JPS62270013A - Magnetic head - Google Patents

Abstract

PURPOSE:To obtain a magnetic head where a substrate and magnetic cores are securely jointed regardless of heat distortion by jointing the substrate and the magnetic cores by means of a metalized layer and an elastic magnetic metallic layer. CONSTITUTION:According to an Mo-Mn method and the like, the metalized layer 50 is formed on the surface of jointing nonmagnetic substrates 1 and 10, and the layer 50 and the magnetic cores 2 and 20 are jointed by means of the elastic nonmagnetic metal 5 such as silver wax. The heat distortion arising on the cores 2 and 20 and the substrates 1 and 10, which is caused by the thermal expansion difference, is absorbed by the elastic metal 5 and does not remain. Therefore the excellent magnetic head that is securely jointed without heat distortion can be obtained.

Description

Detailed Description of the Invention 1. Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a magnetic head installed in a magnetic recording/reproducing device.

(Prior Art) An electronic still camera that records still images on a disk-shaped magnetic record carrier is equipped with a pair of magnetic heads that slide against the signal surface of the rotating magnetic record carrier to send and receive signals. Signals are sent and received to and from the two tracks of the magnetic recording carrier simultaneously or alternately.

The applicant has previously proposed a composite magnetic head as shown in FIGS. 25 and 26 as such a magnetic head (Japanese Patent Application Laid-Open No. 147912/1983).

The magnetic head has a pair of head chips (25) (26
) are bonded and fixed to each other with a shield material (12) in between, and non-magnetic substrates (1) and (10) are fixed on both sides of both head chips (25) and (26) to increase the overall strength.

Each head chip (25) (26) is made of a pair of plate-shaped magnetic cores (2) (20) and (21) (22) formed from magnetic bulk material to have a thickness equal to the track width, but butted against each other. The head chip (
25) A coil window 41) is provided in (26) and the non-magnetic substrates (1) and (10), respectively, and a coil (4) is wound therein. The magnetic recording carrier moves in a direction perpendicular to a plane containing both gaps G, , G2.

Since the respective gap portions G, , G of the pair of head chips (25) and (26) are extremely close to each other, it is possible to prevent signal crosstalk due to electromagnetic field interference when recording and reproducing signals. In order to do this, both head chips (25>(2
6) A shield material (12) is interposed between them.

In addition, in order to guarantee compatibility with different models, the two head chips (25) and (26) have respective gap portions G, , G.

must be arranged on the same plane.

However, in the above-mentioned magnetic head, due to the convenience of winding work, two head chips (25) <26) are manufactured separately, and each head chip (25) (26) is assembled by arranging them at a predetermined track pitch. As a result of this process, adjustment work is required to align the two gap portions G + and G 2 on the same plane, and this adjustment work hinders mass production of the magnetic head.

Also, due to this adjustment, two gap portions G1. G
Second, it is inevitable that some degree of adjustment error remains, and the variation in the adjustment error causes a decrease in the yield of magnetic heads or a decrease in recording and reproducing performance.

In order to solve the above problem, the applicant has provided a pair of gap portions G.
, , G, are proposed on the same plane (for example, in the patent application filed in 1973).
9-229807).

As shown in FIGS. 1 and 2, the magnetic head includes a pair of head chips in which a pair of plate-shaped magnetic cores are bonded together and gap portions G, , G are formed at the bonded portions. A pair of magnetic cores (2) forming each head chip (25) (26)
)(20) and (21)<22) are both gap parts G
1. The head (31) of each magnetic core is formed to have a narrow width corresponding to the track width, and the head (31) of each magnetic core is formed to have a narrow width corresponding to the track width. The end portion of the magnetic core is formed wide, and at the wide portion, one of the pair of magnetic cores has a shaft portion (3) (
3) is formed in a protruding manner, and a coil (4) is wound around the shaft portion (3). Furthermore, a pair of head chips (25) (
26) A non-magnetic substrate (L) (10) is disposed on each of the above.

(Problem to be Solved) In the manufacturing process of the above magnetic head, the magnetic plate (23) serving as the magnetic core and the non-magnetic plate (14) serving as the non-magnetic substrate are bonded and fixed using frit glass or This can be done using an epoxy or polyamide organic resin adhesive.

