JP2695851B2 - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
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- JP2695851B2 JP2695851B2 JP63183082A JP18308288A JP2695851B2 JP 2695851 B2 JP2695851 B2 JP 2695851B2 JP 63183082 A JP63183082 A JP 63183082A JP 18308288 A JP18308288 A JP 18308288A JP 2695851 B2 JP2695851 B2 JP 2695851B2
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- resin composition
- photosensitive resin
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- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、特にアルカリ現像型フォトレジストとして
有用な感光性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a photosensitive resin composition particularly useful as an alkali-developing photoresist.
（従来の技術） フォトレジストはプリント配線板を製造する際に使用
されている。フォトレジストとして用いられるドライフ
ィルムは、近年、その低作業性、環境汚染性を改善し、
且つコスト低減のため、溶剤現像型からアルカリ現像型
へと移行している。このアルカリ現像型ドライフィルム
の使用方法は、（１）その感光層を基板に積層して熱圧
着し、 （２）パターンマスクフィルム等を通して画像形成する
ため露光し、（３）アルカリ現像液（炭酸ソーダー水）
等でフォトレジスト露光の露光部（未架橋部）を選択的
に溶解除去し、銅面部分の露出によりレジストパターン
を形成し、（４）形成されたレジストをマスクして、銅
面表面をメッキ、またはエッチング処理し、（５）フォ
トレジストを水酸化ナトリウム水溶液、または水酸化カ
リウム水溶液により剥離するといった工程に用いられて
いる。(Prior Art) Photoresists are used when manufacturing printed wiring boards. Dry films used as photoresists have recently improved their low workability and environmental pollution,
In order to reduce costs, the development has shifted from the solvent development type to the alkali development type. This alkali developing dry film can be used by (1) laminating the photosensitive layer on a substrate and thermocompression bonding; (2) exposing to light through a pattern mask film or the like to form an image; Soda water)
The exposed portion (uncrosslinked portion) of the photoresist exposure is selectively dissolved and removed, and a resist pattern is formed by exposing the copper surface portion. (4) The formed resist is masked and the copper surface is plated Or (5) stripping the photoresist with an aqueous solution of sodium hydroxide or potassium hydroxide.
これらの製造工程中、フォトレジストの要求性能とし
ては、エッチングおよびメッキ処理において、マスクと
しての十分な耐性を有していなければならないことであ
る。特に、メッキ時に生じる硬化レジストの剥離もしく
は膨潤により、銅基板表面へのメッキ液の浸み込みが起
こり、導線幅の広がりや導線周辺部の形状の乱れ等が問
題となる。During these manufacturing steps, the required performance of the photoresist is that the photoresist must have sufficient resistance as a mask in the etching and plating processes. In particular, the peeling or swelling of the hardened resist that occurs during plating causes the plating solution to soak into the copper substrate surface, causing problems such as an increase in the width of the conductive wire and a disorder in the shape of the peripheral portion of the conductive wire.
この種の問題は、硬化後のレジストの銅面への密着力
不足によるもので、特開昭50−9177号公報、特開昭51−
5934号公報にベンズイミダゾール、ベンズトリアゾール
のような含窒素複素環式化合物が密着促進剤としての効
果があることを開示している。This kind of problem is due to insufficient adhesion of the cured resist to the copper surface, and is disclosed in Japanese Patent Application Laid-Open Nos.
No. 5934 discloses that a nitrogen-containing heterocyclic compound such as benzimidazole or benztriazole has an effect as an adhesion promoter.
しかし、従来用いられている密着促進剤では、添加量
の増加に伴い、フォトレジストの感度低下、解像度の悪
化、現像・剥離後の銅面の色やけ、剥離後のエッチング
速度の遅延化、およびメッキ不良という原因になるた
め、実際には添加量に制限があり、従来の添加量では、
線幅の狭い配線パターンの部分での密着性は十分とはい
えない。また、米国特許4,680,249では、カルボキシベ
ンゾトリアゾールが用いられているが、このもの自身の
溶解性の問題から分散が悪く、十分な効果が得られな
い。However, with the conventionally used adhesion promoters, as the amount of addition increases, the sensitivity of the photoresist decreases, the resolution deteriorates, the coloration of the copper surface after development and peeling, the etching rate after peeling, and Actually, there is a limit to the amount to be added because it causes plating failure.
