JP2697706B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus having a rotary head for mounting an electronic component provided on a tape of a parts feeder on a substrate.

[0002]

2. Description of the Related Art As a high-speed mounting apparatus for mounting electronic components such as LSIs, ICs, capacitor chips, and resistance chips on a substrate, electronic component mounting apparatuses having a rotary head are widely used.

[0003] In an electronic component mounting apparatus having a rotary head, a transfer head provided on the rotary head is rotated by an index so that an electronic component provided on a tape of a parts feeder of the electronic component supply device is taken by the transfer head. The XY table is transferred and mounted on the substrate positioned on the XY table.

[0004]

In recent years, however, there has been a demand for an electronic component mounting apparatus having a rotary head to further increase the speed at which electronic components are mounted on a substrate and to make the entire apparatus smaller and more compact. In order to achieve high speed, it is necessary not only to increase the index rotation speed of the transfer head, but also to increase the processing speed of the empty tape sent from the parts feeder. Further, in order to reduce the size and size of the entire apparatus, it is necessary to functionally arrange various elements such as a rotary head, an XY table, and an electronic component supply device in a space as small as possible.

Accordingly, the present invention provides an electronic component mounting apparatus capable of increasing the processing speed of an empty tape sent out from a parts feeder and realizing the miniaturization and compactness of the entire apparatus by effectively using a narrow space. Aim.

[0006]

For this purpose, the present invention provides an electronic component supply device comprising a rotary head having a transfer head, a table and a parts feeder which moves linearly on the table in the longitudinal direction of the table. And an XY table for positioning the substrate, and the transfer head rotates by index so that the electronic components provided on the tape of the parts feeder are taken up by the transfer head, and the substrate is positioned on the XY table. In the electronic component mounting apparatus adapted to be transported and mounted, the XY
The moving area of the substrate by driving the table is an area including an area below a front end of the parts feeder projecting from the table toward the rotary head, and the transfer head of the rotary head in front of the parts feeder A cutter that cuts an empty tape sent forward from the parts feeder below the inside of the index rotation path, and a suction unit that suctions a small piece of the tape cut by the cutter. With.

[0007]

According to the present invention, an empty tape obtained by taking up electronic components by a transfer head can be used.
It can be sent forward from the parts feeder as it is, cut with a cutter, and the small pieces can be sucked and collected by the suction unit. In addition, the space below the rotary head can be used as a space for moving the substrate by driving the XY table, a space for installing the front end of the parts feeder, and a space for installing the cutting device.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a cross-sectional view of the vicinity of the rotary head, and FIG.
1 and 2, reference numeral 1 denotes a main body box in which driving devices such as a motor and a gear are housed. A rotary head 2 is provided at the lower part of the main body box 1.
Is provided. Provided the rotary head 2
The transfer head 25 (to be described later) is driven by a driving device in the main body box 1 to rotate the index rotation path N in the direction indicated by the arrow.

XY tables 3 and 4 are provided at the front of the main body box 1. MX and MY are drive motors. The substrate 5 is positioned on the XY tables 3 and 4. When the motors MX and MY are started, the board 5 becomes X
Move in the Y direction.

At the rear of the main body box 1, an electronic component supply device 6 is provided. Reference numeral 7 denotes a table on which a plate 8 is placed. On the plate 8, a large number of parts feeders 9 such as a tape unit and a tube feeder are placed. The table 7 is provided with a feed screw 10 driven by the motor M1. Plate 8
A nut 11 screwed to the feed screw 10 is provided on the lower surface of the nut. Therefore, when the motor M1 is driven,
Plate 8 straight in the X direction along the longitudinal direction of the table 7
In line movement, the parts feeder 9 having a predetermined electronic component
Is moved to a take-up position of a transfer head (described later). The indexing rotation of the rotary head 2 causes the transfer head to take up the electronic components of the parts feeder 9 and transfer and mount the electronic components on the substrate 5.

