JP2620949B2 - Photosensitive resin composition - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a photosensitive resin composition having excellent adhesion to a metal.

2. Description of the Related Art A laminated film obtained by coating a photosensitive resin composition in layers on a base film (usually using a polyester film) and then laminating a protective film (usually using a polyethylene film) on the base film is generally a dry film. It is widely used for manufacturing printed wiring boards and precision metal processing.

In the use, first, the protective film is peeled off from the dry film, the photosensitive resin composition layer side is adhered to the copper surface of the copper-clad substrate, and then the pattern mask is exposed on the base film ( In some cases, exposure is performed after the base film is removed, and then the base film is removed and subjected to development. As a development method after exposure, there are a solvent development type and a dilute alkali development type.

In addition to the dry film, the photosensitive resin composition is applied directly on the metal surface and layered, and the pattern mask is adhered through a film such as a polyester film laminated on it,
Exposure methods are also well known.

In the case of dry film, if the adhesion to metal is low, part of the resist may rise from the substrate when cutting the dry film after lamination or peeling off the base film before development after exposure. Troubles such as chipping may occur.

If the adhesion to the metal is insufficient, the developing solution, the etching solution (in the case of the etching method), the plating pretreatment agent and the plating solution (in the case of the plating method) infiltrate from the interface between the resist and the metal, and Good pattern reproducibility cannot be obtained due to floating, under-etching or under-plating, and in severe cases, disconnection or short circuit may be caused, resulting in defective products.

Therefore, in order to improve such poor adhesion between the resist and the metal, a method of adding an adhesion promoter to the photosensitive resin composition, a method of improving the binder polymer, and physically roughening the photoresist layer Methods, and so on.

References regarding the above method include Japanese Patent Publication No. 58-2403.
No. 5 (benzotriazole, benzimidazole,
Benzothiazole and the like), JP-A-56-67845 (diphenylthiocarbazone), JP-A-57-192946 (heterocyclic compound), JP-A-59-46642 (monoazaindole and its derivatives) Derivatives), JP-A-59-48752
JP (Imidazole, thiazole, tetrazole, triazole), JP-A-59-113432 (carbothioamide derivative), JP-A-59-125725 (rhodamines), JP-A-59-125726 (tetrazole) Or its derivatives), JP-A-59-125727 (rophin), JP-A-59-125728 (theophylline), and JP-A-59-15
No. 2439 (2-substituted-4,6-dithiol-s-triazine derivative), Japanese Patent Application Laid-Open No. Sho 60-133591 (tetrazole thiol), Japanese Patent Application Laid-Open No. Sho 60-138540 (heterocyclic thiol compound), JP-A-60-12543 (diazole compound), JP-A-60-12544 (diazole compound),
JP-A-61-166541 (benzotriazole carboxylic acids), JP-A-61-172139 (heterocyclic thiol compound), JP-A-61-186952 (5-aminotetrazole), JP-A-61-16952 JP-A-190330 (β-diketone derivative), JP-A-61-198146 (heterocyclic compound), JP-A-61-223836 (heterocyclic compound) and the like.

References relating to the above method include JP-A-57-1924.
JP-A No. 20 (copolymerizing an aliphatic azo group-containing monomer) and JP-A-60-19135 (comprising polyvinyl butyral).

References relating to the above method include JP-A-60-3963.
No. 5 (using matte polyethylene or roughening the photoresist layer with a brush-like one).

As described above, in the steps of laminating a photosensitive resin composition layer on a metal surface such as a copper surface of a copper-clad substrate, exposing, etching, and plating, strong adhesion between a resist and a metal is required. In the cured resist removing step, it is required that the cured resist is easily peeled and removed.

In the case of a solvent-developable photosensitive resin composition, the removal of the cured resist is relatively easily performed using a solvent, but methylene chloride and the like used as this kind of solvent have toxicity and Due to high cost, there are industrial restrictions.