However, when using frit glass as a bonding material,
It is necessary to heat the magnetic plate and the non-magnetic plate to a high temperature. At this time, the difference in the coefficient of thermal expansion between the two plates (the coefficient of thermal expansion of the Senjis l-based plate is 150 x 10-'/'C, and the coefficient of thermal expansion of the non-magnetic plate made of alumina is 70 x 10-'/'C) ), deformation or peeling may occur in the magnetic plate or non-magnetic plate, which hinders improvement in yield.

Further, when an organic resin adhesive is used as a bonding material, there is a problem that the bonding strength is not sufficient.

(Means for Solving the Problems) In order to solve the above problems, the present invention provides that the bonding layer that connects the magnetic core and the non-magnetic substrate has sufficient bonding strength, and that An object of the present invention is to provide a structure of a magnetic head in which the core and substrate are not deformed even during heat treatment.

A magnetic head according to the present invention includes a head chip in which a pair of plate-shaped magnetic cores are joined and a gap is formed at the joined part, and a non-magnetic substrate (1) fixed to both sides of the head chip.
A single type or composite type magnetic head consisting of a pair of magnetic cores (2 and 0) constituting the head chip.
) and (20) are superimposed and fixed on each other in a plane substantially parallel to the plane including the gap portion.

The head (31) of each magnetic core is formed to have a narrow width corresponding to the track width, and the end of the magnetic core opposite to the head (31) is formed to have a wide width. A shaft portion (3) is formed on at least one of the magnetic cores to protrude toward the mating magnetic core, and a coil (4) is wound around the shaft portion (3).

Further, non-magnetic substrates (1) and (10) are respectively disposed on the head chip on both sides of the plane including the gap portion and parallel to the plane.

The bonding layer between the head chip and each substrate (1) (10) has a metallized layer (50) fixed to the substrate surface and has a smaller elastic modulus than the head chip and the nonmagnetic substrates (1) (10). It is characterized by being composed of a metallized layer (50) and a nonmagnetic metal layer (5) that firmly connects the head chip.

(Function) In the manufacturing process of the magnetic head according to the present invention, a magnetic core (2>(20), a magnetic plate and a non-magnetic substrate (1) (10
) To fix the bond with the non-magnetic plate, first, a metallized layer (50) is applied to the bonding surface of the non-magnetic plate by, for example, the MoMn method.
After forming the metallized layer (50), a metal layer such as silver solder foil, which will become the non-magnetic metal layer (5), is interposed between the metallized layer (50) and the magnetic plate and heated. This can be done by fusing the metallized layer (50) and the magnetic plate. Since the metallized layer (50) has good wettability with respect to the molten metal, the molten metal is brazed over the entire surface of the joint between the metallized N (50) and the magnetic plate, thereby bonding them together. Bond firmly.

In the heat treatment of the above bonding process, there is usually a large difference in thermal expansion coefficient between the magnetic plate serving as the magnetic core and the non-magnetic plate serving as the non-magnetic substrate, resulting in a difference in thermal strain. Since the non-magnetic metal layer (5) has a smaller elastic modulus than the magnetic plate and the non-magnetic plate, the difference in strain is absorbed by the elastic deformation of the non-magnetic metal layer (5), and the magnetic plate No large internal stress or strain remains in the non-magnetic plate, and even if the difference in thermal strain is extremely large and a part of the non-magnetic metal layer (5) reaches the plastic deformation range, the non-magnetic plate The metal layer (5) has high ductility and the strain difference is absorbed by plastic deformation of the non-magnetic metal layer (5).

Therefore, there is no possibility that the magnetic plate and the non-magnetic plate will be deformed or peeled off, and the yield can be improved.

However, the bonding strength of the non-magnetic metal Jl(5) is much higher than that of the bonding layer of organic resin adhesive, so the bonding strength of the non-magnetic metal Jl(5) is excessively high compared to the bonding layer of organic resin adhesive, so it is difficult to form a bond at the bonding part during the manufacturing process of the magnetic head! Not only is there no risk of peeling or cracking, but the strength of the completed magnetic head is also high.

(Example) FIGS. 1 to 3 show an example in which the magnetic head according to the present invention is implemented in the composite magnetic head proposed by the applicant.

The magnetic head consists of a pair of plate-shaped magnetic cores (2), (20), (21), and (22) made of a high permeability material such as sendust or Co-Fe-based amorphous ribbon, with their plate surfaces superimposed on each other. This forms a pair of left-right symmetrical head chips (25) (26), and non-magnetic substrates (1) (10) are placed on both sides of both head chips (25) (26) with a bonding layer (described later). This increases the overall strength. The nonmagnetic substrates (1) and (10) are formed using, for example, crystallized glass or MnO2-Ni0 ceramic.

