JP2727645B2 - Chip-shaped solid electrolytic capacitor - Google Patents
Chip-shaped solid electrolytic capacitorInfo
- Publication number
- JP2727645B2 JP2727645B2 JP1109379A JP10937989A JP2727645B2 JP 2727645 B2 JP2727645 B2 JP 2727645B2 JP 1109379 A JP1109379 A JP 1109379A JP 10937989 A JP10937989 A JP 10937989A JP 2727645 B2 JP2727645 B2 JP 2727645B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- cathode
- lead wire
- layer
- anode lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はチップ状固体電解コンデンサに関するもので
ある。Description: TECHNICAL FIELD The present invention relates to a chip-shaped solid electrolytic capacitor.
従来の技術 従来の固体電解コンデンサは第３図に示すように、陽
極導出線１を具備するタンタル金属からなる多孔質体の
表面に陽極酸化により誘電体酸化皮膜を形成し、そして
この表面に二酸化マンガンなどの電解質層を形成し、さ
らにカーボン層、陰極層２を順次形成してコンデンサ素
子３を構成し、続いてコンデンサ素子３の陽極導出線１
に外部陽極端子４を溶接により接続するとともに、コン
デンサ素子３の陰極層２に外部陰極端子５を半田または
導電性接着剤６により接続し、続いて両端子4,5が両端
側面より引き出されるようにトランスファーモールド方
式による樹脂外装７を施し、そして両端子4,5を側面に
沿って下方へ折曲げ、更に底面において内側に向かって
折曲げることにより構成していた。2. Description of the Related Art As shown in FIG. 3, a conventional solid electrolytic capacitor forms a dielectric oxide film on the surface of a porous body made of tantalum metal having an anode lead wire 1 by anodic oxidation, and forms a dioxide on the surface. An electrolyte layer such as manganese is formed, a carbon layer and a cathode layer 2 are sequentially formed to form a capacitor element 3, and then an anode lead 1 of the capacitor element 3 is formed.
And the external anode terminal 4 is connected by welding, and the external cathode terminal 5 is connected to the cathode layer 2 of the capacitor element 3 by solder or conductive adhesive 6, and then both terminals 4, 5 are pulled out from both side surfaces. In this case, a resin exterior 7 is provided by a transfer molding method, and both terminals 4 and 5 are bent downward along the side surface and further bent inward at the bottom surface.
発明が解決しようとする課題 しかしながら、このように構成されたチップ状固体電
解コンデンサでは、さらに小型のものを製造するために
はスペースに制約があるため、溶接作業が非常に難しく
なり、その結果、絶対寸法の小さい小型のものを歩留り
良く、かつ生産性良く、安価に生産することは難しかっ
た。また特に溶接のときは、物理的、熱的ストレスがコ
ンデンサ素子に加わるため、コンデンサ素子の漏れ電流
特性は悪化して歩留りを低下させるという問題点を有し
ていた。Problems to be Solved by the Invention However, in the chip-shaped solid electrolytic capacitor configured as described above, since the space is limited in order to manufacture a smaller one, the welding operation becomes very difficult, and as a result, It has been difficult to produce small products having small absolute dimensions with good yield, high productivity, and low cost. In particular, during welding, physical and thermal stresses are applied to the capacitor element, so that the leakage current characteristics of the capacitor element are deteriorated and the yield is reduced.
本発明はこのような問題点を解決するもので、容易に
生産することができ、かつ陽極導出線および陰極引出金
属と金属層端子との接続強度をさらに強固にすることが
できるチップ状固体電解コンデンサを提供することを目
的とする。The present invention solves such a problem, and can be easily produced, and can further increase the connection strength between the anode lead wire and the cathode lead metal and the metal layer terminal. It is intended to provide a capacitor.
