed out of the side wall of the radiating medium groove to form a grounding part, and the local area corresponding to the grounding part on the surface of the radiating medium groove is provided with a conductive part, so that the metal layer and the radiating medium are selectively and electrically connected. When the printed circuit board contains different network signal lines, some need to be electrically connected with a heat dissipation medium, and some need not to be electrically connected with the heat dissipation medium, the invention is suitable, so that the invention is beneficial to paving lines of different networks in the printed circuit board. In addition, the core plate and the core plate adhesive sheet are provided with the grooves, and the heat dissipation medium is put into the grooves to realize grounding, so that a method of drilling and then metalizing holes is not needed, the preparation method is simple, and the environmental protection problem caused by using chemical liquid medicine can be avoided. Furthermore, when the heat dissipation medium is grounded, a larger contact area can exist between the heat dissipation medium and the core plate, so that grounding and signal shielding are better realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
The structure, proportion, size and the like shown in the drawings are only used for matching with the content disclosed in the specification, so that the person skilled in the art can understand and read the description, and the description is not used for limiting the limit condition of the implementation of the invention, so the method has no technical essence, and any structural modification, proportion relation change or size adjustment still falls within the scope of the technical content disclosed by the invention without affecting the effect and the achievable purpose of the invention.
Fig. 1 is a schematic structural diagram of a printed circuit board containing a heat dissipation medium according to embodiment 1 of the present invention;
fig. 2 is a schematic top view of a heat dissipation medium provided in embodiment 1 of the present invention;
fig. 3 is a schematic view of a heat dissipation medium provided in embodiment 1 of the present invention;
fig. 4 is another schematic view of a heat dissipation medium provided in embodiment 1 of the present invention;
fig. 5 is a schematic flow chart of the preparation method provided in embodiment 2 of the present invention.
Illustration of the drawings: 1. a heat-dissipating medium; 11. a heat dissipation base; 12. a heat dissipating projection; 2. a core board; 21. a metal layer; 211. a ground part; 22. a metal layer adhesive sheet; 3. a core sheet adhesive sheet; 4. a conductive portion; 5. and a heat dissipation medium groove.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. It should be noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Example one
Referring to fig. 1, the present invention provides a printed circuit board containing a heat dissipation medium, including a plurality of core boards 2, a core board adhesive sheet 3 for adhering the core boards 2 is disposed between two adjacent core boards 2, a core board groove is disposed at a position on the core board 2 where the heat dissipation medium 1 needs to be embedded, and a core board adhesive sheet groove is disposed at a position on the core board adhesive sheet 3 where the heat dissipation medium 1 needs to be embedded. The core plate groove and the core plate bonding sheet groove form a heat dissipation medium groove 5, and the heat dissipation medium 1 is arranged in the heat dissipation medium groove 5.
Each core board 2 includes a metal layer 21, the multi-layer metal layer 21 includes at least one grounding portion 211, and the grounding portion 211 is exposed from the sidewall of the heat dissipation medium slot 5. The surface of the heat-radiating medium groove 5 is provided with a conductive portion 4 in a partial region corresponding to the grounding portion 211, and the grounding portion 211 and the corresponding conductive portion 4 are in contact with each other to form an electrical connection.
The invention can realize selective electric connection between the metal layer 21 and the heat-radiating medium 1 through selective arrangement of the conductive part 4, namely, the heat-radiating medium 1 can be selectively connected with network circuits in the printed circuit board, and the invention is suitable for the condition that the printed circuit board contains different network circuits.
The core adhesive sheet 3 is a semi-cured adhesive sheet. The heat dissipation medium 1 is a metal block, preferably a copper block. The conductive portion 4 is a conductive paste applied on the heat dissipation medium 1, and the conductive paste is preferably a liquid conductive paste for coating.
In the embodiment of the present invention, the core 2 includes two metal layers 21, and a metal layer adhesive sheet 22 for adhering the metal layers 21 is provided between the two metal layers 21. The metal layer adhesive sheet 22 is initially a semi-cured adhesive sheet, and is cured by heat and pressure at the time of production of the core board 2 so that the two metal layers 21 and the metal layer adhesive sheet 22 form an integral structure. The metal layer 21 is preferably a copper foil.
