JP2694875B2 - Contactor solder alloy film removal jig for semiconductor device measurement - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] A measuring contact solder of a semiconductor device for removing a solder alloy film formed on a measuring contact by a contact action with a lead of a semiconductor device to be measured. The present invention relates to an alloy film removing jig.

[Conventional technology]

The measuring contact of the measuring device is affected by soldering of the lead while contacting the leads of a large number of semiconductor devices and energizing and repeating the measurement, and a hard solder alloy film is formed on the contact surface. It Since this solder alloy film is insulating,
Poor contact occurs.

For this reason, conventionally, the solder alloy film formed on the measuring contact has been manually removed by a cutter knife, a brush or the like.

[Problems to be solved by the invention]

The above-described conventional solder alloy film removing means for the measuring contact of the semiconductor device has a problem that the workability is poor because it is scraped by hand and the measurement work must be stopped each time. Also, if you do not care for removal,
There has been a problem that a semiconductor device (for example, an IC) that is a non-defective product to be measured is often determined to be defective due to poor contact in measurement. Further, there is a problem that the measurement contact may be damaged during the cleaning work for removing the solder alloy film.

The present invention has been made to solve such a problem, and the solder alloy film of the contact for measurement can be removed while performing the measurement work of the semiconductor device, resulting in poor contact. It is an object of the present invention to obtain a contact solder alloy film removal jig for a semiconductor device, in which damage to the contact and the contact is eliminated.

[Means for solving the problem]

A measuring contact solder alloy film removing jig for a semiconductor device according to the present invention has a shape similar to the outer shape of a semiconductor device, and corresponds to the measuring contact, the contact surface of the contact receiving piece or the contact side of the contact receiving piece. A file-like rough surface is formed on the contact surface of the leaf spring attached to, and the solder alloy film is removed by relatively pressing the contact receiving piece of the jig against the measuring contact.

[Action]

In the present invention, among the semiconductor device group in which measurement work is performed, a solder alloy film removing jig is appropriately inserted as a substitute and flown into the measuring device, and a contact action is performed in the same manner as the semiconductor device, Remove the solder alloy film of the contact for measurement on the rough surface of the contact receiving piece.

〔Example〕

FIG. 1 is a perspective view of a solder alloy film removing jig according to an embodiment of the present invention. Reference numeral 1 denotes a solder alloy film removing jig, which has a shape similar to the outer shape of the semiconductor device to be measured, and corresponds to a large number of leads grouped in parallel from the main body portion 1a corresponding to the package. The integral contact receiving piece 1b is exposed. A file-like rough surface 1c is formed on the contact surface of the contact receiving piece 1b corresponding to the contact for measurement.

As shown in FIG. 2, the solder alloy film removing jig 1 is positioned and placed on the pusher 4 of the measuring device 2 as a substitute for the semiconductor device in the flow of measurement.
The contact surface 3a of the measuring contact 3 taken out from the measuring device 2 corresponds to the contact receiving piece 1b from above. On the contact surface 3a of each measuring contact 3, a solder alloy film 5 is formed by the contact current-carrying action to each lead of each semiconductor device measured previously. The portion A of FIG. 2 (a) is shown in an enlarged view in FIG. 2 (b).

Here, when the pusher 4 is raised, the solder alloy film removing jig 1 is raised, and the file-shaped rough surface 1c contacts the contact receiving piece 1b and pushes it up. As a result, the contact 3
Slides in the direction perpendicular to the contact direction, that is, in the B direction, and the solder alloy film 5 on the contact surface 3a is scraped off by the roughened surface 1c.

FIG. 3 shows a second embodiment of the present invention, in which the leaf spring 6 is fixed to the contact side of the contact receiving piece 1b of the solder alloy film removing jig 1 at the outer end side and the inner end side to the free end. I'm running. Leaf spring 6
The contact surface of the upper surface of the is a roughened surface 6a.

When the film removing jig 1 rises due to the rise of the pusher 4, the rough surface 6a of the leaf spring 6 that press-contacts the contact 3 has an arrow c.
By displacing in the direction, the solder alloy film 5 is scraped and effectively removed.