The bonding layer between the magnetic core (2>(20) (21)(22) and the nonmagnetic substrate <1>(10) is formed by the metallized layer (50) and the nonmagnetic metal layer (5) as shown in FIG. It is configured.

The metallized layer (50) is made of Mo and Mn as main components, and the non-magnetic metal layer (5) is made of silver solder, as will be described later.

In Figures 1 and 2, the lower magnetic core (20) (2
At the rear part of 2), rectangular parallelepiped-shaped shaft parts (3) (3) have the same thickness as the head (31) and are connected to the head (31) via a thin step part (30). On the other hand,
The upper magnetic cores (2) and (21) in the figure are plate-shaped with uniform thickness, and have the same outer shape as the lower magnetic cores (20) and (22), respectively.

Coils (4) are wound around both shaft portions (3) of the magnetic cores (20) (22), respectively, and both ends of the coil wire are wrapped with a non-magnetic substrate.
10) Coil terminals (40) provided at the rear end of (40)
are connected to each other.

The shield material (12) has a height spanning both valve magnetic substrates (1) (10), and has a height that extends over the magnetic core (20) <22).
It has a depth that passes through the head (31) and the stepped portion (30).

In addition, the total width along the plate surface of the non-magnetic substrates (1) and (10) is approximately 8
00 μm, the thickness is approximately 300 μm to 500 μm,
The thickness of the magnetic core (2) (20) (21) (22) is approximately 1
00μ... to 300μ.

The above magnetic head has the following differences in structure compared to conventional magnetic heads. That is, in the magnetic head shown in FIG. 25, the magnetic cores (2), (20), (21), and (22) have their respective plate surfaces in a plane perpendicular to a plane containing both gap portions G, , G2. In contrast, in the magnetic head shown in FIG. 1, the magnetic cores (2), (20), (21), and (22) are arranged in both gap portions G, . The feature is that each plate surface is arranged on a plane including G2, and the plate surfaces are overlapped and joined to each other.

A method of manufacturing the above magnetic head will be explained with reference to FIGS. 5 to 17.

By machining a high permeability bulk material such as sendust, the fifth
A comb-shaped magnetic plate (23) as shown in the figure is produced. The surface of the magnetic plate (23) is formed to have a flat surface.

As shown in FIG. 6, a plurality of fixing grooves (91) are recessed in a carbon plate <9) serving as a processing jig, and the fixing grooves (91) are
1), the plurality of magnetic plates (23) are attached and fixed to each of them. Note that a heat-resistant glass plate can also be used instead of the carbon plate (9).

The surface of the carbon plate (9) is filled with α-cyanoacrylate adhesive (8) as shown in FIG. 7, and after it is solidified, the surface is polished to a high degree of flatness as shown in FIG. At the same time, groove processing (28) is performed on the surface, and each magnetic plate (23) is divided into a plurality of core parts that will finally become the magnetic core (2>(21) or (20) (22)). do.

Further, as shown in FIG. 9, on the surface of the non-magnetic plate 14) which is the material of the non-magnetic substrate (XO), a strip-shaped metallized layer (50 )
and the required number of coil terminals (40), for example, the well-known Mo
The surface of the non-magnetic plate (14) formed by the -Mn method is covered with the carbon plate (9) as shown in FIG. At this time, as shown in FIG. 18, a silver solder foil (53) several tens of microns thick is interposed between each magnetic plate (23) and the metallized layer (50).

Heat these to about 850° C. in a vacuum atmosphere in a heat treatment furnace to melt the silver solder foil (53). As a result, the molten silver solder becomes a metallized layer (50) with good wettability.
The non-magnetic metal layer 5) of uniform thickness is formed by fusion over the entire surface of the bonding surface of the magnetic plate (23) and the magnetic plate (23).

Also, due to this heating, the carbon plate (9〉) and the magnetic plate (23)
The adhesive that holds them together evaporates and disappears.

After the non-magnetic metal layer (5) is solidified, by removing the carbon plate (9) from the non-magnetic plate (14), a plurality of magnetic plates ( 23
) is fixed with high precision.