In the embodiment of the present invention, the top surface of the heat dissipation medium 1 is flush with the top surface of the core board 2 at the top layer, and the bottom surface of the heat dissipation medium 1 is flush with the bottom surface of the core board 2 at the bottom layer, thereby facilitating heat dissipation and assembly.
In the embodiment of the present invention, the shape of the heat dissipation medium 1 is not limited, and may be any of rectangular parallelepiped, cylindrical, and stepped shapes.
Preferably, the heat dissipation medium 1 is a stepped heat dissipation medium, the stepped heat dissipation medium includes a heat dissipation base 11 and a heat dissipation protrusion 12, which are fixedly connected, and a stepped surface is formed between the heat dissipation base 11 and the heat dissipation protrusion 12. The conductive portion 4 may be provided on at least one of the stepped surface, the side surface of the heat dissipation base 11, and the side surface of the heat dissipation convex portion 12. The heat medium grooves 5 are also stepped corresponding to the stepped heat medium. The stepped heat dissipation medium is more convenient to assemble, and provides an additional stepped surface to dispose the conductive part 4, whereas the conventional rectangular parallelepiped heat dissipation medium can only provide a side surface to dispose the conductive part 4.
Referring to fig. 1 and 2, in the embodiment of the present invention, the heat dissipation medium groove 5 is in clearance fit with the heat dissipation medium 1. On the one hand, the assembly is convenient, and on the other hand, the region of the surface of the heat dissipation medium 1, which is not provided with the conductive part 4, is not in direct contact with the metal layer 21.
The invention firstly assembles the heat dissipation medium 1 in the heat dissipation medium groove 5, and then forms an integrated structure by the core plate 2, the core plate bonding sheet 3 and the heat dissipation medium 1 through hot pressing. In the hot pressing process, the core sheet adhesive sheet 3 flows into the gap between the heat dissipation medium groove 5 and the heat dissipation medium 1 and is adhesively connected to the region of the surface of the heat dissipation medium 1 where no conductive portion 4 is provided. After the core plate adhesive sheet 3 is cured, the core plate 2, the core plate adhesive sheet 3 and the heat dissipation medium 1 form an integral structure.
Referring to fig. 3 and 4, the plurality of grounding portions 211 may be disposed on different regions of the same metal layer 21, or may be disposed on different metal layers 21, which is not limited in the present invention.
The printed circuit board of the heat dissipation medium 1 provided by the invention has the advantages that the grounding part 211 is formed by exposing the position needing grounding on the metal layer 21 on the side wall of the heat dissipation medium groove 5, and the conductive part 4 is arranged on the partial area corresponding to the grounding part 211 on the surface of the heat dissipation medium groove 5, so that the metal layer 21 and the heat dissipation medium 1 are selectively and electrically connected. When the printed circuit board contains different network signal lines, some need to be electrically connected with the heat dissipation medium 1, and some need not to be electrically connected with the heat dissipation medium 1, the invention is suitable, so that the invention is beneficial to paving different network lines in the printed circuit board. In addition, the core plate 2 and the core plate adhesive sheet 3 are provided with the grooves, and the heat dissipation medium 1 is put into the grooves to realize grounding, so that a method of drilling and then metalizing holes is not needed, the preparation method is simple, and the environmental protection problem caused by using chemical liquid medicine can be avoided. Further, when the heat dissipation medium 1 is grounded, a larger contact area can exist between the heat dissipation medium 1 and the core board 2, so that grounding and signal shielding can be better realized.
Example two
The invention also provides a preparation method for preparing the printed circuit board containing the heat dissipation medium in the first embodiment, which comprises the following steps:
s1, providing a heat dissipation medium 1, a multi-layer core board 2 and at least one layer of core board adhesive sheet 3, wherein the core board 2 comprises a metal layer 21.
The core adhesive sheet 3 is a semi-cured adhesive sheet. The heat dissipation medium 1 is a metal block, preferably a copper block. The metal layer 21 is a copper foil.
