JP2629658B2 - Manufacturing method of electronic circuit components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB (Tape Automated Bonding) type multi-pin chip mounting method and apparatus, in which leads on a tape and bumps formed on an IC chip are aligned and pressed. TAB inner lead bonding method and apparatus capable of aligning the upper inner leads and the bumps on the pellet (IC chip) with high accuracy and even when both are overlapped, and the alignment used for them The present invention relates to a method, a bonding tool, a stage, and an IC using the same.

[0002]

2. Description of the Related Art The TAB method is a method of connecting an inner lead 2 formed on a tape 1 and a bump 3 formed on an IC chip 4 as shown in FIG. It is a method. Conventionally, a wire bonding method has been widely used as a method for connecting IC chips. In the wire bonding method, the minimum pitch between connectable electrodes is limited to about 160 μm due to the size limitation of a bonding tool that heats and presses a wire.

On the other hand, an IC chip having a large number of input / output pins, such as a logic LSI for a computer or a driving IC for a liquid crystal display, requires connection of 200 pins or more at a narrow pitch of 160 μm or less due to chip cost and high-density mounting requirements. Yes,
It is becoming impossible to cope with the wire bonding method. In the TAB method, because of the collective lead connection, there is no dimensional restriction due to the above bonding tool, and the pitch is extremely narrow.
Connection of many pins becomes possible. TA generally adopted
The alignment in the B system is performed by separately detecting the alignment of the tape 1 and the IC chip 4 and moving each to a preset position.

The prior art disclosed in Japanese Patent Publication No. 62-27735 and Japanese Patent Laid-Open No. 58-141 is disclosed in FIG.
As shown in (1), alignment is performed using an alignment mark 65 provided at an arbitrary point on the tape 1 remote from the bonding position, or a specific shape of the inner lead pattern is stored, and a new tape is supplied. Each time the pattern is detected, the amount of deviation from the set position is determined, and the tape position is corrected. Similarly, IC chip 4
In the alignment, the pattern of a specific shape in the IC chip 4 is stored, the amount of deviation from the position set for each IC chip 4 is obtained, and the position is corrected.

For positioning the tape 1 and the IC chip 4 in the rotational direction, a station for mechanically correcting the rotational direction of the IC chip 4 is provided between the tray on which the IC chip 4 before bonding is mounted and the bonding position. A method of correcting the rotation deviation amount by providing the rotation deviation amount has been adopted.

Further, a conventional tape bonding apparatus is
As described in JP-A-53-105972, the tool is lowered while a low air pressure is applied to the tool, and the air pressure is switched to a high pressure at the start of bonding, so that the impact load on the IC chip during bonding is increased. Was suppressed. At that time, the switching of the air pressure is synchronized with the bonding start position by a timing cam provided in the tool driving mechanism.

In the conventional bonding tool and stage, for example, as described in JP-A-62-97341, leads on a tape and bumps on an IC chip are heated and pressed by a bonding tool having a heater. . At that time, on the stage equipped with the IC chip,
In order to reduce the temperature during thermocompression bonding, a heater was provided on the stage immediately below the IC chip.

[0008]

In the above-mentioned TAB method, the number of pins is increased, and the bumps 3 and the leads 2 become finer, so that more precise alignment is required. However, the above prior art detects the alignment mark 65 and the like located at a position distant from the bonding position, and corrects the positions of the tape 1 and the IC chip 4 depending on mechanical accuracy.
Bonding is performed as it is. Therefore, the positioning accuracy includes mechanical accuracy in addition to the detection accuracy of the alignment mark and the like. Therefore, multi-pin TA
There was a problem that sufficient alignment accuracy could not be obtained for the miniaturized leads 2 and bumps 3 for B.

Further, the above prior art does not take into account that there is a variation in the height of the bump as an adhesive portion between individual IC chips. For this reason, ICs with low bump height
In the case of a chip, the air pressure is switched to a high pressure before the tool comes into contact with the bump via the lead, and there is a high possibility that the tool applies a load to the lead and the bump. As a result, stress concentration occurs on the leads and bumps,
There has been a problem that so-called bonding damage such as bump peeling and a crack in a lower layer portion of the bump is likely to occur.

[0010] In batch bonding, it is inevitable that a pressing force is applied to only a small number of bumps at the start of pressing due to a variation in bump height due to bump forming accuracy. In the above prior art, the air is switched in two stages to contact many bumps at a low pressure. However, the larger the number of lead bumps which are bonding points, the more necessary during pressurization. Since the load resistance of each bump is reduced with respect to the applied pressure, the above-described bonding damage is also likely to occur.

Further, the above-mentioned prior art does not consider the variation in the temperature distribution on the IC chip, particularly at the connection between the corner and the center of the side. Furthermore, Sn or solder which has been subjected to surface treatment on the leads on the tape adheres to the bottom surface of the bonding tool, causing a partial contact of the seal. Therefore, there has been a problem that a sufficient connection state has not been obtained.

An object of the present invention is to provide a highly accurate and highly reliable TAB inner lead bonding method and apparatus corresponding to a multi-pin TAB and an alignment method therefor.

[0013] Another object of the present invention is to provide a bonding method and apparatus for achieving good bonding without applying an impact force and an excessive pressing force to an IC chip having insufficient bump height accuracy. To provide.

It is a further object of the present invention to provide a bonding tool and a stage having a uniform temperature distribution, and a bonding apparatus which achieves good bonding by using them.

Still another object of the present invention is to provide an IC free from chip cracks and lead breakage.

[0016]

In order to achieve the above object, the present invention provides an IC chip having bumps formed on a surface thereof and an inner lead formed on a carrier tape at a bonding station. Detect the position of the IC chip on the stage,
The position correction amount of the stage is calculated, the lead and the chip are aligned, and then the bonding is performed.

Further, an IC chip having bumps formed on its surface and an inner lead formed on a tape are opposed to each other at a bonding position, and a state where both portions overlap is optically enlarged, and an enlarged image is detected by an image sensor. Then, the detected image is processed to determine the amount of displacement, and the XYθ stage on which the IC chip is mounted is finely moved to align the inner lead and the IC chip. After the alignment, the relative positional relationship between the two in the XYθ direction is determined. It is fixed and both are pressure-bonded with a bonding tool.

Further, the IC chip having the bumps formed on the surface thereof and the inner leads formed on the tape are opposed to each other at the bonding position.
The inner leads are brightly exposed, the inner lead positions are obtained from the pattern, the inner leads and the bumps are darkly detected by epi-illumination perpendicular to the two surfaces, and the inner leads and the oblique illumination images are obtained. The IC chip position is obtained using the lead position.

Further, the object is to provide a means for detecting a pressing force acting between the tool and the IC chip, a means for detecting a moving amount of the tool, and a means for changing a driving force of the tool. This is achieved by performing the bonding while changing the tool driving force based on the detection result obtained by the means.

Further, for the above purpose, the present invention is a device in which the shape and heater arrangement are devised so that the temperature distribution on the bottom surface of the bonding tool becomes uniform when the leads on the tape and the bumps on the IC chip are thermocompressed. is there.

In addition, thermal conductivity is provided on the bottom surface of the bonding tool,
The thermocompression bonding is performed by coating a chemically stable material having excellent wear resistance.

Further, the stage is provided with a function of absorbing a shocking pressing force from the bonding tool and a deviation of the parallelism between the chip and the bottom surface of the tool.

With the above configuration, the tape, chip, tool, and stage can be aligned with respect to the optical axis of the lens or the like as a reference position, so that high-precision bonding can be performed and the number of pins of the IC can be increased. Can respond.

Further, by finely moving the stage in the XYθ directions, the alignment between the lead and the chip can be performed with high accuracy.

In addition, by using oblique illumination and epi-illumination, alignment can be performed with the lead and bump overlapping at the bonding position, so that the alignment accuracy can be maintained during bonding, and the lead and IC can be maintained. High-precision alignment of the chip becomes possible.

Further, the tool and I in bonding are
The pressing force between the C chips can be constantly detected and controlled, and the pressing force can be set according to the contact state between the tool and the bump during the bonding and the crushing state.

Further, since each connection portion at the time of bonding has a uniform temperature distribution, it is possible to reduce variation in connection state,
Highly reliable bonding can be performed.

Further, the adhesion of Sn and solder to the bottom surface of the bonding tool can be prevented, and the bonding yield can be improved.

Further, since the impact pressure from the tool can be absorbed during bonding, damage to the IC chip can be reduced, and highly reliable bonding can be performed. In addition, since the difference in parallelism between the tip and the tool bottom can be absorbed, the adjustment time can be shortened and the throughput can be improved.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below in detail.

First, the overall configuration of an apparatus to which the present invention is applied and the principle of operation will be described with reference to FIGS. 1 and 3 to 9.