Adhesion at the portion of the wiring pattern having a small line width is not sufficient. In U.S. Pat. No. 4,680,249, carboxybenzotriazole is used. However, carboxybenzotriazole is poorly dispersed due to its own solubility problem, and a sufficient effect cannot be obtained.
（発明が解決しようとする課題） 本発明者は、上記のような従来の課題を解決するため
鋭意研究の結果、感光性樹脂組成物中に溶解・分散性の
良い特定の加工物を極めて少量添加することにより、金
属面への密着力を強化し、優れた耐メッキ性、耐エッチ
ング液性、耐薬品性を持たせ、しかも、現像後・剥離後
においては、露出した金属面への色やけを起こさないこ
とを見いだし、本発明に至った。(Problem to be Solved by the Invention) As a result of intensive studies to solve the conventional problems as described above, the present inventor has found that a very small amount of a specific processed product having good dissolution and dispersibility in a photosensitive resin composition is obtained. The addition enhances adhesion to metal surfaces and provides excellent plating resistance, etchant resistance, and chemical resistance. In addition, after development and peeling, the color on the exposed metal surface is improved. The inventors have found that no burn is caused, and have reached the present invention.
（課題を解決するための手段） 本発明は， （ａ）下記の一般式（１）で示される含窒素複素環式化
合物 （式中、ｎは１〜３の整数、R1,R2はそれぞれ炭素数１
〜12のアルキル基又はヒドロキシアルキル基を表
す。）、 （ｂ）熱可塑性重合体、 （ｃ）末端エチレン基を少なくとも１個有する光重合性
モノマー、 （ｄ）光重合開始剤、 および （ｅ）有機ハロゲン化合物、 を含む感光性樹脂組成物を提供するものである。(Means for Solving the Problems) The present invention provides: (a) a nitrogen-containing heterocyclic compound represented by the following general formula (1): (Wherein, n is an integer of 1 to 3, R 1 and R 2 each have 1 carbon atom.
Represents up to 12 alkyl groups or hydroxyalkyl groups. ), (B) a thermoplastic polymer, (c) a photopolymerizable monomer having at least one terminal ethylene group, (d) a photopolymerization initiator, and (e) an organic halogen compound. To provide.
本発明に係る感光性樹脂組成物において、上記の一般
式（１）で示される化合物としては、Ｎ（N,N−ジ−２
−エチルヘキシル）アミノメチレンカルボキシベンゾト
リアゾール、Ｎ（N,N−ジ−２−ヒドロキシルエチル）
アミノメチレンベンゾトリアゾール、Ｎ（N,N−ジ−２
−エチルヘキシル）アミノエチレンカルボキシベンゾト
リアゾール等が挙げられ、その中でも、Ｎ（N,N−ジ−
２−エチルヘキシル）アミノメチレンカルボキシベンゾ
トリアゾールが好ましい。In the photosensitive resin composition according to the present invention, the compound represented by the general formula (1) may be N (N, N-di-2).
-Ethylhexyl) aminomethylenecarboxybenzotriazole, N (N, N-di-2-hydroxylethyl)
Aminomethylenebenzotriazole, N (N, N-di-2
-Ethylhexyl) aminoethylenecarboxybenzotriazole and the like, and among them, N (N, N-di-
2-Ethylhexyl) aminomethylenecarboxybenzotriazole is preferred.
この化合物の量は、有機溶剤を除く全組成物100重量
部に対し0.001〜２重量部の範囲、特に好ましくは、0.0
5〜0.5重量部の範囲が良い。（ａ）成分の含有率が0.00
1重量部未満の場合、金属表面との密着力が弱いため、
耐メッキ性が落ち、２重量部より多いと、感光特性とし
て感度等が低下し、また、剥離性も悪くなる傾向にあ
る。The amount of this compound is in the range of 0.001 to 2 parts by weight, particularly preferably 0.02 parts by weight, per 100 parts by weight of the total composition excluding the organic solvent.
The range of 5 to 0.5 parts by weight is good. (A) Component content is 0.00
If it is less than 1 part by weight, the adhesion to the metal surface is weak,
When the plating resistance is reduced, and when the content is more than 2 parts by weight, sensitivity and the like as photosensitive characteristics are reduced, and the releasability tends to be deteriorated.
