JP2600320B2 - Parts inspection method - Google Patents

Parts inspection method

Info

Publication number
JP2600320B2
JP2600320B2 JP63213060A JP21306088A JP2600320B2 JP 2600320 B2 JP2600320 B2 JP 2600320B2 JP 63213060 A JP63213060 A JP 63213060A JP 21306088 A JP21306088 A JP 21306088A JP 2600320 B2 JP2600320 B2 JP 2600320B2
Authority
JP
Japan
Prior art keywords
component
inspection
histogram
shadow
luminance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63213060A
Other languages
Japanese (ja)
Other versions
JPH0261505A (en
Inventor
正雄 長本
大介 永野
栄一 蜂谷
敏夫 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63213060A priority Critical patent/JP2600320B2/en
Publication of JPH0261505A publication Critical patent/JPH0261505A/en
Application granted granted Critical
Publication of JP2600320B2 publication Critical patent/JP2600320B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Geophysics And Detection Of Objects (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は製造工程中の検査工程において、検査対象物
である部品等がある特定の位置に存在することを判断す
る部品検査方法に関するものである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component inspection method for determining that a component or the like to be inspected exists at a specific position in an inspection process during a manufacturing process.

従来の技術 従来、この種の方法として、第5図において検査基板
1上の検査対象部品2の斜め上方に照明装置3を設置
し、部品2を照らして部品2の影4を作り、この影4が
できる範囲に輝度ヒストグラムを求めるヒストグラム領
域を設定し、かつ部品2をはさんで前記照明装置3と相
対する位置に照明装置5を設置し部品2を照らして前記
の影4と相対する方向に部品2の影6を作り、この影6
ができる範囲に輝度ヒストグラムを求めるヒストグラム
領域を設定し、部品2の真上に設置されたTVカメラ7を
通して画像認識装置8によって取り込み、これら2つの
ヒストグラム領域について前記の各々の照明で照らした
ときに得られる2種類のヒストグラムの違いにより検査
対象部品を存在を検査する部品検査方法がある。
2. Description of the Related Art Conventionally, as a method of this kind, a lighting device 3 is installed diagonally above an inspection target component 2 on an inspection substrate 1 in FIG. A histogram area for obtaining a luminance histogram is set in a range in which the component 4 can be formed, and a lighting device 5 is installed at a position opposed to the lighting device 3 with the component 2 interposed therebetween. Make shadow 6 of part 2
When a histogram area for obtaining a luminance histogram is set in a range in which a histogram can be obtained, the image is captured by an image recognition device 8 through a TV camera 7 installed right above the component 2, and when these two histogram areas are illuminated by the respective illuminations described above. There is a component inspection method for inspecting the existence of an inspection target component based on a difference between two types of obtained histograms.

発明が解決しようとする課題 しかしながら上記の方法では、検査基板の色、その表
面や状態等や、各部品による部品の形状(大きさ、高
さ)、部品の置かれている位置等によってヒストグラム
が大きく異なるためパラメータを設定することが難し
く、設定時間も要していた。従って経験や感に頼ってパ
ラメータを設定していたため人によって設定値にバラツ
キがあり、安定した検査をおこなうことができなかっ
た。
However, in the above method, however, the histogram is determined according to the color of the inspection board, its surface and state, the shape (size, height) of each component, the position where the component is placed, and the like. It was difficult to set parameters because of the large difference, and setting time was required. Therefore, since the parameters are set depending on the experience and feeling, the set values vary from person to person, and a stable inspection cannot be performed.

課題を解決するための手段 そこで本発明の部品検査方法では、部品検査を行う前
段階でサンプルとして複数枚の検査対象基板の各部品に
ついて検査対象部品の斜め上方に設置された照明装置に
よって部品の影ができる範囲の輝度ヒストグラムと影と
ならない範囲の輝度ヒストグラムを求める第1工程と、
第1工程で求めた各基板の部品毎の各輝度ヒストグラム
を統計処理して特徴量を求める第2工程と、第2工程で
求めた各基板の部品毎の特徴量を部品毎に統計処理した
値を部品の影の有無の判断するための設定値とする第3
工程までを前処理とする部品検査方法である。
Means for Solving the Problems Therefore, in the component inspection method of the present invention, before the component inspection, each component of the plurality of substrates to be inspected is sampled by a lighting device installed diagonally above the component to be inspected. A first step of obtaining a luminance histogram in a range where shadows can be formed and a luminance histogram in a range not forming shadows;
A second step of statistically processing each luminance histogram of each component of each board obtained in the first step to obtain a feature amount, and a statistical processing of the feature amount of each component of each board obtained in the second step for each component The third value is a set value for determining whether or not the part has a shadow.
This is a component inspection method that pre-processes up to the process.