As shown in FIGS. 1 and 3, the base 100
An optical system base 102 is attached to an upper surface 101 of the device, and an optical system plate 104 is fixed to an upper surface 103 thereof.
The objective lens 14 is arranged at the tip 105 of the optical system plate 104. The optical axis 10 of the objective lens 14
All tables are arranged with reference numeral 6 as a reference axis.

The light emitted from the epi-illumination light source 8 is reflected by a mirror 9,
The light is projected onto the inner lead 2 on the tape 1 via the shutter 11, the mirror 12, the half prism 13, and the objective lens 14. Similarly, the light from the light source 16 for oblique illumination drives a rotary solenoid 17 and opens a shutter 18 so that an IC is transmitted through a glass fiber 19 and a ring illumination device.
The light is projected on the chip 4. Both reflected light is objective lens 14,
Half prism 13, mirror 23, field lens 2
4. Via the relay lens 25 and the mirror 26b, the image of one corner is taken into the TV camera 29b via the mirrors 27b and 28b. The image of the other corner is mirror 26
a, 27a, and 28a, and are captured by the TV camera 29a.

As shown in FIGS. 1 and 7, etc., a pulse motor drive stage 36a, 36b is mounted on the upper surface 102 of the base 100 and moves forward, backward, left and right in a horizontal plane.
The lower surface 4b of the IC chip 4 is provided at the upper portion thereof with a vacuum pump (not shown) through a solenoid valve 107; 108 holds it by suction. With the IC chip 4 held, the drive stage 36a of the XYθ stage 36 is positioned at a position where the turning center 109 of the turning table 36c and the optical axis 106 coincide.
36b. 1 is a tape, and a pulse motor 1
10, the pair of timing pulleys 1
The drive sprocket 115 attached to the sprocket base 14 and held in a rotatable state is rotated through the sprocket holes 1 b provided on the tape 1 through the sprocket holes 1 b and 11, 112 and the timing belt 113. It is transported in the direction of arrow A by a fixed pitch. On the other side of the sprocket base 114, an idle sprocket 117 is held in a rotatable state.

As shown in FIGS. 1 and 4, the sprocket base 114 is mounted on an XYZ table 118, and is constituted by pulse motor driving stages 118a, 118b, 118c, and moves the sprocket base 114 back and forth, left and right, and up and down. Can be. Sprocket base 114
The tape guide 119 is attached to the center of the tape guide 1.
The center 12 of the bonding hole 121 provided at 19
2 guides the tape 1 to a position coincident with the optical axis 106, and the lower surface 123 of the tape guide 119 is processed into an arc shape, and by applying an appropriate tension to the tape 1,
It can be in close contact with the lower surface 123 (see FIG. 6). As shown in FIG. 4, reference numeral 124 denotes a tool table base, on which a front-rear sliding plate 127 is mounted via a pair of slide guides 125 and 126, and a motor 128 is mounted via a motor shaft 128a, a ball screw 129, and a nut 130. , Attached to the front and rear sliding plate 127,
By rotating 28, the front and rear sliding plate 127 can be slid in the directions of arrows B and C.

The motor 131 is mounted on the front and rear sliding plate 127, and is connected to the motor shaft 132, the coupling 133, the speed reducer 134, and the ring 13 connected by the pin 135.
6, 137 are connected to the vertical slide plate 138. The vertical slide plate 138 is a pair of slide guides 139 and 1 attached to the front and rear slide plate 127.
The vertical sliding plate 138 can be slid in the directions of arrows D and E by being guided by 40 and rotating the motor 131.

As shown in FIG.
8, a pitching plate 143 for holding the thermocompression bonding tool 7 on the front surface 142 thereof and adjusting the inclination of the lower surface 7 a of the bonding tool 7;
44, a groove 145 for holding the shaft 7 b of the bonding tool 7, a head 147 constituted by a holding plate 146,
A pair of slide guides 148 and 149 for holding the head 147 in a vertically slidable state and a head base 150 for mounting the slide guides 148 and 149 are attached. Reference numeral 151 denotes a load cell, which includes an upper portion 152 of the head base 150 and the head 14.
7 is attached to the gap between the upper surface 153 and the head base 15.
0 falls, the lower surface 7a of the bonding tool 7 contacts the IC chip 4 and the inner lead 2 on the chip stage 6, the head 147 stops, and the slide guides 148, 14
9, slides through the load cell 151,
The bonding load can be detected.

The bonding tool 7 has a heater 154.
Hole 155 for attaching the thermocouple 156
7 are provided, each attached by a fixing screw 158, and maintained at a predetermined temperature by a temperature control unit (not shown). Similarly, reference numeral 159 denotes a stage heater, which heats the upper part 6c of the chip stage 6,
A thermocouple 160 attached to the upper part 6c through a hole 6d is attached by a fixing screw 161, and is maintained at a predetermined temperature by a temperature control unit (not shown).
At the center of the chip stage 6, a heat insulating table 6e is mounted, at the center there is a hole 6f for sucking the IC chip 4, and at the lower part there is a chip stage base 6g, which is mounted on the XYθ stage 36. Chip stage base 6
g has a vacuum suction hole 6h, and is connected to a vacuum pump (not shown) via a fitting 162, a tube 163, and a solenoid valve 107.

A vacuum suction pad 164 for transferring the IC chip 4 is connected to a vacuum pump (not shown) via a fitting 165, a tube 166, and a solenoid valve 167. The suction pad 164 is attached to the arm 168, guided by a pair of slide guides 169a and 169b, attached to the hand base 170, held in a vertically slidable state, and attached to the air base 171 attached to the hand base 170. Rod 172 is connected to the arm 168. The air cylinder 171 has a pipe joint 173,
A tube 174 and a solenoid valve 175 are connected to a high-pressure air pipe (not shown). By driving the solenoid valve 175, the suction pad 164 slides up and down via the arm 168.

The hand base 170 is attached to the pulse motor drive stages 176a and 176b of the XY stage 176 that moves back and forth and right and left in the horizontal plane.

Reference numeral 178 denotes a tray base. The tray 180 is positioned on the upper surface 179 by a pair of positioning pins 181 and 182. A plurality of recesses 183 are provided on the upper surface of the tray 180, and the IC chip 4 is positioned and mounted in advance. Have been.

Reference numeral 184 denotes a reel plate on which a feed motor 185 is mounted, and a reel 187 is mounted on a motor shaft 186.
A square shaft 189 for fitting the square hole 188 is mounted. As shown in FIG. 5, a stopper lever 191 that bends around a pin 190 as a fulcrum is attached to the tip of the square shaft to prevent the reel 187 from coming off. Reference numeral 192 denotes a fixed roller, and a fulcrum shaft 193 is fixed to the reel plate 184 and held rotatably via a bearing (not shown). Reference numeral 194 denotes a tension roller via a slide guide 195 attached to the reel plate 184;
The tension roller shaft 196 is fixed and held rotatably via a bearing (not shown).

Reference numeral 197 denotes a spacer, which extends from the reel 187 together with the tape 1. Reference numeral 198 denotes a spacer fixing roller, and a fulcrum shaft 199 is fixed to the reel plate 184 and held rotatably via a bearing (not shown). 200 is a tension roller,
Slide guide 201 mounted on reel plate 184
, The tension roller shaft 202 is fixed, and is held rotatably via a bearing (not shown).

Reference numeral 203 denotes a take-up motor mounted on the reel plate 184, and a square shaft 189 is mounted on the motor shaft 204, similarly to the feed motor 185. A pair of limit switches 205 and 206 for detecting the position of the tension roller 194 are attached to the reel plate 184, and a slide portion 195a of the slide guide 195 is provided.
, Respectively, and each feed motor 18
5 and the winding motor 203 is driven in the direction of arrow G.

In the above configuration, the XY stage 176
Is driven, and the center 1a of the suction pad 164 is placed on the center 4a of the IC chip 4 at an appropriate position mounted on the tray 180.
64a, the solenoid valve 175 is driven to operate the air cylinder 171 and the arm 1 is moved.
After lowering the suction pad 164 via the valve 68, the solenoid valve 167 is driven, the upper surface 4a of the IC chip 4 is suctioned under vacuum, and the arm is raised again.
The IC 76 is driven to move to a position where the IC chip 4 is mounted on the chip stage 6. At the same time, the XYθ stage 36 is driven to move the chip stage 6 to the IC chip 4 receiving position.

Next, the solenoid valve 175 is driven, the air cylinder 171 is operated, and the suction pad 164 is lowered. Then, the solenoid valve 167 is driven, and the IC chip is mounted on the chip stage 6. Is driven to operate the air cylinder 171 to raise the suction pad 164.

