JP2629882B2 - Teaching method for substrate inspection and substrate inspection teaching device using the method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection apparatus used for inspecting, for example, the quality of a soldered portion of a surface-mounted component on a board. The present invention relates to a teaching method and an apparatus for teaching a feature amount of a soldered portion to a board inspection apparatus of this kind prior to board inspection.

<Conventional technology> Conventionally, visual inspection has been performed for inspecting the surface mounted components on a board for the quality of the mounting state. Particularly, the quality of the soldering state is determined by the presence or absence, amount, and melting of the solder. , Short circuit, poor conduction, etc. are determined by this visual inspection. However, in such a visual inspection, the occurrence of an inspection error is inevitable, the judgment result varies depending on the inspected person, and the inspection processing capacity is limited.

Therefore, in recent years, various automatic inspection apparatuses capable of automatically performing this kind of inspection have been proposed.

FIG. 14 shows an example of an automatic inspection device capable of detecting three-dimensional shape information. The apparatus shown in the figure irradiates a solder light on a substrate 2 with a slit light 1 from a laser light source to generate a light cutting line 3 distorted along the surface shape on the surface of the substrate 2 including the solder light. Is what you do. This light cutting line 3
Is reflected by the imaging device 4, and the three-dimensional shape of the soldered part is detected by checking the distortion state of the imaging pattern.

However, in this inspection method, only the shape information of the portion irradiated with the slit light 1 is obtained, and it is difficult to grasp the three-dimensional shape of the other portion.

As a method for solving this problem, the orientation of the curved surface element of the soldering part is obtained by irradiating the surface of the soldering part with light having a different incident angle and imaging the pattern of each reflected light image of the soldering part. There is a method of detecting. This method focuses on the fact that when a light beam of a certain pattern is applied to an inspection object, the pattern of the reflected light beam is deformed according to the three-dimensional shape of the inspection object, and the shape of the inspection object is determined from the deformed pattern. It is to estimate.

FIG. 15 is a diagram for explaining the principle of this method.
2 shows a positional relationship between a detection system including an image sensor 6 and a soldering portion 7 to be inspected.

In the figure, when the light beam 8 is projected from the light projecting device 5 to the surface of the soldering portion 7 at an incident angle i, the angle i ′ (= i)
Is incident on the imaging device 6 at the position directly above and is detected. As a result, it is detected that the curved surface element of the soldering portion 7 irradiated with the light beam 8 is oriented at an angle i with respect to the reference surface 10. Therefore, if a plurality of light projecting devices having different incident angles are used to project light onto the soldering portion 7 composed of a large number of curved surface elements oriented in different directions, a group of curved surface elements corresponding to each of the incident angles becomes an imaging device. 6, whereby it is possible to detect what orientation each curved surface element of the soldering portion 7 has, that is, what the surface properties of the soldering portion are.

If the light projecting device 5 projects a light beam 8 having a width of 2Δi from an incident angle of i + Δi to i−Δi, a reflected light beam 9 having a width corresponding to the width is detected by the imaging device 6. become. That is, in this case, it is possible to detect a curved surface element whose inclination angle with the reference plane 10 has an angle having a width from i + Δi to i−Δi.

Further, as shown in FIG. 16, if the light projecting device 5 is a ring-shaped device installed horizontally with respect to the reference surface 10, the surface of the soldering portion 7 is positioned with respect to an axis perpendicular to the reference surface 10. Regardless of the rotation angle, the distance between the light projecting device 5 and the soldering portion 7 is constant, and the orientation of the curved surface element in the rotation angle direction is eliminated. Will be detected.

As shown in FIG. 16, the light emitting device 5 is connected to a plurality of ring-shaped light emitting pairs 11, 1 having different incident angles to the soldering portion 7.
If constituted by 2,13, the luminous flux by each luminous body 14,15,16
As described above, the curved surface element having the orientation corresponding to the incident angle can be detected in that much detail.

Now, three ring-shaped light-emitting bodies 11, 12, and 13 having a radius of r _n (where n = 1, 2, 3) have heights h _n (n = 1, 2,
If installed horizontally at the position of 3), respectively the incident angle i _{n (n} = 1,2,3) next to the light beams 14, 15, 16 to the soldering portion 7, the inclination angle of the soldering site 7 each curved element is i _n each can be detected by the imaging device 6. At this time, since the size of the curved surface element is sufficiently smaller than the total optical path length from each of the light emitters 11, 12, and 13 to the imaging device 6 through the surface of the soldering portion 7, the incident angle, that is, the detection angle What is necessary is just to determine the inclination angle of the curved surface element to be obtained.