本発明の組成物を構成するバインダー用熱可塑性樹脂
（ｂ）としては、アルカリ現像液に可溶もしくは膨潤す
るもので、フィルム形成性ポリマーであれば特に制限は
ない。好ましくは、重量平均分子量の範囲として２万〜
20万であり、カルボキシル基含有率が15〜50モル％の線
状共重合体が良い。また、このバインダー用熱可塑性樹
脂（ｂ）は、全組成物中有機溶剤を除く30〜70重量部の
範囲で使用するのが好ましい。The thermoplastic resin (b) for a binder constituting the composition of the present invention is not particularly limited as long as it is soluble or swellable in an alkaline developer and is a film-forming polymer. Preferably, the weight average molecular weight ranges from 20,000 to
A linear copolymer having a molecular weight of 200,000 and a carboxyl group content of 15 to 50 mol% is preferred. The thermoplastic resin (b) for a binder is preferably used in the range of 30 to 70 parts by weight excluding the organic solvent in the whole composition.
この線状共重合単量体としては、メタクリル酸メチル
を主成分として、他に（メタ）アクリル酸ブチル（アク
リル酸ブチルまたはメタクリル酸ブチルの意、以下同
様）、（メタ）アクリル酸エチル、（メタ）アクリル酸
プロピル酸プロピル、（メタ）アクリル酸２−エチルヘ
キシル、（メタ）アクリル酸ラウリル、（メタ）アクリ
ル酸２−ヒドロキシエチル、（メタ）アクリル酸２−ヒ
ドロキシプロピル、アクリルアミド、アクリロニトリ
ル、（メタ）アクリル酸ジメチルアミノエチル、カルボ
ン酸を有するビニル共重合体としては、アクリル酸、メ
タクリル酸、イタコン酸、フマル酸、マレイン酸等を常
法により重合することによって得られる。Examples of the linear copolymerizable monomer include methyl methacrylate as a main component, butyl (meth) acrylate (meaning butyl acrylate or butyl methacrylate, the same applies hereinafter), ethyl (meth) acrylate, ( Propyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, acrylamide, acrylonitrile, (meth) The dimethylaminoethyl acrylate and the vinyl copolymer having a carboxylic acid can be obtained by polymerizing acrylic acid, methacrylic acid, itaconic acid, fumaric acid, maleic acid and the like by a conventional method.
末端エチレン基を少なくとも１個有する光重合性モノ
マー（ｃ）としては、例えば、トリメチロールプロパン
トリ（メタ）アクリレート、ペンタエリスリトールトリ
（メタ）アクリレート、ポリエチレングリコールジ（メ
タ）アクリレート、ペンタエリスリトールジ（メタ）ア
クリレート等のポリオールの（メタ）アクリレートやエ
ポキシ（メタ）アクリレート、ウレタン（メタ）アクリ
レート等が挙げられる。これらは１種または２種以上併
用して用いられ、有機溶剤を除く全組成物中10〜70重量
部の範囲で使用するのが好ましい。この量が10重量％未
満であると、硬化皮膜が十分で無く、感度の低下も起こ
り、また70重量％を越えるとレジスト層が柔らかくな
り、コールドフローを起こし易い。Examples of the photopolymerizable monomer (c) having at least one terminal ethylene group include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, polyethylene glycol di (meth) acrylate, and pentaerythritol di (meth) And (meth) acrylates, epoxy (meth) acrylates and urethane (meth) acrylates of polyols such as acrylates. These are used alone or in combination of two or more, and are preferably used in the range of 10 to 70 parts by weight in the whole composition excluding the organic solvent. If the amount is less than 10% by weight, the cured film is not sufficient and the sensitivity is lowered. If it exceeds 70% by weight, the resist layer becomes soft and cold flow is liable to occur.
本発明の組成物を構成する光重合性開始剤（ｄ）とし
ては、例えばベンゾフェノン、4,4−ビス（ジエチルア
ミノ）ベンゾフェノン、ｔ−ブチルアントラキノン、２
−エチルアントラキノン、チオキサントン類、ベンゾイ
ンエーテル類、ベンジルケタール類等が挙げられ、これ
らは１種、もしくは２種以上を併用できる。組成物中の
光重合性開始剤の使用量は感度、解像度等のバランスの
点から0.5〜10重量部が好ましい。0.5重量部未満の場合
は、感光層に活性光線（カーボンアーク灯、超高圧水銀
灯、高圧水銀灯、キセノンランプ等）を照射して硬化さ
せる際、硬化が十分に進行せず、10重量部より多い場合
は、感光層の活性光線に対する感度が高すぎるため、解
像度が低下する傾向がある。Examples of the photopolymerizable initiator (d) constituting the composition of the present invention include benzophenone, 4,4-bis (diethylamino) benzophenone, t-butylanthraquinone,
-Ethylanthraquinone, thioxanthones, benzoin ethers, benzyl ketals and the like, and these can be used alone or in combination of two or more. The amount of the photopolymerizable initiator used in the composition is preferably 0.5 to 10 parts by weight from the viewpoint of the balance between sensitivity and resolution. When the amount is less than 0.5 parts by weight, when the photosensitive layer is irradiated with an actinic ray (carbon arc lamp, ultra-high pressure mercury lamp, high-pressure mercury lamp, xenon lamp, etc.) and cured, the curing does not proceed sufficiently, and the amount is more than 10 parts by weight. In such a case, the sensitivity of the photosensitive layer to actinic rays is too high, and the resolution tends to decrease.
