JP2578140B2 - Manufacturing method of thermal head - Google Patents
Manufacturing method of thermal headInfo
- Publication number
- JP2578140B2 JP2578140B2 JP62291463A JP29146387A JP2578140B2 JP 2578140 B2 JP2578140 B2 JP 2578140B2 JP 62291463 A JP62291463 A JP 62291463A JP 29146387 A JP29146387 A JP 29146387A JP 2578140 B2 JP2578140 B2 JP 2578140B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- layer
- groove
- insulating substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】 (イ)産業上の利用分野 この発明は、ヘッドチップに端部切欠部を備えたサー
マルヘッドの製造方法に関する。The present invention relates to a method of manufacturing a thermal head having a head chip having an end notch.
(ロ)従来の技術 一般に、シリアルサーマルヘッドの場合、ヘッドチッ
プの端部形状が印字品質に大きく影響する。すなわち、
ウェハから個別のヘッドチップにブレイクした場合、端
部形状が非常に鋭く尖っており、その角先で、紙や転写
リボンを傷つける。従来のサーマルヘッドは、このよう
な不具合を避けるため、第3図に示すように、端部7に
切欠部8を設けている。ここに示すサーマルヘッドは、
セラミック基板1上に、グレーズ層2、発熱抵抗体層
3、リード導体層4及び保護膜層5を成膜し、個別のチ
ップ6にブレイクした後、端部7を研磨し、切欠部8を
形成し、鈍角にしている。(B) Conventional technology In general, in the case of a serial thermal head, the end shape of a head chip greatly affects print quality. That is,
In the case of a break from the wafer to individual head chips, the end shape is very sharp and sharp, with the corners damaging the paper or transfer ribbon. The conventional thermal head is provided with a notch 8 at the end 7 as shown in FIG. 3 in order to avoid such a problem. The thermal head shown here is
A glaze layer 2, a heating resistor layer 3, a lead conductor layer 4 and a protective film layer 5 are formed on a ceramic substrate 1, and after breaking into individual chips 6, the ends 7 are polished and the cutouts 8 are formed. Formed and obtuse.
(ハ)発明が解決しようとする問題点 上記従来のサーマルヘッドでは、端部7の切欠部8を
研磨により形成するものであるから、ヘッドチップ6の
端部7の水平面と研磨斜面の接面部Aがなお鋭く、この
部分で紙や転写リボンに傷がつき、印字品質を落とすと
いう問題点が残されていた。(C) Problems to be Solved by the Invention In the above-mentioned conventional thermal head, since the notch 8 at the end 7 is formed by polishing, the contact surface between the horizontal plane of the end 7 of the head chip 6 and the polished slope is used. A was still sharp, and the paper and the transfer ribbon were damaged at this portion, and the problem that the print quality deteriorated remained.
この発明は、上記問題点に着目し、端部における鋭角
部分を少なく、より印字品質を向上し得るサーマルヘッ
ドの製造方法を提供することを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a thermal head which focuses on the above-described problems and has a small number of acute-angled portions at an end portion and can further improve print quality.
(ニ)問題点を解決するための手段及び作用 この発明のサーマルヘッドの製造方法は、個別のサー
マルヘッドを多数個取りする大きさの絶縁基板を形成し
た後、当該絶縁基板表面の各サーマルヘッド領域間の境
界部に切断刃により溝を形成し、この溝を位置決め基準
としてグレーズ層を形成し、絶縁基板の表面及び溝上に
発熱抵抗体層、リード導体層、保護膜層等からなる成膜
部を設け、その後に溝からブレイクして個別のサーマル
ヘッドに分割することを特徴とする。(D) Means and action for solving the problems The method of manufacturing a thermal head according to the present invention is to form an insulating substrate large enough to take a number of individual thermal heads, and then to form each thermal head on the surface of the insulating substrate. A groove is formed by a cutting blade at the boundary between the regions, a glaze layer is formed using the groove as a positioning reference, and a film including a heating resistor layer, a lead conductor layer, a protective film layer, etc. is formed on the surface of the insulating substrate and on the groove. The method is characterized in that a portion is provided, and thereafter, a break is made from the groove and divided into individual thermal heads.
この製造方法によると、絶縁基板に形成した溝によ
り、予め絶縁基板の端部に、切欠切断面が形成されて、
この絶縁基板上の水平部と端部切断面上に発熱抵抗体
層、リード導体層及び保護膜等の成膜部が形成されるも
のであるから、個々に分割されたサーマルヘッド(ヘッ
ドチップ)の水平面と端部切断面の接面部が滑らかとな
り、紙や転写リボンが、この接面部で傷つくということ
が軽減される。According to this manufacturing method, a notch cut surface is formed in advance at an end of the insulating substrate by the groove formed in the insulating substrate,
Since a film forming portion such as a heating resistor layer, a lead conductor layer, and a protective film is formed on a horizontal portion and an end cut surface on the insulating substrate, the thermal head (head chip) is divided into individual portions. In this case, the contact surface between the horizontal plane and the cut end surface is smoothed, so that the paper and the transfer ribbon are less likely to be damaged by the contact surface.
(ホ)実施例 以下実施例により、この発明をさらに詳細に説明す
る。(E) Examples The present invention will be described in more detail with reference to the following examples.
第1図は、この発明の一実施例を示すサーマルヘッド
チップの部分断面図である。この実施例サーマルヘッド
チップ16は、セラミック(絶縁)基板11の端部17に、斜
面11aを形成する態様で、切断切欠部18を設け、さらに
セラミック基板11の水平面11bと斜面(端部切断面)11a
との接面線Bから、所定距離Lの位置の水平面11b上
に、グレーズ層12を形成し、セラミック基板11とグレー
ズ層12上に、発熱抵抗体層13、リード導体層14、14及び
保護膜層15を積層形成している。もちろん、セラミック
基板11の斜面11a上にも、発熱抵抗体層13、リード導体
層14及び保護膜層15が成膜されている。このサーマルヘ
ッドチップ16において、リード導体層14、14が形成され
ない部分が印字ドット部19となり、シリアル型サーマル
ヘッドでは、この印字ドット部19が図紙面の表裏方向に
複数個並設されている。FIG. 1 is a partial sectional view of a thermal head chip showing one embodiment of the present invention. In this embodiment, the thermal head chip 16 is provided with a cutting notch 18 in the form of forming an inclined surface 11a at an end portion 17 of a ceramic (insulating) substrate 11, and furthermore, a horizontal surface 11b of the ceramic substrate 11 and an inclined surface (end cutting surface). ) 11a
A glaze layer 12 is formed on a horizontal plane 11b at a position of a predetermined distance L from a contact line B with the heat generating resistor layer 13, the lead conductor layers 14, 14 and the protection layer on the ceramic substrate 11 and the glaze layer 12. The film layer 15 is formed by lamination. Of course, the heating resistor layer 13, the lead conductor layer 14, and the protective film layer 15 are also formed on the slope 11a of the ceramic substrate 11. In the thermal head chip 16, portions where the lead conductor layers 14 and 14 are not formed become print dot portions 19, and in a serial type thermal head, a plurality of the print dot portions 19 are arranged side by side in the front and back directions of the drawing.
このサーマルヘッドチップ16では、切断切欠部18が研
磨により形成されるものではなく、セラミック基板11の
端部17の切断により、予め斜面11aが形成され、そのセ
ラミック基板11の水平面11b及び斜面11a上に、発熱抵抗
体層13、リード導体層14及び保護膜層15が形成されるも
のであるから、成膜後の斜面と水平面の接面線Aは非常
に滑らかになり、この接面線Aで、紙や転写リボン傷が
つくことは、ほとんどなくなる。In the thermal head chip 16, the cutting notch 18 is not formed by polishing, but a slope 11 a is formed in advance by cutting the end portion 17 of the ceramic substrate 11, and is formed on the horizontal surface 11 b and the slope 11 a of the ceramic substrate 11. In addition, since the heating resistor layer 13, the lead conductor layer 14, and the protective film layer 15 are formed, the contact line A between the inclined surface and the horizontal surface after film formation becomes very smooth. Thus, scratches on the paper and the transfer ribbon are almost eliminated.
次に、この実施例サーマルヘッドチップの製造方法に
ついて説明する。Next, a method of manufacturing the thermal head chip of this embodiment will be described.
先ず、第2図(A)に示すように、個別のチップに分
割前のセラミック基板11の表面の、個別のチップに区分
する境界部に切断刃により、V字溝20を入れる。この溝
U字溝等であってもよい。First, as shown in FIG. 2 (A), a V-shaped groove 20 is formed by a cutting blade at the boundary of the surface of the ceramic substrate 11 before being divided into individual chips, which is divided into individual chips. The groove may be a U-shaped groove or the like.
次に、V字溝20の斜面11aとセラミック基板11の水平
面11bとの接触線Bより、所定距離Lに、V字溝20に平
行して、グレーズ層12を形成する。Next, the glaze layer 12 is formed at a predetermined distance L from the contact line B between the inclined surface 11a of the V-shaped groove 20 and the horizontal surface 11b of the ceramic substrate 11 in parallel with the V-shaped groove 20.
その後、セラミック基板11を個別のチップに分割しな
い状態で、第2図(B)に示すように、セラミック基板
11の上表面に、発熱抵抗体層13、リード導体層14及び保
護膜層15を成膜する。そして成膜後に、第2図(C)に
示すように、V字溝20の底部頂点でブレイクし、個別の
サーマルヘッドチップ16を得る。Thereafter, in a state where the ceramic substrate 11 is not divided into individual chips, as shown in FIG.
On the upper surface of 11, a heating resistor layer 13, a lead conductor layer 14, and a protective film layer 15 are formed. Then, after film formation, as shown in FIG. 2C, a break is made at the bottom apex of the V-shaped groove 20 to obtain an individual thermal head chip 16.
この製造方法では、切断刃により、セラミック基板に
V字溝を形成し、その上から発熱抵抗体層、リード導体
層及び保護膜層を成膜するものであるから、得られたサ
ーマルヘッドチップの端部は研磨処理を行わないで、切
欠斜面部が形成でき、第1図の接面線Aが滑らかとな
り、印字の際に、紙や転写リボンを傷つけることがなく
なる。In this manufacturing method, a V-shaped groove is formed in a ceramic substrate by a cutting blade, and a heating resistor layer, a lead conductor layer, and a protective film layer are formed thereon. A notched slope can be formed at the end without polishing, and the contact line A in FIG. 1 becomes smooth, so that the paper and the transfer ribbon are not damaged during printing.
また、この製造方法では、切断刃を用いて、V字溝を
形成するので、先端が鋭い切断刃を使用することによ
り、端部切欠部の斜面部の角度を大きく、かつ一定にと
ることができる。Further, in this manufacturing method, since the V-shaped groove is formed using the cutting blade, the angle of the slope of the end notch can be made large and constant by using the cutting blade having a sharp tip. it can.
さらに、切断刃を用いて、V字溝を形成するので、セ
ラミック基板の水平部と斜面部の接面線が明確となり、
この接面線を基準にグレーズ層の位置決めが出来るの
で、端部からグレーズ層までの距離を極力小さく、かつ
精度よく一定とするのに好都合である。Furthermore, since the V-shaped groove is formed by using the cutting blade, the contact line between the horizontal portion and the slope portion of the ceramic substrate becomes clear,
Since the glaze layer can be positioned based on this tangent line, it is convenient to keep the distance from the end to the glaze layer as small as possible and to keep it constant with high accuracy.
(ヘ)発明の効果 この発明によれば、絶縁基板形成後に当該絶縁基板表
面に溝を形成し、次いで溝を位置決め基準としてグレー
ズ層を形成し、更に絶縁基板の表面及び溝に発熱抵抗体
層、リード導体層、保護膜層等からなる成膜部を設け、
その後に溝からブレイクするものであるから、絶縁基板
表面の水平面と溝の傾斜面との接面が滑らかであり、プ
リント時に接面の角部で紙面や転写リボンを傷付けるこ
とが軽減され、印字品質が向上する。According to the present invention, a groove is formed on the surface of the insulating substrate after the formation of the insulating substrate, a glaze layer is formed using the groove as a positioning reference, and a heating resistor layer is formed on the surface and the groove of the insulating substrate. , A lead conductor layer, a film forming section composed of a protective film layer and the like are provided,
After that, the groove breaks, so the contact surface between the horizontal surface of the insulating substrate surface and the inclined surface of the groove is smooth, and it is less likely to damage the paper surface and the transfer ribbon at the corners of the contact surface during printing, and printing Quality is improved.