作用 本発明はあらかじめ複数枚のサンプル基板の部品毎に
求めた2種類の輝度ヒストグラムを統計処理した設定値
と、検査基板の部品毎の2種類の輝度ヒストグラムを統
計処理した値を比較するため、検査部品を背景に材質に
よる反射状態のバラツキがある場合や、検査部品近傍の
他の検査部品等の反射光により検査部品の影がうすくな
る場合、そして背景が反射しにくい材質で背景像と影に
差を見い出しにくい場合においても、部品毎のバラツキ
による影響も考慮されることとなり、かつ部品有無判断
をする設定を求めることが容易となり、かつこの設定値
が数値的裏付けをもつものであるため信頼性の高い部品
有無検査を可能にした。
The present invention compares a set value obtained by statistically processing two types of luminance histograms obtained in advance for each component of a plurality of sample substrates with a value obtained by statistically processing two types of luminance histograms for each component of an inspection substrate. When there is variation in the reflection state due to the material behind the inspection component, when the shadow of the inspection component becomes thin due to reflected light from other inspection components near the inspection component, or when the background image and shadow are made of a material whose background is difficult to reflect In the case where it is difficult to find a difference, the influence of the variation of each part is also taken into consideration, and it is easy to find the setting for judging the presence / absence of a part, and since this set value has numerical support. A highly reliable component presence inspection has been made possible.

実 施 例 以下、本発明の一実施例を説明する。第1,2図は本発
明の一実施例における部品検査方法のフローチャート、
第3図aは照明装置5によって部品2の影6ができたと
きのヒストグラム領域9,10を示す図、第3図bは第3図
aのヒストグラム領域9の輝度ヒストグラムのグラフA
12と特徴量の値αA12、第3図cは第3図aのヒストグ
ラム領域10の輝度ヒストグラムのグラフB12と特徴量の
値αB12、第4図dは照明装置3によって部品2の影4
ができたときのヒストグラム領域9,10を示す図、第3図
eは第3図dのヒストグラム領域9の輝度ヒストグラム
のグラフC12と特徴量の値αC12、第3図fは第3図dの
ヒストグラム領域10の輝度ヒストグラムのグラフD12
特徴量の値αD12、第4図aは第3図bの特徴量のグラ
フαA1と設定値βA1、第4図bは第3図cの特徴量のグ
ラフαB1と設定値βB1、第4図cは第3図eの特徴量の
グラフαC1と設定値βC1、第4図dは第3図fの特徴量
のグラフαD1と設定値βD1の図である。
Embodiment Hereinafter, an embodiment of the present invention will be described. 1 and 2 are flowcharts of a component inspection method according to an embodiment of the present invention,
FIG. 3A is a view showing histogram areas 9 and 10 when the shadow 6 of the component 2 is formed by the lighting device 5, and FIG. 3B is a graph A of a luminance histogram of the histogram area 9 in FIG. 3A.
12 and the feature quantity values alpha A12, Figure 3 c is a third diagram a histogram domain plot B 12 of the luminance histogram of the 10 and the feature quantity values alpha B12, the Figure 4 d shadow part 2 by the illumination device 3 4
Shows a histogram region 9, 10 when the could, FIG. 3 e is a graph C 12 and the feature quantity values alpha C12 of the luminance histogram of the histogram region 9 of Figure 3 d, the third diagram f Figure 3 graph D 12 and the feature quantity values alpha D12 of the luminance histogram of d histogram region 10, FIG. 4 a set value beta A1 and graph alpha A1 feature of Figure 3 b, the fourth Figure b Figure 3 graph of the characteristic amounts of c alpha B1 and settings beta B1, Figure 4 c is a set value beta C1 and feature quantity graph alpha C1 in Figure 3 e, Figure 4 d is graph of the characteristic of Figure 3 f FIG. 7 is a diagram of α D1 and a set value β D1 .

本実施例の部品検査装置は第5図の回路基板1上に装
着された部品2の有無を検査するもので、本発明の部品
検査方法をそのまま用いている。検査対象物である部品
2と照明装置3,5と輝度ヒストグラムを取込むためのTV
カメラ7との位置関係は第5図の通りであり、他の部品
の検査のための照明装置3,5とTVカメラ7は回路基板1
上をロボットにより平行移動する。
The component inspection apparatus of this embodiment inspects the presence or absence of the component 2 mounted on the circuit board 1 of FIG. 5, and uses the component inspection method of the present invention as it is. TV to capture component 2 to be inspected, lighting devices 3 and 5, and brightness histogram
The positional relationship with the camera 7 is as shown in FIG. 5, and the lighting devices 3 and 5 for inspecting other parts and the TV camera 7 are connected to the circuit board 1.
The robot translates above it.