また、本発明において使用する有機ハロゲン化合物
（ｅ）は、コントラストの向上、メッキ性の向上がみら
れる。有機ハロゲン化合物の例としては、トリブロモア
セトフェノン、ビス−（トリブロモメチル）スルホン、
トリブロモメチルフェニルスルホン、四臭化炭素等が挙
げられる。The organic halogen compound (e) used in the present invention has improved contrast and improved plating properties. Examples of the organic halogen compound include tribromoacetophenone, bis- (tribromomethyl) sulfone,
Tribromomethylphenyl sulfone, carbon tetrabromide and the like.
本発明においては、更にベンゾチアゾールもしくはそ
の誘導体（ｆ）を併用することが好ましい。この併用に
よって含窒素複素環式化合物（ａ）を単独で用いる場合
よりも、特に解像度、導線周辺部の形状等の密着性、耐
メッキ性に効果がある。ベンゾチアゾール誘導体として
は、アミノベンゾチアゾール、メチルベンゾチアゾール
が挙げられ、全組成物中0.01〜２重量部の範囲で使用す
るのが好ましい。In the present invention, benzothiazole or its derivative (f) is preferably used in combination. This combination is more effective than the case where the nitrogen-containing heterocyclic compound (a) is used alone, particularly in the resolution, the adhesion such as the shape of the periphery of the conductive wire, and the plating resistance. Examples of the benzothiazole derivative include aminobenzothiazole and methylbenzothiazole, and it is preferable to use 0.01 to 2 parts by weight of the total composition.
本発明に係る感光性樹脂組成物は、メチルエチルケト
ン、メチルセロソルブ、メチルエチルケトン／メチルア
ルコールの混合物、塩化メチレン、もしくはイソプロピ
ルアルコール等の有機溶剤を用いて溶液とする。The photosensitive resin composition according to the present invention is made into a solution using an organic solvent such as methyl ethyl ketone, methyl cellosolve, a mixture of methyl ethyl ketone / methyl alcohol, methylene chloride, or isopropyl alcohol.
本発明に係る感光性樹脂組成物には、更に必要に応じ
て可塑剤、熱重合禁止剤、充填剤、染料、顔料、難燃
剤、安定剤、密着付与剤を添加することができる。The photosensitive resin composition according to the present invention may further contain a plasticizer, a thermal polymerization inhibitor, a filler, a dye, a pigment, a flame retardant, a stabilizer, and an adhesion promoter, if necessary.
以上述べたような成分組成からなる本発明の感光性樹
脂組成物は、金属面、例えば、銅、ニッケル等の基板上
にラミネートして用いられる。The photosensitive resin composition of the present invention having the above-described component composition is used by being laminated on a metal surface, for example, a substrate made of copper, nickel or the like.
使用法としては、ポリエステルを支持フィルムとして
用い、乾燥後、ポリエチレンまたはポリプロピレンのよ
うな不活性なポリオレフィンフィルムを保護フィルムと
して用い、積層してドライフィルムとする。また、液状
レジストとして用いる場合には、基板上にスクリーン印
刷機またはロールコーターにより、直接塗布し、乾燥
後、保護フィルムを被覆して用いられる。As a method of use, polyester is used as a support film, and after drying, an inert polyolefin film such as polyethylene or polypropylene is used as a protective film, and laminated to form a dry film. When used as a liquid resist, it is applied directly onto a substrate by a screen printing machine or a roll coater, dried and then coated with a protective film.
以下、実施例により本発明を更に詳細に説明するが、
実施例中の部は重量部を表わす。Hereinafter, the present invention will be described in more detail by examples,
Parts in Examples are parts by weight.