As a method for inspecting the appearance of a soldered portion based on the above principle, a method using a white light source for each of the luminous bodies 11, 12, and 13 has been proposed (Japanese Patent Application Laid-Open No. 61-293657). In this inspection method, the luminous bodies 11, 12, and 13 were temporally different from each other in order to distinguish reflected light images from three luminous bodies 11, 12, and 13 having different incident angles with respect to a soldering portion. It is turned on at the timing and turned off.

However, in this method, a memory for storing images obtained at different light projection timings, an arithmetic device for arithmetically processing these images as the same visual field image, and a device for instantly lighting each illuminant. A lighting device and the like are required, and there are many technical complications, which also cause problems in cost and reliability.

In order to solve the problem of the time sharing system at a glance, the inventor of the present invention has recently proposed a board inspection apparatus having a configuration shown in FIG. As will be described in detail later, the board inspection apparatus includes a light emitting section 24 for irradiating red, green, and blue lights having different incident angles to the surface of the soldering portion, and a reflection from the surface of the soldering portion. The imaging device includes an imaging unit 25 for capturing an optical image for each hue, and a processing unit 26 for detecting properties of each curved surface element of the soldering part from an imaging pattern obtained by the imaging unit 25. Department
The 24 uses three ring-shaped light-emitting bodies 28, 29, and 30 that respectively generate red light, green light, and blue light. Each of the luminous bodies 28, 29, and 30 has a luminescence energy distribution with respect to wavelength so that white light is obtained by combining the respective lights. Is adjustable.

According to this board inspection apparatus, when red light, green light, and blue light are emitted from each of the luminous bodies 28, 29, and 30 at different incident angles to the soldered portion, the red, green, and blue light from the surface of the soldered portion is irradiated. Are simultaneously separated and detected by the imaging unit 25. In this case, since red light, green light and blue light by the light emitters 28, 29 and 30 are combined to form white light, in addition to the information on the curved surface property of the soldered portion, the information on each component on the board is added. Peripheral information such as information (for example, part number, polarity, color code, etc.) and board pattern information (such as various marks), which are indispensable for automatic inspection of board mounted components, can be detected.

<Problems to be Solved by the Invention> When used in such a board inspection apparatus, prior to the inspection of the board to be inspected, a board on which predetermined components are correctly mounted at predetermined positions (this is referred to as a “reference board”). Teaching operation of inputting various data concerning the above-mentioned) from a keyboard. This teaching work is called "teaching", and the position of components mounted on the reference board,
Data relating to the type, inspection area, and the like, and data relating to the characteristic amount of the mounting state (for example, soldering state) of each component in the inspection area are taught.

In particular, when teaching the characteristic amount of the soldering state, one reference board to which each component is normally soldered is prepared in advance, and the characteristic amount of the soldering state of each component is prepared from this reference board. Is extracted, the extracted amount is given a fixed width to determine the range of the feature amount that defines the normal soldering state.

However, the reference board prepared for teaching is not at all guaranteed that the soldering state of each component is in a state suitable for representing a normal state, and therefore, if not, the feature quantity to be taught Is not an average but a biased one, and there is a problem that, in the inspection of the soldering state, a mounting failure is often missed, or a defective determination is made based on strict determination of an allowable mounting state.

The present invention has been made in view of the above problems, and extracts a feature amount of a soldered part of a component using a plurality of reference boards, and performs a statistical process on the extraction result, thereby ensuring a reliable and stable operation. An object of the present invention is to realize inspection of a soldered part of a component.

<Means for Solving the Problems> According to the invention of claim 1, after extracting the type, position, and direction of each component from the data indicating the normal mounting state of the component on the board to be inspected, the extraction result is obtained. A first step of setting an inspection area at a soldering site of each component based on the plurality of reference substrates on which the components are normally mounted to the board inspection apparatus, and imaging each of the reference substrates; A second step of extracting a feature amount in each of the set inspection areas from each image for the substrate, and statistically processing the feature amount obtained for each image; The third step to be created and the third step are performed in series.