Next, the XYθ stage 36 is driven to return the turning center 109 of the turning table 36c to a position coincident with the optical axis 106. At the same time, the pulse motor 110 is rotated, and the driving sprocket 115 is rotated via the timing pulley 111, the timing belt 113, and the timing pulley 112, and as shown in FIG. The center 120 of the tape 1 is aligned with the center 122 of the bonding hole 121 of the tape guide 119. At this time, the tension roller 194b descends by its own weight according to the length of the transported tape 1, the limit switch 206b operates, the winding motor 203 rotates, and the tape 1 and the spacer 197 are rotated while the reel 187b rotates. Take up. As a result, the tape 1 is pulled,
The tension roller 194b is pushed up, the limit switch 205b operates, and the winding motor 203 stops.
At the same time, the tape 1 is pulled, the tension roller 194a is pushed up, the limit switch 205a operates, the feed motor 185 rotates, and the tape 1 and the spacer 197 are sent out while the reel 187a rotates. As a result, the tape 1 is loosened, the tension roller 194a descends,
When the limit switch 206a operates, the feed motor 185
Stops. By repeating this series of operations each time the drive sprocket 115 rotates and conveys the tape 1, a constant tension can always be applied to the tape 1.

Next, the shutter 18 is closed, the shutter 11 is opened, and the image from the epi-illumination light source 8 is displayed on the TV camera 29a.
At 29b, the position of each inner lead 2 which is closest to the corner of the take-in tape 1 and forms a right angle is detected, and as shown in FIG. 9, a difference obtained by adding an offset amount to a predetermined reference position 207a is obtained. XYZ table 1 by the difference
18 is driven to adjust the inner lead 2 to the reference position 207a. Next, the shutter 11 is closed, the shutter 18 is opened, and the image from the oblique illumination light source 16 is displayed on the TV camera 29.
a, 29b, the positions of the chip corners 4c, 4d are detected, and the differences from the reference positions 207a, 207b are obtained. From the difference, the inclination of the IC chip 4 and the difference between the front, rear, left, and right directions after the inclination is corrected are calculated. The XYθ stage 36 is driven by calculation, and the corners 4c and 4d of the IC chip 4 are adjusted to the reference positions 207a and 207b.

After the above operation is repeated and set within the predetermined position deviation, the epi-illumination light source 8 is used again and the average position 208a, 208 of the plurality of inner leads 2 is similarly set.
b, a plurality of average positions 209a and 209b of the bumps 3 are obtained by using the oblique illumination light source 16, and the inclination of the IC chip 4 and the difference between the front, rear, left and right directions after the inclination is corrected are calculated. , XYθ stage 36 is driven to adjust the average positions 209a, 209b of the bumps 3 to the average positions 208a, 208b of the inner leads 2. This operation is repeated to set the position within the predetermined positional deviation amount, and the positioning is completed.

At this time, if a defect is found in the IC chip 4 by image processing, the XYθ stage 36 is returned to the position where the IC chip 4 before alignment is mounted, and the XY stage 176 and the solenoid valves 167 and 175 are driven. ,
The IC chip 4 is placed on the tray 180 by the suction pad 164.
After returning to the empty concave portion 183, another IC chip 4 is mounted on the chip stage 6 again, and alignment is performed by the same means.

If a defect is found in the inner lead 2 of the tape 1, the drive sprocket 115 is rotated, the tape 1 is conveyed at a constant pitch, a new inner lead 2 is positioned, and the same means is used again. Perform positioning.

After the positioning is completed, the motor 128 is driven to move the front / rear sliding plate 127 in the direction of arrow B as shown in FIG. , Motor 131 to drive coupling 133, reducer 134, pin 1
35, links 136, 137, vertical sliding plate 13
8, the reaction force of the load cell 151 is detected via the bonding tool 7 and the head 147 while the head base 150 is lowered in the direction of arrow E. The lower surface 7a of the bonding tool 7 comes in contact with the IC chip 4 on the chip stage 6 via the inner lead 2 and after detecting a predetermined load, presses the bonding tool 7 for a predetermined time and heats the inner lead 2 so that the inner lead 2 is heated. After being bonded to the bumps 3, the motor 128 and the motor 131 are driven again to return to the original position, and the thermocompression bonding of one IC chip 4 and the inner lead 2 on the tape 1 is completed. By repeating all the above operations, the inner lead bonding can be performed continuously.

Next, an alignment method for TAB inner lead bonding according to one embodiment of the present invention will be described with reference to the drawings.

FIG. 10 is a perspective view showing the configuration around the bonding position of the TAB inner lead bonder to which the alignment method according to the present invention is applied and the configuration of the alignment detection optical system. FIG. 11 is a functional block diagram showing the overall configuration of the alignment system. It is.

As shown in FIG. 10, inner leads 2 are provided on the tape 1 in order. The tape 1 is fed by a feed mechanism (not shown) at a set pitch of the inner leads 2 in the direction of the arrow (X direction), and the inner leads 2 are sequentially positioned at the bonding position 39. On the other hand, the IC chip 4 is mounted on the XYθ stage 36, mounted on the chip heating stage 6 coated with heat resistant black, and also positioned at the bonding position 39. After aligning all the inner leads 2 on the tape 1 and the bumps 3 formed on the IC chip 4, the bonding tool 7 is moved in the Y direction to the position shown by the broken line, and then all the inner leads 2 and the bumps 3 are collectively collected. And thermocompression bonding at the same time.

The alignment detection optical system shown in FIG. 10 is constituted by an optical system having the bonding position 39 as the optical axis position, and detects the overlapping inner lead 2 and IC chip 4 at the same time. This detection optical system includes an oblique illumination system, an epi-illumination illumination system, a pattern detection system, and an observation system. The oblique illumination system includes a shutter 1 operated by a light source 16 and a rotary solenoid 17.
8, a glass fiber 19 for guiding light, and a ring illumination device 20 in which the openings of the fibers are arranged on the circumference. The epi-illumination system includes a light source 8, a mirror 9, an aperture 10, a shutter 11 for shielding light, a mirror 12, a half prism 13, and an objective lens 1.
Consists of four. The pattern detection system includes an objective lens 14, an aperture 21 installed at a rear focal position of the objective lens 14, and a mirror 2.
3, field lens 24, relay lens 25, branching mirrors 26a, 26b, mirrors 27a, 27b, 28
a, 28b and TV cameras 29a, 29b. The observation system is branched by a half prism 22 behind the diaphragm 21 and includes a mirror 33, a zoom lens 34, and a TV camera 35.

The alignment method according to the present invention, that is, the alignment of all the inner leads 2 and the bumps 3 is performed in a state where the inner leads 2 and the IC chip 4 are overlapped at the bonding position 39, as shown in the enlarged view 37. Then, in order to perform the alignment, the patterns in the two visual fields 5a and 5b at the diagonal corners of the IC chip 4 are detected.
Furthermore, in the detected images of both fields of view,
And the position of the IC chip 4 are obtained. The position correction amount of the XYθ stage on which the IC chip 4 is mounted is calculated using these position data, and the position of the IC chip 4 is corrected and aligned while the inner lead 2 is fixed. After the completion of the alignment, bonding is performed by the tool 7 on the spot while the inner lead 2 and the IC chip 4 are fixed. For this reason, bonding can be performed without deteriorating the alignment accuracy due to the accuracy of the mechanism.

From the overlapping state, the inner leads 2 and I
In order to reliably determine the position of the C chip 4, images in two illumination states, epi-illumination and oblique illumination, are used. Therefore, when performing alignment, the oblique illumination ring illumination device 20 is installed above the bonding position 39. An illumination method is selected by controlling the opening and closing of the shutter 18 of the oblique illumination system and the shutter 11 of the epi-illumination system. The inner lead 2 and the IC chip 4 illuminated by either of them are connected to the objective lens 1
After the image is formed in the vicinity of the field lens in 4, the image is further enlarged by the relay lens 25. To detect the diagonal corner in two fields of view, the detection light passing through the relay lens 25
It branches right and left at 6a and 26b. The light reflected by the mirror 26a is further reflected by the mirrors 27a and 28a, and then forms an image on the imaging surface of the TV camera 29a. TV camera 29a
Is the upper left half quadrant 3 centered on the bonding position 39
8a is detected. Similarly, the TV camera 29b
Is the lower right quadrant 3 centered on the bonding position 39
8b is detected. TV cameras 29a, 29b
Are respectively held on XY stages (not shown), and by moving them, the positions of the visual fields 5a and 5b are adjusted in accordance with the dimensions of the IC chip 4 and the pattern of the diagonal corner portion is detected. Reference numerals 30a and 30b denote images obtained by detecting the patterns in the visual fields 5a and 5b by the TV cameras 29a and 29b, and input these to the image processing unit 31 for processing.