Next, the detailed structure of the rotary head 2 will be described with reference to FIG. Reference numeral 20 denotes a guide body provided at a lower portion of the main body box 1, and a guide groove 21 is formed on an outer peripheral surface thereof. A bearing 22 is provided below the guide body 20, and a first rotating body 23 is mounted on the bearing 22. A second rotating body 24 is mounted below the rotating body 23. This rotating body 2
The drive units 3 and 24 are driven by a drive device built in the main body box 1 and rotate in the index N direction in the index direction. The rotating body 23 and the rotating body 24 may be formed integrally. Rotating body 24
In order to reduce the weight and the rotational inertia,
4a is formed in a hollow drum shape.

Reference numeral 25 denotes a transfer head. The case 26 of the transfer head 25 is provided with a plurality of nozzles 27 and 28 for sucking the electronic component C. Nozzles 27, 28
Are selected and used depending on the type of the electronic component C.

Reference numeral 29 denotes a first bracket for supporting the transfer head 25. A second bracket 30 is connected to an upper portion of the bracket 29. Rollers 31 and 32 are mounted on the upper end of the bracket 30. One roller 31 is fitted in the guide groove 21. Further, the other roller 32 is in contact with the lower surface of the guide body 20. Also, the bearings 3 and 32 are coaxial with each other.
3, 34 are mounted on the shaft. Claws 35 and 36 are fitted between the bearings 33 and 34. The pawls 35 and 36 are driven up and down by a driving device provided in the main body box 1.

At the lower part of the guide groove 21, notches 37 and 38 are formed partially. A rail 41 is mounted on the bracket 29. Also, on the wall of the rotating body 24,
A slider 42 fitted to the rail 41 is mounted.
When one of the claws 35 moves up and down, the transfer head 25 moves up and down,
The electronic component C of the parts feeder 9 is attracted to the nozzles 27 and 28 to take up. When the other claw 36 moves up and down, the transfer head 25 moves up and down to mount the electronic component C on the substrate 5. The transfer head 25 is located at the lower position 21 of the guide groove 21.
The electronic component C is mounted on the substrate 5 in a. Guide groove 21
The electronic component C is taken up at the high position 21b.

With this configuration, the distance L between the nozzle 27 and the substrate 5 at the time of take-up is made sufficiently large. The space S1 directly below the rotary head 2
And a space S2 below the front end of the parts feeder 9 projecting forward (to the left in FIG. 3) from the table 7.
Is a moving space S3 in which the substrate 5 can enter and move in the X direction or the Y direction.
And a space for arranging a cutting device 45 (described later) directly below the rotary head 2 is secured. The bracket 29 is provided with a motor M2. When the motor M2 is driven, the transfer head 25 rotates horizontally in the θ direction.

The outer diameters D2 and D3 of the rotating bodies 23 and 24 are smaller than the diameter D1 of the guide body 20. Bracket 2
9 and 30 are along the wall surfaces of the rotating bodies 23 and 24.
By configuring the guide body 20, the rotating bodies 23 and 24, and the brackets 29 and 30 in this manner, the rotary head 2 is reduced in size and weight, and the rotating diameter D4 of the transfer head 25 is reduced.

If the gradient α of the guide groove 21 is steep, the acceleration of the vertical movement of the transfer head 25 increases. When the acceleration increases, the electronic component C tends to drop from the nozzles 27 and 28. Therefore, the gradient α of the guide groove 21 must be made gentle, and the transfer head 25 must be moved up and down slowly. For this purpose, the diameter D1 of the guide body 20 must be large.

As the rotational diameter D4 of the transfer head 25 increases, the rotational inertia increases. As the rotational inertia increases, the vibration of the transfer head 25 when the index rotation is stopped increases. If the transfer head 25 vibrates, a take-up error or a mounting error occurs. Therefore, it is necessary to wait for the vibration to completely stop, and then perform a take-up operation or a mounting operation. However, the time to wait for the vibration to stop is a loss time, and the mounting speed is accordingly reduced.