In the above-mentioned first embodiment, the application example in the case where the leads of the semiconductor device are of the SOP type is shown, but FIG. 4 shows the solder alloy film in the case of applying each of the other examples of the present invention to each type. A removal jig is shown.

FIG. 4A shows a third embodiment, which is applied to a QFP type semiconductor device. In the alloy film removing jig 11, the contact surface of the upper surface of the contact receiving piece 11b taken out from the main body portion 11a has a rough surface like a file 1
1c is formed and corresponds to the contact surface 3a of the contact piece 3.

FIG. 4B shows a fourth embodiment, which is applied to a PLCC, SOJ type semiconductor device. The alloy film removal jig 12 has a main body 12
A file-like rough surface 12c is formed on the contact surface of the outer side surface of the contact receiving piece 12b that is taken out from a, and is in pressure contact with the contact surface 21a of the measurement contact 21. The solder alloy film 5 is removed by raising the pusher 4.

FIG. 4C shows a fifth embodiment, which is applied to a ZIP type semiconductor device. In the alloy film removing jig 13, a file-like rough surface 13c is formed on the contact surface of each step of the upper and lower contact receiving pieces 13b which are projected to one side from the main body 13a, and each contact surface of each contact 3 is formed. It corresponds to 3a.

FIG. 4D shows a sixth embodiment, which is applied to a ZIP type semiconductor device in a standing posture with the lead side facing downward. The alloy film removing jig 14 has filed rough surfaces 14c formed on the contact surfaces on both sides of the contact receiving pieces 14b which are exposed downward from the main body portion 14a and open on both sides, and the contact surface of each contact 22 for measurement. It is attached to 22a. The alloy film removing jig 14 is pushed down by the pusher 24.

FIG. 4E shows a seventh embodiment, which is applied to a DIP type semiconductor device. In the alloy film removing jig 15, contact receiving pieces 15b are projected from both sides of the main body 15a and bent downward, and a file-like rough surface 15c is formed on the outer contact surface, and each measuring contact 23 Corresponding to the contact surface 23a. The alloy film removing jig 15 is pushed down by the pusher 25.

〔The invention's effect〕

As described above, according to the present invention, the solder alloy film removing jig has a shape similar to the outer shape of the semiconductor device, and the leaf spring is attached to the contact surface of the contact receiving piece corresponding to the lead or the contact side of the contact receiving piece. Since the contact surface of is formed into a rough surface like a file, it can be flowed as an alternative as well as the semiconductor device that is flowing into the measuring device, and without interrupting the flow of the measuring line, the solder alloy of the measuring contact The film can be easily removed, contact failure at the time of measurement is eliminated, and damage to the contact for measurement is prevented, so that productivity is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a measuring contact solder alloy film removing jig of a semiconductor device according to a first embodiment of the present invention, and FIG. 2 (a) shows the removing jig of FIG. 1 placed on a measuring device. FIG. 2 (b) is an enlarged view of part A of FIG. 2 (a), and FIG. 3 is a solder alloy film removal treatment according to the second embodiment of the present invention. Front view of the operating state of the tool, No. 4
(A)-(e) is a front view of the operating state of the solder alloy film removing jig showing the third to seventh embodiments of the present invention. 1,11〜15 …… Solder alloy film removal jig, 1a, 11a〜15a ……
Main body, 1b, 11b to 15b ... Contact receiving piece, 1c, 11c to 15c ... Rough surface, 2 ... Measuring device, 3, 21 to 23 ... Measuring contact, 3a, 21a to 23a ... … Contact surface, 4,24,25 …… Pusher,
5 ... Solder alloy film The same reference numerals in the drawings indicate the same or corresponding portions.

Claims (1)

(57) [Claims] 1. A main body corresponding to the package, which has a shape similar to the outer shape of a semiconductor device in which a plurality of leads are arrayed from the package and can handle the inside of the device in the same manner as the original product. And a contact receiving piece which is taken out from this main body and corresponds to the array of the leads, and which makes relative pressure contact corresponding to the contact surface of the measuring contact of the measuring device, the contact of the contact receiving piece A measuring contact solder alloy film removing jig for a semiconductor device, wherein a file-like rough surface is formed on a contact surface of a surface or a contact side of a contact receiving piece.