JPH05325156A - Magnetic head code and manufacture of magnetic head - Google Patents

Abstract

PURPOSE:To easily perform the coating operation of a conductive material in the assembly process of a stacked magnetic head. CONSTITUTION:Blocks which have been sandwiched between nonmagnetic- substance substrates are brought face to face with each other, and a head 16 is formed. In the manufacturing method for the head, the lower end of each nonmagnetic-substance substrate on the side of a head base opposite to the side on which a core chip is pasted is made short, or a groove which reaches a magnetically soft material is formed at the lower part at the time when the core chip 12 is formed. Alternatively, a through hole is made in the lower part, a magnetically soft alloy film 2 is exposed and its part is coated with a conductive material 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an S-VHS VTR or HDT using a laminated thin film core having a high saturation magnetic flux density.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head core of a V-VTR and a method of manufacturing a magnetic head, and in particular, a core chip shape and a magnetic head for facilitating application of a conductive material used as a measure for preventing discharge noise generated by discharge from a soft magnetic alloy film during VTR reproduction. Manufacturing method.

[0002]

2. Description of the Related Art Recently, S-VHS VTR head, HDT
For manufacturing a so-called layered head using a thin film core used in a V-VTR head, for example, as shown in FIG. 7, a soft magnetic alloy film 2 such as sendust, which is a high saturation magnetic flux density material, is formed on a non-magnetic substrate 3. A block 20 is obtained by stacking and forming glass 6 on both sides by sputtering or the like. A plurality of A blocks 20 are fastened with a lap torque of 7, and heat treatment is performed to bond them to obtain a wafer 21 shown in FIG. Since the manufacturing process after this is general, I will not describe it, but various processing,
After the assembly process, finally, the D head 19 in which the conductive material 1 as shown in FIG. 6 was applied to the side surface 25 in the thickness direction of the chip was obtained. Here, 2 is a soft magnetic alloy film, 3 is a non-magnetic substrate, 4 is an adhesive, 5 is a head base, and the conductive material 1 is a D core chip 15 and a D head 19 in order to prevent discharge noise from the core chip. Adhesive 4 is used for adhesion with. Since the adhesive flows into the lower end surface of the chip in the thickness direction, the conductive material 1 cannot be applied.

[0003]

However, when the conductive material 1 is applied to the side surface 25 in the thickness direction of the chip as shown in FIG. 6, the applying operation itself is difficult and, at the same time, D of the previous step is used. Head chip 5 with core chip 15
The adhesive 4 may flow to a position where the conductive paste material 1 should be applied when the adhesive paste is applied to, so that the conduction failure may occur even when the applying work is performed.

[0004]

In order to solve the above-mentioned problems, a magnetic head core of the present invention is formed by laminating soft magnetic alloy films and abutting blocks sandwiched by a non-magnetic substrate. In the case of forming the core chip, the bottom end of the non-magnetic substrate on the opposite surface to the head base attachment surface is shortened, or a groove reaching the soft magnetic alloy film is provided at the bottom, or a through hole is provided at the bottom of the core chip. It is characterized in that the magnetic alloy film is exposed.

The method of manufacturing the magnetic head of the present invention is
When the magnetic head is attached to the head base, a conductive material is applied over the exposed soft magnetic alloy film of the magnetic head and the head base.

[0006]

As described above, by newly exposing the soft magnetic alloy film to a part of the core chip at the time of forming the core chip, it becomes easy to apply a conductive material for providing conduction between the soft magnetic alloy film and the head base. Become. Moreover, it does not depend on how the adhesive flows. In addition, the resin can be completely molded after the coating operation.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In describing an embodiment of the present invention, a portion having steps similar to those of the prior art will be described as a precaution.

First, as shown in FIG. 7, a soft magnetic alloy film 2 such as sendust is formed on one surface of a non-magnetic substrate 3 as is conventionally done.
Are laminated, and the glass 6 is sputtered on both sides.
To obtain the A block 20. That A block 20
The wafers 21 as shown in FIG. After that, through various processing steps such as grooving, cutting and polishing, a B block 22 is obtained as shown in FIG.

The B block 22 prepared as described above
An example of a main part of a method of manufacturing a magnetic head core and a magnetic head according to the present invention using the above will be described. As shown in FIG. 2, an A groove 8 is provided in parallel with the soft magnetic alloy film 2 on the lower end surface of the B block 22 at a position opposite to the surface to be attached to the head base 5. At this time, the soft magnetic alloy film 2 must be exposed in the A groove 8 in the depth direction as shown in FIG. Further, through various processing steps, an A core chip 12 as shown in FIG. 1 is obtained. Next, the A core chip 12 is attached to the head base 5 with the adhesive 4, the base-shaped conductive material 1 is applied to the portion of the A core chip 12 where the soft magnetic alloy film 2 is exposed, the coil 23 is further wound, and the mold resin is applied. 9 is molded to obtain the A head 16 shown in FIG.

