JPH0233148A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
JPH0233148A
JPH0233148A JP18308288A JP18308288A JPH0233148A JP H0233148 A JPH0233148 A JP H0233148A JP 18308288 A JP18308288 A JP 18308288A JP 18308288 A JP18308288 A JP 18308288A JP H0233148 A JPH0233148 A JP H0233148A
Authority
JP
Japan
Prior art keywords
compound
formula
resin composition
photosensitive resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18308288A
Other languages
Japanese (ja)
Other versions
JP2695851B2 (en
Inventor
Toshifumi Kamimura
Juichi Sawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Ink SC Holdings Co Ltd
Original Assignee
Toyo Ink SC Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink SC Holdings Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Priority to JP63183082A priority Critical patent/JP2695851B2/en
Publication of JPH0233148A publication Critical patent/JPH0233148A/en
Application granted granted Critical
Publication of JP2695851B2 publication Critical patent/JP2695851B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To enhance adhesion of a dry film to a metal face and resistances to plating and chemicals by adding a small amount of specified N-containing hereocyclic compound to the title composition.
CONSTITUTION: The title composition contains the N-containing heterocyclic compound of formula I, such as N-(N,N-di-2-ethylhexyl) aminomethylenecarboxybenzotriazole, a thermoplastic polymer, and a photopolymerizable monomer having one terminal ethylene group, such as trimethylolpropane tri(meth)acrylate, and a photopolymerization initiator, and an org. halogen compound, such as carbon tetrabromide. In formula I, (n) is 1, 2, or 3, and each of R1 and R2 is 1-12C (hydroxy)alkyl. It is preferred further to add benzothiazol (derivatives) to the composition.
COPYRIGHT: (C)1990,JPO&Japio
JP63183082A 1988-07-22 1988-07-22 Photosensitive resin composition Expired - Lifetime JP2695851B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63183082A JP2695851B2 (en) 1988-07-22 1988-07-22 Photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63183082A JP2695851B2 (en) 1988-07-22 1988-07-22 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
JPH0233148A true JPH0233148A (en) 1990-02-02
JP2695851B2 JP2695851B2 (en) 1998-01-14

Family

ID=16129447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63183082A Expired - Lifetime JP2695851B2 (en) 1988-07-22 1988-07-22 Photosensitive resin composition

Country Status (1)

Country Link
JP (1) JP2695851B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06148881A (en) * 1992-10-30 1994-05-27 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition
JP2000347391A (en) * 1999-03-29 2000-12-15 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using same, manufacture of resist pattern and printed circuit board
JP2001013679A (en) * 1999-04-30 2001-01-19 Toagosei Co Ltd Resist composition
JP2004177597A (en) * 2002-11-26 2004-06-24 Asahi Kasei Electronics Co Ltd Photosensitive resin composition
CN106918993A (en) * 2015-10-26 2017-07-04 旭化成株式会社 Photosensitive polymer combination, photoresist layered product and protection pattern formation method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166541A (en) * 1985-01-19 1986-07-28 Fuotopori Ouka Kk Photopolymerizable composition
JPS61223836A (en) * 1985-03-29 1986-10-04 Hitachi Chem Co Ltd Photosensitive resin composition and its laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166541A (en) * 1985-01-19 1986-07-28 Fuotopori Ouka Kk Photopolymerizable composition
JPS61223836A (en) * 1985-03-29 1986-10-04 Hitachi Chem Co Ltd Photosensitive resin composition and its laminate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06148881A (en) * 1992-10-30 1994-05-27 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition
JP2000347391A (en) * 1999-03-29 2000-12-15 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using same, manufacture of resist pattern and printed circuit board
JP2001013679A (en) * 1999-04-30 2001-01-19 Toagosei Co Ltd Resist composition
JP2004177597A (en) * 2002-11-26 2004-06-24 Asahi Kasei Electronics Co Ltd Photosensitive resin composition
CN106918993A (en) * 2015-10-26 2017-07-04 旭化成株式会社 Photosensitive polymer combination, photoresist layered product and protection pattern formation method

Also Published As

Publication number Publication date
JP2695851B2 (en) 1998-01-14

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