JP2731493B2 - How to split the thermal printhead - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for manufacturing a thermal print head in which a heating resistor and a circuit pattern thereof are formed on a surface of a ceramic head substrate. The present invention relates to a method of dividing a thermal print head into individual thermal print heads.

[0002]

2. Description of the Related Art Generally, when manufacturing a thermal print head, for example, as described in Japanese Patent Publication No. 4-17796, and as shown in FIGS. The glaze layer A ₂ ′ made of gasla in each thermal head A ′ is provided on the surface of one ceramic material plate B ′ on which the substrate A ₁ ′ is integrated.
Is formed, a heating resistor A ₃ ′ and a circuit pattern A ₄ ′ are formed on the surface of the glaze layer A ₂ ′, and then a glass protective film A ₅ ′ covering these is formed. The material body B 'is divided for each thermal print head A' along a dividing line C 'between the thermal print heads A'.

When the ceramic material B 'is divided for each thermal print head A' along each dividing line C ', conventionally, as shown in FIG. A scribe groove D 'by a laser beam is engraved along each of the division lines C', and scribing is performed for each thermal print head A 'along the scribe line D', or as shown in FIG. The cutting is performed by cutting with a rotary dicing cutter E 'of a grinding wheel.

[0004]

However, as in the former case,
Of the division by scribe along the scribe groove D '
When scribe along scribe line D '
The gas formed on the surface of the ceramic material plate B '
Lath glaze layer A_Two'And the glaze layer A _Two′
Heating resistor A on the surface of_Three'And circuit pattern A_Four′
Protective film A made of glass_Five′,
8, chipping occurs as indicated by the two-dot chain lines F 'and F ".
Live.

Therefore, each thermal print head A '
, A dividing line C ′ between the two and a circuit pattern A
₄ between the 'and the heating resistor A _3', wherein the chipping provided margin of the circuit pattern A ₄ 'and the heating resistor A _3' so as not to reach the in variable become larger dimension L ' Therefore, the number of thermal print heads A 'is increased by the amount of the margins, in other words, the size of the thermal print heads A' is increased. ′ As shown by G ′ in FIG.
Since the chipping becomes jagged, the side face of each thermal print head A 'must be polished after the division, resulting in a problem that the cost is greatly increased.

[0006] Also, as in the latter, dicing of a grinding wheel
When dividing by cutting with the cutter E ',
Particle Size of Abrasive Particles in Stone Wheel Dicing Cutter E '
In accordance with the ceramic material plate B '.
In order to increase the cutting speed for sheet B '
In this case, each thermal preform of this ceramic material plate B '
Board A in printhead A '₁′ Formed on the surface
Glaze layer A_Two'And protective film A_Five′, Chipping
On the other hand, on the other hand, the dicing
The size of the abrasive particles in the
A_Two'And protective film A _Five′ According to the glaze layer
A_Two'And protective film A_Five′ To prevent chipping
The cutting speed for the ceramic material plate B '
The problem is that it slows down and leads to higher costs
was there.

An object of the present invention is to provide a dividing method which does not cause these problems.

[0008]

SUMMARY OF THE INVENTION In order to achieve this technical object, the present invention provides a thermal printing head, comprising a ceramic substrate on which a plurality of head substrates are integrated. Forming a body, a circuit pattern, and a protective film, and then dividing the ceramic material plate for each thermal print head along a dividing line between the thermal print heads. The scribe groove is engraved along each of the dividing lines, while the glaze layer and the protective film on the surface of the ceramic material plate are cut along the cutting lines by a rotary dicing cutter of a grinding wheel along the cutting lines. After engraving so as to extend, scribe the ceramic material plate along the scribe grooves. It was to be.

[0009]

[Work] By doing so, chipping occurs in the glaze layer and the protective film on the surface of the ceramic material plate by a dicing cutter of a grinding wheel having a fine abrasive particle size. Therefore, when the ceramic material substrate is scribed along the scribe grooves formed on the back side of the ceramic material substrate, the cut grooves can be formed on the glaze layer and the protective film. It is possible to reliably prevent or reduce the occurrence of chipping.