S2, grooving the position of each core 2 where the heat-dissipating medium 1 needs to be embedded to form a core groove, and exposing at least one metal layer 21 on the groove wall of the core groove to form the grounding portion 211.
The grounding portion 211 is exposed from the wall of the core slot to ensure the electrical connection with the conductive portion 4.
S3, grooving the core sheet adhesive sheet 3 at the position where the heat-dissipating medium 1 needs to be embedded, to form a core sheet adhesive groove.
And S4, combining the multilayer core board 2 and at least one layer of core board adhesive sheet 3 according to the arrangement mode that the core board adhesive sheet 3 is arranged between two adjacent core boards 2, and combining the core board grooves and the core board adhesive grooves to form the heat dissipation medium grooves 5.
S5, the conductive portion 4 is provided on the surface of the heat radiating medium 1 in a partial region corresponding to the ground portion 211.
Specifically, a conductive adhesive is applied to a partial region of the surface of the heat dissipation medium 1 corresponding to the ground portion 211 to form the conductive portion 4. The conductive paste is preferably a liquid conductive paste.
S6, the heat dissipation medium 1 is placed in the heat dissipation medium slot 5, and the grounding portion 211 and the corresponding conductive portion 4 are in contact with each other to form an electrical connection.
The heat dissipation medium groove 5 and the heat dissipation medium 1 are in clearance fit, so that on one hand, assembly is facilitated, and on the other hand, the region of the surface of the heat dissipation medium 1, which is not provided with the conductive part 4, is not in direct contact with the metal layer 21.
And S7, carrying out hot pressing treatment on the heat dissipation medium 1, the multilayer core board 2 and at least one layer of core board adhesive sheet 3 together, and solidifying the core board adhesive sheet 3 to enable the heat dissipation medium 1, the multilayer core board 2 and the at least one layer of core board adhesive sheet 3 to form an integral structure, thereby obtaining the printed circuit board containing the heat dissipation medium.
In the hot pressing process, the core adhesive sheet 3 flows into the gap between the heat dissipation medium groove 5 and the heat dissipation medium 1 and is adhesively connected to the region of the surface of the heat dissipation medium 1 where no conductive portion 4 is provided. Thereby, the heat dissipation medium 1 is prevented from being in direct contact with the metal layer 21.
Further, after the core board 2, the core board adhesive sheet 3 and the heat dissipation medium 1 are formed into an integrated structure, post-processing, such as drilling processing, electroplating processing, outer layer circuit manufacturing processing, solder resist processing, surface processing and the like, may be performed on the integrated structure to obtain a finished printed circuit board.
The method for manufacturing a printed circuit board containing a heat dissipation medium according to this embodiment is based on the same inventive concept as the method for manufacturing a printed circuit board containing a heat dissipation medium according to the first embodiment, and the shape and structure of the heat dissipation medium 1 are the same as those of the first embodiment, and are not described herein again. The printed circuit board containing the heat dissipation medium obtained by the preparation method has the performance and effect of the printed circuit board containing the heat dissipation medium in the first embodiment.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A printed circuit board containing a heat dissipation medium is characterized by comprising a plurality of layers of core boards, wherein a core board adhesive sheet for adhering the core boards is arranged between two adjacent layers of core boards, a core board groove is formed in the position, needing to be embedded in the heat dissipation medium, on the core board adhesive sheet, a core board adhesive sheet groove is formed in the position needing to be embedded in the heat dissipation medium; the core plate groove and the core plate bonding sheet groove form a heat dissipation medium groove, and the heat dissipation medium is arranged in the heat dissipation medium groove;
each core plate comprises a metal layer, the multiple metal layers comprise at least one grounding part, and the grounding part is exposed out of the side wall of the heat dissipation medium groove; and a local area corresponding to the grounding part on the surface of the heat dissipation medium groove is provided with a conductive part, and the grounding part is in contact with the corresponding conductive part to form electrical connection.
2. The printed circuit board with heat dissipating medium of claim 1, wherein when the plurality of metal layers include a plurality of grounding portions, the plurality of grounding portions are disposed on different metal layers, or/and a plurality of grounding portions are disposed on one metal layer.
