JPH0712748A - Curved surface shape inspecting device - Google Patents

Abstract

PURPOSE:To reduce the cost of an inspecting device and to enhance the reliability thereof by detecting a shape of a curved surface of a curved surface body such as a soldered part, in a short time. CONSTITUTION:Ring-like optical sources for projecting a red light beam, a green light beam and a blue light beam are provided being directed at different incidence angles. Reflected light beams from an object is sorted for respective light sources by hue-selecting filters 27a, 27b, 27c, and thereafter, are picked up by monochromatic cameras 26a, 26b, 26c, respectively. Image signals from the cameras are delivered to a control process part 7 so as to carry out an image process for teaching and inspecting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curved body composed of a large number of curved surface elements whose surfaces are oriented in different directions.
The present invention relates to a curved surface state inspection device used to detect the orientation of each curved surface element, and in particular, the present invention is suitable for inspecting the state of a soldering part of a component mounted on a printed circuit board. The present invention relates to a curved surface state inspection device.

[0002]

2. Description of the Related Art As a curved body having a multi-oriented curved surface, a soldering portion of a component mounted on a printed board is a typical example. Conventionally, this soldered portion has been inspected by visual inspection, and the quality of the soldered state, that is, the presence or absence of solder, the amount, the solubility, the short circuit, the poor continuity, etc., has been determined by this visual inspection. However, such a method by visual inspection inevitably causes the occurrence of inspection errors, the judgment result varies depending on the inspector, and the inspection processing capacity is limited.

Therefore, in recent years, various automatic inspection apparatuses have been proposed which can automatically perform this type of inspection. By the way, the surface shape of the soldered portion is a three-dimensional shape having a three-dimensional spread, and in order to inspect this, it is an indispensable condition that three-dimensional shape information can be detected.

FIG. 8 shows an example of an automatic inspection apparatus that satisfies this condition. A plate-like slit light 50 is emitted from a light source such as a laser to a soldering portion on a substrate 51. By the irradiation of the slit light 50, a light cutting line 52 that is distorted along the three-dimensional shape is generated on the surface of the substrate 51 including the soldering portion, and a reflected light image of the light cutting line 52 is generated. The three-dimensional shape of the soldered portion is detected by taking an image with the image pickup device 53 and checking the distortion state of the image pickup pattern.

However, in the case of this inspection apparatus, only the shape information of the portion irradiated with the slit light 50 can be obtained, and it is difficult to grasp the three-dimensional shape of the other portions. Moreover, since the orientation of the surface of the soldered portion is indefinite with respect to the vertical direction of the substrate 51, at least four or more combinations of the light source and the image pickup device 53 are required, which complicates the device. In addition, there is a problem in that high-precision assembly work is required, resulting in high cost.

Therefore, as a method for solving this kind of problem,
The surface of the curved body to be inspected is irradiated with light having different incident angles, each reflected light image from the surface of the curved body is captured, and the orientation of each curved surface element of the curved body is detected from each imaging pattern. There is a way to do it. The principle of this method is "active
Sensing method ". That is, this method focuses on the fact that when a light beam having a certain pattern is projected onto the inspection target, the pattern of the reflected light beam obtained from the inspection target is deformed in accordance with the three-dimensional shape of the inspection target. Then, the shape of the inspection target is estimated from the deformation pattern.

FIG. 9 is a diagram for explaining the principle of this method and shows the positional relationship between an observation system consisting of a light source 57 and an image pickup device 58, and a curved surface body 59 to be observed. In the figure, the incident elevation angle i from the light source 57 to the surface of the curved body 58 is
When the light flux 60 is projected at, the reflected light flux 61 at the angle i ′ (= i) is incident on the image pickup device 58 placed right above and detected. As a result, it is detected that the curved surface elements of the curved surface body 59 illuminated by the light flux 60 are oriented at an elevation angle of i with respect to the reference plane 62. Therefore, if the surface shape of the curved surface body 59 is composed of a large number of curved surface elements oriented in different elevation angles, such as a soldering surface, the surface of the curved surface body 59 is formed by using a plurality of light sources having different incident elevation angles. When the light is projected onto, a group of curved surface elements corresponding to the respective incident elevation angles is detected by the image pickup device 58, and by this, what elevation angle each curved surface element of the surface of the curved body 58 is oriented, that is, It is possible to detect what the surface shape of the soldered part looks like.