[0010]

As described above, according to the present invention, when the ceramic material plate is divided for each thermal print head, chipping of the glaze layer and the protective film can be reliably prevented or reduced. In each thermal print head, the margin provided around the circuit pattern and the heating resistor can be reduced, and the size and weight of the thermal print head can be reduced. The polishing finish on the side of the print head can be omitted.

Moreover, since the ceramic material can be quickly divided by scribing without cutting by a dicing cutter, the manufacturing cost of the thermal print head can be significantly reduced in combination with the above-mentioned elimination of polishing. It has the effect of being able to reduce.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
Will be described. In this figure, the symbol B is
Substrate A in the print head A ₁More than one
This shows an integrated ceramic material plate.
On the surface of the material plate B, the gas
Glaze layer A made of_TwoIs formed, and furthermore, this glaze layer
A_TwoHeating resistor A on the surface of_ThreeAnd circuit pattern A_FourThe shape
After formation, a glass protective film A covering these_FiveFormed
Have been.

Further, on the back surface of the ceramic material plate B,
Means that the scribe groove D by the laser beam is
Extending along the dividing line C between the printheads A
It is engraved as follows. And the ceramic material plate
Glaze layer A on the surface of B_TwoAnd protective film A _FiveTo
The cutting groove F by the rotary dicing cutter E of the stone wheel,
It is engraved so as to extend along each cutting line C.

In this case, by reducing the particle size of the abrasive particles in the dicing cutter E, chipping does not occur in the glaze layer A ₂ and the protective film A ₅ , or only fine chipping occurs. . When the cutting groove F is cut by the dicing cutter E, the dicing cutter E
And may be penetration to a depth reaching the surface of the ceramic material plate B, but as shown in FIG. 5, a dicing cutter E, as shown in FIG. 5, to the middle portion of the glaze layer A ₂ intrusion You may do it.

Then, the ceramic material plate B is moved along each of the scribe grooves D into each of the thermal print heads A.
Scribe every time, but in this case,
Glaze layer A _{2 on} the surface of the ceramic material plate B
And the protective film A _5, by cutting grooves F as described above is engraved in advance, when scribe along each scribe groove D, the glaze layer A ₂ and the protective film A ₅
Can prevent chipping from occurring, or
Chipping can be reduced.

That is, according to the present invention, it is possible to surely prevent or reduce the occurrence of chipping in the glaze layer A ₂ and the protective film A ₅ when the ceramic material plate B is divided for each thermal print head A. Therefore, the width L of the margin provided around the circuit pattern A ₃ and the heating resistor A ₄ in each thermal print head A can be reduced by this amount, and the side surface of each thermal print head A can be reduced. It can prevent jaggedness.

[Brief description of the drawings]

FIG. 1 is a perspective view of a ceramic material plate according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a cutting groove is cut in the ceramic substrate in FIG. 1;

FIG. 3 is an enlarged perspective view of FIG. 2;

FIG. 4 is a perspective view of a thermal print head according to an embodiment of the present invention.

FIG. 5 is a perspective view showing another embodiment of the present invention.

FIG. 6 is a perspective view of a conventional ceramic material plate.

FIG. 7 is a perspective view of a conventional thermal print head.

FIG. 8 is an enlarged perspective view showing an example of a conventional dividing method.

FIG. 9 is a perspective view showing another example of a conventional dividing method.

[Explanation of symbols]

Reference Signs List A Thermal print head A ₁ Head substrate A ₂ Glaze layer A ₃ Heating resistor A ₄ Circuit pattern A ₅ Protective film B Ceramic material plate C Dividing line D Scribing groove E Rotary dicing cutter F Cutting groove

Claims (1)

(57) [Claims] A glaze layer, a heating resistor, a circuit pattern, and a protective film of a thermal print head are formed on a surface of a ceramic material plate in which a plurality of head substrates of a thermal print head are integrated. When the board is divided for each thermal print head along a dividing line between the thermal print heads, a scribe groove is formed along the dividing line on the back surface side of the ceramic material plate. After forming a cutting groove by a rotary dicing cutter of a grinding wheel on the glaze layer and the protective film on the surface of the ceramic material plate so as to extend along the respective cutting lines, the ceramic material plate is scribed. A method for dividing a thermal print head, which comprises scribing along a groove.