JPS63177589A - Automatic parts mounter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a component for positioning and mounting chip-formed electronic components (hereinafter referred to as chip components) such as resistors, capacitors, or transistors on a printed circuit board or the like. This invention relates to an automatic mounting device.

[Prior Art] Conventionally, in this type of automatic mounting device for electronic components, as disclosed in Japanese Utility Model Application Publication No. 57-48673 previously filed by the present applicant, a predetermined length of the base tape is attached in the longitudinal direction. A tape in which chip parts are inserted into square holes provided at regular pitch intervals, and then covered with cover tape on both sides, thereby enclosing chip parts in a sandwich shape at approximately equal intervals in the longitudinal direction of the tape. The tape is wound and stored on a tape reel and fed out intermittently to supply the chip components to the component extraction means, and the chip components are sucked and held by the component extraction means. Take it out.

There is a device that is configured to be placed on a printed circuit board positioned in advance on an X-Y table and automatically assembled. A device has been proposed in which a tape cutting means as disclosed in the previously filed Japanese Utility Model Publication No. 57-37282 is incorporated, and the waste tape after chip components are taken out by the component taking out means is cut into small pieces by a cutter.

It is put into practical use.

However, in the tape cutting device used in the conventional automatic mounting apparatus for electronic components as described above, the current state is that the position at which the tape is cut by the cutter is always constant.

[Problems to be Solved by the Invention] For this reason, if a chip component is picked up incorrectly when the chip component is taken out from the tape by the component picking means,
There is a risk that the chip components will be carried along with the tape to the cutting position of the cutter. In particular, many chip components such as electronic components are usually made of hard materials such as ceramics. This may damage the cutter or make it impossible to cut the chip component with the cutter.

Therefore, as a means to solve this problem, it is possible to fix the cutter position by setting the cutting position of the tape between adjacent chip parts. This is fine if the tape feed pitch is always constant, but if tapes with different feed pitches are used, the square hole portion of the base tape in which the chip components are housed will have to be cut.

There was a problem in that the same drawbacks as those described above occurred.

The present invention has been made under the above circumstances, and its object is to provide an automatic component mounting device that can reliably prevent chip components remaining in the waste tape from being cut. It is about providing.

[Means for solving problems] In order to solve the above-mentioned problems, the present invention has been made.

A tape in which chip-shaped components are encapsulated at approximately equal intervals in the longitudinal direction is intermittently delivered from a component supply means.

And the chip-shaped parts encapsulated in the tape are taken out by a parts extraction means, and for assembly, the chip-shaped parts are positioned and placed on a base, and are automatically mounted, and the tape is cut after the chip-shaped parts are taken out. The tape cutting means is provided with a control means for variably controlling the position at which the tape is cut by the tape cutting means.

[Function] That is, the present invention has the above configuration,
Since the cutting position of the tape can be freely controlled in accordance with the tape feeding pitch by the component supply means, the cutting position of the tape can always be set between adjacent chip-shaped parts. Even if some parts remain, there is no need to cut the chip-like parts.

[Example] Hereinafter, the present invention will be described in detail with reference to an example shown in FIGS. 1 to 8.

FIG. 1 schematically shows an automatic mounting device for electronic components according to the present invention, and (1) in the figure is a component supply means. This component supply means (1) is equipped with a pedestal (2) that is selectively controlled to move at equal pitches or counting pitches in the solid line arrow direction (A) by a drive system (not shown), and the movement direction on this pedestal (2) is A plurality of component supply units (3) are stacked in parallel at predetermined pitch intervals. Each of these component supply units (3) is connected to a tape reel (4).

Tape (5) with chip parts (U) encapsulated in it
This tape (5) is the second
As shown in detail in FIG. 3 and FIG. 6
) and cover tapes (8) and (9) applied to both the front and back sides of the chip parts (
By inserting each of the chip parts (U) and covering both the front and back sides of the base tape (6) with cover tapes (8) and (9) in a sandwich-like manner,
) ... are enclosed at approximately equal intervals in the longitudinal direction of the tape. Further, (5a) in the figure indicates tape feed holes bored at predetermined pitch intervals in the longitudinal direction of the tape (5).