さて、実施例の部品検査装置の動作を第1,2図に基づ
き説明する。ステップ1(検査準備)では複数枚のサン
プル基板の各部品2に対して照明装置3を発光し、部品
2の影4を生じさせ、ヒストグラム領域9,10(第3図)
において輝度ヒストグラムA12,B12を取込む。同様にし
て他の部品(n=1,2,……lただし、n:部品番号,l:部
品数)についても輝度ヒストグラムAn2,Bn2,(n=1,2,
……lただし、n:部品番号,l:部品数)を取込み、同様
にして他の基板の各部品についても輝度ヒストグラムA
nk,Bnk(n=1,2,……l,k=1,2,……qただしn:部品番
号,l:部品数,k:基板番号,q:基板数)を取込む。ステッ
プ2ではステップ1と全く同様にして照明5を発光し、
各基板(k=1,2,……q,ただしk:基板番号,q:基板数)
の各部品(n=1,2,……lただしn:部品番号,l:部品
数)の影6を生じさせ、ヒストグラム領域9,10(第3
図)において輝度ヒストグラムCnk,Dnkを取込む。ステ
ップ3ではステップ1,2で求めた各基板の部品毎の各輝
度ヒストグラムAnk,Bnk,Cnk,Dnk(例 第3図とA12,
B12,C12,D12)を統計処理(第1表)して特徴量αAnk,
αBnkCnkDnk(例 第3図のαA12B12C12,
αD12)を求める。
The operation of the component inspection apparatus according to the embodiment will be described with reference to FIGS. In step 1 (preparation for inspection), the illuminating device 3 emits light to each of the components 2 of the plurality of sample substrates to generate shadows 4 of the components 2 and histogram regions 9 and 10 (FIG. 3).
, The luminance histograms A 12 and B 12 are acquired. Similarly, for other parts (n = 1, 2,... L, n: part number, l: number of parts), luminance histograms A n2 , B n2 , (n = 1, 2,
... L (n: part number, l: number of parts), and the luminance histogram A
nk , B nk (n = 1, 2,... l, k = 1, 2,... q, where n: part number, l: number of parts, k: board number, q: number of boards). In step 2, the illumination 5 is emitted in exactly the same manner as in step 1,
Each board (k = 1,2, ... q, where k: board number, q: number of boards)
, Where n = 1, 2,... L, where n is the part number and l is the number of parts, and the shadow areas 9 and 10 (the third
In the figure, the luminance histograms C nk and D nk are taken. In step 3, each brightness histogram A nk , B nk , C nk , D nk for each component of each board obtained in steps 1 and 2 (eg, FIG. 3 and A 12 ,
B 12 , C 12 , D 12 ) are subjected to statistical processing (Table 1) to obtain feature quantities α Ank ,
α Bnk , α Cnk , α Dnk (eg, α A12 , α B12 , α C12 ,
α D12 ).

ステップ4ではステップ3で求めた各基板の部品毎の
特徴量αAnkBnkCnkDnkを部品毎に統計処理
(第1表)して部品の影の有無を判断するための設定値
βAnBnCnDn(例 第4図のβA1B1C1
D1)を求める。
In step 4, the feature amounts α Ank , α Bnk , α Cnk , and α Dnk of each component obtained in step 3 are statistically processed for each component (Table 1) to determine the presence or absence of a shadow of the component. Set values β An , β Bn , β Cn , β Dn (eg, β A1 , β B1 , β C1 , β C in FIG. 4)
D1 ).