In order to correct the position of the IC chip 4 during alignment, the inner lead 2 is held with a slight gap between the inner lead 2 and the bump 3. Therefore, in order to simultaneously detect the overlapping inner lead 2 and IC chip 4 with one imaging system as shown in the enlarged view 37, the detection optical system needs to have a wide focusing range. In the present invention, a telecentric optical system is configured by installing the stop 21 at the rear focal position of the objective lens 14 to enable simultaneous detection.
The telecentric optical system is used for measuring projectors and the like.Even if the sample moves slightly from the correct focus position in the direction of the optical axis, the image is slightly blurred, but the size is hardly changed. It has the feature of little influence. In addition, since the incident illumination light is guided from the half prism 13 between the objective lens 14 and the aperture 21, by changing the diameter of the aperture 21, the NA of the detection system can be changed without changing the illumination field of the incident illumination. Numerical Aperture) can be adjusted, whereby the depth of focus can be adjusted, and a necessary focusing range can be obtained.

In this embodiment, an enlarged image is obtained by two-stage imaging using the objective lens 14 and the relay lens 25. Therefore, the magnification of the objective lens 14 can be reduced, and the working distance (the distance from the tip of the objective lens 14 to the sample) can be increased. Thereby, the detection optical system and the bonding tool 7
Realizes a configuration that does not cause interference. Further, by using a photolithography lens having a large pupil diameter as the objective lens 14, a field of view corresponding to various IC chip dimensions can be secured.

With the above configuration, it is possible to realize a fixed detection optical system for detecting the diagonal corner of the IC chip 4 in two fields of view. In addition, the ring illumination device 20 used in the oblique illumination system can be retracted to the position shown by the broken line at the time of bonding without providing a special mechanism by fixing the tool 7 to the moving stage.

In the observation system, the image forming light of the objective lens 14 is branched by the half prism 22, forms an image once near the lens 32, is reflected by the mirror 33, is enlarged by the zoom lens 34 at an appropriate magnification, and is expanded by the TV camera 35. To detect. Zoom lens 3
4 and the TV camera 35 have an integral structure, and are moved by an XYZ moving mechanism (not shown) to observe a pattern of an arbitrary position of the inner lead 2 and the IC chip 4 shown in an enlarged view 37 from right above at an appropriate magnification. can do.

FIG. 11 is a functional block diagram of the overall configuration of the alignment system. The alignment system includes a detection optical system 47 for simultaneously detecting the inner lead 2 and the IC chip 4 on the tape 1 overlapping at the bonding position, and a pattern in the two fields of view at the diagonal corners of the IC chip 4. Inner lead position (hereinafter abbreviated as lead position) and I
An image processing unit 31 for obtaining a C chip position (hereinafter abbreviated as a chip position) by image processing, and an XYθ stage 3 on which an IC chip 4 is mounted, using position data in the two fields of view.
6, a mechanism control unit 46 for calculating and correcting the position correction amount, an XYθ stage 36 for moving the IC chip 4,
It consists of a tape XYZ moving mechanism (not shown).

First, referring to FIG.
6 uses the position data in the two fields of view 5a and 5b of the diagonal corner portion received from the image processing unit 31 and uses the IC chip 4
The procedure for calculating the amount of position correction of the XYθ stage equipped with is described. Coordinate system XYθ stage 36 XOY is equipped with an IC chip in FIG., X ₁ o ₁ y ₁ coordinate system the field 5a to be detected by the TV camera 29a, x ₂ o ₂ y ₂ is T
The coordinate system of the visual field 5b detected by the V camera 29b
The direction is positive in the counterclockwise direction in FIG. R is X
Stage 36 is the rotation center position. The lead positions L ₁ , L _{2 and the} chip positions C ₁ , C ₂ are obtained by image processing from within each field of view. The L ₁ and C _1, and L ₂ and C ₂ is the position to be matched after the alignment. The amount of position correction of the XYθ stage 36 is obtained by converting the vector C ₁ C ₂ into the vector L ₁
Determined as the movement amount of the XYθ direction to match the L _2.

First, the coordinates of each position are defined as follows.

R (X _R , Y _R ) O ₁ (X ₁ , X ₁ )
O ₂ (X ₂ , Y ₂ ) L ₁ (x _{1 L} , y _{1 L} ) C ₁ (x
_{1C, y 1C) L 2 (} x 2L, y 2L) C 2 (x 2C,
y _2C ) is the XOY coordinate system, is the x ₁ o ₁ y ₁ coordinate system,
Are the coordinates in the x ₂ o ₂ y ₂ coordinate system. The vectors L ₁ L ₂ ,
The angles θ _L and θ _C that the vector C ₁ C ₂ forms with the x axis are

[0067]

(Equation 1)

[0068]

(Equation 2)

Is obtained. Correction angle Δ of chip position in θ direction
θ is

[0070]

Equation 3 θ _L = θ _C + Δθ ∴Δθ = θ _L −θ _C (= (Equation 1) − (Equation 2)) Rotating only Δθ around the rotation center R chip, chip position C ₁ is 'to, C ₂ is C _2' C ₁ moves to. Since the θ direction has already been corrected, the vector C ₁ ′
C ₂ ′ is parallel to the vector L ₁ L ₂ . Where C ₁ ′, C
The coordinates of ₂ ′ are represented by an XOY coordinate system, and C ₁ ′ (X ′ _1C ,
Y ′ _1C ) and C ′ ₂ (X ′ _2C , Y ′ _2C ).

The coordinates of C ′ ₁ are obtained by the following equation.

[0072]

(Equation 4)

[0073]

(Equation 5)

Is obtained. Further XY direction correction amount [Delta] X ₁ to C _'1 is equal to L _1, ΔY ₁ is

[0075]

(Equation 6)

Because

[0077]

(Equation 7)

Is obtained. Similarly, the movement amounts ΔX ₂ and ΔY ₂ in the X and Y directions can be obtained from the following expression from the movement of C ₂ .

[0079]

(Equation 8)

Since the vectors C ′ ₁ C ′ ₂ and L ₁ L ₂ are parallel,

[0081]

(Equation 9)

The chip position may be corrected by using the XY movement amount obtained by the equation (7) or (8).

As described above, the position correction in the XYθ direction of the XYθ stage 36 on which the IC chip 4 is mounted is corrected from the rotation center position R, the visual field positions O ₁ and O ₂ , the lead position L in each visual field, and the chip position C. The amount can be calculated. Note that each of the visual field positions O ₁ and O ₂ is determined according to the size of the IC chip 4 by T
This is a value measured in advance each time the position of the V camera 5a, 5b is moved.

An example of the definition of the above-described lead position L and chip position C will be described with reference to the patterns in the field of view 5 shown in FIGS. 13, 14 and 15.

An embodiment will be described with reference to FIG. In this case, the chip position C is the intersection of the orthogonal linear portions on the outer periphery of the chip, that is, the chip corner position. The lead position L is most a first lead position l ₁ determined from the corner side of the horizontal and vertical direction each one lead, the first lead position correction amount [Delta] X, corrected by ΔY position. The first lead position correction amounts ΔX and ΔY indicate the difference between the chip corner position C and the first lead position l ₁ when the inner lead 2 and the bump 3 are accurately aligned as shown in FIG. .
Therefore, the lead position L and the chip position C defined here are
After the alignment, the position should be the same. Note that the first read position correction amounts ΔX and ΔY are values set before the execution of the alignment.

Next, a second embodiment is shown in FIG. In this case, the inner leads 2 and the bumps 3 that are actually joined always have an overlapping portion, and the inner leads 2 and the bumps 3 that are not joined do not have an overlapping portion. As shown in the figure, the chip position C is an average bump position obtained from the positions of the plurality of bumps 3 included in the visual field 5. This is a position determined from the X coordinate obtained as the average value of the center positions of the bumps in the X direction for all the bumps arranged in the X direction and the Y coordinate obtained in the same manner. Although FIG. 2 shows a case where two bumps are included in both the horizontal and vertical directions, for example, when six bumps are included in one direction, an average position of the six bumps is used. On the other hand, as the lead position L, an average lead position obtained from a plurality of lead positions included in the visual field 5 is used as in the case of the bump.

In the definition shown in FIG. 13, it is a necessary condition for alignment that the chip corner position C and the first lead position l ₁ are within the visual field 5. Further, in the method using the average lead / bump position shown in FIG. 15, the alignment is performed to some extent by some method, and it is a necessary condition for the alignment that the above-mentioned condition is satisfied.

Next, the TV cameras 29a and 29 shown in FIG.
A method of obtaining the lead position L and the chip position C defined as described above from the images 30a and 30b detected in b will be described with reference to FIGS.