On the other hand, in the case of a diluted alkali-developing photosensitive resin composition, it is industrially advantageous to perform stripping and removal of the cured resist using an alkali stripping solution, and recently, this method is often used. However, there is a problem in that productivity is reduced due to a slow peeling rate, and in the case of solder plating, Sn and Pb are eluted with alkali. Discoloration occurs, resulting in defective products such as poor etching and poor soldering.

A method of adding butyl cellosolve, an amine compound, a nitrogen-containing heterocyclic compound, or the like to the stripping solution has been proposed in order to improve the stripping and removing properties of the cured resist using an alkali stripping solution. (For example, Japanese Patent Application Laid-Open No. 62-50832,
As another method for improving the strippability of a cured resist with an alkali stripping solution, a method of improving the photosensitive resin composition from the side has been proposed, as disclosed in JP-A-62-106459. JP-A-57337 and JP-A-60-80843 disclose a method of introducing a large number of carboxylic acid groups into a binder polymer.

Problems to be Solved by the Invention Among the methods for improving the adhesion between a resist and a metal, the method of adding an adhesion-imparting agent requires the addition of a large amount of the adhesion-imparting agent, or the metal surface after the resist is removed turns red. May adversely affect the etching, plating, and soldering, or may affect the photosensitive properties and impair the stability of the composition. Often causes poor removability.

When stripping and removing the cured resist with an alkali stripping solution, butyl cellosolve, an amine compound,
The method of adding a nitrogen-containing heterocyclic compound or the like has disadvantages in that a material having solvent resistance must be used for the stripping device, and the waste liquid load increases.

In addition, the method of introducing a large amount of carboxylic acid groups into the binder polymer to improve the peelability of the cured resist may reduce the chemical resistance of the resist or impair the properties of other resists. Even if improved, the adhesion to the metal may be reduced.

In view of such circumstances, the present invention provides a photosensitive resin composition having good adhesion to a metal, and when a photosensitive resin composition of a dilute alkali development type is used, the adhesion to a metal is improved. It is an object of the present invention to provide a photosensitive resin composition having good properties and a good removability of a cured resist with an alkali stripping solution.

Means for Solving the Problems The photosensitive resin composition of the present invention is a composition comprising a base polymer (A), a photopolymerizable monomer (B) and a photopolymerization initiator (C), At least a part of the monomer (B) is an acetoacetyl group-containing ethylenically unsaturated compound (b).

 Hereinafter, the present invention will be described in detail.

Base Polymer (A) As the base polymer (A), various polymers conventionally used as a base polymer of a base resin / photopolymerizable monomer / photopolymerization initiator-based photosensitive resin composition, for example, acrylic polymers Resins, polyester resins, polyamide resins, polyurethane resins, epoxy resins, polyvinyl alcohol resins, and the like can be used.

Particularly preferred resin as the base polymer (A) is an acrylic resin containing an acrylate or / and a methacrylate as a main component and optionally copolymerizing an ethylenically unsaturated carboxylic acid or another copolymerizable monomer. is there. When using a dilute alkali developing type, the ethylenically unsaturated carboxylic acid is added in an amount of about 15 to 30% by weight (acid value of 100 to 200%).
It is necessary to copolymerize (about mgKOH / g).

Here, as the acrylate, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate,
Benzyl acrylate, dimethylaminoethyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, glycidyl acrylate and the like are exemplified.Examples of methacrylates include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, hexyl methacrylate,
Examples thereof include 2-ethylhexyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, dimethylaminoethyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and glycidyl methacrylate.

As the ethylenically unsaturated carboxylic acid, acrylic acid,
Monocarboxylic acids such as methacrylic acid and crotonic acid are preferably used, and dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid, or anhydrides and half esters thereof can also be used. Among these, acrylic acid and methacrylic acid are preferred.

Examples of other copolymerizable monomers include acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, styrene, α-methylstyrene, vinyl acetate, and alkyl vinyl ether.

Photopolymerizable monomer (B) As the photopolymerizable monomer (B), a photopolymerizable monomer at least part of which is an acetoacetyl group-containing ethylenically unsaturated compound (b) is used.

