JP2707946B2 - Hermetic sealing cap - Google Patents
Hermetic sealing capInfo
- Publication number
- JP2707946B2 JP2707946B2 JP5135995A JP13599593A JP2707946B2 JP 2707946 B2 JP2707946 B2 JP 2707946B2 JP 5135995 A JP5135995 A JP 5135995A JP 13599593 A JP13599593 A JP 13599593A JP 2707946 B2 JP2707946 B2 JP 2707946B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- shim
- inner diameter
- hermetic sealing
- sealing cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Laser Beam Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はマイクロ波帯ハイブリッ
ドＩＣ等を収納するパッケージに関し、特に気密封止キ
ャップに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for accommodating a microwave band hybrid IC and the like, and more particularly to a hermetic sealing cap.
【０００２】[0002]
【従来の技術】従来この種のパッケージの気密封止キャ
ップは、レーザー光や電気抵抗により発生する熱により
金属を溶かすことによりパッケージとの間で溶接する方
法を取っていた。（例えば、特開昭６３−１０５４５号
公報）2. Description of the Related Art Conventionally, a hermetic sealing cap of a package of this type has adopted a method of welding with a package by melting a metal by heat generated by laser light or electric resistance. (For example, JP-A-63-10545)
【発明が解決しようとする課題】この従来のレーザー光
や電気抵抗により発生する熱を利用した溶接による気密
封止では溶接部とパッケージの内径との間に溶接されて
いない部分が発生し、その部分が電磁気的に空間として
存在していた。高周波数帯で使用するパッケージの開発
において波長が短い為に溶接部とパッケージ内径との間
の空間が機能上影響を与えるという問題点があった。In the conventional hermetic sealing by welding using heat generated by laser light or electric resistance, an unwelded portion is generated between a welded portion and the inner diameter of a package. The part existed electromagnetically as a space. In the development of a package used in a high frequency band, there was a problem that the space between the welded portion and the inner diameter of the package had a functional effect because the wavelength was short.
【０００３】[0003]
【課題を解決するための手段】本発明の気密封止キャッ
プは内部にマイクロ波帯等の高周波数帯で使用する高周
波部品が収容され、一端が開口したパッケージの開口部
全体を覆い外周を溶接して高周波信号を電磁気的にシー
ルドする気密封止キャップにおいて、 前記パッケージの
溶接部の内側の内径部に相当する部分にふくらみをもた
せて絞り構造としてその内部に板バネ構造をしたシムを
溶接し、前記シムと前記パッケージの内径部の外側とを
接触させることを特徴とする。 SUMMARY OF THE INVENTION The hermetic sealing cap of the present invention has a high frequency seal inside a high frequency band such as a microwave band.
Opening of package with one end open, housing wave components
High frequency signals are electromagnetically shielded by covering the whole and welding the outer periphery.
In the sealing cap bother to field, of the package
A bulge is formed in the area corresponding to the inside diameter of the weld
And a shim with a leaf spring structure inside
Weld the shim to the outside of the inner diameter of the package.
It is characterized by contacting.
【０００４】[0004]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例である。キャップ１を図１
の様に絞り構造とする。その絞り込んだ部分に４方向を
板バネ構造にしたシム２を溶接する。シム２は図２の様
にキャップ１をパッケージ３の内径部の外側にシム２の
先端が接触する寸法とする。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention. Fig. 1
The diaphragm structure is used as shown in the figure. A shim 2 having a leaf spring structure in four directions is welded to the narrowed portion. As shown in FIG. 2, the cap 1 has a size such that the tip of the shim 2 contacts the outside of the inner diameter of the package 3 as shown in FIG.
【０００５】実施例において、キャップ１を絞り構造と
し、パッケージ内径部分に相当するふくらみをもたせ、
この中にシム２を配置しているのは、キャップ１が平坦
であればシム２がキャップ１とパッケージ３の間に入っ
た場合に溶接部に隙間ができてしまうのを防ぐためであ
る。In the embodiment, the cap 1 has a squeezing structure, and has a bulge corresponding to the inner diameter portion of the package.
The reason why the shim 2 is arranged therein is to prevent a gap from being formed in the welded portion when the shim 2 enters between the cap 1 and the package 3 if the cap 1 is flat.
【０００６】[0006]
【発明の効果】以上説明したように本発明は、気密封止
キャップにおいてパッケージの内径部に対応する大きさ
をもつシムを取り付けることにより、パッケージの外周
部で気密封止を行うとともに、電磁気的には、パッケー
ジ内径部でシールド効果を得ることができる。As described above, according to the present invention, by attaching a shim having a size corresponding to the inner diameter portion of the package in the hermetic sealing cap, the outer peripheral portion of the package is hermetically sealed, and the In this case, a shielding effect can be obtained at the inner diameter of the package.
