JPH06349966A - Hermetically sealing cap - Google Patents

Hermetically sealing cap

Info

Publication number
JPH06349966A
JPH06349966A JP5135995A JP13599593A JPH06349966A JP H06349966 A JPH06349966 A JP H06349966A JP 5135995 A JP5135995 A JP 5135995A JP 13599593 A JP13599593 A JP 13599593A JP H06349966 A JPH06349966 A JP H06349966A
Authority
JP
Japan
Prior art keywords
package
shim
cap
welded
sealing cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5135995A
Other languages
Japanese (ja)
Other versions
JP2707946B2 (en
Inventor
Yoshio Hamada
祥夫 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5135995A priority Critical patent/JP2707946B2/en
Publication of JPH06349966A publication Critical patent/JPH06349966A/en
Application granted granted Critical
Publication of JP2707946B2 publication Critical patent/JP2707946B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Laser Beam Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To incorporate an electromagnetic shield effect inside a package by a shim by regarding a part between a welded part and the inside of the package as an electromagnetic space and hence affecting influence of a function of a hermetically sealing cap to be used in a high frequency band. CONSTITUTION:A cap 1 is formed in a drawn structure. A shim 2 in which four directions are formed in a leaf spring structure is welded to its drawn part. The shim 2 has a size in which, when the cap 1 is welded to a package, it is brought into contact with the package outside the inner wall of the package. The shim 2 is brought into contact with the package thereby to give an electromagnetic shield effect to the part.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はマイクロ波帯ハイブリッ
ドＩＣ等を収納するパッケージに関し、特に気密封止キ
ャップに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing a microwave band hybrid IC or the like, and more particularly to a hermetically sealed cap.

【０００２】[0002]

【従来の技術】従来この種のパッケージの気密封止キャ
ップは、レーザー光や電気抵抗により発生する熱により
金属を溶かすことによりパッケージとの間で溶接する方
法を取っていた。（例えば、特開昭６３−１０５４５号
公報）2. Description of the Related Art Conventionally, the airtight sealing cap of this type of package has been welded to the package by melting metal by heat generated by laser light or electric resistance. (For example, JP-A-63-10545)

【発明が解決しようとする課題】この従来のレーザー光
や電気抵抗により発生する熱を利用した溶接による気密
封止では溶接部とパッケージの内径との間に溶接されて
いない部分が発生し、その部分が電磁気的に空間として
存在していた。高周波数帯で使用するパッケージの開発
において波長が短い為に溶接部とパッケージ内径との間
の空間が機能上影響を与えるという問題点があった。In the conventional hermetic sealing by welding using heat generated by laser light and electric resistance, a non-welded portion is generated between the welded portion and the inner diameter of the package, and The part existed electromagnetically as a space. In the development of a package used in a high frequency band, there is a problem that the space between the weld and the package inner diameter has a functional influence because the wavelength is short.

【０００３】[0003]

【課題を解決するための手段】本発明の気密封止キャッ
プはパッケージ内径部の外側に接触する様に板バネ構造
にしたシムを取り付けている。The hermetically sealing cap of the present invention is provided with a shim having a leaf spring structure so as to come into contact with the outside of the inner diameter portion of the package.

【０００４】[0004]

【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例である。キャップ１を図１
の様に絞り構造とする。その絞り込んだ部分に４方向を
板バネ構造にしたシム２を溶接する。シム２は図２の様
にキャップ１をパッケージ３の内径部の外側にシム２の
先端が接触する寸法とする。The present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the present invention. Figure 1 with cap 1
As shown in Fig. The shim 2 having a leaf spring structure in four directions is welded to the narrowed portion. The shim 2 is dimensioned so that the tip of the shim 2 contacts the outside of the inner diameter portion of the package 3 as shown in FIG.

【０００５】実施例において、キャップ１を絞り構造と
し、パッケージ内径部分に相当するふくらみをもたせ、
この中にシム２を配置しているのは、キャップ１が平坦
であればシム２がキャップ１とパッケージ３の間に入っ
た場合に溶接部に隙間ができてしまうのを防ぐためであ
る。In the embodiment, the cap 1 has a throttle structure and has a bulge corresponding to the inner diameter of the package.
The reason why the shim 2 is arranged therein is to prevent a gap from being formed in the welded portion when the shim 2 enters between the cap 1 and the package 3 if the cap 1 is flat.

【０００６】[0006]

【発明の効果】以上説明したように本発明は、気密封止
キャップにおいてパッケージの内径部に対応する大きさ
をもつシムを取り付けることにより、パッケージの外周
部で気密封止を行うとともに、電磁気的には、パッケー
ジ内径部でシールド効果を得ることができる。As described above, according to the present invention, a shim having a size corresponding to the inner diameter portion of the package is attached to the hermetically sealing cap so that the outer peripheral portion of the package is hermetically sealed and the electromagnetic sealing is performed. In addition, the shield effect can be obtained at the inner diameter of the package.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の平面図。FIG. 1 is a plan view of an embodiment of the present invention.

【図２】図１に示した実施例をパッケージに溶接した例
の断面図。FIG. 2 is a sectional view of an example in which the embodiment shown in FIG. 1 is welded to a package.

【符号の説明】[Explanation of symbols]

１ キャップ ２ シム ３ パッケージ Ａ 溶接部 Ｂ パッケージ内径部 1 Cap 2 Shim 3 Package A Welding area B Package inner diameter area

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 9/00 Ｑ // Ｂ２３Ｋ 11/00 ５６２ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 9/00 Q // B23K 11/00 562

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 気密封止の為の溶接部の内側に電磁気的
なシールド部を備えることを特徴とする気密封止キャッ
プ。1. A hermetically sealing cap, comprising an electromagnetic shield portion inside a welded portion for hermetic sealing. 【請求項２】 パッケージ内径部に相当する部分にふく
らみをもたせこの中にパッケージ内径部と接触するシム
を前記シールド部として具備する請求項１の封止キャッ
プ。2. The sealing cap according to claim 1, wherein a portion corresponding to the inner diameter portion of the package is provided with a bulge, and a shim in contact with the inner diameter portion of the package is provided as the shield portion.
JP5135995A 1993-06-07 1993-06-07 Hermetic sealing cap Expired - Fee Related JP2707946B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5135995A JP2707946B2 (en) 1993-06-07 1993-06-07 Hermetic sealing cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5135995A JP2707946B2 (en) 1993-06-07 1993-06-07 Hermetic sealing cap

Publications (2)

Publication Number Publication Date
JPH06349966A true JPH06349966A (en) 1994-12-22
JP2707946B2 JP2707946B2 (en) 1998-02-04

Family

ID=15164738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5135995A Expired - Fee Related JP2707946B2 (en) 1993-06-07 1993-06-07 Hermetic sealing cap

Country Status (1)

Country Link
JP (1) JP2707946B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139370A (en) * 1976-05-17 1977-11-21 Nec Home Electronics Ltd Semiconductor device
JPH02142164A (en) * 1988-08-15 1990-05-31 General Electric Co (Ge) Sealed housing
JPH02297955A (en) * 1989-02-15 1990-12-10 Toshiba Corp Airtight sealing structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139370A (en) * 1976-05-17 1977-11-21 Nec Home Electronics Ltd Semiconductor device
JPH02142164A (en) * 1988-08-15 1990-05-31 General Electric Co (Ge) Sealed housing
JPH02297955A (en) * 1989-02-15 1990-12-10 Toshiba Corp Airtight sealing structure

Also Published As

Publication number Publication date
JP2707946B2 (en) 1998-02-04

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970916

LAPS Cancellation because of no payment of annual fees