First, as the photopolymerizable monomer (B) other than the acetoacetyl group-containing ethylenically unsaturated compound (b), ethylene glycol diacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, Butylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexane glycol diacrylate, trimethylolpropane triacrylate, glycerin diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, 2,2- Bis (4-acryloxydiethoxyphenyl) propane, 2,2-bis (4-
(Acryloxypolyethoxyphenyl) propane, 2-hydroxy-3-acryloyloxypropyl acrylate, ethylene glycol diglycidyl ether diacrylate, diethylene glycol diglycidyl ether diacrylate, 1,6-hexamethyldiglycidyl ether diacrylate, diglycidyl phthalate Ester diacrylate, glycerin polyglycidyl ether polyacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, propylene glycol dimethacrylate, polypropylene glycol dimethacrylate, butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6 -Hexane glycol dimethacrylate G, trimethylolpropane trimethacrylate, glycerin dimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, dipentaerythritol pentamethacrylate, 2,2-bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis ( 4-methacryloxypolyethoxyphenyl) propane, 2-hydroxy-3-methacryloyloxypropyl methacrylate, ethylene glycol diglycidyl ether dimethacrylate, diethylene glycol diglycidyl ether dimethacrylate, 1,6-hexamethyldiglycidyl ether dimethacrylate, phthalic acid Multifunctional monomers such as diglycidyl ester dimethacrylate and glycerin polyglycidyl ether polymethacrylate It is below. An appropriate amount of a monofunctional monomer can be used together with these polyfunctional monomers.

Examples of monofunctional monomers include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate,
2-hydroxybutyl acrylate, 2-phenoxy-
2-hydroxypropyl acrylate, 2-acryloyloxy-2-hydroxypropyl phthalate, 3-chloro-2-hydroxypropyl acrylate, glycerin monoacrylate, 2-acryloyloxyethyl acid phosphate, half acrylate of phthalic acid derivative, N-methylol acrylamide And 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate,
-Phenoxy-2-hydroxypropyl methacrylate, 2-methacryloyloxy-2-hydroxypropyl phthalate, 3-chloro-2-hydroxypropyl methacrylate, glycerin monomethacrylate, 2-methacryloyloxyethyl acid phosphate, half methacrylate of phthalic acid derivative, N -Methylol methacrylamide and the like.

Acetoacetyl group-containing ethylenically unsaturated compound (b) The acetoacetyl group-containing ethylenically unsaturated compound (b) of the photopolymerizable monomer (B) is obtained, for example, by the following method.

The diketene is reacted with the functional group-containing ethylenically unsaturated compound.

A transesterification reaction between the functional group-containing ethylenically unsaturated compound and the acetoacetic ester is performed.

Examples of the functional group in the above case include a hydroxyl group, an amide group, a urethane group, an amino group and a carboxy group.

Here, as the functional group-containing ethylenically unsaturated compound,
A polyfunctional monomer or a monofunctional monomer as described in the section of the photopolymerizable monomer (B) is used.

The reaction of diketene in the above case should be carried out in the absence of a catalyst and in the presence of a catalyst of a tertiary amine, an acid (such as sulfuric acid), a basic salt (such as sodium acetate), or an organic metal compound (such as dibutyltin laurylate). Can be.

The reaction of the acetoacetic ester in the above case is desirably performed in the presence of a transesterification catalyst such as calcium acetate, zinc acetate, and lead oxide.

Photopolymerization initiator (C) Examples of the photopolymerization initiator (C) include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n
Butyl ether, benzoin phenyl ether, benzyl diphenyl disulfide, azobisisobutyronitrile, dibenzyl, diacetyl, anthraquinone, naphthoquinone, benzophenone, p, p'-bis (dimethylamino) benzophenone, pivaloin ethyl ether, benzoyl peroxide, Benzyl ketal, 1,1-dichloroacetophenone, pt-butyldichloroacetophenone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2 -Dichloro-4-phenoxyacetophenone, Michler's ketone, phenylglyoxylate, α-hydroxyisobutylphenone, dibezosparone, benzophenoneamine, 1- (4-isopropyl Eniru) -2-hydroxy-2-methyl-1-propanone, 2-methyl - [4-
(Methylthio) phenyl] -2-morpholino-1-propanone, leuco crystal violet, tribromophenylsulfone, tribromomethylphenylsulfone, p-methoxyphenol, Victoria Pure Blue and the like, and these may be used in an appropriate combination. Can be.

