JP2655221B2 - Manufacturing method of thin film head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

2. Description of the Related Art Thin film type magnetic heads for recording / reproducing information on / from a magnetic disk in a magnetic disk drive have been widely used instead of the conventional monolithic type. As a thin-film magnetic head, there has been proposed an integrated thin-film head in which a magnetic head element portion and a spring arm portion are integrally formed by thin-film technology. The present invention relates to a method for manufacturing a thin film head in which at least the magnetic head element portion is formed by lamination using thin film technology.

[0002]

2. Description of the Related Art FIGS. 4 to 6 show an integrated thin film head introduced in Japanese Patent Application Laid-Open No. 3-178017, and FIG. 4 is a plan view and a front view showing the entirety of the integrated thin film head. It is. Reference numeral 1 denotes a spring arm portion, at the tip of which a magnetic head element portion 2 is formed, and at the tip of the magnetic head element portion 2, a sliding surface 3 is formed so as to protrude.

FIG. 5 is a vertical sectional view of the integrated thin film head. The magnetic head element section 2 includes a core 4 made of a magnetic material.
Then, the coil 5 is wound by a thin film technique, and the lead pattern 6 of the coil 5 is connected to the bonding pad 8 at the root (mounting portion) 7 of the spring arm 2.

A magnetic pole 9 extending toward the magnetic disk D is connected to the front end of the core 4, and a rear end yoke 10 is formed at the rear end and also extends toward the magnetic disk D. And
A return yoke 11 is connected to the rear end yoke 10 in parallel with the core 4. The above-described components are manufactured by sequentially laminating the components by a thin film technique.

When an information signal is applied to the coil 5 in a state where the sliding surface 3 at the tip of the thin film head is in contact with the magnetic disk D rotating in the direction of the arrow, the magnetic pole 9 and the return yoke 11 Is transmitted through the magnetic disk D, thereby enabling perpendicular magnetic recording.

FIG. 6A is a plan view showing a state in which the integrated thin film head is mounted on a magnetic disk drive, which is described in Japanese Patent Application No. 3-137883 previously proposed by the applicant of the present invention. Same as the ones. That is, the root 7 of the integrated thin film head H is fixed to the mounting arm 13,
Are fixed to the positioner 14. FIG. 2B is an enlarged front view showing a mounting portion of the integrated thin film head.
The sliding surface 3 at the tip of the integrated thin film head H is a magnetic disk D
The spring arm portion 1 is attached so as to bend slightly when pressed against the spring arm portion 1.

FIGS. 7 and 8 show a method of manufacturing an integrated thin-film head described in Japanese Patent Application Laid-Open No. 3-178017. First, as shown in FIG. After a magnetic circuit, an insulating layer, a coil 5, and the like are formed by sequentially laminating them thereon, the substrate 15 is finally removed. In order to easily remove the substrate 15 after completion, it is preferable to form an easily-etched separation layer 16 on the substrate 15 and to form an integrated thin-film head on the separation layer 16.

After laminating a magnetic circuit, an insulating layer, a coil 5, etc. on the substrate 15, the end face is lap-polished until the tip of the core 4 is exposed as shown in FIG. The magnetic pole 9 is formed by lamination. Thereafter, when the separation layer 16 is etched, the substrate 15 is separated, and only the integrated thin film head H remains.

[0009]

The separation layer 16 is made of Al
_On a substrate 15 made of ₂ O ₃ , a material such as Cu
After plating to a certain degree, the surface is polished flat and manufactured. However, when such a thick film is formed by plating, the stress is increased and the film is easily deformed. For this reason, there is a fear that it may hinder the fabrication of the thin film head thereon using the thin film technology.

Further, it takes time to form a thick film by plating, and it takes several hours to form, for example, several tens of μm. If the current density of plating is increased in order to increase the film forming rate, the grain size of the plated film becomes coarse, which may adversely affect the subsequent manufacturing process. Therefore, low-speed plating must be performed at a low current, the production efficiency is reduced, and the method is not suitable for mass production.

The technical problem of the present invention is to focus on such a problem and to make it possible to produce a separation layer that is finally removed by a method that is efficient and does not adversely affect the process of producing a thin film head. It is in.