Then, the tape reel (
The tape (5) wound and stored in 4) is adapted to be fed out at a predetermined pitch at a time to a parts feeding unit (10) which is a parts feeding means. As shown in Fig. 4, is installed on the pedestal (2) with fixing pins (11) (11) as guides, and a tape cutting unit (50), which will be described later, is installed at the lower front of the frame (2) as a guide. Protruding stopper (61
) is provided with a spacer (12) in contact with the spacer (12).

By the way, as shown in FIG. 5, the internal structure of the component delivery unit (1o) includes a first drive gear (13) that is rotationally driven by a drive system (not shown), and a first drive gear (13) that is rotatably driven by a drive system (not shown). The meshed second gear (14) and this second gear
a first sprocket (15) provided on the gear (14), a second sprocket (16) connected to and spaced apart from the first sprocket (15), and a first sprocket (16) of each of these sprockets. First and second timing pulleys (17) provided on the second sprockets (15) and (16), respectively.
(18) and these first and second timing pulleys (
17) (18) It is equipped with a timing belt (19) which is passed between the belts and can freely rotate synchronously.
Said first and second sprockets (15) (16)
is a pin (5a) that engages with the feed hole (5a) of the tape (5) wound and stored on the tape reel (4) of the parts supply section (3).
15a) (16a), and the timing belt (1
9) by the first and second timing pulleys (17) (
18), the tape (5) is linearly fed from the second sprocket (16) side to the first sprocket (15) side.

In addition, (20) in the figure is a cover tape peeling plate installed at the front and rear intermediate position between the first and second sprockets (15) (16), and this peeling plate (20) A peeling roller (
The peeling roller (21) is a friction drum (22) that rotates together with the first drive gear (13).

The surface pressed by the biasing force of the spring (23) can rotate synchronously with a friction rotating roller (24) made of rubber. Furthermore, in the figure (25) is a gear feed claw that feeds the second gear (14) at a predetermined pitch;
) is the operating lever of this gear feed pawl (25), and (27) is the operating lever of the second gear (14) that controls the rotational position of the second gear (14) with the spring (28).
) is a positioning pawl that is fixed by the urging force.

Moreover, in the above-mentioned parts sending unit (10),
In order to strengthen the peeling force of the cover tape (8), it is sufficient to increase the urging force of the spring (23). Usually, the amount of the cover tape (8) wound around the peeling roller (21) is as follows. The feed amount is set to be greater than the feed amount of the tape (5), and the amount greater than the feed amount of the tape (5) is caused to slip between the friction drum (22) and the friction rotating roller (24). As a result,
The excess feed of the tape (5) is transferred to the second sprocket (16).
), which reliably prevents the tape (5) from loosening or undulating at the position where the chip component is picked up in the component extraction section by the component extraction means described later.

As shown in FIG. 30) to take them out one by one.

This component extraction means (30) is supported so as to be movable up and down by a rotary table (31) which is intermittently rotationally driven by a drive system (not shown) and a cam drive device (not shown) in the circumferential direction of the lower surface of this rotary table (31). A plurality of (four in the illustrated embodiment) suction nozzles (32)
..., and this component extraction means (30) includes:
Each component supply section (3) of the component supply means (1) is prepared in advance.
The parts delivery unit (which is a part delivery means supplied from
10) is selectively positioned at a predetermined position by controlling the movement of the frame (2).