If the light source 57 projects a light beam 60 having an incident elevation angle of 2Δi from i + Δi to i-Δi, a reflected light beam 61 having a width corresponding to the width is detected by the image pickup device 58. Will be. That is, in this case, it is possible to detect a curved surface element having an elevation angle with the reference plane 62 having an angle of a width from i + Δi to i−Δi.

Further, as shown in FIG. 10, a plurality of light sources 57a, 57b, 57c having different incident elevation angles to the curved body 59 are provided.
If the lighting device is configured with
Therefore, the curved surface elements having the orientations corresponding to the incident elevation angles of a, 63b, and 63c can be detected in detail.

The light sources 57a, 57b, 57c are three annular white light sources having different radii, and each light source 57
The a, 57b, and 57c are horizontally arranged at different height positions with respect to the reference plane 62. Now each light source 57a, 57
When the radius of b, 57c is r _n (where n = 1,2,3) and the height with respect to the reference plane 62 is h _n (n = 1,2,3), the incident elevation angle of each light beam on the curved surface body 59 is increased. Are i _n (n = 1,2,
3), each curved surface element having an elevation angle of i _n in the curved surface body 59 can be detected by the imaging device 6. At this time, the size of the curved surface element is sufficiently smaller than the total optical path length from each of the light sources 57a, 57b, 57c to the image pickup device 58 through the surface of the curved surface body 59. The elevation angle of the curved surface element to be set may be determined.

[0011]

[Equation 1]

As a device for inspecting the external appearance of a soldering portion based on the above principle, a device using a plurality of annular white light sources has been proposed (Japanese Patent Laid-Open No. 61-293657).
issue). In this inspection device, in order to distinguish reflected light images from the three light sources 57a to 57c having different incident elevation angles with respect to the surface of the soldered portion, the light sources 57a to 57c are respectively identified.
57c is turned on and off at different timings with respect to time.

[0013]

In such a method, however, a memory for storing each image obtained at different lighting timings, an arithmetic unit for arithmetically processing these images as the same visual field image, and each light source. A lighting control device or the like for instantaneously turning on the lighting device is required, which is technically complicated.

In order to solve such a problem of the time sharing system, the inventor of the present invention has recently proposed a new curved surface state inspection device for inspecting a soldered portion. This device is a projection unit composed of a plurality of light sources for simultaneously irradiating an inspection object with different colored light at different incident angles, and an imaging unit composed of a color camera for imaging reflected light from the surface of a curved body, And a processing unit that determines the state of the curved surface based on the imaging pattern obtained by the imaging unit.

The light projecting section has a structure in which, for example, three annular light sources for emitting red light, green light, and blue light are arranged at different elevation angles with respect to the inspection position, and the light sources are simultaneously irradiated. The reflected light image of the curved surface of red light, green light, and blue light captured by the color camera is decomposed into color signals R, G, B of the three primary colors, and these are supplied to a processing unit for image processing. Is going.

According to the above construction, since the light from all the light sources can be simultaneously radiated and the reflected light image can be processed at one time, the inspection can be speeded up and the technical complexity can be eliminated. Since the color image input device is used, the cost of the color image input device becomes extremely high, which is a major obstacle to the spread of the inspection device.

The present invention has been made in view of the above problems, and it is possible to detect a curved surface shape of a curved surface body such as a soldering portion in a short time, and to realize cost reduction and reliability improvement. An object is to provide an inspection device.

[0018]

SUMMARY OF THE INVENTION A curved surface state inspection apparatus according to the present invention provides a plurality of annular light sources arranged at different elevation angles with respect to an inspection position and reflected light on the surface of a curved body at the inspection position. An optical system for selecting each light source, a number of monochrome image pickup devices corresponding to the number of light sources for individually picking up the reflected light on the surface of the curved body selected by the optical system, and an image obtained by each monochrome image pickup device And a control processing device that detects the shape of each curved surface element of the curved body from the pattern.