In the heat treatment of the above bonding process, a strain difference occurs between the non-magnetic plate (14) and the magnetic plate (23) due to the difference in thermal expansion coefficient, but this strain difference is caused by the non-magnetic metal made of silver solder. Absorbed by elastic deformation or, in some cases, plastic deformation of layer <5),
Large internal stress in the non-magnetic plate (14) and magnetic plate (23),
No internal strain remains, and even after plastic deformation, the non-magnetic metal layer (5) exhibits much higher strength than the organic adhesive bonding layer, so see 8! There is no risk of cracking or peeling occurring during the machining process.

It has been confirmed that an extremely good yield can be obtained when the thickness of the nonmagnetic metal layer (5) is set to 2 μm to 20 μm.

As shown in Figure 12, the magnetic plate (23) on the non-magnetic plate (14)
), a groove (24) extending in the width direction is recessed, and a protrusion (32) and a protrusion (33) are connected by a thin step (30).
) to form.

Through the same steps as shown in FIGS. 5 to 11, a joined body having the same structure as the joined body shown in FIG. 11 is manufactured, and as shown in FIG. 62) to produce a wafer block (6).

The wafer block (6) is cut along the broken line A, and the first
The block pieces shown in Fig. 4 are formed, and the block pieces are further ground along the broken line B to form a pair of half-blocks (71).
(72) (see FIGS. 15 and 16) is formed.

As shown in FIG. 16, coils (4) are wound around each shaft (3) of one block half (72), and a Sing spacer (15) is placed on the surface of the head (31). is formed by a vapor deposition method (thus, it is formed to a thickness of 0.2 to 0.3 μm).

Next, as shown in FIG. 17, the block half-hole (71) shown in FIG. 15 and the block half-hole (72) shown in FIG. Form block (7).

After forming a recess (17) of a predetermined width on the front surface of each head of the core block (7), a shielding material (
12).

By cutting the core block (7) along broken line C, the magnetic head shown in FIG. 1 is completed. That is, through the above steps, the non-magnetic plates (14) and (16) are transformed into the non-magnetic substrate (
1) (10), and the magnetic plates (23) and (27) become the magnetic cores (2), (20), (21), and (22), and the protrusions (32) and protrusions of the magnetic plate (23). (33) become the heads (31) (31) and shaft portions (3) (3) of the magnetic cores (20) (22), respectively.

Finally, final polishing is applied to each magnetic head so that the sliding surface with the recording carrier is finished into a convex curved surface.

In the above magnetic head, by exciting the coil of each flat head chip, a closed magnetic path including the shaft portion (3) is created in the fusible core (2) (20) or (21) (22). This causes each gap to malfunction.

According to the above manufacturing method, both head chips (25) (2
The non-magnetic spacers (15) which become the gap portions G1 and G2 of 6) are formed on a single magnetic plate (23) shown in FIG. 16, and are shown in FIG. 17 while their relative positions are fixed. Since each magnetic head is divided in the process, the two gap portions G, . . . G2 are precisely arranged on one plane, and there is no positional error due to assembly error as in the conventional case.

Further, the above magnetic head has a gap portion G during manufacturing.
1. Since the step of adjusting the position of G2 is unnecessary,
The manufacturing process is simplified.

However, from the plurality of magnetic plates (23) shown in FIG.
Since a large number of magnetic heads can be manufactured at one time through the steps shown in FIGS. 17 to 17, mass productivity is extremely good.

In addition, it goes without saying that not only silver solder but also various well-known hard solders made of alloys of Ag, Cu, Ni, etc. can be used as the metal for the soldering process to form the non-magnetic metal layer (5). .

Further, the non-magnetic metal layer (5) is formed using a silver wax foil (53).
In addition to the method of interposing the metal with a magnetic plate (2
3) Alternatively, it is also possible to form it in advance on the surface of the metallization l (50) by a method such as plating or vapor deposition.

Furthermore, after the groove machining process shown in Fig. 12 is completed, a non-magnetic plate (
14) and the magnetic plate (23) at a high temperature (approximately 600° C.), it is possible to improve the magnetic properties of the magnetic head. Even in this case, since the silver solder layer has a melting point of 700°C or higher, it will not soften.

Figure 4 shows a non-magnetic metal layer (5), a nickel layer (52) and a silver solder layer (51) formed on both sides of the nickel layer (52).
This figure shows another embodiment configured according to (51).

