JP2696395B2 - Electrode manufacturing method - Google Patents
Electrode manufacturing methodInfo
- Publication number
- JP2696395B2 JP2696395B2 JP13068989A JP13068989A JP2696395B2 JP 2696395 B2 JP2696395 B2 JP 2696395B2 JP 13068989 A JP13068989 A JP 13068989A JP 13068989 A JP13068989 A JP 13068989A JP 2696395 B2 JP2696395 B2 JP 2696395B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode material
- electrode
- holder
- brazing
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はプラズマアーク切断機の放電電極として使用
するに適した電極の製造方法に関する。The present invention relates to a method for manufacturing an electrode suitable for use as a discharge electrode of a plasma arc cutting machine.
［従来の技術］ プラズマアーク切断機用の電極は、銅又は銅合金のホ
ルダーに穴を開けて棒状の電極材（チップ）をこの穴に
圧入するか、又は電極材をこの穴に嵌合したのちホルダ
ーを加圧してかしめ付けていた。従来使用されてきた放
電チップはハフニウム（Hf）やジルコニウム（Zr）の線
材であるので、圧入やかしめのような大きな加圧を伴う
接合方法を採用してもそのもの自体に延性があるためク
ラックが生じたりすることはなかった。[Prior Art] An electrode for a plasma arc cutting machine has a hole made in a copper or copper alloy holder and a rod-shaped electrode material (chip) is pressed into this hole, or the electrode material is fitted into this hole. Later, the holder was pressed and caulked. Conventionally used discharge tips are made of hafnium (Hf) or zirconium (Zr) wires, so even if a joining method involving large pressurization such as press-fitting or caulking is adopted, cracks occur because the duct itself is ductile. It did not happen.
［発明が解決しようとする課題］ しかしながら、最近放電チップとしてレニウム（Re）
−酸化イットリウム（Y2O3）やルテニウム（Ru）−酸化
イットリウム（Y2O3）のような粉末治金法によって製造
される放電特性の優れたチップが電極材として使用され
るようになると、この種のチップは比較的脆いため圧入
やかしめによってチップにクラックが生じ、放電中に破
損したりホルダーから脱落するという問題点があった。[Problems to be solved by the invention] However, recently, rhenium (Re) has been used as a discharge tip.
- yttrium oxide (Y 2 O 3) and ruthenium (Ru) - the good chip discharge characteristics to be produced by powder metallurgy methods, such as yttrium oxide (Y 2 O 3) is to be used as an electrode material However, since this type of chip is relatively brittle, there is a problem that the chip is cracked by press-fitting or caulking, and is damaged during discharge or falls off the holder.
本発明は、上記脆い電極材を採用してもクラック等を
生じず、確実に保持することのできる製造方法を提供す
るものである。The present invention is to provide a manufacturing method capable of securely holding without causing a crack or the like even when the above-mentioned brittle electrode material is adopted.
［課題を解決するための手段］ 上記課題を解決するため、本発明は次のような製法を
提供する。[Means for Solving the Problems] In order to solve the above problems, the present invention provides the following manufacturing method.
すなわち、本発明にかかる電極の製造方法は、ろう材
に対し濡れ性の良い金属コーティング層を表面に形成し
た放電特性の優れた電極材を、該電極材が嵌合する凹部
と該凹部から外面に通ずる細孔が形成された銅又は銅合
金のホルダーに嵌合し、ホルダーの融点以下のろう接温
度を有するろう材を用いて非酸化性雰囲気中で電極材を
ホルダーにろう接一体化することを特徴としている。That is, the method for manufacturing an electrode according to the present invention includes the steps of: forming an electrode material having excellent discharge characteristics in which a metal coating layer having good wettability with respect to a brazing material is formed on the surface; The electrode material is brazed to the holder in a non-oxidizing atmosphere using a brazing material having a brazing temperature equal to or lower than the melting point of the holder. It is characterized by:
以下、具体例を挙げつつ詳細に説明する。 Hereinafter, a detailed example will be described with reference to specific examples.