That is, the chip component (U) on the tape (5) from which the cover tape (8) has been peeled off after being fed out from the component delivery unit (10) is transferred to the suction nozzle (32) of the component extraction means (30). . . and is taken out by suction and held by one of the rotary tables (31), and placed on the first positioning unit (33) by the rotation of the rotary table (31). After determining the position and direction of the chip component (U) using the plurality of claw members (34)..., the chip component (U) is placed on the X-Y table (40) which is a mounting base. This X-Y table (40) is automatically placed and assembled on a printed circuit board (P), and this X-Y table (40) is composed of an X-axis peripheral table (41) that can be moved in the X-axis direction by a drive system (not shown). , and a Y-axis circumferential table (42) movable in the Y-axis direction, and the printed circuit board (P) installed on the X-axis circumferential table (41) is assembled with chip components (U) in advance. The front part is movably adjusted in the X-axis direction and the Y-axis direction for positioning.

On the other hand, the tape (5) that becomes a waste tape that is fed out from the component delivery unit (10) and from which the chip components (U) are taken out by the component extraction means (30) is cut into a tape cutting unit (50) that is a tape cutting means. The tape cutting unit (50) is such that the tape is fed out and conveyed in sequence and cut into a predetermined length.
The configuration is as shown in FIG. That is, the tape cutting unit (50) has an upper blade (53) mounted on a support (52) that is rotatable in the horizontal direction along the front-rear direction, which is the transport direction of the tape (5), about the rotation axis (51). ) is fixed, and a lower blade (55) is pivotally supported on the support (52) via a support shaft (54) so as to be movable up and down with respect to the upper blade (53); The lower blade (55) is attached to the shaft (56)
The tape (5) conveyed between the upper blade (53) and the lower blade (55) can be linked to the vertical movement of the connecting rod (57) connected via the can be cut at a predetermined cutting position. Then, the rotation of the support body (52), that is, the upper blade (
53) and the lower blade (55) in the front-rear direction to adjust them to a predetermined tape cutting position.
A swingable actuation lever (60) is connected via a shaft (59) to an arm (58) projecting from the connecting rod (52), and the connecting rod (57) and the actuation lever (60) are driven. , all of which are performed by a cam mechanism of a drive system that is automatically controlled by instructions from a computer (not shown). In addition, in Figure 1 (
61) is a stopper that restricts the swing range in the front and back direction of the cutter consisting of the upper blade (53) and the lower blade (55);
62) is a duct connected to the tape cutting unit (50), which allows small pieces of the cut tape (5) to be stored in a dust collector (not shown).

Next, the cutting position and cutting operation of the tape (5) in the tape cutting unit (50) described above will be explained below.

Here, this type of tape (5) usually meets the requirements of RC-1009B of the Electronics Industry Association of Japan (EIAJ) standard.
The pitch interval of the square holes (7) in the base tape (6) is determined to be a multiple of 4. For example, as shown in Fig. 7, the pitch interval (Ll) of the square holes (7) is 4 mm. Using tape as an example, to cut between square holes (7) (7),
If the shaded area is the suction position of the encapsulated chip component (U), then [4n x +
2 ] +11QI (n, = o, 1, 2, 3...)
Similarly, if we take a tape with square holes (7) whose pitch interval (L2) is 8 mm as shown in Fig. 8, the shaded part is the encapsulated chip. Assuming the suction position of the component (U), the square hole (7) at the suction position
From the center of (8n, +4 cores am (n, = 0.1, 2
, 3...), thereby making it possible to cut between the square holes (7).

As is clear from this, if the adsorption positions of the chip parts (U) are set at the same position, the tape with a pitch of 4 mm and the
With tapes that have a pitch of mm, the tape cutting position will not match the same position and will always be 2 mm off.
It is impossible to cut between the square holes of both tapes using a tape cutting means such as the conventional device.

Therefore, in the present invention, for example, 4 mm pitch interval and 8+
In order to make it possible to cut tape at both an+pitch intervals, a moving system is adopted in which the cutter consisting of the upper blade (53) and lower blade (55) as described above can be controlled to swing back and forth. According to this, first, the entire tape cutting unit (50) moves forward (towards the tape feeding opening of the parts feeding unit) around the rotating shaft (51), and then the tape (5) cuts the parts. Sending unit (1o)
When the tape is fed out by one pitch from the tape feeding opening and fed between the upper blade (53) and lower blade (55) of the cutter, the lower blade (55) rises and the gap between the upper blade (53) and the upper blade (53) increases. Cut the tape (5) at a predetermined cutting position. Thereafter, the lower blade (55) descends to its original position, and the entire tape cutting unit (50) further moves backward around the rotating shaft (51), completing one cycle of cutting operation. At this time, as shown in FIG. 7, if tape is used at a pitch of 4 mm, a spacer (12) as shown in FIG. Not installed and for this reason.