課題を解決するための手段 上記目的を達成するために本発明のチップ状固体電解
コンデンサは、陽極導出線を具備する弁作用金属からな
る多孔質体の表面に誘電体酸化皮膜、電解質層、カーボ
ン層、陰極層を順次形成してコンデンサ素子を構成し、
このコンデンサ素子に陰極引出金属を接続するととも
に、陽極導出線および陰極引出金属が両端に引き出され
るようにトランスファーモールドにより樹脂外装を施
し、かつ露出した陽極導出線および陰極引出金属の周囲
の一部を除去して凹部を設けて陽極導出線および陰極引
出金属の露出面を多くし、さらに陽極導出線および陰極
引出金属とその樹脂外装の両端部に金属層端子を形成し
たものである。Means for Solving the Problems In order to achieve the above object, a chip-shaped solid electrolytic capacitor of the present invention comprises a porous body made of a valve metal having an anode lead wire, a dielectric oxide film, an electrolyte layer, Layer and the cathode layer are sequentially formed to form a capacitor element,
Connect the cathode lead metal to this capacitor element, apply a resin sheath by transfer molding so that the anode lead wire and the cathode lead metal are pulled out to both ends, and partially expose the exposed anode lead wire and the cathode lead metal. By removing and providing a concave portion, the exposed surfaces of the anode lead wire and the cathode lead metal are increased, and metal layer terminals are formed at both ends of the anode lead wire and the cathode lead metal and the resin sheath.
作用 上記した構成とすることにより、従来のように狭いス
ペースで溶接を行う必要がないため、その生産が非常に
容易となる。またコンデンサ素子の占めるスペースも高
めて体積効率を上げることができ、しかも従来のような
溶接工程が不要となるため、コンデンサ素子にストレス
が加わることはなくなり、これにより、歩留りの良い高
品質のものが得られる。Operation With the above-described configuration, there is no need to perform welding in a narrow space as in the related art, and therefore, the production thereof becomes very easy. In addition, the space occupied by the capacitor element can be increased to increase the volumetric efficiency, and the conventional welding process is not required, so that stress is not applied to the capacitor element, thereby providing a high quality product with a good yield. Is obtained.
そしてまた樹脂外装にトランスファーモールド方式を
採用することにより寸法精度のよい外形が得られるた
め、品位の高い金属層端子を形成することができる。In addition, since the outer shape with high dimensional accuracy can be obtained by employing the transfer molding method for the resin exterior, a high-quality metal layer terminal can be formed.
さらに前記樹脂外装は陽極導出線および陰極引出金属
が両端に引き出されるようにトランスファーモールドに
より施しているが、この樹脂外装を施した後、露出した
陽極導出線および陰極引出金属の周囲の一部を除去して
凹部を設けて陽極導出線および陰極引出金属の露出面を
多くし、そしてこの陽極導出線および陰極引出金属とそ
の樹脂外装の両端部に金属層端子を形成するようにして
いるため、陽極導出線および陰極引出金属と金属層端子
との接続強度もさらに強固にすることができるものであ
る。Further, the resin exterior is applied by transfer molding so that the anode lead wire and the cathode lead metal are drawn to both ends.After applying the resin exterior, a part of the periphery of the exposed anode lead wire and the cathode lead metal is exposed. To remove and provide a concave portion to increase the exposed surface of the anode lead wire and the cathode lead metal, and to form metal layer terminals at both ends of the anode lead wire and the cathode lead metal and its resin exterior, The connection strength between the anode lead wire and the cathode lead metal and the metal layer terminal can be further increased.
実施例 以下、本発明の実施例について図面を参照しながら説
明する。第１図は本発明におけるチップ状固体電解コン
デンサの一実施例を示したものである。Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of a chip-shaped solid electrolytic capacitor according to the present invention.
タンタル金属からなり、かつ陽極導出線11を具備する
幅0.8mm×高さ0.8mm×長さ1.2mmのタンタル多孔質体の
表面に一般的な陽極酸化方法により誘電体酸化皮膜を形
成した後、電解質層、カーボン層、銀塗料からなる陰極
層12を順次形成して4V1.5μＦのコンデンサ素子13を構
成した。そしてこのコンデンサ素子13の銀塗料からなる
陰極層12には厚さ0.08mmのニッケル板からなる陰極引出
金属14を導電性接着剤15で接続し、続いて陽極導出線11
および陰極引出金属14が両端に引き出されるように金型
にセットし、トランスファーモールド方式により樹脂外
装16を施して幅1.25mm×高さ1.25mm×長さ2.5の外装品
を得た。After forming a dielectric oxide film by a general anodic oxidation method on the surface of a tantalum porous body made of tantalum metal, and having a width 0.8 mm × height 0.8 mm × length 1.2 mm provided with the anode lead wire 11, An electrolytic layer, a carbon layer, and a cathode layer 12 composed of silver paint were sequentially formed to form a capacitor element 13 of 4V1.5 μF. A cathode lead metal 14 made of a nickel plate having a thickness of 0.08 mm is connected to the cathode layer 12 made of silver paint of the capacitor element 13 with a conductive adhesive 15, and then the anode lead wire 11 is connected.