A method for detecting the lead position will be described with reference to FIG. In the case of detecting the lead position, the oblique illumination type shutter 18 shown in FIG.
Is closed and oblique illumination is performed. In this illumination, light is emitted from an opening of a fiber arranged on the circumference of the ring illumination device 20. The diameter of the opening is larger than the outer diameter of the IC chip 4, so that the illumination light is equally obliquely incident on both surfaces of the inner lead 2 and the IC chip 4 from each direction.
The inner lead 2 is formed by etching a copper foil, and its surface is rough, so that many irregularly reflected components are detected brightly. On the other hand, the surface of the IC chip 4 is detected darker than the inner lead 2 because the surface thereof is smooth and has less diffuse reflection components. Therefore, when the state in which the inner lead 2 is superimposed on the IC chip 4 is detected by oblique illumination, an image in which the inner lead 2 is made bright and visible is obtained. When this is binarized, a binary image as shown in FIG. 16A is obtained. Here, a white portion indicates “1”, and a hatched portion indicates “0”. A procedure for detecting the lead positions arranged in the X direction from the binary image will be described below.

(1) “1” portion projection waveform lead-pr (X) (FIG. 2B) along the Y direction with the projection width shown in FIG. 2A, ie, “1” pixel at the same X coordinate Create a waveform indicating the number of In this case, the projection width is set such that the maximum value of lead-pr (X) is equal to the projection width, with the upper end of the image as a starting point. Specifically, first, projection processing is performed on the entire image, and the maximum value of the projection waveform is compared with the projection width. If they are not equal, the projection processing is repeated again with the maximum value as the projection width. With this processing, the projection waveform under the above conditions is automatically obtained.

(2) Lead-pr (X) and threshold value Thl
The lead position L _C is obtained as the middle point between the intersections L _l and L _r of.
Thl uses a value obtained by multiplying the projection width by an appropriate ratio r (0 <r <1).

The lead positions arranged in the Y direction are detected in a similar procedure. According to the above-described procedure, all the lead positions included in the visual field are detected. From these, the first lead position l ₁ shown in FIG. 13 and the average lead position shown in FIG. 15 can be obtained.

Next, a method of detecting the chip corner position as the chip position C will be described with reference to FIG. The chip corner position detection is performed after the lead position detection described above is performed.
In this case, the epi-illumination system shutter 11 shown in FIG. 10 is opened, and the oblique illumination system shutter 18 is closed to perform epi-illumination.
In this illumination, the illumination light is incident almost perpendicularly to both surfaces of the inner lead 2 and the IC chip 4. Since the surface of the IC chip 4 is smooth, although the circuit pattern is bright and dark, it is detected bright because of the large number of specular reflection components. On the other hand, since the inner lead 2 has a rough surface, there are many irregular reflection components,
It is detected darker than the surface of the IC chip 4. Since the bumps 3 are also formed on the surface of the IC chip 4 by plating, the surfaces are rough and are detected as dark as the inner leads 2. Therefore, when the state in which the inner lead 2 overlaps the IC chip 4 is detected by epi-illumination, an image is obtained in which both the inner lead 2 and the bump 3 are dark and only the chip surface is bright. When this is binarized, a binary image as shown in FIG. 17A is obtained. In the chip corner position detection method, an approximate straight line of the outer periphery of the chip in both the X and Y directions is obtained from the binary image of FIG. 3A, and the chip corner position C is detected as the intersection of these two straight lines. A procedure for linearly approximating the outer periphery of the chip in the X direction will be described below.

(1) A “1” portion projected waveform pellet-pr (X) (FIG. 2B) along the Y direction with the projection width shown in FIG. This waveform is searched from the left side with the threshold value Thp, and the first intersection is set to pe. A point that is further advanced by dp than this pe is set as a starting point, and a search range shown in FIG. dp is used for the inclination θ of the IC chip 4.
This is for setting a range in which the outer periphery of the chip in the X direction is correctly searched even when is large.

(2) The binary image shown in FIG. 17A is searched along the Y direction from the upper end of the image within the search range, and the image is changed from "0" (shaded area) to "1" (white area). ), The point that changes first is extracted. (FIG. (C)) (3) In FIG. (C), in the portion where the inner lead 2 overlaps the IC chip 4, a portion other than the chip outer periphery is extracted. Therefore, using the lead position data already obtained from the above-described oblique illumination image, the extraction points near the lead portion are removed (masked). (FIG. (D)) (4) The result of chip periphery extraction in FIG. (D) is approximated by the least squares method. (FIG. 9E) The Y direction is processed in the same way, and the chip corner position shown in FIG. 13 can be obtained as the intersection of the approximate straight lines in both the X and Y directions.

Next, a method of obtaining the average bump position as the chip position C will be described with reference to FIGS. The bump position detection is performed after the lead position detection in the same manner as the above-described chip corner position detection, and an image detected by incident illumination is used. FIG. 18A shows a procedure for detecting the positions of bumps arranged in the X direction in this binary image.

(1) Projection waveform “pellet-pr (y)” of “1” portion along the X direction with a projection width p shown in FIG.
(FIG. 2B) is created. This waveform is searched from the upper side with the threshold value Thp to find the first intersection point pe.

(2) The projection width b is set based on the pe obtained in (1), and the “0” portion projection waveform bump along the Y direction is set.
-Pr (x) (FIG. 9C) is created. The projection width b is I
The area is limited to the area where the bumps around the C chip 4 are present, and is set so as not to be affected by the pattern inside the chip.

(3) The projection waveform bump- in FIG.
A method for obtaining the bump position from pr (x) will be described with reference to FIG. For this purpose, the following two methods are selected depending on the alignment between the inner leads 2 and the bumps 3.

(I) When both the left and right edges of the bump 3 are visible from the side of the inner lead 2 (FIG. 2 (d) -1), the known lead position Lc is determined by detecting the lead position (FIG. 2 (d) -2). At the starting point, bump-pr on the threshold Thb
Searching (x) to the right and left, each first intersection B _l, Request B _r. The bump position Bc is determined as the middle point between them. ((D) -3 in the figure) (II) When one edge of the bump 3 is hidden under the lead and cannot be seen ((e) -1 in the figure) Intersections B ′ _l , B ′ as in (I) _{Find r} . Then, from the intersection having the longer search distance (B ′ _{l in} this case), bw / 2 (b
The position returned to the lead position Lc side by (w: bump width) is defined as a bump position B′c.

Note that which method (I) or (II) is used is determined using the distance S having the longer search distance. That is, when S ≦ bw−lw / 2 (lw: lead width),
(I) If S> bw-lw / 2, the bump position is determined by the method (II).

By searching for bump positions as described above from all lead positions in the X and Y directions known by the lead position detection, all bump positions in the field of view can be detected. This makes it possible to detect the average bump position as shown in FIG.

Next, an embodiment of the image processing section 31 for detecting the above-described lead position L and chip position C will be described with reference to FIG.

The image processing section 31 includes a switch 48, an A / D
It comprises a converter 40, a multi-valued memory 41, a binarization circuit 42, a binary memory 43, a projection processing circuit 44, and a microcomputer 45.
The image signals detected by the TV cameras 29a and 29b are switched by a switch 48 and processed alternately. After the A / D conversion at 40, the data is temporarily stored in the multi-value memory 41. Further, the image is binarized by 42 and the binary image is stored in the memory 43. The microcomputer 45 sets a projection width with respect to the binary image, and obtains a projection waveform with 44. The microcomputer 45 inputs a projection waveform, that is, a one-dimensional waveform, processes the waveform, and detects the positions of leads, bumps, and the like. In addition, the microcomputer 45 controls the opening and closing of the shutters 18 and 11 of the detection optical system, and selects an illumination method according to the flow of image processing. The position data in each image of the lead position L and the chip position C detected from the images in the two fields of view are sent to the mechanism control unit 46.

The position detection method according to the present invention is performed only by repeating the projection waveform processing, and the apparatus configuration of the image processing unit 31 is simple and the scale can be reduced.

Next, an embodiment of the flow of the alignment operation of the TAB bonder to which the alignment method according to the present invention is applied will be described with reference to FIG.

The alignment is started (48) after positioning the inner lead 2 and the IC chip 4 before bonding at the bonding position 39. First, oblique illumination is performed, a lead position detection 49 is performed in any field of view, a first lead position is obtained, and the lead position is corrected (50). This aims at positioning the inner lead 2 below the crimping surface of the bonding tool 7, and corrects the position in the XY directions. The correction target position is obtained as follows. Tool 7 is shown in FIG.
As shown in (1), the position of the crimping surface does not change only by repeating the movement for a certain distance in the YZ directions. Therefore, before performing actual bonding, a thin plate on which a polyimide tape or the like is adhered is placed on the chip stage 6, and the tool 7 is pressed in the same manner as bonding. Burn marks are formed on the tape on the thin plate, and these are marked with the alignment TV camera 29a (or 29).
Observation in b) shows the position of the crimping surface. Since the size of the crimping surface is substantially equal to the size of the IC chip 4, the IC chip 4 is adjusted to the position of the burn mark. Then, the first lead position in a state where the inner lead 2 is aligned with the chip is a target position, and the lead is aligned with this position.