Next, the ratio of each component constituting the photosensitive resin composition will be described.

The ratio of the photopolymerizable monomer (B) to 100 parts by weight of the base polymer (A) is desirably selected from the range of 5 to 150 parts by weight, particularly 40 to 100 parts by weight. Insufficient photopolymerizable monomer (B) causes poor curing, reduced flexibility, and delays in development speed. Excessive photopolymerizable monomer (B) results in increased tackiness, cold flow, and reduced peeling speed of the cured resist. Invite.

The proportion of the acetoacetyl group-containing ethylenically unsaturated compound (b) in the photopolymerizable monomer (B) is preferably 1 to 100% by weight, particularly preferably 5 to 40% by weight. If the proportion of the acetoacetyl group-containing ethylenically unsaturated compound (b) is too small, the intended purpose cannot be achieved.

The mixing ratio of the photopolymerization initiator (C) is 0.5 to the total amount of the base polymer (A) and the photopolymerizable monomer (B).
It is appropriate to use about 10% by weight.

In addition to the above components, known additives such as a polymerization inhibitor, a solvent, a plasticizer, a colorant, a surface tension modifier, a stabilizer, and an antifoaming agent can be added.

Layering method The above photosensitive resin composition is applied to a base film surface such as a polyester film, and then coated with a protective film such as a polyethylene film or a polyvinyl alcohol film from the coated surface to form a dry film. I do.

In addition to a dry film, a photosensitive resin composition can be directly applied and formed on a metal surface.

Exposure In the case of a dry film, compare the adhesive strength between the base film and the photosensitive resin composition layer and the adhesive strength between the protective film and the photosensitive resin composition layer, and peel off the lower adhesive film. After attaching the side of the photosensitive resin composition layer to a metal surface such as a copper surface of a copper-clad substrate, exposure is performed by bringing a pattern mask into close contact with the other film. When the photosensitive resin composition layer has no tackiness, the other film may be peeled off and then the pattern mask may be brought into direct contact with the photosensitive resin composition layer for exposure.

When the coating is applied directly to the metal surface, a pattern mask is brought into contact with the coating surface directly or via a polyester film or the like, and exposed.

Exposure is usually performed by ultraviolet irradiation, and as a light source at that time, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a chemical lamp, a black light, or the like is used. Exposure amount is 40 ~ 1000mJ
/ cm ^{2 in} many cases. After the ultraviolet irradiation, heating can be performed as necessary to complete the curing.

Development After exposure, the film on the resist is peeled off and developed.

When the photosensitive resin composition of the present invention is a dilute alkali developing type, development after exposure is performed using a dilute aqueous solution of an alkali such as sodium carbonate, sodium hydroxide, or potassium carbonate. In the case of a solvent development type, development is performed using a solvent such as 1,1,1-trichloroethane.

Etching and Plating When an etching method is employed, etching is performed according to a conventional method using an etching solution such as an aqueous ferric chloride solution or an aqueous cupric chloride solution. When the plating method is adopted, a pretreatment is performed using a plating pretreatment agent such as a degreasing agent or a soft etching agent, and then plating is performed using a plating solution.

Uses The photosensitive resin composition of the present invention can be used for various uses, such as for manufacturing printed wiring boards and precision processing of metals.

Functions and Effects of the Invention The photosensitive resin composition of the present invention has good adhesion to metal and does not cause troubles such as resist floating, underetching, underplating, disconnection, and short circuit due to poor adhesion.

In addition, when a photosensitive resin composition of a rare alkali developing type is used, it is possible to ensure easy peeling and removal of the cured resist with an alkali peeling liquid regardless of good adhesion to a metal.

EXAMPLES Next, the present invention will be further described with reference to examples. Hereinafter, “parts” and “%” are expressed on a weight basis.