電極材としては、所望のアーク特性を有するもので、
例えばハフニウム、ルテニウム等をベースとする焼結材
のほかタングステン基合金等種々のものがある。また、
電極ホルダーとしては、最も普通に使用されているもの
は純銅であるが、クロム−銅合金その他の銅合金でもよ
い。As an electrode material, one having desired arc characteristics,
For example, there are various materials such as a tungsten-based alloy in addition to a sintered material based on hafnium, ruthenium, or the like. Also,
The most commonly used electrode holder is pure copper, but may be a chromium-copper alloy or other copper alloy.
第１図は完成したプラズマアーク切断用の電極１の例
をあらわすもので、大径（Ｄφ）の基部2aに小径
（ｄφ）の電極材保持部2bが一体に形成されたホルダー
２に丸棒材の電極材３が埋設されている。寸法例として
は、Ｄが10〜20mm、ｄは５〜15mm、Ｌは15〜50mm、電極
材の寸法例は例えばφ２×5mmである。この電極の製造
法を例示すれば、先ず第２図に示す如きホルダー素材
２′を製作し、電極材保持部2bとなる部分の先端部には
電極材３嵌合用の孔５をドリル、エンドミル等を用いて
穿孔する。嵌合孔５を穿孔したら電極材保持部2bの外周
面からドリルで前記嵌合孔５の底部に達する細孔７を穿
設する。細孔７の径は、例えば0.5〜0.7mmとするのが好
ましい。嵌合孔５と細孔７を穿設したホルダー素材２′
は充分に洗浄しておく。一方、丸棒状の電極材３を例え
ば公知の粉末治金法で製造し、その表面にコーティング
層を形成する。このコーティング層の材質は、使用する
ろう材に対し濡れ性の良い金属で、例えば銀、銅、ニッ
ケル等であり、化学メッキ、CVD、PVD等の方法でコーテ
ィング層を形成することができる。コーティング層の厚
さは10〜50ミクロンとするのが好ましく、25〜35ミクロ
ンとするのがより好ましい。FIG. 1 shows an example of a completed electrode 1 for plasma arc cutting. The holder 2 has a large-diameter ( Dφ ) base 2a and a small-diameter ( dφ ) electrode material holding portion 2b formed integrally. An electrode material 3 made of a round bar is embedded. As dimensions, D is 10 to 20 mm, d is 5 to 15 mm, L is 15 to 50 mm, and the dimension of the electrode material is, for example, φ2 × 5 mm. As an example of the manufacturing method of this electrode, first, a holder material 2 'as shown in FIG. 2 is manufactured, and a hole 5 for fitting the electrode material 3 is drilled at an end of a portion to be the electrode material holding portion 2b, Perforate using After the fitting hole 5 is drilled, a small hole 7 reaching the bottom of the fitting hole 5 is drilled from the outer peripheral surface of the electrode material holding portion 2b. The diameter of the pores 7 is preferably, for example, 0.5 to 0.7 mm. Holder material 2 ′ having a hole 5 and a hole 7
Wash thoroughly. On the other hand, a round bar-shaped electrode material 3 is manufactured by, for example, a known powder metallurgy method, and a coating layer is formed on the surface thereof. The material of the coating layer is a metal having good wettability to the brazing material to be used, for example, silver, copper, nickel, or the like. The coating layer can be formed by a method such as chemical plating, CVD, or PVD. The thickness of the coating layer is preferably between 10 and 50 microns, more preferably between 25 and 35 microns.
表面にコーティング層を形成した電極材３をホルダー
素材２′の嵌合孔５に嵌合し、第３図（ａ）および第４
図（ａ）に例示するようにホルダー材質よりも融点の低
いろう材10を一部嵌合孔５に嵌入した状態で電極材３上
に載置し、真空中又は、還元性雰囲気中等の非酸化性雰
囲気中で加熱する。第３図は細孔７をホルダーの外周面
に開口させる例をあらわし、第４図は短いホルダーの場
合に細孔７をホルダーの底面に開口させる例をあらわ
す。The electrode material 3 having a coating layer formed on the surface is fitted into the fitting hole 5 of the holder material 2 ', and FIG.