According to the second aspect of the present invention, the reference board on which the components are normally mounted is supplied to the board inspection apparatus to be imaged, and the type, position, and direction of each component are extracted from the obtained image. A first step of setting and teaching an inspection area at a soldered part of each component based on the extraction result, and supplying a plurality of reference boards on which the components are normally mounted to the board inspection apparatus, A second step of extracting a feature amount in each of the taught inspection areas from each image for each reference board, and statistically processing the feature amount obtained for each image, and The third step of creating feature amount teaching data is performed in series.

Further, the board inspection teaching device according to the invention of claim 3 comprises:
Inspection area setting means for extracting the type, position, and direction of each component from data indicating a normal mounting state of the component on the board to be inspected, and then setting an inspection area at a soldered portion of each component based on the extraction result. A feature amount extracting unit that extracts a feature amount in each of the set inspection areas from images obtained by imaging a plurality of reference boards on which components are normally mounted, and a feature amount extracting unit that extracts the feature amount. Computing means for statistically processing the obtained feature quantity, and storage means for determining and storing the teaching data of the feature quantity from the statistical result of the computing means.

<Operation> Based on the type, position, and direction of each component extracted from the data indicating the normal mounting state of the component, an inspection area is set at a soldering site of each component, and the setting is performed based on images of a plurality of reference boards. Since the features in each inspection area are extracted and the statistically processed values are taught to the board inspection apparatus as feature quantities, even if the feature quantities of the soldered portions on the individual reference boards vary, the statistical processing is performed. Therefore, when inspecting a soldered part of a component, the number of overlooked or overlooked defects is reduced, and a reliable and stable board inspection can be performed.

<Example> FIG. 1 shows a schematic configuration of a substrate inspection apparatus.

The board inspection apparatus includes a feature parameter (judgment data) of an inspection area of each portion 21S on the reference substrate 20S obtained by imaging the reference substrate 20S, and the imaging parameter obtained by imaging the substrate to be inspected 20T. By comparing the characteristic parameters (inspection data) of the inspection area of each component 21T on the inspection target board 20T,
This is for checking whether these components 21T are correctly mounted and soldered, and includes an X-ray table unit 22, a Y-axis table unit 23, a light emitting unit 24, an imaging unit 25, and a processing unit 26. And so on as its configuration.

Each of the X-axis table unit 22 and the Y-axis table unit 23 includes a motor (not shown) that operates based on a control signal from the processing unit 26. The drive of these motors causes the X-axis table unit 22 to operate as an imaging unit. 25 is moved in the X direction, and the Y-axis table 23 is a conveyor 27 for supporting the substrates 20S and 20T.
Is moved in the Y direction.

The substrates 20S and 20T are imaged by the imaging unit 25 while receiving irradiation light from the light projecting unit 24.

The light projecting unit 24 includes ring-shaped light emitters 28, 29, and 30 for generating red light, green light, and blue light based on a control signal from the processing unit 26 and irradiating the object to be inspected with different incident angles. The light is emitted to the substrates 20S, 20T by the mixed light of the three primary colors emitted from the light emitters 28, 29, 30 and the reflected light image is obtained by the imaging unit 25 and converted into an electric signal. . In the case of this embodiment, each of the luminous bodies 28, 29, and 30 has a structure in which a red, green, and blue colored transparent plate is covered with a white light source, but generates light of each of the three primary colors. As long as it is not limited to such a configuration, three ring-shaped color fluorescent lamps (red, green, and blue) or three ring-shaped neon tubes (red, green, and blue) are used. You can also.

In addition, the light projecting unit 24 is capable of detecting information (part number, polarity, color code, etc.) and component pattern information (various marks, etc.) on components on the substrates 20S, 20T under the illumination. In addition, a device is devised so that when the lights of the respective hues emitted from the respective luminous bodies 28, 29 and 30 are mixed, a complete white light is obtained. That is, each of the luminous bodies 28, 29, and 30 is composed of a luminous body that emits light of a red light spectrum, a green light spectrum, and a blue light spectrum having a luminous energy distribution with respect to wavelength such that white light is obtained by mixing colors. The light amount of each hue light can be adjusted by the imaging controller 31 so that red light, green light, and blue light emitted from the bodies 28, 29, and 30 are mixed to form white light.

Next, the imaging unit 25 includes a color television camera 32 positioned above the light projecting unit 24, and the reflected light from the substrate 20S or 20T is supplied by the color television camera 32 to color signals R, G of three primary colors. , B and supplied to the processing unit 26.