 The following materials were prepared for the experiment.

Base Polymer (A) A-1 A methyl methacrylate / ethyl acrylate / methacrylic acid (weight ratio 60/15/25) copolymer having an average molecular weight of 90,000 is mixed with methyl ethyl ketone / methyl cellosolve / toluene (weight ratio 70/15/15). 40% solution by solvent A-2 Methyl methacrylate / 2-ethylhexyl acrylate / acrylonitrile having an average molecular weight of 110,000 (weight ratio 70/20 /
10) 40% solution of the copolymer in a mixed solvent of methyl ethyl ketone / toluene / methyl cellosolve (weight ratio 70/25/5) Photopolymerizable monomer (B) B-1 Trimethylolpropane triacrylate B-2 Tetraethylene glycol diacrylate B-3 Tetraethylene glycol dimethacrylate B-4 2,2-bis (4-methacryloxypolyethoxyphenyl) propane Among the photopolymerizable monomers (B), an acetoacetyl group-containing ethylenically unsaturated compound (b) b-1 2-acetoacetylated ethyl methacrylate b-2 3-phenoxy-2-acetoacetylpropyl acrylate b-3 2-acetoacetylated propyl acrylate b-4 2-methacryloyloxyethyl-2'-acetoacetylpropyl phthalate b-5 polypropylene Glycol jig Ricidyl ether diacrylate diacetoacetylated adduct b-6 2-acetoacetylated ethyl acrylate b-7 1,6-hexamethyldiglycidyl ether diacrylate acetoacetylated b-8 pentaerythritol triacrylate acetoacetylated b- 9 Ethylene glycol diglycidyl ether dimethacrylate acetoacetylated product b-10 Diglycidyl phthalate diacrylate monoacetoacetylated product (In all cases, the product obtained by completely acetoacetylating the functional group of the functional group-containing ethylenically unsaturated compound is used. Used.) Photopolymerization initiator (C) C-1 A mixture of C-2 Examples 1 to 4 <Formulation> The photosensitive resin composition of Example 1 was prepared according to the following formulation.

Also, in the case where 5 parts of b-2 (Example 2), 3 parts of b-3 (Example 3), and 3 parts of b-4 (Example 4) are used instead of 3 parts of b-1, A photosensitive resin composition was prepared.

<Preparation of Dry Film> After the above composition was uniformly dissolved, it was applied on a 25 μm-thick polyester film, dried at 90 ° C. for 8 minutes with a hot-air drier, and then a 30 μm-thick polyethylene film was laminated thereon. The thickness of the photosensitive resin composition layer after drying was 50 μm.

<Lamination on Copper-Clad Substrate> The dry film thus obtained was applied to two 40-μm-thick copper-clad substrates having been subjected to surface polishing in advance using a laminator at a roll temperature of 90 ° C. and a roll pressure of 3 kg / roll. Lamination was performed while peeling off the polyethylene film under the conditions of cm ² and a lamination speed of 1.5 m / min.

<Exposure> Next, using an exposure machine using a 3KW ultra-high pressure mercury lamp as a light source, one exposure is performed through the entire surface, and the other exposure is performed through a pattern mask so that the exposure amount is 80 mJ / cm ^2. Was exposed. The pattern at this time is line width 50, 60,
Those having line intervals of 50, 60, 70, 80, 100, 150 and 200 μm were used for 70, 80, 100, 150, 200 and 300 μm, respectively.

<Development> After the exposure, peel off the polyester film,
Spray development was performed using a 1% aqueous sodium carbonate solution at a temperature of 30 ° C. under the conditions of a spray pressure of 1.0 kg / cm ² and a development time of 60 seconds.

<Adhesion test> 15 minutes after exposure and 15 minutes after development, the substrate exposed on the entire surface was cut into 100 square squares of 1 mm square with a cutter and subjected to a peeling test using cellophane adhesive tape to check the adhesion. Was.

<Etching> On the other hand, the pattern exposure substrate was etched using a cupric chloride acidic etching solution under the conditions of a liquid temperature of 50 ° C., a spray pressure of 1.5 kg / cm ² and 90 seconds.