Then, the cathode extraction metal 14 was set in a mold so as to be pulled out to both ends, and a resin exterior 16 was applied by a transfer molding method to obtain an exterior product having a width of 1.25 mm, a height of 1.25 mm and a length of 2.5.
次に露出した陽極導出線11および陰極引出金属14と次
の工程で形成する金属層端子との接続強度をさらに強固
にするために、陽極導出線11および陰極引出金属14の露
出部の面積をさらに大きくする工夫を行った。すなわ
ち、樹脂外装16を施した後、露出した陽極導出線11およ
び陰極引出金属14の周囲にレーザ光線を照射して樹脂の
みを気化させることにより、樹脂外装16の一部を除去し
て凹部17を形成した。この局部的な樹脂の気化は一般的
なYAGレーザを照射することにより容易に行うことがで
きる。Next, in order to further strengthen the connection strength between the exposed anode lead wire 11 and the cathode lead metal 14 and the metal layer terminal formed in the next step, the area of the exposed part of the anode lead wire 11 and the cathode lead metal 14 is reduced. We worked on making it even larger. That is, after applying the resin sheath 16, a portion of the resin sheath 16 is removed by irradiating a laser beam around the exposed anode lead wire 11 and the cathode extraction metal 14 to vaporize only the resin, thereby removing the recess 17. Was formed. This local vaporization of the resin can be easily performed by irradiating a general YAG laser.
そしてこの樹脂外装16より突出した陽極導出線11およ
び陰極引出金属14は切断した。次に露出した陽極導出線
11および陰極引出金属14とその樹脂外装16の両端部に金
属層端子18を形成するために、塩化パラジウム溶液に樹
脂外装16の両端部を順次浸漬してパラジウムの核18aを
表面に形成した後、ニッケル無電解めっき液に浸漬して
ニッケルめっき層18bを形成した。さらにそのニッケル
めっき層18bを補強する目的と、はんだ付け性を確保す
るために、さらにその表面にはんだ層18cを形成した。
そしてこれらのパラジウムの核18aとニッケルめっき層1
8bおよびはんだ層18cは、チップ状固体電解コンデンサ
の外部端子となる金属層端子18を構成するものである。Then, the anode lead wire 11 and the cathode lead metal 14 protruding from the resin sheath 16 were cut. Next exposed anode lead wire
After forming the palladium nucleus 18a on the surface by sequentially immersing both ends of the resin sheath 16 in a palladium chloride solution to form metal layer terminals 18 on both ends of the metal sheath 11 and the cathode extraction metal 14 and the resin sheath 16 Then, it was immersed in a nickel electroless plating solution to form a nickel plating layer 18b. Further, in order to reinforce the nickel plating layer 18b and secure solderability, a solder layer 18c was further formed on the surface thereof.
And these palladium nucleus 18a and nickel plating layer 1
8b and the solder layer 18c constitute a metal layer terminal 18 which is an external terminal of the chip-shaped solid electrolytic capacitor.
この金属層端子18はその他の金属めっきでもよく、ま
た金属溶射によっても形成することができる。そしてこ
の金属溶射層は銅、亜鉛、黄銅などの金属をアーク溶射
法、プラズマ溶射法などの方法で形成することができ
る。The metal layer terminal 18 may be formed by other metal plating or may be formed by metal spraying. The metal sprayed layer can be formed of a metal such as copper, zinc, or brass by a method such as an arc spraying method or a plasma spraying method.