The processing unit 26 includes an A / D conversion unit 33, a memory 38, a teaching table 35, an image processing unit 34, a determination unit 36, an X and Y table controller 37, an imaging controller 31, a CRT display unit 41, a printer 42,
Keyboard 40, floppy disk device 43, control unit (CPU) 3
In the teaching mode, the mounting position of each component 21S, the type and mounting direction of the mounted component, the inspection area, and the inspection area are detected in the teaching mode in a manner to be described later. The color signals R, G, and B are processed to detect red, green, and blue hue patterns for the inspection area of each component 21S having a good soldering state, generate feature parameters, and create a determination data file.
Further, in the inspection mode, the processing unit 26 processes the color signals R, G, and B for the substrate to be inspected 20T, detects each similar hue pattern for the inspection region of each component 21T on the substrate, and generates feature parameters. Then, an inspection data file is created.
Then, the inspected data file is compared with the determination data file, and the quality of the soldered component is automatically determined for the predetermined component 21T on the inspected board 20T from the comparison result.

FIG. 2 shows the cross-sectional form of the solder 44 when the soldering is good, when parts are missing, and when the solder is insufficient, and the imaging pattern, red pattern, green pattern, and blue color in each case. The relationship with the patterns is shown in a list, and a clear difference appears between any of the hue patterns, so that the presence or absence of components and the quality of soldering can be determined.

Returning to FIG. 1, when the color signals R, G, and B are supplied from the imaging unit 25, the A / D conversion unit 33 converts them into analog signals.
The digital conversion is performed and stored in the memory 38. Memory 38 is RA
Equipped with M etc. and used as image memory. Image processing unit 3
4 performs image processing of the image data stored in the memory 38 in accordance with an instruction from the control unit 39 to create the inspection data file and the determination data file, and stores them in the control unit 39 and the determination unit.
Supply to 36.

The teaching table 35 controls the controller 39 during teaching.
When the judgment data file is supplied from the, it is stored, and when the control unit 39 outputs a transfer request at the time of inspection,
In response to this request, the determination data file is read and supplied to the control unit 39, the determination unit 36, and the like.

The determination unit 36 compares the data file supplied from the control unit 39 at the time of inspection with the data file to be inspected transferred from the image processing unit 34, and determines whether the soldering state of the substrate 20T to be inspected is good. Control unit and
Output to 39.

The imaging controller 31 includes an interface for connecting the control unit 39 to the light emitting unit 24 and the image capturing unit 25, and adjusts the light amounts of the respective light emitters 28, 29, and 30 of the light emitting unit 24 based on the output of the control unit 39. And controls to maintain mutual balance of each hue light output of the color television camera 32 of the imaging unit 25.

The X, Y table controller 37 includes an interface for connecting the control unit 39 to the X-axis table unit 22 and the Y-axis table unit 23, and controls the X-axis table unit 22 and the Y-axis table unit 23 based on the output of the control unit 39. Control.

The CRT display unit 41 includes a cathode ray tube (CRT), and when image data, a determination result, key input data, and the like are supplied from the control unit 39, these are displayed on a screen. When the printer 42 receives the determination result or the like from the controller 39, the printer 42 prints it out in a predetermined format.
The keyboard 40 is used for operating information, the reference board 20S and the board under test 20T.
There are provided various keys necessary for inputting data and the like relating to information, and information and data input from the keyboard 40 are supplied to the control unit 39.

The control unit 39 includes a microprocessor and the like,
The operation in teaching and inspection is controlled according to the procedure described below (FIGS. 3 and 4).

First, at the time of teaching, at the start of FIG. 3, the control unit 39 controls each unit of the apparatus to turn on the light projecting unit 24 and the imaging unit 25, and prepares imaging conditions and data processing conditions. Next, the operator operates the keyboard 40,
After registering the name of the board to be taught in Step 1 (indicated by “ST1” in the figure) and inputting the board size by key, in Step 2 the reference board 20S is
3 Set on the top and press the start key. Then, in step 3, the origin and the upper right and lower left corners of the reference substrate 20S are imaged by the imaging unit 25, and the actual size of the substrate 20S is input according to the position of each point. The X-axis table unit 22 and the Y-axis table unit 23 are controlled based on the position of the reference substrate 20S at the initial position.

The reference substrate 20S is formed by appropriately soldering a predetermined component 21S to a component mounting position and forming a good mounting state. At substantially the center of the upper surface of each component 21S, FIG. 5 and FIG. Labels 50 and 51 as shown in FIG. 6 are attached.