[0019]

[Operation] When the curved surface is irradiated with light from each light source all at once, the reflected light on the surface of the curved surface is separated by the optical system,
Each monochrome image pickup device individually picks up an image. The control processing device recognizes the shape of the curved surface body using the imaging pattern obtained from each monochrome imaging device.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the overall construction of a substrate inspection apparatus according to an embodiment of the present invention. This board inspecting apparatus includes characteristic parameters of an inspection area of each component 2S on the reference board 1S obtained by imaging the reference board 1S, and the board to be inspected 1
This is for inspecting the mounting quality of each component 2T by comparing with the characteristic parameter of the inspection region of each component 2T on the inspected substrate 1T obtained by imaging T. , A Y-axis table unit 4, a light projecting unit 5, an image pickup unit 6, a control processing unit 7 and the like are included as its components.

The X-axis table section 3 and the Y-axis table section 4 each include a motor (not shown) that operates based on a control signal from the control processing section 7. The X-axis table section is driven by these motors. The unit 3 moves the image pickup unit 6 in the X direction, and the Y axis table unit 4 moves the conveyor 8 supporting the substrates 1S and 1T in the Y direction.

The light projecting unit 5 has three annular light sources 9, 10, 11 which have different diameters and which simultaneously emit red light, green light and blue light based on a control signal from the control processing unit 7. The light sources 9, 10 and 11 are arranged so as to be centered directly above the inspection position and to correspond to different elevation angles when viewed from the inspection position.

In this embodiment, a white light source is used as each of the light sources 9, 10 and 11 with a colored transparent plate of red, green and blue, respectively, but instead of this, red light,
It is also possible to use three annular color fluorescent lamps or neon tubes that respectively generate green light and blue light.

The substrate 1 is also illuminated by the light projecting section 5.
Since it is possible to detect information (part number, polarity, color code, etc.) and pattern information (various marks, etc.) related to parts on S, 1T, the respective light sources 9, 10, 11 can be detected.
It is devised so that when the lights of different hues emitted by are mixed, it becomes a completely white light. That is, each of the light sources 9, 10 and 11 is configured with a light source that emits light of a red light spectrum, a green light spectrum, and a blue light spectrum having an emission energy distribution with respect to wavelength so as to be white by mixing colors,
Red light, green light emitted from each light source 9, 10, 11
The light quantity of each hue light can be adjusted by the image pickup controller 18 described later so that the blue light is mixed into white light.

Next, the image pickup unit 6 includes three monochrome cameras 26a, 26b and 26c (hereinafter simply referred to as "camera 26a,
26b, 26c ”), and each camera 26a,
26b and 26c are positioned downwardly above the inspection position. Immediately below each of the cameras 26a, 26b, and 26c, there is arranged an optical system 27 including hue selective filters 27a, 27b, and 27c that transmit red light, green light, and blue light, respectively. An optical system 28 for separating the same image is located at. This optical system 28 is configured by combining a plurality of half mirrors and the like, and each camera 26a, 26b, 26c reflects red light, green light, and blue light in the same field of view via these optical systems 27, 28. Optical images can be taken individually and simultaneously.
The red, green, and blue reflected lights imaged by the cameras 26a, 26b, and 26c are converted into grayscale image signals and supplied to the control processing unit 7.

The control processor 7 includes an A / D converter 12, a memory 13, a teaching table 14, an image processor 15,
The reference unit 1S is composed of a determination unit 16, an XY table controller 17, an image pickup controller 18, a display unit 20, a printer 21, a keyboard 22, a floppy disk device 23, a control unit 24, and the like. The red, green, and blue grayscale image signals are processed, and the image pickup pattern of each color is detected for a predetermined area of each component 2S in a good soldering state to create a determination data file.

In the inspection mode, the red, green and blue grayscale image signals of the substrate 1S to be inspected are processed,
A similar imaging pattern is detected for each inspection area of each component 2T on the inspected substrate 1T, characteristic parameters are generated, and an inspected data file is created. Then, this inspection data file is compared with the determination data file, and the mounting quality such as the quality of soldering is automatically determined for each component 2T on the inspection substrate 1T from this comparison result.

FIG. 2 shows the relationship between the cross-sectional shape of the solder 30 when soldering is good, when parts are missing, and when there is insufficient solder, and the imaging pattern of each color in each case. This is illustrated in the table.