ステップ5では実際の検査において検査基板の各部品
(n=1,2,……l)に対して照明装置3を発光し、部品
の影4を生じさせ、ヒストグラム領域9,10において輝度
ヒストグラムE1,G1を取込む。同様にして他の部品につ
いても輝度ヒストグラムEn,Fnを取込む。ステップ6で
はステップ5と全く同様にして実際の検査において照明
装置5を発光し、検査基板の各部品の影6を生じさせ、
ヒストグラム領域9,10において輝度ヒストグラムGn,Hn
を取込む。ステップ7ではステップ5,6で求めた輝度ヒ
ストグラムを統計処理(第1表)して特徴量γEnFn,
γGnHnを求める。ステップ8ではステップ7で求め
た実際の検査基板の部品毎の各輝度ヒストグラムEn,Fn,
Gn,Hnを統計処理(第1表)して求めた特徴量γEn,
γFnGnHnとステップ4で求めた設定値βAnBn,
βCnDnを比較し、ステップ9で影の有無を判断す
る。(例 βCn−βAnγGn−γEnかつβBn−βDnγ
Fn−γHnが成立するとき影ができていると判断し、どち
らか一方が成立しないとき影ができていないと判断す
る。)ステップ10ではステップ9で求めた影の有無によ
って部品の有無を判断する。
In step 5, in the actual inspection, the illumination device 3 emits light for each component (n = 1, 2,... L) of the inspection board to generate a shadow 4 of the component. 1 , G 1 is taken. Similarly, luminance histograms E n and F n are fetched for other components. In step 6, the illuminating device 5 emits light in the actual inspection in exactly the same manner as in step 5, causing shadows 6 of the components on the inspection board.
In histogram areas 9 and 10, luminance histograms G n and H n
Take in. In Step 7, the luminance histograms obtained in Steps 5 and 6 are statistically processed (Table 1), and the feature amounts γ En , γ Fn ,
γ Gn and γ Hn are obtained. In step 8, each luminance histogram E n , F n ,
The feature amount γ En , obtained by statistically processing G n and H n (Table 1)
γ Fn , γ Gn , γ Hn and the set values β An , β Bn ,
β Cn and β Dn are compared, and the presence or absence of a shadow is determined in step 9. (Eg β CnAn γ GnEn and β BnDn γ
When FnγHn is established, it is determined that a shadow is formed, and when either one is not established, it is determined that a shadow is not formed. In step 10, the presence or absence of a component is determined based on the presence or absence of a shadow obtained in step 9.

また、部品検査装置(第5図)で照明装置8,9を結ぶ
線上と直角方向で部品を斜め上方から照らす位置に照明
装置2個を取り付けて4個の照明によって部品検査する
とより効果的である。
In addition, it is more effective to mount two illuminating devices at a position perpendicular to the line connecting the illuminating devices 8 and 9 to illuminate the components obliquely from above and to inspect the components by four illuminations using the component inspection device (FIG. 5). is there.

発明の効果 以上のように本発明によれば、あらかじめ複数枚のサ
ンプル基板の部品毎に求めた2種類の輝度ヒストグラム
を統計処理した設定値と、検査基板の部品毎の2種類の
輝度ヒストグラムを統計処理した値とを比較するため、
部品毎のバラツキによる影響も考慮されることとなり、
かつ部品有無判断をする設定値を求めることが容易とな
り、かつこの設定値が数値的裏付けをもつものであるた
め信頼性の高い部品有無検査を可能にした。
As described above, according to the present invention, a set value obtained by statistically processing two types of luminance histograms obtained in advance for each component of a plurality of sample substrates and two types of luminance histograms for each component of an inspection substrate are obtained. To compare with the statistically processed values,
The influence of the variation for each part will also be considered,
In addition, it is easy to obtain a set value for judging the presence / absence of a component, and since the set value has numerical support, a highly reliable component presence / absence inspection can be performed.

【図面の簡単な説明】[Brief description of the drawings]

第1,2図は本発明の一実施例における部品検査方法のフ
ローチャート図、第3図aは照明装置によって部品の影
ができたときのヒストグラム領域を示す図、第3図bは
ヒストグラム領域の輝度ヒストグラムのグラフと特徴量
の値の関係図、第3図cは第3図aのヒストグラム領域
の輝度ヒストグラムのグラフと特徴量の値の関係図、第
3図dは照明装置によって部品の影ができたときのヒス
トグラム領域を示す図、第3図eは第3図dのヒストグ
ラム領域の輝度ヒストグラムのグラフと特徴量の値の関
係図、第3図fは第3図dのヒストグラム領域の輝度ヒ
ストグラムのグラフと特徴量の値の関係図、第4図aは
第3図bの特徴量のグラフと設定値との関係図、第4図
bは第3図cの特徴量のグラフと設定値との関係図、第
4図cは第3図eの特徴量のグラフと設定値との関係
図、第4図dは第3図fの特徴量のグラフと設定値との
関係図、第5図a,bは部品検査装置の側面図及び平面図
である。 1……回路基板、2……部品、3,4……照明装置、5,6…
…影、7……TVカメラ、8……画像認識装置、9,10……
ヒストグラム領域。
1 and 2 are flowcharts of a component inspection method according to an embodiment of the present invention. FIG. 3a is a diagram showing a histogram area when a shadow of a component is formed by a lighting device. FIG. FIG. 3C is a graph showing the relationship between the graph of the luminance histogram and the value of the characteristic amount, FIG. 3C is a graph showing the relationship between the graph of the luminance histogram in the histogram area of FIG. 3A and the value of the characteristic amount, and FIG. FIG. 3E is a diagram showing a relationship between a graph of a luminance histogram of the histogram region of FIG. 3D and a value of a feature amount, and FIG. 3F is a diagram of a histogram region of FIG. 3D. FIG. 4A is a graph showing the relationship between the graph of the luminance histogram and the value of the characteristic amount, FIG. 4A is a graph showing the relationship between the graph of the characteristic amount of FIG. 3B and the set value, and FIG. Fig. 4c shows the relationship with the set values, FIG. 4d is a graph showing the relationship between the graph of the characteristic amount and the set value, FIG. 4d is a graph showing the relationship between the graph of the characteristic amount of FIG. 3f and the set value, and FIGS. 5a and 5b are side and plan views of the component inspection apparatus. It is. 1 ... circuit board, 2 ... parts, 3,4 ... lighting equipment, 5,6 ...
... Shadow, 7 ... TV camera, 8 ... Image recognition device, 9,10 ...
Histogram area.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 森本 敏夫 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭64−86090(JP,A) 特開 昭63−106508(JP,A) 特開 昭62−175606(JP,A) ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Toshio Morimoto 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-64-86090 (JP, A) JP-A-63- 106508 (JP, A) JP-A-62-175606 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】検査基準となる設定値を設定するための標
準検査対象として複数枚の検査基板の各部品について検
査対象部品の斜め上方に設置された照明装置によって部
品の影ができる範囲の輝度ヒストグラムと影とならない
範囲の輝度ヒストグラムを求める第1工程と、第1工程
で求めた各基板の部品毎の各輝度ヒストグラムを統計処
理して特徴量を求める第2工程と、第2工程で求めた各
基板の部品毎の特徴量を部品毎に統計処理した値を部品
の影の有無の判断するための設定値とする第3工程と、
検査基板の各部品の影ができる範囲の輝度ヒストグラム
と影とならない範囲の輝度ヒストグラムを求める第4工
程と、第4工程で求めた部品毎の各輝度ヒストグラムを
統計処理して特徴量を求める第5工程と、第5工程で求
めた実際の検査部品の特徴量と第3工程で求めた各部品
の設定値を部品毎に比較し影の有無を判断する第6工程
と、影の有無によって部品の有無を判断する第7工程を
有した部品検査方法。
1. A luminance in a range where a shadow of a component can be formed by a lighting device installed obliquely above a component to be inspected for each component of a plurality of inspection boards as a standard inspection object for setting a set value serving as an inspection standard. A first step of obtaining a histogram and a luminance histogram in a range not forming a shadow; a second step of performing a statistical process on each luminance histogram of each component of each board obtained in the first step to obtain a feature amount; A third step in which a value obtained by statistically processing the feature amount of each component of each board for each component is set as a set value for determining the presence or absence of a shadow of the component;
A fourth step of obtaining a luminance histogram in a range where shadows of each component of the inspection board can be formed and a luminance histogram in a range where no shadow is formed; and a fourth step of statistically processing each luminance histogram of each component obtained in the fourth step to obtain a feature amount. A fifth step, a sixth step of comparing the feature value of the actual inspection part obtained in the fifth step with the set value of each part obtained in the third step for each part to determine the presence or absence of a shadow; A component inspection method including a seventh step of determining the presence or absence of a component.
JP63213060A 1988-08-26 1988-08-26 Parts inspection method Expired - Fee Related JP2600320B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63213060A JP2600320B2 (en) 1988-08-26 1988-08-26 Parts inspection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63213060A JP2600320B2 (en) 1988-08-26 1988-08-26 Parts inspection method

Publications (2)

Publication Number Publication Date
JPH0261505A JPH0261505A (en) 1990-03-01
JP2600320B2 true JP2600320B2 (en) 1997-04-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP63213060A Expired - Fee Related JP2600320B2 (en) 1988-08-26 1988-08-26 Parts inspection method

Country Status (1)

Country Link
JP (1) JP2600320B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2629882B2 (en) * 1988-09-12 1997-07-16 オムロン株式会社 Teaching method for substrate inspection and substrate inspection teaching device using the method
US6903360B2 (en) * 2002-10-16 2005-06-07 Agilent Technologies, Inc. Method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors
JP5765152B2 (en) * 2011-09-12 2015-08-19 大日本印刷株式会社 Authentication apparatus, authentication method, and program

Also Published As

Publication number Publication date
JPH0261505A (en) 1990-03-01

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