[0012]

FIG. 1 is a process chart for explaining the basic principle of a method for manufacturing a thin film head according to the present invention.
The present invention is applied to a method of forming a separation layer on a surface of a substrate, forming a thin film head on the separation layer, and then etching the separation layer to separate and remove the substrate.

That is, according to the first aspect of the present invention, as shown in FIG. 1 (a), after a metal foil 16f serving as a separation layer 16 is bonded to a substrate 15 by an adhesive or a welding method, This is a method in which a thin-film head is laminated and formed on a flat surface so that the front surface is parallel to the back surface of the substrate 15.

According to a second aspect of the present invention, as shown in FIG. 1 (b), a thin film 18 is formed on the surface of a substrate 15 by a method such as vapor deposition, sputtering, or plating. Become metal foil
After bonding 16f with an adhesive or a welding method, the metal foil 16
This is a method in which a thin film head is laminated and formed on a flat surface of the substrate f in a state where the surface is finished so as to be parallel to the back surface of the substrate.

[0015]

According to the present invention, the metal foil 16f to be the separation layer 16 is bonded to the substrate 15 by an adhesive or a welding method so that the surface of the metal foil 16f is parallel to the back surface of the substrate 15. According to the method of laminating and forming the thin film head in a state where it has been finished, compared to the method of forming the separation layer 16 by conventional plating,
The separation layer 16 can be formed in a short time, which is suitable for mass production. Also, various materials can be used. Unlike the case where a thick film is formed by plating, no stress is generated later.

A thin film 18 for adhesion is formed on the surface of the substrate 15 by vapor deposition, sputtering, plating, or the like, and a metal foil serving as a separation layer 16 is deposited thereon by a welding method. In the case of the joining method, since the thin film 18 for adhesion is extremely thin, it can be formed in a short time, and the time required for welding is also short, so that when the entire separation layer 16 is formed by conventional plating, In comparison, it can be formed in a short time. In addition, thin film
It is also possible to bond a metal foil 16f to 18 with an adhesive.

[0017]

EXAMPLES Next, how the method of manufacturing a thin film head according to the present invention is actually embodied will be described with reference to examples. FIG. 2 is a perspective view showing an embodiment of the first aspect of the present invention. Reference numeral 15 denotes a substrate, and 16f denotes a metal foil for a separation layer. An adhesive 17 is applied to the substrate 15 but may be applied to the metal foil 16f.

According to the first aspect of the present invention, a metal foil 16
Is bonded to the substrate 15 so that the metal foil 16f is integrally laminated on the substrate 15. In the case of bonding with an adhesive as described above, the adhesive needs to have heat resistance so that it does not deteriorate in a heat treatment step of baking and baking and hardening the photoresist in a later step, for example, withstanding about 300 ° C. The material used is effective.

Cu (copper) is used as the metal foil 16f for the separation layer.
), Al (aluminum), Fe (iron), Ni (nickel) or alloys thereof. If the separation layer 16 is too thin, it will be difficult to etch, but there will be no inconvenience because it is too thick. Therefore, the metal foil 16f has several tens of μ.
It is sufficient if the thickness is about m to 100 μm or more. Although the outer shape of the metal foil 16f is preferably similar to the substrate 15, the metal foil 16f may be processed into the same shape as the substrate 15 after bonding.

On the other hand, as the substrate 15, a material having high workability and high rigidity is required, and, for example, Al ₂ O ₃ TiC, titanium bur, photo-serum and the like are suitable. Substrate 15 and metal foil
In the combination of 16f, the substrate 15 is hard to be etched,
It is suitable that the metal foil 16f be easily etched selectively.

The bonding of the metal foil 16f may be performed by welding instead of bonding with an adhesive. That is,
Without using an adhesive, in a state where the substrate 15 and the metal foil 16f are overlapped, bonding is carried out by applying pressure / heating or ultrasonic waves to cause diffusion between them. However, in the case of joining by welding in this way, it is effective to form the adhesion layer 18 and then to weld, as described in claim 2, in addition to directly welding as in claim 1.