In the figure, 31, 32, and 33 are regions in which reflected lights of red light, green light, and blue light are detected, respectively.
According to the figure, since each imaging pattern when the solder state is good and each imaging pattern when it is defective are clearly different, by comparing each imaging pattern of the inspection target with a normal pattern, It is possible to determine the presence or absence of parts and the quality of soldering.

Returning to FIG. 1, when a grayscale image signal is given from each of the cameras 26a, 26b and 26c of the image pickup section 6, the A / D conversion section 12 synchronously takes in these by using a scanning synchronization signal. , And each of them is converted into a digital signal and output to the control unit 24. The memory 13 includes a RAM and the like and is used as a work area of the control unit 24. The image processing unit 15 performs image processing on the image data supplied via the control unit 24 to create the inspection data file and the determination data file, and supplies these to the control unit 24 and the determination unit 16.

The teaching table 14 stores the judgment data file when it is supplied from the control unit 24 at the time of teaching, and when the control unit 24 outputs a transfer request at the time of inspection, the judgment data file is stored according to this request. It is read and supplied to the control unit 24, the determination unit 16 and the like.

The determination section 16 compares the determination data file supplied from the control section 24 at the time of inspection with the inspected data file transferred from the image processing section 15 for each component 2T of the inspected substrate 1T. The quality of the soldering state is determined, and the determination result is output to the control unit 24.

The image pickup controller 18 includes an interface for connecting the control unit 24 to the light projecting unit 5 and the image pickup unit 6, and adjusts the light amount of each of the light sources 9 to 11 of the light projecting unit 5 based on the output of the control unit 24. Control is performed or the mutual balance of the light output of each hue of the image pickup unit 6 is maintained.

The XY table controller 17 is the control unit 2
4 is provided with an interface for connecting the X-axis table unit 3 and the Y-axis table unit 4, and controls the X-axis table unit 3 and the Y-axis table unit 4 based on the output of the control unit 24.

The display unit 20 receives image data, inspection results, key input data, etc. from the control unit 24,
This is displayed on the display screen. When the inspection result and the like are supplied from the control unit 24, the printer 21 prints out the inspection result in a predetermined format.

The keyboard 22 is used for operation information and reference board 1.
Various keys necessary for inputting S and data relating to the inspected substrate 1T are provided, and the key input data is supplied to the control section 24. The control unit 24 includes a microprocessor and the like, and controls each operation of the board inspection device in the teaching and soldering inspection according to the procedure shown in FIGS. 6 and 7 (details will be described later).

In the above embodiment, three annular light sources 9, 10, 11 for irradiating red light, green light, and blue light and three monochrome cameras 26a for picking up reflected light images of respective colors are used.
Although 26b and 26c are used for the inspection, sufficient inspection performance may be obtained even if the number of hues is reduced to two depending on the substantial inspection conditions. For example,
The soldering part of the lead of the component inserted into the lead insertion hole of the printed circuit board is generally in a simple form, and the types of defects are few such as no solder, perforation, and bridge.

FIG. 3 shows the construction of a board inspecting apparatus used for inspecting the soldered portion of this kind of insertion lead. This substrate inspection apparatus also includes the X-axis table section 3, the Y-axis table section 4, the light projecting section 5, the imaging section 6, the control processing section 7 and the like as in the first embodiment, but the light projecting section 5 Is composed of two annular light sources 10 and 11 for emitting red light and green light, and the image pickup unit 6 is composed of two monochrome cameras 26a and 26b. Hue-selective filter 27a that transmits red light and green light corresponding to each camera,
The provision of the optical system 27 composed of 27b and the optical system 28 for separating the same image on the incident optical path is the same as in the previous embodiment. The rest of the configuration is the same as that of the embodiment of FIG. 1, and the description thereof is omitted here.

FIG. 4 shows the relationship between the cross-sectional form of the solder 42 and the image pickup patterns obtained by the cameras 26a and 26b for the soldering portion of the insertion lead.

In the figure, (1) shows a normal state and a state in which the lead is missing with respect to the vertical lead 40 which is still inserted vertically into the lead insertion hole, and (2) shows after the insertion into the lead insertion hole. The clinch lead 41 to be bent is shown in a normal state, a short lead state, and a lead missing state. In the figure, 43 indicates a printed circuit board.