As shown in FIG. 1A, a brazing material 10 having a lower melting point than the material of the holder is placed on the electrode material 3 in a state of being partially fitted in the fitting hole 5, and is placed in a vacuum or in a reducing atmosphere. Heat in an oxidizing atmosphere. FIG. 3 shows an example in which the fine holes 7 are opened on the outer peripheral surface of the holder, and FIG. 4 shows an example in which the fine holes 7 are opened on the bottom surface of the holder in the case of a short holder.
ろう材10の量は、電極材５と嵌合孔５内壁との間の隙
間11を充填するに充分な量よりもやや多い量とするのが
好ましい。隙間11の大きさは、通常のろう接のクリアラ
ンスと同等またはそれ以上、例えば0.2mm〜1mm程度とす
ればよいが、これよりも大きくてもよい。The amount of the brazing material 10 is preferably slightly larger than the amount sufficient to fill the gap 11 between the electrode material 5 and the inner wall of the fitting hole 5. The size of the gap 11 may be equal to or larger than the clearance of normal brazing, for example, about 0.2 mm to 1 mm, but may be larger than this.
上記加熱によりろう材が溶けて、第３図（ｂ）第４図
（ｂ）に示すように電極材３とホルダー２とを接合一体
化する。このとき、嵌合孔５中のガスは細孔７を通って
外部へ排出されるので、気泡の少ない良好なろう接が行
なわれるのである。The brazing material is melted by the above heating, and the electrode material 3 and the holder 2 are joined and integrated as shown in FIG. 3 (b) and FIG. 4 (b). At this time, the gas in the fitting hole 5 is discharged to the outside through the fine hole 7, so that good brazing with few bubbles is performed.
ろう接が終ったら、ホルダー先端部等に必要な機械加
工を施し、所望の形状の電極を得る。上記嵌合孔５の底
部に通ずる細孔７をホルダーの外周面に開口させておけ
ば、ろう接後にこの点の色がホルダー自体の色と変わっ
ているので、電極材の末端部の目印になるという利点が
ある。When the brazing is completed, necessary machining is performed on the tip of the holder and the like to obtain an electrode having a desired shape. If the fine hole 7 communicating with the bottom of the fitting hole 5 is opened in the outer peripheral surface of the holder, the color of this point is different from the color of the holder itself after brazing, so that it is used as a mark at the end of the electrode material. There is an advantage that it becomes.
第５図は第１図と異なる例をあらわすもので、この電
極１′は基部2aの左右両側にそれぞれ電極保持部2b、2b
が形成された両頭式の電極となっている。この場合も上
記とほぼ同様な方法で製造することができる。FIG. 5 shows an example different from that of FIG. 1, in which the electrode 1 'is provided on the left and right sides of the base 2a with electrode holding portions 2b, 2b, respectively.
Are formed on both sides of the electrode. Also in this case, it can be manufactured by a method substantially similar to the above.
［実施例］ 電極材寸法φ２×5mmの第１図に示すような電極１を
製造した。電極材はRu-Y2O3焼結合金であり、ホルダー
２は銅で製作した。細孔７の径は0.7mmであった。電極
材３の表面にニッケルコーティングを施し、銀ろうを用
いてろう接した。Example An electrode 1 having an electrode material size of φ2 × 5 mm as shown in FIG. 1 was manufactured. Electrode material is a Ru-Y 2 O 3 sintered alloy, the holder 2 is made of copper. The diameter of the pores 7 was 0.7 mm. The surface of the electrode material 3 was coated with nickel and brazed using a silver solder.