第２図は本発明の他の実施例を示したもので、この第
２図は陰極引出金属14を陽極導出線11と同一水平面より
引き出した構造で、その他の構造は第１図Ａとほぼ同一
の構造となっているものである。FIG. 2 shows another embodiment of the present invention. FIG. 2 shows a structure in which the cathode lead metal 14 is drawn from the same horizontal plane as the anode lead wire 11, and other structures are almost the same as those in FIG. 1A. They have the same structure.
発明の効果 以上のように本発明の構成によれば、従来のように狭
いスペースで溶接を行う必要がないため、その生産が非
常に容易となる。またコンデンサ素子の占めるスペース
も高めて体積効率を上げることができ、しかも従来のよ
うな溶接工程が不要となるため、コンデンサ素子にスト
レスが加わることはなくなり、これにより、歩留りの良
い高品質のものが得られる。Effect of the Invention As described above, according to the configuration of the present invention, it is not necessary to perform welding in a narrow space as in the related art, so that the production thereof becomes very easy. In addition, the space occupied by the capacitor element can be increased to increase the volumetric efficiency, and the conventional welding process is not required, so that stress is not applied to the capacitor element, thereby providing a high quality product with a good yield. Is obtained.
そしてまた樹脂外装にトランスファーモールド方式を
採用することにより寸法精度のよい外形が得られるた
め、品位の高い金属層端子を形成することができる。In addition, since the outer shape with high dimensional accuracy can be obtained by employing the transfer molding method for the resin exterior, a high-quality metal layer terminal can be formed.
さらに前記樹脂外装は陽極導出線および陰極引出金属
が両端に引き出されるようにトランスファーモールドに
より施しているが、この樹脂外装を施した後、露出した
陽極導出線および陰極引出金属の周囲の一部を除去して
凹部を設けて陽極導出線および陰極引出金属の露出面を
多くし、そしてこの陽極導出線および陰極引出金属とそ
の樹脂外装の両端部に金属層端子を形成するようにして
いるため、陽極導出線および陰極引出金属と金属層端子
との接続強度もさらに強固にすることができるものであ
る。Further, the resin exterior is applied by transfer molding so that the anode lead wire and the cathode lead metal are drawn to both ends.After applying the resin exterior, a part of the periphery of the exposed anode lead wire and the cathode lead metal is exposed. To remove and provide a concave portion to increase the exposed surface of the anode lead wire and the cathode lead metal, and to form metal layer terminals at both ends of the anode lead wire and the cathode lead metal and its resin exterior, The connection strength between the anode lead wire and the cathode lead metal and the metal layer terminal can be further increased.
第１図A,B,Cは本発明の一実施例によるチップ状固体電
解コンデンサの断面図、要部拡大図および斜視図、第２
図は本発明の他の実施例を示す断面図、第３図は従来の
チップ状固体電解コンデンサの断面図である。 11……陽極導出線、12……陰極層、13……コンデンサ素
子、14……陰極引出金属、16……樹脂外装、17……凹
部、18……金属層端子。1A, 1B, and 1C are a cross-sectional view, a main part enlarged view, and a perspective view of a chip-shaped solid electrolytic capacitor according to an embodiment of the present invention.
FIG. 3 is a sectional view showing another embodiment of the present invention, and FIG. 3 is a sectional view of a conventional chip-shaped solid electrolytic capacitor. 11 ... Anode lead wire, 12 ... Cathode layer, 13 ... Capacitor element, 14 ... Cathode extraction metal, 16 ... Resin sheath, 17 ... Recess, 18 ... Metal layer terminal.