Further, in each imaging pattern, 44,
Reference numeral 45 is an area in which the respective reflected lights of red light and green light are detected. Reference numerals 46 and 47 are low-brightness regions where the reflected lights of red light and green light are slightly detected.

According to the figure, since the image pickup patterns of the normal soldered portion and the image pickup patterns of the abnormal soldered portion are clearly different from each other, the image pickup patterns of the inspection object are regarded as normal patterns. By comparing, it is possible to judge the quality of soldering.

FIG. 5 shows a third embodiment of the present invention in which a white light source is used as the light source. Projector 6 of this embodiment
Are two annular white light sources 10 ', 11' having different diameters.
Are centered right above the inspection position and are installed in directions corresponding to different elevation angles when viewed from the inspection position.

Polarization filters 30a and 30b are provided right below the light sources 10 'and 11', respectively, so as to make one round. The polarization angle of one polarization filter 30a is α, the polarization angle of the other polarization filter 30b is β, and the polarization filter 31a having the polarization angle α is located directly below the camera 26a of the imaging unit 6.
And a polarization filter 31b having a polarization angle β is arranged directly below the other camera 26b to form an optical system. According to this structure, the reflected light of the light from one light source 10 'is observed by one camera 26a, and the reflected light of the light from the other light source 11' is observed by the other camera 26b.

FIG. 6 shows the teaching procedure in each of the above embodiments from step 1 (indicated by "ST1" in the figure) to ST.
Shown by 7. First, in step 1 of the figure, the operator operates the keyboard 22 to register the name of the board to be taught, and after key inputting the board size, in the next step 2, the reference board 1S is moved to the Y-axis table part. 4 Set it on and press the start key.

Next, in step 3, the origin of the reference board 1S and the upper and lower corners of the reference board 1S are imaged by the image pickup section 6, and the actual size of the reference board 1S is input according to the position of each point. 24 controls the X-axis table unit 3 and the Y-axis table unit 4 based on the input data to position the reference substrate 1S at the initial position.

The reference board 1S has a good mounting quality in which a predetermined component 2S is properly soldered at a component mounting position. When the reference board 1S is positioned at the initial position, In step 4, the image pickup section 6 picks up an image of the area on the reference board 1S and creates teaching data regarding the mounting position of the component.

In the next step 5, each camera 26a,
Images of the mounting positions of the components having good mounting quality are picked up by 26b and 26c, and the inspection information of the component 2S whose mounting position is taught in step 4 is created as teaching data.

When the same procedure is repeatedly executed for all the components on the reference board 1S, the determination in step 6 becomes "YES", the process proceeds to step 7, and step 4,
Based on the teaching data created in step 5, a judgment data file necessary for inspecting the inspected substrate 1T is created and stored in the teaching table 14, and then the teaching is finished.

FIG. 7 shows an automatic inspection procedure. In steps 1 and 2 of the same drawing, a board name to be inspected is selected and a board inspection start operation is performed. In the next step 3, the supply of the inspected substrate 1T to the substrate inspection device is checked,
When the determination is "YES", the conveyor 8 is operated, the substrate 1T to be inspected is carried into the Y-axis table portion 4, and automatic inspection is started (steps 4 and 5).

In step 5, the control section 24 controls the X-axis table section 3 and the Y-axis table section 4 to position the field of view of the image pickup section 6 with respect to the first component 2T on the inspected substrate 1T and pick up an image. Then, each land area in the inspection area is automatically extracted, and the characteristic parameters of each land area are calculated to create an inspection data file. Then, the control unit 24 determines the inspection data file by the determination unit 16
Then, the inspected data file is compared with the determination data file to determine the mounting quality such as the quality of soldering for the first component 2T.

Such an inspection is repeatedly executed for all the components 2T on the inspected substrate 1T. As a result, if there is a soldering defect, the defective component and the contents of the defect are displayed on the display unit 20 or the printer. After being printed on 21,
The substrate is unloaded (steps 6, 7, and 8).