得られた電極の電極材保持部2bを電極材３の底面付近
で切断し、第６図に示すように、金型Ｍ′内にスペーサ
10で保持し、ピン11を介して電極材に軸方向の荷重を加
えて電極材３を押し抜き、接合強度を調べた結果は第１
表に示す通りであった。同表には参考のため、従来の圧
入によるもの（比較例１）およびかしめによるもの（比
較例２）のデータを併記した。接合強度δは、δ＝W/
（π×Dt×１）に従って算出した。ここにDtは電極材の
径、１は試験片の長さである。The electrode material holding portion 2b of the obtained electrode is cut in the vicinity of the bottom surface of the electrode material 3, and as shown in FIG.
10, the axial load was applied to the electrode material via the pin 11 to push out the electrode material 3, and the bonding strength was examined.
As shown in the table. In the same table, for reference, data of a conventional press-fitting (Comparative Example 1) and a caulking (Comparative Example 2) are also shown. The joining strength δ is δ = W /
It was calculated according to (π × Dt × 1). Here, Dt is the diameter of the electrode material, and 1 is the length of the test piece.
［発明の効果］ 以上の説明から明らかなように、本発明にかかる電極
材の製造方法によれば、電極材にクラック等が生じず、
電極材とホルダーとの接合程度が高い高品質の電極を製
造することが可能となった。 [Effects of the Invention] As is clear from the above description, according to the method for manufacturing an electrode material according to the present invention, cracks and the like do not occur in the electrode material,
It has become possible to manufacture high-quality electrodes with a high degree of bonding between the electrode material and the holder.
第１図（ａ）、（ｂ）は電極の正面図および側面図、第
２図（ａ）、（ｂ）はかしめ法の説明図、第３図
（ａ）、（ｂ）および第４図（ａ）、（ｂ）はろう接法
の説明図、第５図は異なる電極をあらわす側面図、第６
図は接合強度試験方法の説明図である。 １……電極、２……ホルダー、３……電極材、５……嵌
合孔、７……細孔1 (a) and 1 (b) are a front view and a side view of an electrode, FIGS. 2 (a) and 2 (b) are explanatory diagrams of a caulking method, and FIGS. 3 (a), (b) and 4 (A), (b) are explanatory views of the brazing method, FIG. 5 is a side view showing different electrodes, FIG.
The figure is an explanatory diagram of the bonding strength test method. 1 ... electrode 2 ... holder 3 ... electrode material 5 ... fitting hole 7 ... pore
Claims (1)
グ層を表面に形成した放電特性の優れた電極材を、該電
極材が嵌合する凹部と該凹部から外面に通ずる細孔が形
成された銅又は銅合金のホルダーに嵌合し、ホルダーの
融点以下のろう接温度を有するろう材を用いて非酸化性
雰囲気中で電極材をホルダーにろう接一体化することを
特徴とする電極の製造方法。An electrode material having excellent discharge characteristics, having a metal coating layer having good wettability on the surface of a brazing material formed on a surface thereof, is formed with a concave portion in which the electrode material is fitted and pores communicating from the concave portion to the outer surface. The electrode is characterized in that the electrode material is brazed and integrated with the holder in a non-oxidizing atmosphere using a brazing material having a brazing temperature equal to or lower than the melting point of the holder. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13068989A JP2696395B2 (en) | 1989-05-23 | 1989-05-23 | Electrode manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13068989A JP2696395B2 (en) | 1989-05-23 | 1989-05-23 | Electrode manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02307667A JPH02307667A (en) | 1990-12-20 |
| JP2696395B2 true JP2696395B2 (en) | 1998-01-14 |
Family
ID=15040269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13068989A Expired - Fee Related JP2696395B2 (en) | 1989-05-23 | 1989-05-23 | Electrode manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2696395B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3298194B2 (en) * | 1992-05-12 | 2002-07-02 | 富士電機株式会社 | Soldering method |
| KR100478140B1 (en) * | 2000-11-02 | 2005-03-22 | 재단법인 포항산업과학연구원 | Method for Manufacturing Plasma Cutting Electrode |
| US6483070B1 (en) * | 2001-09-26 | 2002-11-19 | The Esab Group, Inc. | Electrode component thermal bonding |
-
1989
- 1989-05-23 JP JP13068989A patent/JP2696395B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02307667A (en) | 1990-12-20 |
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