<Evaluation of Fine Line Adhesion> The evaluation of the fine line adhesion after development and after etching was represented by the minimum resist line width at which a chipping, disconnection and resist floating at a resist line interval of 80 to 200 μm did not occur.

<Removal of the cured resist> Next, using a 4% aqueous sodium hydroxide solution at 50 ° C.
Curing resist (size 10c under the conditions of a spray pressure of 1.5 kg / cm ²
(m × 10 cm, whole surface exposure), and the stripping removal time at this time was measured, and the state of the stripped piece was observed.

<Observation of Discoloration of Copper Surface> The presence or absence of discoloration of the copper surface from which the resist was removed after development and the presence or absence of discoloration of the copper surface after removal of the resist were observed.

Comparative Example 1 A similar experiment was performed with the composition of Example 1 except that b-1 was omitted.

Comparative Example 2 The same experiment was performed as in Example 1, except that 0.8 parts of 2-mercaptobenzothiazole was used instead of b-1.

As described above, the results of Examples 1 to 4 and Comparative Examples 1 and 2
It is shown in the table.

Examples 5 to 8 The photosensitive resin compositions of Example 5 were prepared according to the following formulations.

Also, instead of b-5 10 parts, b-6 4 parts and b
-7 6 parts (Example 6), b-8 5 parts and b-1
A photosensitive resin composition was prepared for each of the cases where 5 parts (Example 7), 5 parts of b-9 and 14 parts of b-14 (Example 8) were used.

Thereafter, development was performed in the same manner as in Example 1 to prepare a pattern-exposed substrate.

Next, copper plating and direct solder plating were performed according to a conventional method, and the presence or absence of underplating was examined by observing the cross section.

Comparative Example 3 A similar experiment was performed using the composition of Example 5 except that b-5 was omitted.

Table 2 shows the results of Examples 5 to 8 and Comparative Example 3.

Examples 9 to 11 The photosensitive resin compositions of Example 9 were prepared according to the following formulation.

Also, instead of b-8 5 parts, b-8 2 parts and b
A photosensitive resin composition was prepared for each of the cases of using 13 parts (Example 10) and 5 parts of b-10 (Example 11).

After uniformly dissolving the above composition, use an applicator
The composition was applied on a copper-clad substrate having a thickness of 35 μm and dried with a hot air drier at 100 ° C. for 10 minutes. The thickness of the photosensitive resin composition layer after drying was 40 μm.

Next, the same pattern exposure as in Example 1 was performed using an exposure machine using a 3 KW ultra-high pressure mercury lamp as a light source so that the exposure amount was 80 mJ / cm ² .

After the exposure was completed, spray development was performed using 1,1,1-trichloroethane at a temperature of 20 ° C. under the conditions of a spray pressure of 1.5 kg / cm ² and a development time of 40 seconds.

Hereinafter, evaluation was performed in the same manner as in Example 1. As a result, almost the same preferable results as in Example 1 were obtained.

Claims (6)

(57) [Claims] 1. A composition comprising a base polymer (A), a photopolymerizable monomer (B) and a photopolymerization initiator (C), wherein at least a part of the photopolymerizable monomer (B) is an acetoacetyl group. A photosensitive resin composition comprising an ethylenically unsaturated compound (b). 2. The photosensitive resin composition according to claim 1, wherein the proportion of the photopolymerizable monomer (B) is 5 to 150 parts by weight based on 100 parts by weight of the base polymer (A). 3. The ratio of the acetoacetyl group-containing ethylenically unsaturated compound (b) to the photopolymerizable monomer (B) is 1%.
The photosensitive resin composition according to claim 1, wherein the amount is from 100 to 100% by weight. 4. The photosensitive resin composition according to claim 1, wherein the base polymer (A) is an acrylic resin. 5. The photosensitive resin composition according to claim 4, wherein the acrylic resin is a resin containing an ethylenically unsaturated carboxylic acid component. 6. The photosensitive resin composition according to claim 1, which is a photosensitive resin composition for a dry film.