Since the stopper (61) that restricts the swing range of the cutter, which is made up of the upper blade (53) and the lower blade (55), in the front-back direction does not work, the cutter moves to its maximum forward position and maintains that position. On the other hand, as shown in Fig. 8, if tape is used at an 8 mm pitch, there is a spacer (as shown in Fig. 4) at the lower front of the component delivery unit (10). 12) is attached, and the stopper (61) comes into contact with this spacer (12) to restrict the forward swing range of the cutter, so that the tape cutting position is set 2 mm before the tape with a pitch of 4 mm. This is what is meant to be done.

In the above embodiment, the cutting position of the tape was variably adjusted by regulating the movement range of the cutter using the parts sending unit (10), which is a parts sending means, but the present invention is not limited to this. It is also possible to variably adjust the cutting position of the tape by electrically detecting the type of component delivery unit that differs depending on the tape, and controlling the pulse motor etc. using the signal to regulate the movement range of the cutter. It is.

Further, in the above embodiment, a swinging mechanism is used to control the cutter, but even if a linear mechanism is used, the functions and effects of the present invention can be fully exerted.

In addition, it goes without saying that the present invention can be modified in various ways without departing from the gist of the invention.

[Effects of the Invention] As is clear from the above description, according to the present invention, a tape in which chip-shaped components are encapsulated at approximately equal intervals in the longitudinal direction is intermittently fed out from the component supply means, and A chip-shaped component encapsulated in the tape is taken out by a component extraction means, positioned and placed on a mounting base, and automatically assembled, and the tape is cut after the chip-shaped component is taken out. In an automatic component mounting device equipped with a component supply means, the tape cutting position can be freely controlled in accordance with the tape feeding pitch by the component supply means, so that the tape cutting position can always be set between adjacent chip-like components. Therefore, even if a chip-like part remains in the tape, it has an excellent effect of not cutting the chip-like part.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view showing an embodiment of an automatic component mounting device according to the present invention, FIG. 2 is a partially enlarged sectional view showing a state in which chip components are enclosed in a tape, and FIG. FIGS. 4 and 5 are schematic explanatory diagrams of the component delivery unit in the component supply section, FIG. 6 is a schematic perspective view of the tape cutting unit, and FIGS. 7 and 8 are schematic illustrations of the tape cutting unit. FIG. 6 is an explanatory diagram showing the positions at which the tape is cut by the tape cutting unit. (1)...Parts supply means. (5)...tape, (5a)...feeding hole. (6)...Base tape, (7)...Square hole, (10
)...Parts sending means (parts sending unit), (30)
. . . Component extraction means, (32) . . . Suction nozzle, (40) . . . Mounting base (X-Y table). (50)... Tape cutting unit, (51)... Rotating shaft, (52)... Support body. (53) (55) ...Cutter, (U)
...Chip parts, (P) ...Mounting base (printed circuit board).

Claims (2)

[Claims] (1) A tape in which chip-shaped components are encapsulated at approximately equal intervals in the longitudinal direction is intermittently sent out from a component supply means, and the chip-shaped components encapsulated in the tape are taken out and assembled by a component extraction device. A control means for variably controlling the cutting position of the tape by the tape cutting means, comprising a tape cutting means for positioning and mounting on a base, and for cutting the tape after the chip-shaped component has been taken out, and for automatically mounting the chip. An automatic parts mounting device characterized by being provided with. (2) The automatic component mounting apparatus according to claim 1, wherein the cutting position of the tape is controlled by the control means in accordance with the tape feeding pitch by the component supply means.