After positioning the inner lead 2 on the crimping surface of the tool 7 as described above, the lead position is detected again (5).
Perform 1). Thereafter, the leads are fixed and the chips are moved to perform alignment. Therefore, the first lead position and the average lead position detected at 51 are the target positions for the subsequent alignment operation. Then, the chip position detection 52
Thus, the chip corner position or the average bump position is detected according to the alignment state between the inner lead 2 and the bump 3. At 53, the amount of deviation between the lead position L and the chip position C is checked, and if the target alignment accuracy has been reached, bonding (56) is performed. If the accuracy is not reached, the chip position is corrected (55), and the chip position is detected again (52).
Is repeated.

FIG. 21A shows the contents of the shift amount check 53. The deviation amounts dx ₁ , dy ₁ , and d of the chip position C in the XY directions with respect to the lead position L in the two visual fields 5a and 5b.
When both x ₂ and dy ₂ are equal to or smaller than the target accuracy D, the alignment is terminated. That is, as shown in the figure, if the chip position C falls within the alignment accuracy range 58 of ± D in the XY directions around the lead position L in each field of view, the alignment is terminated and bonding is performed.

However, if an actual product is aligned only by the above-described displacement amount checking method, the accuracy may not be reduced and bonding may not be performed. One of the causes is poor work accuracy. For example, although the tape 1 on which the inner leads 2 are formed is made of a heat-resistant material selected and used, thermal deformation is inevitable because the tool 7 and the chip stage 6 heated at a high temperature are close to each other. FIG. 22 shows an example of alignment when the tape is expanded. In this embodiment, as described in the equation (Equation 9) above, in principle, the chip position C is equal to the lead position L in one of the two visual fields.
If the amount of movement of the XYθ stage 36 in the XY directions is determined so as to match the above, the alignment should be possible. However, the tape expands as shown in FIG.
When the movement amount in the X and Y directions is obtained only with the visual field 5a, the result is as shown in FIG. That is, although the inner leads 2 and the bumps 3 are well aligned in the visual field 5a, the positional deviation is large in the visual field 5b. As a result, if the expansion is large, the displacement vector C ₂ L _{2 of the} visual field 5b becomes large, and the alignment is not completed. The same thing occurs when attention is paid to the visual field 5b as shown in FIG.

Therefore, in the alignment method of the present invention, as another embodiment of calculating the moving amount in the X and Y directions, the average value of the moving amount calculated by paying attention to each visual field obtained by Expressions (7) and (8) is used. The amount of movement in the XY directions. By doing so, in the case of FIG. 22, it is possible to perform alignment with an equal shift amount in both the visual fields 5a and 5b. As a result, even for a target having a low work accuracy, an optimum alignment corresponding to the work accuracy can be realized.

The average alignment of the two visual fields is as follows.
Optimal alignment can be provided even for a workpiece with a somewhat poor accuracy. However, even in this method, if the work accuracy is further worse, the alignment cannot be completed because the accuracy has not been reached. FIG. 21 (b) shows the correction in the θ direction and 2
This shows a state where the correction of the average XY direction position of the visual field has been completed. However, the displacement vectors C ₁ L ₁ and C ₂ L ₂ in each field of view are almost equal in size, and both are larger than the alignment accuracy range 58 shown in FIG. Cannot finish the alignment. In order to prevent this, in the present invention, the following method is added as another embodiment of the deviation amount checking method. (1) The correction amount in the θ direction is sufficiently small.

(2) The amount of displacement in both fields is greater than the target accuracy.

(3) Displacement vectors C ₁ L ₁ ,
The vector (Δdx, Δdy) of the sum of the vectors C ₂ L ₂ is X
In both Y directions, it is smaller than the set value Δd.

If all of the above conditions (1) to (3) are satisfied, it is determined that further alignment is impossible, and the bonding is stopped as shown in FIG. 20 (57).
I do.

In the alignment operation flow shown in FIG. 20, an alignment count check 54 is performed before the shift amount check 53 is completed and the chip position is corrected. Originally,
If the calculation of the position correction amount is correct, the alignment should be completed by several chip position corrections. However, for some reason, the convergence of the accuracy is poor, and the bonding is stopped (57) even when the chip position is corrected more than a specified number of times.

After the bonding is stopped, an alarm is issued to inform the operator of the bonder that a problem such as a work defect or a device defect has occurred, and the operator takes necessary measures. By doing so, it is effective in early detection of a tape or the like with low precision, prevention of a potential defect by forcibly bonding a workpiece with low precision, prevention of a reduction in tact due to an infinite loop of the alignment operation, and the like.

Next, an alignment method from a state where the corner portion of the IC chip 4 is detected in only one visual field will be described with reference to FIG. In the present invention, the state where the inner lead 2 and the corner portion of the IC chip 4 are detected in the two visual fields is represented by X
It is assumed that the position correction amount of the Yθ stage 36 is calculated.
As shown in the operation flow of FIG.
Each time the tape 1 is fed by one pitch, the lead position is detected.
9 and lead position correction 50 are performed. For this reason, the corner portion can be positioned at a fixed position in both visual fields. On the other hand, the IC chip 4 is mounted on a chip stage 6 indicated by a broken line in FIG. If a positioning device is provided in the middle of the transfer, it is easy to insert the corner of the IC chip into two fields of view. In this embodiment, an application example of the alignment method according to the present invention for reducing the supply accuracy of the IC chip 4 to a bonder having no such a positioning mechanism will be described. FIG. 23A shows a case where the corner of the IC chip 4 is detected in the visual field 5a and not detected in the visual field 5b. In such a case, the correction amount in the X and Y directions is obtained and aligned only from the position detected in the visual field 5a. That is, the position correction amount (ΔX, ΔY) is obtained from the first lead position and the chip corner position in the visual field 5a. After the correction, the corners of the IC chip can be detected in both fields of view, as shown in FIG. Thereafter, the position correction in the XYθ directions based on the position data in the two visual fields is performed, and the alignment operation may be repeated until the state shown in FIG. However, when the inclination of the chip is large, the corner of the IC chip 4 may enter only one field of view even if the position in the XY directions is corrected. In this case, since the correction amount in the θ direction cannot be calculated and alignment cannot be performed any more, the automatic alignment is stopped, and the bonder operator is requested to assist. According to the present embodiment, in addition to the alignment device according to the present invention, a mechanism dedicated to positioning the IC chip 4,
No device or the like is required, and the configuration of the bonder can be simplified.

In the present invention, there is a value set in advance before the alignment operation. Hereinafter, an embodiment of the setting method will be described.

First, a method of setting the first lead position correction amounts ΔX and ΔY shown in FIG. 14 will be described. First, as shown in the drawing, the inner leads 2 and the bumps 3 are aligned together in two fields of view. Actually, T shown in FIG.
The XYθ stage may be manually moved and aligned while observing the detection images of the V cameras 29a and 29b on a monitor (not shown). After the alignment, the lead position detection 51 and the chip position detection 52 shown in FIG. 20 are executed, and the first lead position and the chip corner position are automatically detected by the algorithm described in the present embodiment. As a difference between these two positions, a first lead position correction amount in both visual fields is obtained.
In this method, the correction amount can be obtained according to the appearance of the peripheral pattern of the IC chip 4. Further, the change depending on the type can be easily performed only by performing the manual alignment once before the bonding. Further, since the design values are not used, it is possible to provide an optimum correction amount even for a workpiece with low accuracy.

Next, a method of setting the visual field positions O ₁ and O ₂ shown in FIG. 12 will be described. For this purpose, an alignment mark 60 is provided on the chip stage 6 shown in FIG. Since the black-painted surface of the chip stage 6 is detected as dark, the mark 60 is formed by forming a pattern such that a material that can be detected brightly becomes the surface. The chip stage 6 is fixed on the θ stage of the XYθ stage 36, and is assembled so that the alignment mark 60 coincides with the rotation center of the θ stage. During assembly, the mark 60 is observed while rotating the θ stage, and the eccentric direction is known from the movement. By finely moving the chip stage 6 using the fine adjustment mechanism 61, the eccentricity between the mark 60 and the rotation center of the θ stage is eliminated.