According to a second aspect of the present invention, as shown in FIG. 3, the surface of the substrate 15 is formed by a technique such as vapor deposition, sputtering, or plating.
This is a method of forming a thin film 18 for welding in advance. The thin film 18 is for improving the adhesion between the substrate 15 and the metal foil 16f during welding, and is preferably made of the same material as or similar to the metal foil 16f.

That is, if the material of the thin film 18 and the metal foil 16f formed on the substrate 15 are the same or similar, when they are pressed / heated to each other, thermal diffusion between them is easy to proceed, and Is securely joined. Heating for welding depends on the mutual material, but usually about 1000 ° C. is sufficient. In addition, the thickness of the thin film 18 is more than ten μm because it is a film for securing the weldability.
The following thin films are sufficient. It goes without saying that the metal foil 16f can be bonded to the film 18 using an adhesive.

After bonding the metal foil 16f to the substrate 15 as described above, the front surface of the metal foil 16f is polished with reference to the back surface of the substrate 15 so that the flat surface is parallel to the back surface of the substrate 15. In the finished state, a thin film head is formed thereon.

That is, a thin film head is formed on the surface of the separation layer made of the metal foil 16f by a thin film technique.
After the lamination step is completed, the metal foil 16f constituting the separation layer is removed by etching or the like as described above, and the substrate 15 is removed.
From the thin film head.

The present invention is not limited to the case where the spring arm portion 1 and the magnetic head element portion 2 are formed as an integral thin film head as shown in FIGS. It goes without saying that it also applies to.

[0027]

As described above, according to the present invention, a metal foil 16f for the separation layer 16 is prepared in advance and bonded to the substrate 15 by an adhesive or a welding method, so that the entire separation layer 16 is formed by plating. This method can be formed in a shorter time as compared with the above method, and has the effects that the material is not limited and no stress is generated.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating a basic principle of a method of manufacturing a thin film head according to the present invention.

FIG. 2 is a perspective view showing an embodiment of the present invention.

FIG. 3 is a perspective view showing an embodiment of the invention of claim 2;

FIGS. 4 to 6 show a conventional integrated thin film head, and FIG. 4 is a plan view and a front view showing the entirety of the integrated thin film head.

FIG. 5 is a longitudinal sectional view of the integrated thin film head.

FIG. 6A is a plan view showing a state where the integrated thin-film head is mounted on a magnetic disk drive, and FIG. 6B is an enlarged front view showing a mounting portion of the integrated thin-film head.

FIG. 7 is a perspective view showing a method of manufacturing a conventional integrated thin film head.

FIG. 8 is a perspective view showing a method of manufacturing a magnetic pole portion in the integrated thin film head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Spring arm part 2 Magnetic head element part 3 Sliding surface 4 Core 5 Coil 6 Lead pattern 7 Root (attachment part) of spring arm part 8 Bonding pad 9 Magnetic pole 10 Rear end yoke 11 Return yoke D Magnetic disk 12 Magnetic flux H Thin film head 13 Mounting arm 14 Positioner 15 Jig board 16 Separation layer 16f Metal foil for separation layer 17 Adhesive 18 Thin film for adhesion during welding

Claims (2)

(57) [Claims] 1. A separation layer (16) is formed on a surface of a substrate (15),
After laminating a thin film head on the separation layer (16),
In the method of etching the separation layer (16) to separate and remove the substrate (15), the method includes the steps of: bonding a metal foil (16f) to be a separation layer (16) to the substrate (15) by an adhesive or a welding method; A method of manufacturing a thin film head, comprising: forming a thin film head in a laminated state with the surface of the metal foil (16f) finished so as to be parallel to the back surface of the substrate (15). 2. A separation layer (16) is formed on a surface of a substrate (15),
After laminating a thin film head on the separation layer (16),
In the method of etching the separation layer (16) to separate and remove the substrate (15), a thin film (18) of a material suitable for welding to the metal foil (16f) for the separation layer is formed on the surface of the substrate (15). ) Is deposited by a method such as vapor deposition, sputtering, or plating, and a metal foil (16f) serving as a separation layer (16) is bonded thereon with an adhesive or a welding method. A method for manufacturing a thin film head, comprising laminating thin film heads in a state where they are finished so as to be parallel to the back surface of the substrate (15).