3. The printed circuit board containing a heat dissipating medium according to claim 1, wherein the heat dissipating medium is rectangular, cylindrical or stepped.
4. The printed circuit board containing a heat dissipating medium according to claim 3, wherein the stepped heat dissipating medium comprises a heat dissipating base and a heat dissipating protrusion fixedly connected to each other, a stepped surface is formed between the heat dissipating base and the heat dissipating protrusion, and the conductive portion is provided on at least one of the stepped surface, a side surface of the heat dissipating base, and a side surface of the heat dissipating protrusion.
5. The printed circuit board containing a heat dissipating medium of claim 1, wherein the conductive portion is a conductive paste applied to the heat dissipating medium.
6. The printed circuit board containing a heat dissipating medium as claimed in claim 1, wherein the core adhesive sheet is a semi-cured adhesive sheet, the heat dissipating medium is a metal block, and the metal layer is a copper foil.
7. The printed circuit board containing a heat dissipating medium of claim 1, wherein the heat dissipating medium groove and the heat dissipating medium groove are in a clearance fit.
8. A method for preparing a printed circuit board containing a heat dissipation medium is characterized by comprising the following steps:
providing a heat dissipation medium, a multi-layer core board and at least one layer of core board adhesive sheet, wherein the core board comprises a metal layer;
grooving the positions of the core plates, where the heat dissipation media need to be embedded, to form core plate grooves, wherein at least one metal layer is exposed out of the groove walls of the core plate grooves to form grounding parts;
grooving the position of the core plate bonding sheet where the heat dissipation medium needs to be embedded to form a core plate bonding groove;
combining a plurality of layers of the core plates and at least one layer of the core plate adhesive sheets according to the arrangement mode that the core plate adhesive sheets are arranged between two adjacent core plates, wherein the core plate grooves and the core plate adhesive grooves are combined to form radiating medium grooves;
a conductive part is arranged on a local area corresponding to the grounding part on the surface of the heat dissipation medium;
placing the heat dissipation medium in the heat dissipation medium groove, wherein the grounding part is in contact with the corresponding conductive part to form electrical connection;
and carrying out hot-pressing treatment on the heat dissipation medium, the multiple layers of the core plates and at least one layer of the core plate adhesive sheets together, and solidifying the core plate adhesive sheets to enable the heat dissipation medium, the multiple layers of the core plates and the at least one layer of the core plate adhesive sheets to form an integral structure, so that the printed circuit board containing the heat dissipation medium is obtained.
9. The method for manufacturing a printed circuit board containing a heat dissipating medium according to claim 8, wherein the steps of: the disposing of the conductive portion in the local area corresponding to the grounding portion on the surface of the heat dissipation medium specifically includes:
and coating conductive adhesive on a local area corresponding to the grounding part on the surface of the heat dissipation medium to form a conductive part.
10. The method for manufacturing a printed circuit board containing a heat-dissipating medium as claimed in claim 8, further comprising the steps of, after the heat-dissipating medium, the plurality of layers of the core boards and at least one layer of the core board adhesive sheet are collectively subjected to the thermocompression bonding:
and sequentially carrying out drilling treatment, electroplating treatment, outer layer circuit manufacturing treatment, resistance welding treatment and surface treatment on the heat dissipation medium, the plurality of layers of the core plates and at least one layer of the core plate adhesive sheets which form an integral structure.
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| CN201910983582.2A CN110708864B (en) | 2019-10-16 | 2019-10-16 | Printed circuit board containing heat dissipation medium and preparation method thereof |
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| CN201910983582.2A CN110708864B (en) | 2019-10-16 | 2019-10-16 | Printed circuit board containing heat dissipation medium and preparation method thereof |
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| CN110708864A true CN110708864A (en) | 2020-01-17 |
| CN110708864B CN110708864B (en) | 2021-06-25 |
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| CN110139462A (en) * | 2018-02-09 | 2019-08-16 | 深南电路股份有限公司 | A kind of printed circuit board and preparation method thereof and electronic device |
| CN209419982U (en) * | 2018-09-05 | 2019-09-20 | 深南电路股份有限公司 | Printed circuit board and electronic device |
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| CN110708864B (en) | 2021-06-25 |
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