The non-magnetic metal layer (5) is bonded to the magnetic plate (23) and the non-magnetic plate (14) as shown in FIG. 19 in the bonding process shown in FIG.
) is formed by interposing a nickel plate (54) and two silver solder foils (53) (53) sandwiching the nickel plate (54) between the metallized JW (50) You can.

The nickel plate (54) has a lower silver solder foil <53)
On the joint surface with
The recesses are repeatedly formed at a pitch of approximately 10μ pupils.

As a result, the silver solder melted by heating is filled in the groove <55) as shown in FIG. 5) is formed.

Since the nonmagnetic metal layer (5) has a larger elastic constant (E=approximately 10×1.O”Pa) than the silver solder layers (51) (51), the nickel NI (52) Silver solder layer (51) with great plasticity (51)
), it becomes a composite structure having appropriate elasticity and plasticity compared to the non-magnetic metal layer (5) consisting only of the silver solder layer shown in FIG.

However, since the solder (55) formed on the nickel layer (52) is filled with silver solder, the composite structure exhibits its performance more effectively than when a nickel layer of uniform thickness is formed. , it becomes possible to reduce the thickness of the nonmagnetic metal layer (5) while maintaining mechanical strength.

Figure 23 shows the thickness of the nickel layer (52) on the axis.

The ratio of the depth L2 of the groove (55) to The yield of a magnetic head having a non-magnetic gold rilsNI structure is experimentally investigated and graphed.

Straight line F indicates that the thickness of nickel M (52) is 15 μm.
This shows the change in yield when the depth L2 of the groove (55) is changed in a magnetic head having a non-magnetic metal layer (5) with a total thickness of 16 to 18 μm.

The straight line G is a non-magnetic metal W having a thickness of 10 μm for the nickel layer (52) and a total thickness of 13 to 15 μm.
It shows the change in yield in the J(5) magnetic head.

Furthermore, the straight line E has a thickness I, instead of a nickel layer <52).
1 has a 15μ thick Cu layer, and the total thickness is 13~16μ
- In a magnetic head having a non-magnetic metal layer (5),
It shows the change in yield when the depth L2 of the groove (55) is changed.

As is clear from this graph, the yield is greatly improved by forming the grooves (55). For example, when Lx/L+ is 0.5, compared to a magnetic head having a non-magnetic metal layer made only of silver solder, Yield is improved by approximately 20-50%.

Furthermore, it can be seen that by forming the groove (55) deeply, the thickness of the nickel layer (52) can be reduced while maintaining the yield.

Furthermore, it can be seen that even if Cu[ is formed in place of the nickel layer (52), substantially the same or better effect than the nickel layer (52) can be obtained.

The applicant has also determined from the graph of FIG. 23 that the deeper the 7M (55) is, the better the yield can be obtained, and as shown in FIG.
By forming a non-magnetic metal layer (5) with

The non-magnetic metal layer (5) is bonded to the magnetic plate (23) and the non-magnetic plate (14) as shown in FIG. 21 in the bonding process shown in FIG.
) can be formed by silver solder 1 (53) and a large number of through holes. The inner diameter of the through hole (56) is approximately 3
It is 0 μm.

Through the heat treatment in the bonding step, the silver solder foil (53) is melted and fused to the bonding surfaces of the magnetic plate (23) and the nickel plate (54), and at the same time, the through hole (56) of the nickel plate (54) is melted.
and penetrates into the bonding surface between the nickel layer (52) and the metallized layer (50) as shown in FIG.
A silver solder layer (51) is formed. As a result, the through hole (56
) is filled with silver solder and a nickel layer (52)
Silver solder layers (51) (51) are formed on both sides, and a nonmagnetic metal layer (5) is formed.

As shown in FIG. 21, the silver solder foil (53) and the nickel plate (54) are each molded into a shape corresponding to the magnetic plate (23) by etching, and the magnetic plate (23) and the metallized layer (50>) are formed into a shape corresponding to the magnetic plate (23). Unnecessary parts that do not contribute to bonding are removed in advance.

According to the above non-magnetic metal layer structure, compared to the structure shown in FIG. 19, it is possible to omit the interposition of a single piece of silver solder foil (53), so the joining process is simplified, and this improves productivity. Yield is improved.

In the magnetic head equipped with the above-mentioned non-magnetic metal layer (5), it is possible to obtain a manufacturing yield that is approximately equal to the manufacturing yield when the ratio L2/L is 1.0, as shown in the graph shown in FIG. .