However, in the present apparatus, the brackets 29, 30
Are arranged along the small rotating bodies 23 and 24, the rotating diameter D4 of the transfer head 25 is small, and the rotary head 2 is lightweight, so that the rotary inertia of the rotary head 2 is small. Therefore, when the index rotation of the rotary head 2 stops, the vibration of the transfer head 25 stops quickly.

In FIG. 4, T1 is the vibration time of the present apparatus, and T2 is the vibration time of the conventional apparatus. By reducing the vibration time T1 when the index rotation is stopped, the take-up operation and the mounting operation can be performed quickly,
The mounting speed can be increased.

In FIG. 3, reference numeral 12 denotes a base of the parts feeder 9. The supply reel 1 is provided on the base 12.
3, take-up reel 14, sprocket 15, cover plate 1
6 are provided. The supply reel 13 has an electronic component C
Is wound around the tape 17. When the sprocket 15 rotates by the pitch, the tape 17 is pitch-fed forward (to the left in FIG. 3). Cover tape 17a
Is peeled off by a slit 18 formed in the cover plate 16 and wound on a take-up reel 14.

Immediately below the rotating body 24, a cutting device 45 is provided.
Are arranged. The cutting device 45 is provided for the transfer head 25.
It is arranged below the inside of the index rotation path N,
Thus, the index rotation path N is rotated by the index.
So that it does not interfere with the transfer head 25. The cutting device 45 includes a box 46, a cutter 47 disposed inside the box 46, and a suction tube 48 as a suction unit. The empty tape 17 on which the electronic component C has been taken up advances as it is to the left, enters the box 46, and is cut by the cutter 47. The cut tape strips 17 'are sucked into the tube 48 and collected. The substrate 5 is driven by the XY tables 3 and 4 to enter below the cutting device 45 and the parts feeder 9 and freely moves in the moving area S3 in the X direction and the Y direction. The electronic component C is mounted at the coordinate position. Thus, the cutting device 4
5 is provided below the rotating body 24, so that the cutting device 4
A sufficient space for moving the substrate 5 can be secured below the substrate 5.

[0023]

According to the present invention, the empty tape after the electronic component is taken up by the transfer head is sent forward from the parts feeder as it is, cut by the cutter, and the small piece is sucked by the suction unit. As a result, the processing speed of the empty tape can be increased, and the speed at which the electronic components are mounted on the substrate can be further increased.
Further, the space directly below the rotary head can be used as a space for moving the substrate by driving the XY table, a space for installing the front end of the parts feeder, and a space for installing the cutting device, so that the entire device can be reduced in size and size. Also, the cutting device is transferred to the index rotation path of the transfer head.
The cutting device is located below the inside of the
Without interfering with the index rotation of the
Index rotation of index rotating path at high speed
The electronic component mounting operation can be performed while doing so.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a sectional view of the vicinity of a rotary head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a vibration characteristic diagram of the electronic component mounting apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 2 Rotary head 3 X table 4 Y table 5 Substrate 6 Electronic component supply device 7 Table 9 Parts feeder 17 Tape 17 'Strip 25 Transfer head 45 Cutting device 47 Cutter 48 Suction tube

Claims (1)

(57) [Claims] A rotary head having a transfer head;
Table and the length of this table on this table
Component feeder comprising a parts feeder that moves linearly in the direction, and an XY table for positioning the substrate, and the transfer head rotates the index so that the electronic components provided on the tape of the parts feeder are transferred. The electronic component mounting apparatus is adapted to be taken up by the above and transferred to and mounted on the substrate positioned on the XY table, wherein a moving area of the substrate by driving the XY table is projected from the table to the rotary head side. An area including an area below a front end of the parts feeder, and an index rotation path of the transfer head of the rotary head in front of the parts feeder .
A cutting device comprising a cutter for cutting an empty tape sent forward from the parts feeder and a suction unit for suctioning a small piece of the tape cut by the cutter below the side. Component mounting equipment.