[0010]

Second Embodiment FIG. 3 shows a second embodiment of the magnetic head core and the method of manufacturing a magnetic head according to the present invention. Since various processing steps until obtaining the B block 22 shown in FIG. After that, the D core chip 15 of FIG. 6 is obtained as in the conventional technique. A B groove 10 reaching the soft magnetic alloy film 2 in the depth direction is provided on the side surface of the D core chip 15 which is the opposite surface to the head base 5 and is not attached to the head base 5, and the B core chip 13 is obtained in FIG. In this case, unlike the first embodiment, since the B groove 10 is provided in the chip state, it can be set at an arbitrary position (in the first embodiment, since it is a block state, it can be provided only at the lower end portion).

Next, the B core chip 13 is attached to the head base 5 with the adhesive 4, and the soft magnetic alloy film 2 of the B core chip 13 is attached.
Apply the paste-like conductive material 1 to the exposed area,
Further, the coil 23 is wound and the molding resin 9 is molded to obtain the B head 17 of FIG.

[0012]

Third Embodiment FIG. 4 shows a third embodiment of the magnetic head core and the method of manufacturing a magnetic head of the present invention. Various processing steps until obtaining the wafer 21 shown in FIG. After that, as shown in FIG. 9, the B block 22 is provided with the through hole 11 in advance and processed in the same manner as the conventional technique to obtain the C core chip 14 shown in FIG.

Next, the C core chip 14 is attached to the head base 5 with the adhesive 4, the paste-like conductive material 1 is applied to the through hole 11 of the C core chip 14, the coil 23 is further wound, and the molding resin 9 is molded. C head 18 of FIG.
Is obtained.

[0014]

As described above, when the core chip is formed, the lower end of the non-magnetic substrate on the opposite surface to the head base is not shortened, or a groove reaching the soft magnetic alloy film is provided at the bottom, or By providing a through hole in the lower part of the core chip and exposing the soft magnetic alloy film, the coating operation itself can be facilitated and the place where the conductive material should be coated can be easily secured. Further, since it is not affected by the flow of the adhesive, it has an excellent effect of preventing the occurrence of defective conduction. In addition, after coating, it can be completely molded with resin, so after shipping
It does not come off and it also improves reliability.

[Brief description of drawings]

FIG. 1 is a perspective view of an A head showing a first embodiment of the present invention.

FIG. 2 is a perspective view of a B block in which an A groove is provided to obtain the same A head.

FIG. 3 is a perspective view of a B head showing a second embodiment of the present invention.

FIG. 4 is a perspective view of a C head showing a third embodiment of the present invention.

FIG. 5 is a perspective view of a B block used in the first and second embodiments of the present invention and the conventional magnetic head manufacturing method.

FIG. 6 is a perspective view of a D head obtained by a conventional magnetic head manufacturing method.

FIG. 7 is a perspective view of an A block used in an embodiment of the present invention and a conventional magnetic head manufacturing method.

FIG. 8 is a perspective view of a wafer used in an embodiment of the present invention and a conventional magnetic head manufacturing method.

FIG. 9 is a perspective view of a B block in which a through hole is provided to obtain the C head shown in the third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductive material 2 Soft magnetic alloy film 3 Nonmagnetic substrate 8 A groove 10 B groove 11 Through hole 12 A core chip 13 B core chip 14 C core chip 15 D core chip 16 A head 17 B head 18 C head 19 D head 23 Coil 24 Gap 25 side

Claims (8)

[Claims] 1. A laminated magnetic head, wherein the area of the core chip on the side where the head base is not adhered is made smaller than the area of the core chip on the side where the head base is adhered to expose the soft magnetic alloy film between the core chips. Magnetic head core. 2. The magnetic head core according to claim 1, wherein the soft magnetic alloy film is exposed by shortening the lowermost end of the core chip on the side not adhered to the head base. 3. The magnetic head core according to claim 1, wherein the soft magnetic alloy film is exposed by providing a groove in a part of the core chip on the side not adhered to the head base. .. 4. A magnetic head core in a laminated magnetic head, wherein a magnetic alloy film is exposed by providing a through hole in a part of a core chip. 5. The method of manufacturing a magnetic head according to claim 1, wherein a conductive material is applied to the exposed soft magnetic alloy film to establish electrical continuity with the head base. 6. The method of manufacturing a magnetic head according to claim 2, wherein a conductive material is applied to the exposed soft magnetic alloy film to establish electrical continuity with the head base. 7. A method of manufacturing a magnetic head according to claim 3, wherein the exposed soft magnetic alloy film is coated with a conductive material to establish electrical continuity with the head base. 8. A method of manufacturing a magnetic head according to claim 4, wherein a conductive material is applied to the exposed soft magnetic alloy film to establish conduction with the head base.