These labels 50 and 51 indicate the mounting position of the component 21S,
It is used to teach the type and mounting direction of the mounted components. In this embodiment, a large number of leads 52 are provided on both sides.
For a rectangular component 21S such as an SOP with a yellow semi-circular label 50, with the arc portion directed in the mounting direction,
In addition, a red circular label 51 is attached to a square component 21S such as QFP having a large number of leads 52 on all four sides, and another color or shape is changed for a chip component such as a square chip (not shown). Attach the label. In the case of this embodiment, the mounting position of the component is taught by the sticking position of the label, the type of the component is taught by the color and shape of the label, and the mounting direction of the component is taught by the sticking direction of the label. In this embodiment, both the color and the shape of the label are prepared for the identification of the component type, but this is to prevent erroneous identification based on the single information.

Returning to FIG. 3, when the reference board 20S is positioned at the initial position, a teaching procedure about the mounting position of the component, the type of the mounted component, and the like is started in step 4;
The first area on the reference substrate 20S is imaged by the imaging unit 25, and the first screen is generated.

Figure 7 is a rectangular region of the region Aspect l _x × l _y on the substrate 20S 5
It is divided into three and each rectangular area 53 is made to correspond to the size of one screen. First, a screen of the lower left area is generated, the following teaching procedure is executed, and thereafter, the arrow in the figure A similar procedure is repeatedly executed along each of the rectangular areas 53.

In the teaching procedure, first, based on the color signals of the three primary colors, the eighth
After the red and yellow regions 55 and 57 are extracted on the images 54 and 56 as shown in FIGS. 1 and 2, the circumscribed rectangle abcd of each region 55 and 57 depends on the size of the two sides. It is identified whether the image is the image of the red label 51 or the image of the yellow label 50, and the center coordinates of the circumscribed rectangle abcd for the red area 55 and the center coordinates of the circumscribed rectangle abcd and the arc part of the arc area for the yellow area. The direction and the direction are respectively extracted.

FIG. 9 (1) shows a display screen of the CRT display section 41 when the above procedure is in progress. In a predetermined screen area 58, a detection position 59 of a rectangular component 20S to which a yellow label 50 is attached is shown.
(Indicated by + in the figure) and a detection position 60 (indicated by in the figure) of the square component 20S to which the red label 51 is affixed.

Thus, when the teaching procedure of the component position and the type is completed, the process proceeds to step 5 in FIG. 3, and the reference board 20S is carried out.

In the next step 6, the operator sets the reference board 20S on which predetermined components are properly mounted at predetermined positions on the Y-axis table unit 23, presses the start key of the keyboard 40, and then operates the inspection area. Starts the teaching procedure for setting. In this embodiment, the reference substrate 20S used in the teaching procedure of the previous step 4 is reused, but it is needless to say that the present invention is not limited to this.

First, in step 7, "1" is initially set to a component count counter j of the control unit 39, and the control unit 39 sets the X-axis table unit 22 and the Y-axis table unit based on the component position data obtained by the previous teaching. By controlling 23, the first component 20S is positioned in the field of view of the television camera 32 and the component is imaged.

FIG. 10 specifically shows a method of setting an inspection area for the image 61 of the SOP component obtained at this time. This method
For the image 61, rectangular areas 62A and 62B indicated by chain lines in FIG. 10 (1) are set corresponding to both sides of the SOP component, and a land 63 on the substrate is set in each rectangular area 62A and 62B. After the automatic extraction, a circumscribed rectangle including each land portion 63 is obtained for each, and the circumscribed rectangle is further enlarged by a predetermined width in all directions to set rectangular inspection areas 64A and 64B shown in FIG. 10 (2). . Here, the method of setting the inspection area for the SOP component is also described as an example, but it is a matter of course that the inspection area is set for other parts by a method according to the method.

After the setting of the inspection area for the first component is completed in this way, when the operator presses the next key of the keyboard 40 in the next step 9, the counter j is incremented by one, and based on the contents of the counter j, all counters are incremented. It is determined whether the inspection area has been set for the component (steps 10 and 11). If the determination in step 11 is "NO", the next part is imaged and the same procedure as above is executed.

FIG. 9 (2) shows the CRT display unit 4 when the above procedure is in progress.
1 shows a display screen, and each time an inspection area of the part is set at a part detection position 59, 60 in a predetermined screen area 58, a display 65, 66 corresponding to the shape and size of the part.
It switches to.