Further, as shown in FIG. 13B, the alignment mark 60 is detected in each field of view 5, and based on the position of the mark 60 in the field of view and the stage position at the time of detection,
The origin positions O ₁ and O ₂ of both fields of view can be obtained in the stage coordinate system.

Next, an embodiment of a means for detecting the position of the alignment mark 60 in the field of view will be described with reference to FIG.
First, the XYθ stage 36 is moved, and the positioning mark 60 is positioned in the visual field 5. This mark 60 is imaged by a TV camera, binarized, and then "1" in the same manner as the lead position detection.
Create a partial projection waveform. The projection width is set to the entire image, the intersection of the waveform projected in both the X and Y directions with an appropriate threshold is obtained, and the position of the mark 60 in the field of view is obtained from the middle point. As another embodiment, as shown in FIG. 9C, a binary image of the alignment mark 60 stored in the reference pattern storage area 59 and the field of view 5 where the mark 60 is detected are displayed.
The position of the mark 60 is obtained by performing pattern matching, which is a well-known technique, with the image. In another embodiment, the position can be obtained by circumscribing a cursor or the like to the outer periphery of the mark 60 detected in the image of the visual field 5.

Next, FIG. 25 shows an embodiment of the inner lead bonding method utilizing the feature of the alignment method by simultaneously detecting the inner leads 2 and the bumps 3 at the bonding position 39 according to the present invention.

FIG. 25 (a) shows the structure near the bonding target, 62 is a tape guide for guiding the tape 1, 6 is a tape guide.
Reference numeral 3 denotes a tape Z stage connected to the tape guide 62. The alignment is performed by moving the IC chip 4.
The bump 3 is aligned with the fixed inner lead 2.
Therefore, a slight gap is provided between the inner lead 2 and the bump 3. When the thermocompression bonding to the tool 7 is performed in this state after the completion of the alignment, a crack 64 is easily generated in a bent portion of the inner lead 2 as shown in FIG. In addition, as shown in FIG. 3C, the inner lead may be shifted laterally during pressing, and the alignment accuracy after crimping may be deteriorated. The lateral displacement may be caused by poor parallelism of the crimping surface of the tool 7 to the surface of the IC chip 4 or the pressing direction of the tool 7 not perpendicular to the IC chip 4.

As a solution to the above problem, FIG.
After the alignment is completed, as shown in FIG.
The stage 63 is lowered, and the inner leads 2 are brought close to the bumps 3 and then pressed. By doing so, the bonding can be performed without bending the inner lead 2 as shown in FIG. On the other hand, the lateral displacement of the inner lead 2 hardly occurs when the tool 7 is pressed. However, since the tape Z stage 63 is driven after the alignment, if the moving direction of the stage is inclined with respect to the IC chip 4, a lateral displacement similar to that shown in FIG. This can be dealt with by an alignment method because of a phenomenon with reproducibility. That is, as shown in FIG. 21A, the tape Z stage 6 is positioned at the lead position L of each field of view, which is the target position for alignment.
The amount of deviation resulting from the operation 3 is added as an offset amount, and alignment is performed using the offset amount as a target position. In this method, alignment is performed with the inner leads 2 and the bumps 3 separated. After alignment, Z stage 6 for tape
When 3 is lowered, the inner leads are shifted laterally by a fixed amount, whereby correct alignment can be performed in the state of FIG.

The above-mentioned deviation amount is determined by the Z stage 63 for the tape.
It is possible to detect the lead position before and after the lowering of the position, and obtain the position from the difference between the two.

In this embodiment, the diagonal of the IC chip 4 is 2
Although two corners have been detected, the corners need not be particularly diagonal if they are two corners. In addition, two views
Although the heads have been simultaneously detected, the two visual fields may be detected by moving the detection system with one head. In addition, the position detection method described in the present embodiment can be applied to only one visual field, and it is needless to say that it can be applied to alignment in the XY directions. In addition, this embodiment can be applied as a part for finally increasing the accuracy of the alignment by using in combination with a chip and tape position detecting method using a known pattern matching technique. Further, in this embodiment, the ring illumination device 20 is used for oblique illumination, but this can be replaced by any illumination device having a function of uniformly illuminating the target obliquely, such as an illumination device composed of a plurality of glass fibers. It is.
In addition, epi-illumination is not limited to guiding light through the objective lens 14, and light can be guided from between the objective lens 14 and an object.

The present invention realizes alignment in the XYθ directions completely without contact after the IC chip 4 is supplied, and can prevent defects such as chip breakage and chipping during alignment.

Next, an embodiment of the pressing mechanism used in the present invention will be described with reference to the drawings.

FIG. 26 shows a vertical movement mechanism of the bonding tool according to the present invention. (A) shows a front view and (b) shows a side view. The tool stage 502 slidably mounted in the Y direction with respect to the base 501 is driven by a permanent magnet type DC servo motor 503. On the tool stage 502, there is a permanent magnet type DC servo motor 505 for driving the tool, and a harmonic drive 507 for deceleration.
The angle of the input link 508a of the link mechanism 508 can be changed via the. The output link 508c of the link mechanism can be moved up and down along a slide guide mechanism 517, and a tool support 509 coupled to the output link 508c.
And the tool 510 moves up and down. Tool support 50
9 has a U-shaped notch 5 as shown in FIGS.
09a and symmetrically with respect to the center axis of the tool 510.
The formed parallelogram link structure is formed. When a Z-direction force component 518 is applied to the tool tip, FIG.
After elastically deforming as shown in FIG. 7, the load cell 511 is pressed against the upper surface of the tool support. The load cell 511 generates a distortion signal according to the contact force. The distance between the load cell 511 and the upper surface of the tool support 509 can be changed by finely adjusting the screw 512. The initial adjustment of the interval is performed when the tool 510 receives no external force corresponding to the force 518 in FIG.
12 by tightening the screw 512 to a position where a contact force is generated.

Next, a block diagram of the system is shown in FIG. In this figure, reference numeral 519 denotes a main control unit for managing the entire bonding apparatus, which is indicated by a dashed line 52.
Reference numeral 0 denotes a tool vertical movement control device. The bonding command 522 sent from the main controller 519 is processed by the bonding algorithm 523 to control the driving of the tool. When the bonding is completed, the bonding algorithm analyzes the data being bonded and transmits 521 the result to main controller 519.

The details of the bonding algorithm will be described later.

In the tool up / down movement control device 520, the output pulse signal 528 of the optical encoder 506 directly connected to the tool up / down drive motor 505 is input to the counter 529 to perform a counting process, whereby the position of the tool in the Z direction is obtained. Has been detected. At the same time, a load cell force detection value 527 determined by the rotation angle displacement 525 of the motor 505 and the displacement of the tool 510 is input to the A / D via the amplifier 530.
It is input to the converter 531 and is captured as a digital quantity. The detection of the position in the tool Z direction and the detection of the force are performed at the same time interval, and based on this, the bonding algorithm 523 performs a predetermined calculation within each time interval and outputs the current to the motor 505. The value is set. This output current command value is input to the current amplifier 524, and the current of the motor is controlled.

The operation of the tool up / down drive mechanism having the above configuration will be described with reference to the flowcharts of FIGS. 29 and 30.

Before the start of each bonding operation, the tool stage 502 is retracted backward, and is in a state of waiting for completion of alignment between the chip and the lead (3).
02). In this state, the communication from main controller 519 is constantly monitored to determine the presence or absence of a bonding command (3.
04). When the main controller 519 alignment is completed, Y coordinates Ty chip position, pressure target value F _B, each data squeezing time target value T _B, and transmits a block of bonding command and human unity. Upon receipt of this, the tool vertical movement control device 520 stores each data as a variable of the control program, and then shifts to the drive control state of the tool vertical movement mechanism (306).

The tool first moves to the upper limit point in the Z direction,
Stop (308). Next, the tool stage moves forward in the Y direction and stops at the tip position Ty (310). Next, the tool moves in the Z direction, approaches a point Az where the distance between the tool tip and the tip can be expected to be a predetermined value, and stops (312). Next, the predetermined speed command value Vref is substituted for the command value of the control algorithm (3
14) Using the speed control algorithm, the tool approaches the chip and the lead while keeping the speed of the tool in the Z direction at a constant value (316). At this time, the signal value from the load cell is monitored at the same time, and the presence or absence of contact between the tool and the chip is determined (318). Thereafter, at predetermined time intervals (31
6) and (318) are repeated until the signal value detected from the load cell reaches a value corresponding to the target value of the pressing force (320).

Feedback control is performed on the detection signal value of the load cell corresponding to the target pressure value (32).
2) At the point in time when the target pressurization time and the time during which the feedback control of the pressing force is actually performed become equal (32)
4) The tool is moved to the upper limit point in the Z direction and stopped (326). Further, after the tool stage is moved to the rear limit point in the Y direction and stopped (328), the deviation distribution of the pressurized force detection values is totaled (330), the result is transmitted to the main controller, and one cycle is finished ( 332).