[0053]

As described above, according to the present invention, light is simultaneously radiated to the inspection position from the respective annular light sources positioned in different elevation angles, and the reflected light from the curved surface body is selected for each light source to obtain an individual monochrome. Since the image is picked up by the image pickup device, the cost of the inspection device can be significantly reduced as compared with the conventional example using the color camera, and the state of the curved body can be inspected at high speed.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a board inspection apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a relationship between a quality of a soldering state and an imaging pattern.

FIG. 3 is an explanatory diagram showing an overall configuration of a substrate inspection device according to a second embodiment of the present invention.

FIG. 4 is an explanatory diagram showing the relationship between the quality of the soldered state and the imaging pattern according to the second embodiment.

FIG. 5 is an explanatory diagram showing an overall configuration of a substrate inspection device according to a third embodiment of the present invention.

FIG. 6 is a flowchart showing a teaching procedure.

FIG. 7 is a flowchart showing a procedure of automatic inspection.

FIG. 8 is an explanatory diagram showing the principle of a conventional automatic soldering inspection device.

FIG. 9 is an explanatory diagram showing the principle of a conventional automatic soldering inspection device.

FIG. 10 is an explanatory diagram showing the principle of a conventional automatic soldering inspection device.

[Explanation of symbols]

 5 Light projecting section 6 Imaging section 7 Control processing section 9, 10, 11, 10 ', 11' Annular light source 24 Control section 26a, 26b, 26c Monochrome camera 27a, 27b, 27c Filter 30a, 30b, 31a, 31b Polarized light filter

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[Procedure amendment]

[Submission date] August 20, 1992

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be amended] Title of invention

[Correction method] Change

[Correction content]

Title: Curved surface shape inspection device

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be amended] Claims

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[Claims]

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0001

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[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curved body composed of a large number of curved surface elements whose surfaces are oriented in different directions.
The present invention relates to a curved surface shape inspection device used for detecting the orientation of each curved surface element, and in particular, the present invention is suitable for inspecting the shape of a soldering part of a component mounted on a printed board. The present invention relates to a curved surface shape inspection device.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

In order to solve such a problem of the time sharing system, the inventor of the present invention has recently proposed a new curved surface shape inspection device for inspecting a soldered portion. This device is a projection unit composed of a plurality of light sources for simultaneously irradiating an inspection object with different colored light at different incident angles, and an imaging unit composed of a color camera for imaging reflected light from the surface of a curved body, And a processing unit that determines the shape of the curved surface based on the imaging pattern obtained by the imaging unit.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction content]

The present invention has been made in view of the above problems, and it is possible to detect the curved surface shape of a curved surface body such as a soldering portion in a short time, and further, it is possible to reduce the cost and improve the reliability of the curved surface shape. An object is to provide an inspection device.

[Procedure Amendment 7]

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[Correction method] Change

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[0018]

SUMMARY OF THE INVENTION A curved surface shape inspection apparatus according to the present invention provides a plurality of annular light sources arranged at different elevation angles with respect to an inspection position and reflected light on the surface of a curved body at the inspection position. An optical system for selecting each light source, a number of monochrome image pickup devices corresponding to the number of light sources for individually picking up the reflected light on the surface of the curved body selected by the optical system, and an image obtained by each monochrome image pickup device And a control processing device that detects the shape of each curved surface element of the curved body from the pattern.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0053

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[0053]

As described above, according to the present invention, light is simultaneously radiated to the inspection position from the respective annular light sources positioned in different elevation angles, and the reflected light from the curved surface body is selected for each light source to obtain an individual monochrome. Since the image is picked up by the image pickup device, the cost of the inspection device can be significantly reduced as compared with the conventional example using the color camera, and the shape of the curved body can be inspected at high speed.

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Claims (1)

[Claims] 1. A curved surface state inspection device for inspecting the surface state of a curved body to be inspected, comprising: a plurality of annular light sources arranged at different elevation angles with respect to the inspection position; An optical system that sorts the reflected light on the surface of the curved body for each light source, and a monochrome imaging device whose number corresponds to the number of light sources that individually capture the reflected light on the surface of the curved body sorted by the optical system. And a curved surface shape inspection device comprising a control processing device for detecting the shape of each curved surface element of the curved surface body from the imaging pattern obtained by each monochrome imaging device.