（実施例） 熱可塑性樹脂の合成例 80℃に加熱したメチルエチルケトン150部に、メタク
リル酸メチル60部、アクリル酸２−エチルヘキシル15
部、メタクリル酸ｎ−ブチル５部メタクリル酸20部、メ
チルエチルケトン200部、アゾビスイソブチルニトリル
0.2部の混合物を1.5時間で滴下し、滴下終了後、４時間
反応を続ける。更に、アゾビスイソブチルニトリル0.4
部をメチルエチルケトン20部に溶解させた溶液を15分間
で滴下した。滴下後、５時間反応させた溶液にメチルエ
チルケトン30部を添加して、バインダーワニスとした。
得られた溶液の特性は不揮発分33％、25℃での粘度1300
cps、重量平均分子量は約100,000である。(Example) Synthesis example of thermoplastic resin In 150 parts of methyl ethyl ketone heated to 80 ° C, 60 parts of methyl methacrylate and 15 parts of 2-ethylhexyl acrylate were added.
Part, n-butyl methacrylate 5 parts, methacrylic acid 20 parts, methyl ethyl ketone 200 parts, azobisisobutylnitrile
0.2 parts of the mixture is added dropwise over 1.5 hours, and the reaction is continued for 4 hours after completion of the addition. Further, azobisisobutylnitrile 0.4
A solution in which 20 parts of methyl ethyl ketone was dissolved was added dropwise over 15 minutes. After the dropwise addition, 30 parts of methyl ethyl ketone was added to the solution reacted for 5 hours to obtain a binder varnish.
The properties of the obtained solution are as follows: non-volatile content 33%, viscosity at 25 ° C. 1300
cps, weight average molecular weight is about 100,000.
実施例および比較例 表１に示す組成からなる感光性樹脂組成物を25μｍの
ポリエステルフィルムを支持フィルムとして、ナイフコ
ーターで塗布し、乾燥後の膜厚が40μｍとした。この上
に25μｍ厚のポリエチレンフィルムを保護フィルムとし
て積層し、ドライフィルムとした。Examples and comparative examples The photosensitive resin composition having the composition shown in Table 1 was applied by a knife coater using a 25 μm polyester film as a support film, and the film thickness after drying was 40 μm. A 25 μm-thick polyethylene film was laminated thereon as a protective film to obtain a dry film.
銅張り積層板の銅表面を研摩機により研摩し、水洗後
乾燥した。次に、基板にポリエチレンフィルムを除去し
たドライフィルムを110℃で熱圧着した。ラミネート後
の基板をネガフィルムを使用して、5kwの高圧水銀灯
（株式会社オーク製作所製）で露光を行い、１％の炭酸
ナトリウム水溶液により、スプレー（スプレー圧力1.5k
g/cm2）することによって現像した。The copper surface of the copper-clad laminate was polished with a grinder, washed with water and dried. Next, a dry film from which the polyethylene film had been removed was thermocompression-bonded to the substrate at 110 ° C. The laminated substrate is exposed using a negative film with a 5 kw high-pressure mercury lamp (manufactured by Oak Manufacturing Co., Ltd.), and sprayed with a 1% aqueous sodium carbonate solution (spray pressure 1.5 k
g / cm 2 ).
得られたレジスト像を酸性脱脂剤水溶液中に40℃で１
分間浸漬し、脱脂後、スプレー水洗を約１分間行い、次
に約１％の過硫酸アンモニウム水溶液中に１分間浸漬
し、スプレー水洗を約１分間行う。次に、約15％の硫酸
水溶液に１分間浸漬し、その後、硫酸銅メッキ槽（硫酸
銅75g/、硫酸190g/、塩素イオン50ppm等、温度25
℃）に入れて、60分間2.0A/dm2でメッキを行う。The obtained resist image is placed in an aqueous acidic degreasing solution at 40 ° C. for 1 hour.
After immersion for about 1 minute, after degreasing, spray water washing is performed for about 1 minute, and then immersed in about 1% ammonium persulfate aqueous solution for 1 minute, and spray water washing is performed for about 1 minute. Next, it is immersed in an aqueous solution of about 15% sulfuric acid for 1 minute, and then a copper sulfate plating tank (75 g of copper sulfate, 190 g of sulfuric acid, 50 ppm of chlorine ion, etc.
C) and plating at 2.0 A / dm 2 for 60 minutes.