Thus, the same processing is repeatedly performed for all the components, and when the determination in step 11 is “YES”, the reference board 20
S is unloaded, and the process proceeds to the characteristic parameter teaching procedure.

First, in step 13, “1” is initially set in a counter n for counting the number of substrates in the control unit 39, and then in step 14, the operator sets the first reference substrate 20 S (when a predetermined component is properly positioned at a predetermined position). Is mounted on the Y-axis table unit 23 and the start key of the keyboard 40 is pressed, and in step 15, the control unit
Reference numeral 39 controls the X-axis table unit 22 and the Y-axis table unit 23 based on the component position data obtained by the previous teaching, and sequentially positions the field of view of the television camera 32 to each component to perform imaging.

The three primary color signals R,
G and B are A / D converted by the A / D converter 33, and the conversion result is stored in the memory 38 in real time. Next, the control unit 39
After extracting each land area in the inspection area of each part obtained by the previous teaching, the image data is transferred from the memory 38 to the image processing unit 34 corresponding to each hue. The normal soldering state of each land is detected as red, green, and blue patterns by binarizing the image data of each of the hues with an appropriate threshold value for each hue, and the features of these patterns are characterized by feature parameters. Is calculated as

FIG. 11 (1) shows a component 21S mounted on a reference substrate 20S.
This shows a state in which the lead 52 is properly soldered to the land 70, and a sufficient amount of solder 71 is placed on the land 70 and covers the tip 70a of the land 70.

When imaging such a normal soldering site, the twelfth
A pattern of three primary colors as shown in FIG. 1A appears. In particular, the red region at the tip end portion 70a shines red due to the presence of the solder 71.

Therefore, a red hue value is obtained for the red region of the tip 70a, and this is set as one of the characteristic parameters.

When the extraction of a plurality of types of characteristic parameters for each component of the first reference board 20S is completed, the counter n is incremented by 1 after the board is unloaded and the second reference board 20S is added.
S is designated, and feature parameter extraction processing is executed in the same procedure as described above.

When the characteristic parameter extraction processing is completed for a predetermined number (n) of the reference substrates 20S in this manner, step 16
Is "YES" and the routine proceeds to step 18. Step 18
Then, the control unit 39 calculates the average value and the standard deviation by statistically processing the characteristic parameters of the n reference substrates 20S in order to obtain an average characteristic amount for each component, and calculates an average value + constant × A determination data file in which the range corresponding to the standard deviation is set as a normal range is created, stored in the teaching table 35, and the data is corrected if necessary, thereby completing the teaching.

FIG. 13 shows the distribution of data obtained from the n reference substrates 20S with respect to the red hue value of the tip portion 70a of the land 70, and the average value and the standard deviation of the red hue value calculated by the statistical processing are shown. Defines the normal range of this characteristic parameter.

When the teaching is completed as described above, the board inspection apparatus is ready for an automatic inspection of the board to be inspected 20T after soldering.

Thus, the operator shifts to the inspection mode shown in FIG. 4, selects the name of the substrate to be inspected in steps 1 and 2, and performs the operation of starting the substrate inspection.

The next step 3 is that the substrate to be inspected 20
Checking the supply of T, conveyor 2
7 is actuated, carried into the substrate to be inspected 20T in the Y-axis table unit 23, and substrate inspection is started (steps 4 and 5).

In step 5, the control unit 29 controls the X-axis table unit 22 and the Y-axis table unit 23 to position the field of view of the television camera 32 with respect to the first component 21T on the board to be inspected and perform imaging. Each land area in the inspection area is automatically extracted, and a characteristic parameter of each land area is calculated to create an inspection data file. Then control unit 39
Causes the inspection data file to be transferred to the determination unit 36,
The inspected data file is compared with the judgment data file to judge whether the first component 21T is good or not.

FIG. 11 (2) shows a part 21T having a poor soldering.
Only a small amount of solder 71 is placed on the land 70, and the tip 70a of the land 70 is
Is missing and exposed.

When an image of the soldered part in such a state is taken, the twelfth
As shown in FIG. 2B, a pattern of three primary colors similar to the normal state appears, but the red area of the tip portion 70a has a dull red glow due to the lack of the solder 71.

Therefore, when the red hue value of the red region of the tip end portion 70a is determined as a feature parameter, the value is out of the normal range shown in FIG.