【図１】本発明の一実施例の平面図。FIG. 1 is a plan view of one embodiment of the present invention.
【図２】図１に示した実施例をパッケージに溶接した例
の断面図。FIG. 2 is a sectional view of an example in which the embodiment shown in FIG. 1 is welded to a package.
１ キャップ ２ シム ３ パッケージ Ａ 溶接部 Ｂ パッケージ内径部 DESCRIPTION OF SYMBOLS 1 Cap 2 Shim 3 Package A Welded part B Package inner diameter
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 9/00 Ｈ０５Ｋ 9/00 Ｑ // Ｂ２３Ｋ 11/00 ５６２ Ｂ２３Ｋ 11/00 ５６２ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification number Office reference number FI Technical display location H05K 9/00 H05K 9/00 Q // B23K 11/00 562 B23K 11/00 562
Claims (1)
する高周波部品が収容され、一端が開口したパッケージ
の開口部全体を覆い外周を溶接して高周波信号を電磁気
的にシールドする気密封止キャップにおいて、 前記パッケージの溶接部の内側の内径部に相当する部分
にふくらみをもたせて絞り構造としてその内部に板バネ
構造をしたシムを溶接し、前記シムと前記パッケージの
内径部の外側とを接触させる ことを特徴とする気密封止
キャップ。1. Internally used in high frequency band such as microwave band
Package with high-frequency components
High-frequency signals are electromagnetically covered by welding over the entire opening
Part of the hermetically sealed cap that is to be electrically shielded and that corresponds to the inner diameter of the welded portion of the package
The leaf spring has a swelling structure as a drawing structure inside.
Weld the structured shim and connect the shim to the package.
A hermetic sealing cap, which is brought into contact with the outside of the inner diameter portion .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5135995A JP2707946B2 (en) | 1993-06-07 | 1993-06-07 | Hermetic sealing cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5135995A JP2707946B2 (en) | 1993-06-07 | 1993-06-07 | Hermetic sealing cap |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06349966A JPH06349966A (en) | 1994-12-22 |
| JP2707946B2 true JP2707946B2 (en) | 1998-02-04 |
Family
ID=15164738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5135995A Expired - Fee Related JP2707946B2 (en) | 1993-06-07 | 1993-06-07 | Hermetic sealing cap |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2707946B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52139370A (en) * | 1976-05-17 | 1977-11-21 | Nec Home Electronics Ltd | Semiconductor device |
| US4901135A (en) * | 1988-08-15 | 1990-02-13 | General Electric Company | Hermetically sealed housing with welding seal |
| JP2692990B2 (en) * | 1989-02-15 | 1997-12-17 | 株式会社東芝 | Hermetically sealed structure |
-
1993
- 1993-06-07 JP JP5135995A patent/JP2707946B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06349966A (en) | 1994-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5801474A (en) | Surface acoustic wave (SAW) device | |
| US4487999A (en) | Microwave chip carrier | |
| JP3413562B2 (en) | Hermetic sealing container and hermetic sealing method | |
| US4675629A (en) | Noise filter | |
| JP2002231201A (en) | Packed cell and its manufacturing method | |
| EP0623241B1 (en) | Semiconductor device with terminal lead | |
| US4547624A (en) | Method and apparatus for reducing package height for microcircuit packages | |
| JP2707946B2 (en) | Hermetic sealing cap | |
| JP3131128B2 (en) | Package for storing semiconductor elements | |
| EP0076104A2 (en) | Package for semicondutor device and method of manufacturing it | |
| JP2000058692A (en) | Package for electronic components | |
| US10763647B2 (en) | Ground contact integrated into welding protection strip | |
| JP3269235B2 (en) | Electronic components | |
| JP3878899B2 (en) | Electronic device and manufacturing method thereof | |
| JP2850065B2 (en) | Metal airtight container for electronic components | |
| JP2007019537A (en) | Electronic apparatus and its manufacturing method | |
| JPH033969Y2 (en) | ||
| JPH0531962B2 (en) | ||
| JPH0378782B2 (en) | ||
| JPH1041665A (en) | High frequency oscillator | |
| US5772487A (en) | Method for manufacturing metal halide lamp | |
| JPH1155068A (en) | Solid-state element device | |
| JPS641788Y2 (en) | ||
| JPH02257656A (en) | Metal airtight container of electronic component | |
| JPH0773123B2 (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970916 |
|
| LAPS | Cancellation because of no payment of annual fees |