Claims (4)
多孔質体の表面に誘電体酸化皮膜、電解質層、カーボン
層、陰極層を順次形成してコンデンサ素子を構成し、こ
のコンデンサ素子に陰極引出金属を接続するとともに、
陽極導出線および陰極引出金属が両端に引き出されるよ
うにトランスファーモールドにより樹脂外装を施し、か
つ露出した陽極導出線および陰極引出金属の周囲の一部
を除去して凹部を設けて陽極導出線および陰極引出金属
の露出面を多くし、さらに陽極導出線および陰極引出金
属とその樹脂外装の両端部に金属層端子を形成したチッ
プ状固体電解コンデンサ。A capacitor element is formed by sequentially forming a dielectric oxide film, an electrolyte layer, a carbon layer, and a cathode layer on the surface of a porous body comprising a valve action metal having an anode lead wire. Connect the cathode extraction metal,
The anode lead wire and the cathode lead metal are drawn out to both ends by resin molding by transfer molding, and a part of the periphery of the exposed anode lead wire and the cathode lead metal is removed to form a concave portion to provide the anode lead wire and the cathode. A chip-shaped solid electrolytic capacitor having a large number of exposed metal exposed surfaces and metal layer terminals formed at both ends of an anode lead wire, a cathode extracted metal, and a resin sheath thereof.
徴とする請求項１記載のチップ状固体電解コンデンサ。2. The chip-shaped solid electrolytic capacitor according to claim 1, wherein the recess is formed by a laser beam.
する請求項１記載のチップ状固体電解コンデンサ。3. The solid electrolytic capacitor according to claim 1, wherein the metal layer terminal is a plating layer.
する請求項１記載のチップ状固体電解コンデンサ。4. The solid electrolytic capacitor according to claim 1, wherein the metal layer terminals are metal sprayed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109379A JP2727645B2 (en) | 1989-04-28 | 1989-04-28 | Chip-shaped solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109379A JP2727645B2 (en) | 1989-04-28 | 1989-04-28 | Chip-shaped solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02288321A JPH02288321A (en) | 1990-11-28 |
| JP2727645B2 true JP2727645B2 (en) | 1998-03-11 |
Family
ID=14508753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1109379A Expired - Fee Related JP2727645B2 (en) | 1989-04-28 | 1989-04-28 | Chip-shaped solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2727645B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020026673A (en) * | 2000-10-02 | 2002-04-12 | 전형구 | Method making terminal of conformal type tantal chip condenser |
| WO2021038901A1 (en) * | 2019-08-26 | 2021-03-04 | 株式会社村田製作所 | Electrolytic capacitor and manufacturing method of electrolytic capacitor |
| WO2021038900A1 (en) * | 2019-08-26 | 2021-03-04 | 株式会社村田製作所 | Electrolytic capacitor |
-
1989
- 1989-04-28 JP JP1109379A patent/JP2727645B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02288321A (en) | 1990-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4010447B2 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| TWI412048B (en) | Solid electrolytic capacitor and its manufacturing method | |
| JP2004103981A (en) | Method for manufacturing solid electrolytic capacitor and solid electrolytic capacitor manufactured by this method | |
| US4097985A (en) | Method of manufacturing a solid electrolyte capacitor | |
| US4907130A (en) | Method for the fabrication of aluminium electrolytic capacitors, and capacitor with integrated anode obtained thereby | |
| US20060126273A1 (en) | Solid electrolytic capacitor with face-down terminals, manufacturing method of the same, and lead frame for use therein | |
| JP2727645B2 (en) | Chip-shaped solid electrolytic capacitor | |
| JP3463692B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JPH11251189A (en) | Manufacture of capacitor element in solid-state electrolytic capacitor | |
| JP2010123728A (en) | Solid electrolytic capacitor | |
| JP3294362B2 (en) | Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor | |
| JPH02256221A (en) | Manufacture of chip-type solid state electrolytic capacitor | |
| JP3378285B2 (en) | Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor | |
| JPH02256222A (en) | Manufacture of chip-type solid state electrolyte capacitor | |
| JP3104246B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JPH07106204A (en) | Solid electrolytic capacitor | |
| JP4307439B2 (en) | Manufacturing method of solid electrolytic capacitor | |
| JPH01109711A (en) | Composite chip-type solid electrolytic capacitor | |
| JP3294361B2 (en) | Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor | |
| JP3185405B2 (en) | Solid electrolytic capacitors | |
| JP3894316B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JPH09102442A (en) | Manufacture of nonpolar solid-state electrolytic capacitor | |
| JP3129579B2 (en) | Solid electrolytic capacitors | |
| JP2003142339A (en) | Solid electrolytic capacitor structure and manufacturing method therefor | |
| JP6309198B2 (en) | Solid electrolytic capacitor and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |