JPH0261505A - Method for inspecting component part - Google Patents

Method for inspecting component part

Info

Publication number
JPH0261505A
JPH0261505A JP63213060A JP21306088A JPH0261505A JP H0261505 A JPH0261505 A JP H0261505A JP 63213060 A JP63213060 A JP 63213060A JP 21306088 A JP21306088 A JP 21306088A JP H0261505 A JPH0261505 A JP H0261505A
Authority
JP
Japan
Prior art keywords
component
shadow
histogram
inspected
brightness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63213060A
Other languages
Japanese (ja)
Other versions
JP2600320B2 (en
Inventor
Masao Nagamoto
長本 正雄
Daisuke Nagano
大介 永野
Eiichi Hachitani
栄一 蜂谷
Toshio Morimoto
敏夫 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63213060A priority Critical patent/JP2600320B2/en
Publication of JPH0261505A publication Critical patent/JPH0261505A/en
Application granted granted Critical
Publication of JP2600320B2 publication Critical patent/JP2600320B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To inspect whether a part is present with high reliability by comparing a set value, which is obtained by applying statistical processing to two kinds of brightness histograms at every part of a sample substrate, with a value obtained by applying statistical processing to two kinds of brightness histograms at every part of a substrate to be inspected. CONSTITUTION:In the first process, each of the parts of a plurality of substrates to be inspected is used as a standard object to be inspected and the brightness histogram of a range where the shade of the part is formed by an illumination device and the brightness histogram of a range where no shade of the part is formed are calculated. In the second process, the respective brightness histograms are subjected to statistical processing to calculate characteristic quantities. In the third process, these characteristic quantities are subjected to statistical processing at every part to obtain a value which is, in turn, used as a set value for judging whether the shade of the part is present. In the fource process, the brightness histogram of a range where the shade of each part of each substrate to be inspected is formed and that of a range where no shade of the part is formed are calculated. In the fifth process, the respective brightness histograms calculated in the fourth process are subjected to statistical processing to calculate characteristic quantities and, in the sixth process, the characteristic quantity of each part to be inspected is compared with the set value of each part calculated in the third process at every part to judge the presence of shade. In the seventh process, the presence of the part is judged from the presence of the shade.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は製造工程中の検査工程において、検査対象物で
ある部品等がある特定の位置に存在することを判断する
部品検査方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a component inspection method for determining whether a component to be inspected is present at a specific position in an inspection step during a manufacturing process.

従来の技術 従来、この種の方法として、第6図において検査基板1
上の検査対象部品2の斜め上方に照明装置3を設置し、
部品2を照らして部品2の影4を作シ、この影4ができ
る範囲に輝度ヒストグラムを求めるヒストグラム領域を
設定し、かつ部品2をはさんで前記照明装置3と相対す
る位置に照明装置6を設置し部品2を照らして前記の影
4と相対する方向に部品2の影6を作り、この影6がで
きる範囲に輝度ヒストグラムを求めるヒストグラム領域
を設定し、部品2の真上に設置されたTVカメラ7を通
して画像認識装置8によって取り込み、これら2つのヒ
ストグラム領域について前記の各々の照明で照らしたと
きに得られる2種類のヒストグラムの違いにより検査対
象部品の存在を検査する部品検査方法がある。
BACKGROUND OF THE INVENTION Conventionally, as a method of this kind, as shown in FIG.
A lighting device 3 is installed diagonally above the part to be inspected 2 above,
A shadow 4 of the component 2 is created by illuminating the component 2, a histogram area for obtaining a luminance histogram is set in the range where the shadow 4 is formed, and a lighting device 6 is placed at a position facing the lighting device 3 across the component 2. , and illuminate the component 2 to create a shadow 6 of the component 2 in the direction opposite to the shadow 4. Set the histogram area for obtaining the brightness histogram in the range where this shadow 6 is created, and set it directly above the component 2. There is a component inspection method in which the presence of the component to be inspected is inspected based on the difference between two types of histograms obtained when the images are captured by the image recognition device 8 through the TV camera 7 and these two histogram regions are illuminated with the respective lights mentioned above. .

発明が解決しようとする課題 しかしながら上記の方法では、検査基板の色、その表面
の状態等や、各部品による部品の形状(大きさ、高さ)
、部品の置かれている位置等によってヒストグラムが大
きく異なるためパラメータを設定することが難しく、設
定時間も要していた。従って経験や感に頼ってパラメー
タを設定していたため人によって設定値にバラツキがあ
り、安定した検査をおこなうことができなかった。
Problems to be Solved by the Invention However, in the above method, the color of the test board, the condition of its surface, etc., and the shape (size, height) of each component
Since the histogram varies greatly depending on the position of the part, it is difficult to set the parameters, and it takes a long time to set them. Therefore, since parameters were set based on experience and feeling, the set values varied depending on the person, making it impossible to perform stable inspections.

課題を解決するための手段 そこで本発明の部品検査方法では、部品検査を行う前段
階でサンフ諏しとして複数枚の検査対象基板の各部品に
ついて検査対象部品の斜め上方に設置された照明装置に
よって部品の影ができる範囲の輝度ヒストグラムと影と
ならない範囲の輝度ヒストグラムを求める第1工程と、
第1工程で求めた各基板の部品毎の各輝度ヒストグラム
を統計処理して特微量を求める第2工程と、第2工程で
求めた各基板の部品毎の特微量を部品毎に統計処理した
値を部品の影の有無を判断するための設定値とする第3
工程までを前処理とする部品検査方法である。
Means for Solving the Problems Therefore, in the component inspection method of the present invention, each component of a plurality of substrates to be inspected is illuminated by a lighting device installed diagonally above the component to be inspected as a pre-inspection step. A first step of calculating a brightness histogram of a range where a shadow occurs and a brightness histogram of a range where a shadow does not occur of the part;
In the second step, the brightness histograms for each component of each board obtained in the first step were statistically processed to obtain the characteristic quantities, and in the second step, the characteristic quantities of each component of each board obtained in the second step were statistically processed for each component. The third value is the setting value for determining the presence or absence of a shadow on the part.
This is a component inspection method that includes pre-processing up to the process.

作  用 本発明はあらかじめ複数枚のサンプル基板の部品毎に求
めた2種類の輝度ヒストグラムを統計処理した設定値と
、検査基板の部品毎の2種類の輝度ヒストグラムを統計
処理した値を比較するため、検査部品の背景に材質によ
る反射状態のバラツキがある場合や、検査部品近傍の他
の検査部品等の反射光によシ検査部品の影がうすくなる
場合、そして背景が反射しにくい材質で背景像と影に差
を見い出しにくい場合においても、部品毎のバラツキに
よる影響も考慮されることとなり、かつ部品有無判断を
する設定値を求めることが容易となシ、かつこの設定値
が数値的裏付けをもつものであるため信頼性の高い部品
有無検査を可能にした。
Function The present invention compares a setting value obtained by statistically processing two types of brightness histograms obtained in advance for each component of a plurality of sample boards with a value obtained by statistically processing two types of brightness histograms for each component of a test board. , when there are variations in the reflection state depending on the material of the background of the inspected part, when the shadow of the inspected part becomes weak due to reflected light from other inspected parts near the inspected part, and when the background is made of a material that is difficult to reflect. Even when it is difficult to find a difference between the image and the shadow, the influence of variations in each part is taken into account, and it is easy to determine the setting value for determining the presence or absence of a part, and this setting value is numerically supported. This enables highly reliable parts presence inspection.

実施例 以下、本発明の一実施例を説明する。第1,2図は本発
明の一実施例における部品検査方法のフローチャート、
第3図aは照明装置5によって部品2の影6ができたと
きのヒストグラム領域9゜10を示す図、第3図すは第
3図aのヒストグラム領域9の輝度ヒストグラムのグラ
フAI2  (!:特機微量値aA12、第3図Cは第
3図aのヒストグラム領域1oの輝度ヒストグラムのグ
ラフB12と特微量の値αB12、第4図dは照明装置
3によって部品2の影4ができたときのヒストグラム領
域9.1oを示す図、第3図eil−i第3図dのヒス
トグラム領域9の輝度ヒストグラムのグラフC12と特
微量の値aC12、第3図fは第3図dのヒストグラl
U域10の輝度ヒストグラムのグラフDI2と特微量の
値αD12、第4図aは第3図すの特微量のグラフaA
1と設定値βA1、第4図すは第3図Cの特微量のグラ
フαB1と設定値βB1、第4図Cは第3図eの特微量
のグラフαc1と設定値βc1、第4図dは第3図fの
特微量のグラフαD1  と設定値βD1  の図であ
る。
EXAMPLE An example of the present invention will be described below. 1 and 2 are flowcharts of a component inspection method in an embodiment of the present invention,
FIG. 3a is a diagram showing the histogram area 9°10 when the shadow 6 of the component 2 is created by the illumination device 5, and FIG. 3 is a graph AI2 (!: The characteristic trace value aA12, FIG. 3C is the graph B12 of the brightness histogram of the histogram area 1o in FIG. A diagram showing the histogram area 9.1o of FIG. 3 eil-i, a graph C12 of the brightness histogram of the histogram area 9 of FIG.
The graph DI2 of the brightness histogram in U area 10 and the value αD12 of the characteristic quantity, Figure 4a is the graph aA of the characteristic quantity in Figure 3.
1 and set value βA1, Figure 4 is the graph of the characteristic quantity αB1 and set value βB1 of Figure 3C, Figure 4C is the graph of the characteristic quantity αc1 and set value βc1 of Figure 3 e, Figure 4 d is a graph of the characteristic quantity αD1 and the set value βD1 in FIG. 3f.

本実施例の部品検査装置は第5図の回路基板1上に装着
された部品2の有無を検査するもので、本発明の部品検
査方法をそのまま用いている。検査対象物である部品2
と照明袋6置3,6と輝度ヒストグラムを取込むための
TVカメラ7との位置関係は第6図の通りであり、他の
部品の検査のだめの照明装置3,5とTVカメラ7は回
路基板1上をロボットにより平行移動する。
The component inspection apparatus of this embodiment inspects the presence or absence of the component 2 mounted on the circuit board 1 shown in FIG. 5, and uses the component inspection method of the present invention as is. Part 2 which is the object to be inspected
The positional relationship between the lighting bags 6, 3, 6, and the TV camera 7 for capturing the brightness histogram is shown in Figure 6. The substrate 1 is moved in parallel by a robot.

さて、実施例の部品検査装置の動作を第1,2図に基づ
き説明する。ステップ1(検査準備)では複数枚のサン
プル基板の各部品2に対して照明装置3を発光し、部品
2の影4を生じさせ、ヒストグラム領域9p1oc第3
図)において輝度ヒストグラムAI2.B12  を取
込む。同様にして他の部品(n=1.2.・・・・・・
2 ただし、n:部品番号、2:部品数)についても輝
度ヒストグラムA   B   (n=1 、2、−・
”n  ただし、n2+   n2 + n:部品番号、2二部品数)を取込み、同様にして他の
基板の各部品についても輝度ヒストグラムAnk、Bn
k(n=1,2.・・・・・・2.に=1,2゜・・・
・・・q ただしn:部品番号2℃:部品数、に:基板
番号、q:基板数)を取込む。ステップ2ではステップ
1と全く同様にして照明5を発光し、各基板(k=1.
2.・・・・・・q、ただしに:基板番号、q:基板数
)の各部品(n=1.2.・・・・・・まただしn:部
品番号、2:部品数)の影6を生じさせ、ヒストグラム
領域9.10(第3図)において輝度ヒストグラムCn
k、Dnkを取込む。ステップ3ではステップ1,2で
求めた各基板の部品毎の各輝度ヒストグラムAnk、B
nk、Cnk、Dnk(例 第3図のAl1.B121
CI2.D12 )を統計処理(第1表)して特微量α
Ank’αBnk、αcnk。
Now, the operation of the component inspection apparatus of the embodiment will be explained based on FIGS. 1 and 2. In step 1 (preparation for inspection), the illumination device 3 emits light for each component 2 of a plurality of sample boards to create a shadow 4 of the component 2, and the third histogram area 9p1oc
), the brightness histogram AI2. Take in B12. Similarly, other parts (n=1.2...
2 However, for n: part number, 2: number of parts), the brightness histogram A B (n=1, 2, -・
”n, where n2+n2+n: part number, 22 parts number), and in the same way, brightness histograms Ank, Bn for each part of the other boards.
k (n = 1, 2... 2. = 1, 2°...
...q However, n: part number 2°C: number of parts, ni: board number, q: number of boards) are taken in. In step 2, the illumination 5 is emitted in exactly the same manner as in step 1, and each substrate (k=1...
2. ....q, where: board number, q: number of boards) shadow of each part (n = 1.2..., where n: part number, 2: number of parts) 6 and brightness histogram Cn in histogram area 9.10 (FIG. 3).
k, take in Dnk. In step 3, each brightness histogram Ank, B for each component of each board obtained in steps 1 and 2 is
nk, Cnk, Dnk (Example: Al1.B121 in Figure 3)
CI2. D12 ) is statistically processed (Table 1) to obtain the characteristic quantity α
Ank'αBnk, αcnk.

aDnk (例 第3図の(’A12pαB12+αC
12*αD12)を求める。
aDnk (Example: ('A12pαB12+αC in Figure 3)
12*αD12).

第1表 ステップ4ではステップ3で求めた各基板の部品毎の特
微量αA n k・αBnk・”Cnk・aDnkを部
品毎に統計処理(第1表)して部品の影の有無を判断す
るための設定値βAn’βBn、βcn、βDn(側温
4図のβA1+βB1.βc1.βD1)を求める。
In step 4 of Table 1, the characteristic quantities αA n k, αBnk, ``Cnk, and aDnk of each board component obtained in step 3 are statistically processed for each component (Table 1) to determine the presence or absence of a shadow of the component. The set values βAn'βBn, βcn, βDn (βA1+βB1.βc1.βD1 in the side temperature diagram 4) are determined.

ステップ6では実際の検査において検査基板の各部品(
n=1.2.・・・・・・2)に対して照明装置3を発
光し、部品の影4を生じさせ、ヒストグラム領域9,1
oにおいて輝度ヒストグラムE1.G1を取込む。同様
にして他の部品についても輝度ヒストグラムEn、Fn
を取込む。ステップ6ではステップ5と全く同様にして
実際の検査において照明装置5を発光し、検査基板の各
部品の影6を生じさせ、ヒストグラム領域9,1oにお
いて輝度ヒストグラムGn、Hnを取込む。ステップ7
ではステップ5,6で求めた輝度ヒストグラムを統計処
理(第1表)して特微量γEn’+γFn、γGn。
In step 6, each component (
n=1.2. 2) The illumination device 3 emits light to create a shadow 4 of the component, and histogram areas 9, 1
Brightness histogram E1. Take in G1. Similarly, brightness histograms En, Fn for other parts
take in. In step 6, in the same manner as in step 5, the illumination device 5 is turned on to emit light in an actual inspection to create a shadow 6 of each component on the inspection board, and brightness histograms Gn and Hn are captured in the histogram areas 9 and 1o. Step 7
Now, the luminance histograms obtained in steps 5 and 6 are statistically processed (Table 1) to obtain the characteristic quantities γEn'+γFn and γGn.

γHn  を求める。ステップ8ではステップ7で求め
た実際の検査基板の部品毎の各輝度ヒストグラムEn、
Fn、Gn、Hnを統計処理(第1表)して求めた特微
量γEn+γFn、γGn、γHnとステップ4で求め
た設定値βAn+βBn+βcn、βDnを比較し、ス
テップ9で影の有無を判断する。
Find γHn. In step 8, each brightness histogram En for each component of the actual test board obtained in step 7,
The characteristic quantities γEn+γFn, γGn, γHn obtained by statistical processing of Fn, Gn, and Hn (Table 1) are compared with the setting values βAn+βBn+βcn and βDn obtained in step 4, and the presence or absence of a shadow is determined in step 9.

(例 βCn−βAn≦γGn−γEnかつβBn−β
DnくγFn−γHn  が成立するとき影ができてい
ると判断し、どちらか一方が成立しないとき影ができて
いないと判断する。)ステップ10ではステップ9で求
めた影の有無によって部品の有無を判断する。
(Example βCn-βAn≦γGn-γEn and βBn-β
When Dn×γFn−γHn holds true, it is determined that a shadow is formed, and when either one does not hold, it is determined that a shadow is not formed. ) In step 10, the presence or absence of the part is determined based on the presence or absence of the shadow determined in step 9.