メッキ終了後、直ちに水洗し、約15％のホウフッ化水
素酸水溶液に浸漬し、その後、半田メッキ槽（45％ホウ
フッ化錫64ml/、45％ホウフッ化鉛22ml/、42％ホウ
フッ化水素酸200ml/等、温度25℃）に入れて、20分間
1.5A/dm2でメッキを行い、水洗を行う。Immediately after plating, rinse with water and immerse in about 15% aqueous borofluoric acid solution, then solder plating tank (45% tin borofluoride 64ml /, 45% lead borofluoride 22ml /, 42% borofluoric acid 200ml) / Temperature, 25 ℃) for 20 minutes
Plating at 1.5 A / dm 2 and washing with water.
メッキ後の密着性試験、およびSEM像によるレジスト
の浮きの観察、光学顕微鏡による導線周辺部形状の観察
を行い、その結果を表２に示す。The adhesion test after plating, the observation of the floating of the resist by SEM images, and the observation of the shape of the periphery of the conducting wire by an optical microscope were performed. The results are shown in Table 2.
本発明に係る感光性樹脂組成物より得られたレジスト
は優れた耐メッキ性、耐薬品性を示す。 The resist obtained from the photosensitive resin composition according to the present invention exhibits excellent plating resistance and chemical resistance.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−223836（ＪＰ，Ａ) 特開 昭61−166541（ＪＰ，Ａ) 特開 平２−191955（ＪＰ，Ａ) 特開 昭61−86746（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-223836 (JP, A) JP-A-61-166541 (JP, A) JP-A-2-191955 (JP, A) JP-A-61-19561 86746 (JP, A)
Claims (3)
素複素環式化合物 （式中、ｎは１〜３の整数、R1,R2はそれぞれ炭素数１
〜12のアルキル基又はヒドロキシルアルキル基を表
す。）、 （ｂ）熱可塑性重合体、 （ｃ）末端エチレン基を少なくとも１個有する光重合性
モノマー、 （ｄ）光重合開始剤、 および （ｅ）有機ハロゲン化合物、 を含む感光性樹脂組成物。(A) a nitrogen-containing heterocyclic compound represented by the following general formula (1): (Wherein, n is an integer of 1 to 3, R 1 and R 2 each have 1 carbon atom.
Represents up to 12 alkyl groups or hydroxylalkyl groups. (B) a thermoplastic polymer; (c) a photopolymerizable monomer having at least one terminal ethylene group; (d) a photopolymerization initiator; and (e) an organic halogen compound.
含んでなる請求項１記載の感光性樹脂組成物。2. The photosensitive resin composition according to claim 1, further comprising benzothiazole or a derivative thereof.
物を支持フィルムに塗工してなるドライフィルム。3. A dry film obtained by applying the photosensitive resin composition according to claim 1 to a support film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63183082A JP2695851B2 (en) | 1988-07-22 | 1988-07-22 | Photosensitive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63183082A JP2695851B2 (en) | 1988-07-22 | 1988-07-22 | Photosensitive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0233148A JPH0233148A (en) | 1990-02-02 |
| JP2695851B2 true JP2695851B2 (en) | 1998-01-14 |
Family
ID=16129447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63183082A Expired - Lifetime JP2695851B2 (en) | 1988-07-22 | 1988-07-22 | Photosensitive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2695851B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2767174B2 (en) * | 1992-10-30 | 1998-06-18 | 日本合成化学工業株式会社 | Photosensitive resin composition |
| JP2000347391A (en) * | 1999-03-29 | 2000-12-15 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using same, manufacture of resist pattern and printed circuit board |
| JP2001013679A (en) * | 1999-04-30 | 2001-01-19 | Toagosei Co Ltd | Resist composition |
| JP4259855B2 (en) * | 2002-11-26 | 2009-04-30 | 旭化成エレクトロニクス株式会社 | Photosensitive resin composition |
| JP6567952B2 (en) * | 2015-10-26 | 2019-08-28 | 旭化成株式会社 | Photosensitive resin composition, photosensitive resin laminate, and resist pattern forming method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61166541A (en) * | 1985-01-19 | 1986-07-28 | Fuotopori Ouka Kk | Photopolymerizable composition |
| JPS61223836A (en) * | 1985-03-29 | 1986-10-04 | Hitachi Chem Co Ltd | Photosensitive resin composition and its laminate |
-
1988
- 1988-07-22 JP JP63183082A patent/JP2695851B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0233148A (en) | 1990-02-02 |
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