Such an inspection is repeatedly performed for all the components 21T on the substrate to be inspected 20T. As a result, if there is a soldering defect, the defective component and the content of the defect are displayed on the CRT display section 41 or printed on the printer 42. After the inspection, the substrate to be inspected 20T
Is carried out from the inspection position (steps 6 to 8).

FIG. 9 (3) shows a display screen of the CRT display section 41 displaying the determination result.

In the screen shown in FIG.
65 and 66 are performed, and the defective soldering component 65 ′ is displayed in a specific color, and a screen area 67 below the defective soldering component 65 ′ is designated by the operator.
The content of the defect for 65 'is specifically displayed. In addition, the parts specified by the operator are parts with poor soldering.
The color different from the color indicating 65 'is specified on this screen.

<Effects of the Invention> As described above, the present invention teaches the characteristic amount of the mounted state of a component prior to board inspection, and the type and position of each component extracted from data of a reference board on which the component is normally mounted. ,
Based on the direction, after setting the inspection area at the soldered part of each component, the feature amount in each of the set inspection areas is extracted from the images of the plurality of reference boards, and the value obtained by statistical processing is used as the feature amount. Since the inspection device is taught, in the inspection of the soldering part of the component, the oversight and the oversight of mounting defects are reduced, and a reliable and stable board inspection is realized. It works.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing the overall configuration of the board inspection apparatus, FIG. 2 is an explanatory diagram showing the relationship between the quality of the soldering state and the pattern, FIG. 3 is a flowchart showing the teaching procedure, and FIG. FIG. 5 and FIG. 6 are plan views of parts showing the state of label attachment,
FIG. 7 is an explanatory diagram showing divided areas on a substrate and the order of processing;
FIG. 8 is an explanatory diagram showing an image of a label extracted on the image and its circumscribed rectangle, FIG. 9 is an explanatory diagram showing a display screen of a CRT display unit, and FIG. 10 is an explanatory diagram showing a method of setting an inspection area. Figure,
FIG. 11 is a cross-sectional view showing a soldered state of a part, FIG. 12 is an explanatory view showing an imaging pattern of a soldered part, FIG. 13 is an explanatory view showing a data distribution of a red phase value, and FIG. FIG. 15 and FIG. 16 are explanatory diagrams showing the principle of the automatic inspection device, and FIG. 15 and FIG. 20S …… Reference board, 21S …… Parts

Claims (3)

(57) [Claims] 1. A method for teaching a feature amount of a soldered part of a component to a board inspection apparatus for inspecting a soldering state of a mounted component on the board prior to the board inspection. Extracting a type, a position, and a direction of each component from data indicating a normal mounting state of the component, and setting an inspection area in a soldered portion of each component based on the extracted result; A second method of supplying a plurality of reference boards on which components are normally mounted to the apparatus, imaging each of the reference boards, and extracting a feature amount in each of the set inspection areas from each image for each of the reference boards. And a third step of statistically processing a feature amount obtained for each image and creating teaching data of the feature amount from the statistical result in a series of steps. Teaching method 2. A method for teaching a feature amount of a soldered portion of a component to a board inspection apparatus for inspecting a soldering state of a mounted component on a board prior to the board inspection. On the other hand, the reference board on which the components are normally mounted is supplied and imaged, and the type, position, and direction of each component are extracted from the obtained image. A first step of setting and teaching, and supplying a plurality of reference boards on which components are normally mounted to the board inspection apparatus to image each reference board, and for each reference board, A second step of extracting a feature amount in each of the taught inspection areas, a third step of performing statistical processing on the feature amount obtained for each image, and creating teaching data of the feature amount from the statistical result; Is implemented in a series Teaching method for a substrate inspecting characterized by. 3. An apparatus for teaching a feature amount of a soldered portion of a component to a board inspection apparatus for inspecting a soldering state of a mounted component on the board prior to the board inspection. Inspection area setting means for extracting the type, position, and direction of each component from the data indicating the normal mounting state of the component, and setting an inspection area in a soldered portion of each component based on the extraction result; A feature amount extracting unit that extracts a feature amount in each of the set inspection regions from images obtained by imaging a plurality of reference substrates mounted on the device, and a feature amount extracted by the feature amount extracting unit. A board inspection teaching device comprising: an arithmetic unit for performing statistical processing; and a storage unit for determining and storing the teaching data of the feature amount from the statistical result of the arithmetic unit.