また〈部品検査装置(第5図)で照明装置8゜9を結ぶ
線上と直角方向で部品を斜め上方から照らす位置に照明
装置2個を取り付けて4個の照明によって部品検査する
とより効果的である。
In addition, it is more effective to install two lighting devices in the parts inspection device (Fig. 5) in a position that illuminates the parts diagonally from above on a line connecting the lighting devices 8 and 9, and inspect the parts with four lights. be.

発明の効果 以上のように本発明によれば、あらかじめ複数枚のサン
プル基板の部品毎に求めた2種類の輝度ヒストグラムを
統計処理した設定値と、検査基板の部品毎の2種類の輝
度ヒストグラムを統計処理した値とを比較するため、部
品毎のバラツキによる影響も考慮されることとなり、か
つ部品有無判断をする設定値を求めることが容易となシ
、かつこの設定値が数値的裏付けをもつものであるため
信頼性の高い部品有無検査を可能にした。
Effects of the Invention As described above, according to the present invention, setting values obtained by statistically processing two types of brightness histograms obtained in advance for each component of a plurality of sample boards, and two types of brightness histograms for each component of a test board are calculated. Since the values are compared with statistically processed values, the influence of variations in each part is also taken into account, and it is easy to determine the set value for determining the presence or absence of parts, and this set value has numerical support. This makes it possible to perform highly reliable component presence inspections.

【図面の簡単な説明】[Brief explanation of the drawing]

第1.2図は本発明の一実施例における部品検査方法の
フローチャート図、第3図aは照明装置によって部品の
影ができたときのヒストグラム領域を示す図、第3図す
はヒストグラム領域の輝度ヒストグラムのグラフと特微
量の値の関係図、第3図Cは第3図aのヒストグラム領
域の輝度ヒストグラムのグラフと特微量の値の関係図、
第3図dは照明装置によって部品の影ができだときのヒ
ストグラム領域を示す図、第3図eは第3図dのヒフト
ゲラム領域の輝度ヒストグラムのグラフと特微量の値と
の関係図、第3図fは第3図dのヒストグラム領域の輝
度ヒストグラムのグラフと特微量の値との関係図、第4
図aは第3図すの特微量のグラフと設定値との関係図、
第4図すは第3図Cの特微量のグラフと設定値との関係
図、第4図Cは第3図eの特微量のグラフと設定値との
関係図、第4図dは第3図fの特微量のグラフと設定値
の関係図、第5図a、bは部品検査装置の側面図及び平
面図である。 1・・・・・・回路基板、2・・・・・・部品、3.4
・・・・・・照明装置、5.6・・・・・・影、7・・
・・・・TVカメラ、8・・・・・・画像認識装置、9
,10・・・・・・ヒストグラム領域。 代理人の氏名 弁理士 粟 野 重 孝 ほか1名第1
図 第2図 ■ 第 図 第 図 閂t♀l几・2
Fig. 1.2 is a flowchart of a component inspection method according to an embodiment of the present invention, Fig. 3a is a diagram showing a histogram area when a shadow of a part is created by an illumination device, and Fig. 3 is a diagram of a histogram area. A diagram of the relationship between the brightness histogram graph and the value of the special quantity, FIG. 3C is a diagram of the relationship between the graph of the brightness histogram of the histogram area of FIG.
Figure 3 d is a diagram showing the histogram area when a shadow of a part is created by the illumination device, Figure 3 e is a diagram showing the relationship between the luminance histogram graph of the Hiftogerum area in Figure 3 d and the value of the characteristic quantity, Figure 3 f is a diagram of the relationship between the luminance histogram graph of the histogram area in Figure 3 d and the value of the characteristic quantity, and Figure 4
Figure a is a diagram of the relationship between the graph of the characteristic quantities in Figure 3 and the set values,
Figure 4 is a relationship diagram between the characteristic quantity graph in Figure 3C and the setting value, Figure 4C is a relationship diagram between the characteristic quantity graph in Figure 3e and the setting value, and Figure 4d is a relationship diagram between the characteristic quantity graph in Figure 3e and the setting value. FIG. 3 f is a relationship diagram of the characteristic quantity graph and setting values, and FIGS. 5 a and 5 b are a side view and a plan view of the component inspection device. 1... Circuit board, 2... Parts, 3.4
...Lighting device, 5.6...Shadow, 7...
...TV camera, 8...Image recognition device, 9
, 10...Histogram area. Name of agent: Patent attorney Shigetaka Awano and 1 other person 1st
Fig. 2 ■ Fig. Fig. 2

Claims (1)

【特許請求の範囲】[Claims]  検査基準となる設定値を設定するための標準検査対象
として複数枚の検査基板の各部品について検査対象部品
の斜め上方に設置された照明装置によって部品の影がで
きる範囲の輝度ヒストグラムと影とならない範囲の輝度
ヒストグラムを求める第1工程と、第1工程で求めた各
基板の部品毎の各輝度ヒストグラムを統計処理して特微
量を求める第2工程と、第2工程で求めた各基板の部品
毎の特微量を部品毎に統計処理した値を部品の影の有無
の判断するための設定値とする第3工程と、検査基板の
各部品の影ができる範囲の輝度ヒストグラムと影となら
ない範囲の輝度ヒストグラムを求める第4工程と、第4
工程で求めた部品毎の各輝度ヒストグラムを統計処理し
て特微量を求める第5工程と、第5工程で求めた実際の
検査部品の特微量と第3工程で求めた各部品の設定値を
部品毎に比較し影の有無を判断する第6工程と、影の有
無によって部品の有無を判断する第7工程を有した部品
検査方法。
The brightness histogram of the range where shadows are created by a lighting device installed diagonally above the parts to be inspected for each component of multiple inspection boards as a standard inspection target for setting the set values that serve as inspection standards, and the area where shadows do not occur. A first step of calculating the luminance histogram of the range, a second step of statistically processing each brightness histogram for each component of each board obtained in the first step to obtain a characteristic amount, and a second step of obtaining a characteristic amount of each component of each board obtained in the second step. The third step is to use the value obtained by statistically processing the characteristic quantities for each component as a set value for determining the presence or absence of a shadow on the component, and the brightness histogram of the shadow-forming range of each component on the inspection board and the shadow-free range. A fourth step of obtaining a brightness histogram of
The fifth step is to statistically process each brightness histogram for each part obtained in the process to obtain the characteristic quantity, and the characteristic quantity of the actual inspected part determined in the fifth process and the set value of each component determined in the third process are A component inspection method comprising a sixth step of comparing each component to determine the presence or absence of a shadow, and a seventh step of determining the presence or absence of a component based on the presence or absence of a shadow.
JP63213060A 1988-08-26 1988-08-26 Parts inspection method Expired - Fee Related JP2600320B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63213060A JP2600320B2 (en) 1988-08-26 1988-08-26 Parts inspection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63213060A JP2600320B2 (en) 1988-08-26 1988-08-26 Parts inspection method

Publications (2)

Publication Number Publication Date
JPH0261505A true JPH0261505A (en) 1990-03-01
JP2600320B2 JP2600320B2 (en) 1997-04-16

Family

ID=16632867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63213060A Expired - Fee Related JP2600320B2 (en) 1988-08-26 1988-08-26 Parts inspection method

Country Status (1)

Country Link
JP (1) JP2600320B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276079A (en) * 1988-09-12 1990-03-15 Omron Tateisi Electron Co Teaching method in substrate inspecting instrument
GB2394284A (en) * 2002-10-16 2004-04-21 Agilent Technologies Inc A method and apparatus for detecting missing components on a printed circuit board
JP2013061696A (en) * 2011-09-12 2013-04-04 Dainippon Printing Co Ltd Authenticity determination device, authenticity determination method and program

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276079A (en) * 1988-09-12 1990-03-15 Omron Tateisi Electron Co Teaching method in substrate inspecting instrument
GB2394284A (en) * 2002-10-16 2004-04-21 Agilent Technologies Inc A method and apparatus for detecting missing components on a printed circuit board
GB2394284B (en) * 2002-10-16 2006-03-22 Agilent Technologies Inc A method and apparatus for detecting missing components from a printed circuit board
SG129257A1 (en) * 2002-10-16 2007-02-26 Agilent Technologies Inc A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors
JP2013061696A (en) * 2011-09-12 2013-04-04 Dainippon Printing Co Ltd Authenticity determination device, authenticity determination method and program

Also Published As

Publication number Publication date
JP2600320B2 (en) 1997-04-16

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