又、個別のサーマルヘッドに分割する前の絶縁基板表
面の各ヘッド領域間の境界部に切断刃により形成した溝
でブレイクすることにより、端部切欠部を形成している
ので、研磨処理を行わなくても端部切欠部の斜面部にバ
リが生じず、滑らかな切欠斜面部を形成できるだけでな
く、先鋭の切断刃を使用することで、端部切欠部の斜面
部の角度を大きく且つ一定にすることができる。In addition, since a notch at the end is formed by breaking with a groove formed by a cutting blade at a boundary portion between each head region on the surface of the insulating substrate before being divided into individual thermal heads, a polishing process is performed. Even without it, burrs do not occur on the slope of the end notch, and not only can a smooth notch be formed, but also by using a sharp cutting blade, the angle of the slope of the end notch is large and constant. Can be
更に、切断刃を用いるので、絶縁基板の水平面と溝の
傾斜面との接面線が明確となり、この接面線をグレーズ
層の形成時に位置決め基準として利用でき、絶縁基板端
部からグレーズ層までの距離を極力短く且つ精度良く一
定とすることができる。Furthermore, since a cutting blade is used, the contact surface between the horizontal surface of the insulating substrate and the inclined surface of the groove becomes clear, and this contact surface can be used as a positioning reference when forming the glaze layer, from the end of the insulating substrate to the glaze layer. Can be kept as short as possible and accurately.
【図面の簡単な説明】 第1図は、この発明の一実施例を示すサーマルヘッドチ
ップの要部の断面図、第2図(A)、第2図(B)及び
第2図(C)は、同サーマルヘッドチップの製造方法を
説明するための図、第3図は、従来のサーマルヘッドチ
ップの要部の断面図である。 11:セラミック基板、12:グレーズ層、13:発熱抵抗体
層、14:リード導体層、15:保護膜層、16:サーマルヘッ
ドチップ、17:端部、18:切断切欠部。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a main part of a thermal head chip showing an embodiment of the present invention, and FIGS. 2 (A), 2 (B) and 2 (C). Is a view for explaining a method of manufacturing the thermal head chip, and FIG. 3 is a sectional view of a main part of the conventional thermal head chip. 11: ceramic substrate, 12: glaze layer, 13: heating resistor layer, 14: lead conductor layer, 15: protective film layer, 16: thermal head chip, 17: end portion, 18: cutting notch.
Claims (1)
きさの絶縁基板を形成した後、当該絶縁基板表面の各サ
ーマルヘッド領域間の境界部に切断刃により溝を形成
し、この溝を位置決め基準としてグレーズ層を形成し、
絶縁基板の表面及び溝上に発熱抵抗体層、リード導体
層、保護膜層等からなる成膜部を設け、その後に溝から
ブレイクして個別のサーマルヘッドに分割することを特
徴とするサーマルヘッドの製造方法。After forming an insulating substrate large enough to take a number of individual thermal heads, a groove is formed at a boundary portion between the thermal head regions on the surface of the insulating substrate by a cutting blade, and the groove is positioned. Form a glaze layer as a reference,
A thermal head is characterized in that a film forming portion including a heating resistor layer, a lead conductor layer, a protective film layer, and the like is provided on the surface of the insulating substrate and on the groove, and thereafter, the film is broken from the groove and divided into individual thermal heads. Production method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62291463A JP2578140B2 (en) | 1987-11-18 | 1987-11-18 | Manufacturing method of thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62291463A JP2578140B2 (en) | 1987-11-18 | 1987-11-18 | Manufacturing method of thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01130958A JPH01130958A (en) | 1989-05-23 |
JP2578140B2 true JP2578140B2 (en) | 1997-02-05 |
Family
ID=17769199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62291463A Expired - Lifetime JP2578140B2 (en) | 1987-11-18 | 1987-11-18 | Manufacturing method of thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2578140B2 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS607989A (en) * | 1983-06-27 | 1985-01-16 | Kurita Water Ind Ltd | Production apparatus for extremely pure water |
JPS61125452U (en) * | 1985-01-25 | 1986-08-07 | ||
JPS61255810A (en) * | 1985-05-09 | 1986-11-13 | 松下電器産業株式会社 | Method of working sheet-shaped molded shape |
JP2586008B2 (en) * | 1985-11-09 | 1997-02-26 | 三菱電機株式会社 | Manufacturing method of thermal head |
-
1987
- 1987-11-18 JP JP62291463A patent/JP2578140B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01130958A (en) | 1989-05-23 |
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