Note that the configuration of each part of the present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the technical scope of the claims.

For example, as shown in FIG. 24, the magnetic head according to the present invention can be effectively applied to a magnetic head that has basically the same structure as the composite magnetic head, but has a single gap portion G. Of course it can be implemented.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a magnetic head according to the present invention, FIG. 2 is a perspective view of the lower half of the magnetic head cut vertically, FIG. 3 is an enlarged front view of the head of the magnetic head, and FIG. The figures are enlarged front views of the magnetic head head showing other embodiments;
Fig. 7 is a diagram showing the manufacturing process of the magnetic head shown in Fig. 1, in which Fig. 5 is an oblique view of the magnetic plate, Fig. 6 is an oblique view of the carbon plate to which the magnetic plate is fixed, and Fig. 7 is an adhesive Fig. 8 is an oblique view of a carbon plate filled with the agent, Fig. 9 is an oblique view of a carbon plate with grooves, Fig. 9 is an oblique view of a non-magnetic plate on which a metallized layer is formed, and Fig. 10 is an oblique view of a carbon plate joined together. Fig. 11 is a perspective view of the non-magnetic plate to which the magnetic plate is fixed, Fig. 12 is a perspective view of the joined body in which the magnetic plate is grooved, Fig. 13 The figure is a slanted view of the wafer block.
Fig. 14 is a slope view of a cut block piece, Fig. 15 is a plan view of one half block, Fig. 16 is a plan view of the other block half, and Fig. 17 is a slope view of the core block fixed by joining. , FIG. 18 is a perspective view illustrating the bonding process shown in FIG. 10, FIG. 19 is a perspective view corresponding to FIG.
0 is an enlarged sectional view of the non-magnetic metal layer of the magnetic head shown in FIG. 4, FIG. 21 is an oblique view corresponding to FIG. FIG. 23 is a graph showing the effect of the non-magnetic metal layer shown in FIG. 20; FIG. 24 is a sloped surface of a single type magnetic head showing another embodiment of the present invention. Figure, 2nd
5 and 26 are an exploded perspective view and a plan view, respectively, of a conventional magnetic head. (1) (10)...Nonmagnetic substrate (12)...Shield material (2) (20) (21) (22)...Magnetic core (3)...Shaft (4)...・Coil (5)...Nonmagnetic gold ill (50)...Metallized layer (51)...Silver wax 71 (52
)...Nickel layer ratio Request person Sanyo Electric Co., Ltd. Figure 1B Foil Figure 20 Figure 7Q

Claims (1)

[Scope of Claims] [1] A head chip in which a pair of plate-shaped magnetic cores are bonded and a gap is formed at the bonded portion, and a non-magnetic substrate (1) fixed to both sides of the head chip via a bonding layer. ) (10), the pair of magnetic cores (2) and (20) constituting the head chip are superimposed on each other in a plane substantially parallel to the plane including the gap portion. The head of each magnetic core is formed to have a narrow width corresponding to the track width, and the end of the magnetic core opposite to the head is formed to be wide, and at least one of the pair of magnetic cores is fixed at the wide part. A shaft portion (3) is formed to protrude toward the mating magnetic core,
A coil (4) is wound around the shaft (3), and non-magnetic substrates (1) and (10) are respectively arranged on the head chip on both sides of a plane including the gap and parallel to the plane. , the bonding layer between the head chip and each of the substrates (1) and (10) has a metallized layer (50) fixed to the substrate surface and a lower elastic modulus than that of the head chip and the non-magnetic substrates (1) and (10). A magnetic head comprising a metallized layer (50) and a nonmagnetic metal layer (5) that firmly connects a head chip. [2] The nonmagnetic metal layer (5) has a thickness of approximately 2 μm to 20 μm.
The magnetic head according to claim 1, which is a silver solder layer with a thickness of μm. [3] The nonmagnetic metal layer (5) includes a nickel layer (52),
The magnetic head according to claim 1, comprising silver solder layers (51) (51) formed on the upper and lower surfaces of the nickel layer (52). [4] The nickel layer (52) has a plurality of grooves (55) recessed in the joint surface with the silver solder layer (51), and the grooves (55)
4. The magnetic head according to claim 3, wherein the magnetic head is filled with silver solder. [5] The magnetic head according to claim 3, wherein a plurality of through holes (56) are formed in the nickel layer (52), and the through holes (56) are filled with silver solder.