FIG. 31 schematically shows the movement of the tool according to this embodiment. FIG. 31A shows a time change of each coordinate. (B) shows the spatial movement of the tool. ,
Is a mode for positioning, ~ circle 10 is a mode that continues to detect force while lowering the tool at low speed, and circles 11 and 12 perform feedback control based on the detected force to reduce the pressing force. In this mode, the target value is maintained.

FIG. 32 is a block diagram showing a control calculation method in each mode. In this figure, 5
31 is the current amplifier 524 and the motor 50 in FIG.
5 and an optical encoder 506, which will be hereinafter referred to as a motor system. 532 is
This is a differential element that calculates the difference between the two terms before and after the time-series signal. In the figure, it is a mechanism that approximately differentiates the rotation angle of the motor output shaft, which is the output of the motor system, and obtains the rotation speed as a digital quantity. 533 is a sample-and-hold element, 534 is a difference element and an element opposite to 532, and is an integrator that performs approximate integration. Z is a Z conversion factor.

In each mode, the time series m (K) (K = 1, 2,...) Of the output m to the motor system is calculated as follows.

(A) m (K) = Kp (θr (K) −θ (K)) − Kv {θ (K) −θ (K−1)} In this mode, θr is not a constant value but is given. The value obtained by internally dividing between the initial position and the target position is used.

(B) i (K) = i (K−1) + K _vi {v _ref − (θ (K) −θ (K−1))}; i (θ) ≡0 m (K) = i (K) −K _vv {θ (K) −θ (K−1)} As described above, in this mode, v _ref is a constant value.

(C) i (K) = i (K−1) + K _fi {F _ref −K _F (θ (K) −T _Z (K))} m (K) = i (K) −K _ff {F _ref −K _F (θ (K) −T _Z (K))} In this mode, Fref is also used as a constant.

When bonding is performed by the tool vertical movement mechanism described above, the condition setting as shown in FIG. 33 can be realized. First, the rate of increase of the pressing force, that is, the inclination in FIG. 33, is given by approximately K _F · V _ref due to the repulsive force characteristic K _F of the object contacted by the tool. Therefore, by arbitrarily changing the low-speed command value, which is a parameter that can be set, the inclination at the rise of the pressing force can be arbitrarily realized. Also, the pressing force target value F _ref can be arbitrarily changed because it can be a variable in the program.

As an application example of this embodiment, a description will be given of a case where bumps on a chip to be bonded have uneven height. FIG. 34 is a flowchart of the application example, and FIG. 35 shows the behavior of the tool and the bump in the application example.

The tool is initially separated from the pellet (IC chip) and the leads (400). When there is a command to start bonding, the control device detects the amount of movement of the tool and holds this as a current value in the memory (4).
02). Subsequently, after substituting the initial pressing force f ₀ into the pressing force set value fr, the process returns to the repetitive execution of the tool drive control program.

First, the pressing force is detected (406), a servo operation is performed on the pressing force set value fr, and the result is output to the means for changing the driving force of the tool (40).
8). Subsequently the amount of movement of the tool is detected, it is compared with the value x ₀ when the previously detected (410, 412). x ₀ and x _n
If the Dere tool is moving not equal, pressure setting value f _r
Returns to the beginning of the repeated part while keeping the value as it is. This corresponds to either a state in which the tool has not yet contacted the pellet or a state in which the bump has been crushed with a pressure equal to or less than the initial pressure f ₀ .

If x ₀ is equal to x _n and the tool does not move, the pressure setting value fr is increased by the increment Δf and the process returns to the beginning of the repeated portion (414, 416). This corresponds to a state in which both are balanced while the tool presses the bump.

[0150] After continued until pressure setpoint this repetition f _r becomes greater than the predetermined bonding startable pressure Fc, performs a bonding operation in which the bonding load F _b predetermined and pressure-force setting value (41
8) Then, the tool is retracted to complete the bonding (420, 422). At this time, the value of Fc is experimentally determined on condition that a sufficiently large number of bumps come into contact with the tool.

FIG. 35 illustrates a change in the contact state between the tool 7 and the bumps 3a and 3b corresponding to the progress of the above algorithm. Here, for ease of understanding,
The illustrated bumps 3 are limited to two bumps: a bump 3a which comes into contact with the tool 7 at the earliest time, and a bump 3b which comes into contact with the tool 7 at the latest time before the pressure setting value fr becomes larger than Fc. .

FIG. 17A shows a state in which the tool 7 does not come into contact with any of the bumps 3 and drops with the initial pressure f ₀ as a set value. (B) the tool 7 is in contact with the bump 3a, and shows a state in which balanced in pressure f _0. (C)
Is a state in which the tool 7 descends while crushing the bump 3a while gradually increasing the pressing force. At this time, the pressing force takes a minimum value necessary to continue crushing the bump 3a, so that the impact force or excessive Pressing force is bump 3a
It does not start. (D) Tool 7 descends further,
This is a state immediately before the bump 3 b comes into contact with the tool 7. At this time, a predetermined number of bumps 3 including the bumps 3a are
It is crushed by the pressing force Fc-Δf. (E) the bump 3b is in contact with the tool 7, with the pressure set value is larger than Fc, performing bonding of regular was predetermined value F _b the bonding load from this state.

According to this application example, even when there is an error in the height of the bump 3 for each IC chip (pellet) 4, the impact load change at the time of contact between the tool 7 and the bump 3 is determined in the initial stage. It has the effect of being suppressed within the pressing force. Further, there is an effect that an excessive pressing force on a small number of bumps 3 in the initial stage of bonding is avoided.

According to the present embodiment, since the parameters of the pressing force can be changed during the bonding, it is possible to set conditions and change the algorithm according to the characteristics of the object, which is effective in reducing damage to the chip.

Next, a method of heating the bonding tool used in the present invention will be described.

The conventional bonding tool 700 is usually Inconel, and has a structure shown in FIG. 36 (a) in which a sintered diamond is attached to a bonding portion.

The tool 700 is used to improve the bonding quality.
It is necessary that the temperature of the bonding surface at the tip of the substrate is uniform. FIGS. 37 (a), (b) and (c) show the results of simulating the temperature distribution of the tool assuming various tool shapes. The most uniform temperature distribution in the tool is the concave tool shape shown in FIG.
As a result of experimentally producing a tool having the shape shown in FIG. 3B and conducting an experiment, the temperature distribution in the tool bonding plane could be kept within ± 2 ° C. Therefore, by taking the shape shown in FIG. 36B, the quality of bonding can be improved.

In FIGS. 36 and 37, 700 is a bonding tool, 701 is a heater, 702 is a thermocouple, and 703 is an isotherm.

A conventional tool shape is shown in FIG.
As shown in the figure, the heating of the tool 700 requires the tool 700
Is carried out by a heater 701 embedded above. Structurally, heat is supplied to the bonding surface by conduction through an Inconel tool 700. Therefore, due to heat loss due to radiation from the tool surface, the temperature distribution in the tool must be as shown in FIG. 37 (b), and there is a difficulty in making the temperature of the bonding portion uniform. In the case of continuous bonding, the temperature of the tool decreases each time, and it takes several seconds to recover the temperature, resulting in an increase in bonding tact time and a decrease in throughput. Therefore,
As shown in FIG. 38, by adopting a structure in which heat is supplied from a heater block 704 surrounding the periphery of the tool 700, the temperature of the bonding portion can be made more uniform.

On the other hand, the TAB inner bonder has a problem in that since the bonding temperature is as high as 450 to 550 ° C., the thermal shock applied to the chip is extremely large. In particular,
Due to the heating method with pressure, chip damage due to bonding, tape deformation, etc.
The situation is becoming more and more problematic due to the increasing number of pins. Therefore, most of the inner bonding apparatus has a heater 6 inside a stage 600 in a rod shape or another shape as shown in FIG.
01 is arranged so that preheating of about 250 ° C. is possible. The problem with this structure is that one is that little consideration is given to the uniformity of the temperature distribution of the stage 600, and the other is that the pressure during bonding is usually about 3 to 10 kgf. ,
In some cases, the heater 601 was damaged.

In view of this, the present embodiment has a structure in which the support stage 600 of the tool is circular and the periphery thereof is surrounded by the ring-shaped heater 602. As a result, a substantially uniform temperature distribution is obtained on the stage, and a load due to tool pressurization is not transmitted to the heater 602, so that damage to the heater can be prevented.

The stage structure of the inner bonder is as follows:
To align the tape and chip, the entire stage
It was common to be on the -Y-θ table. Since the stage 600 generates heat from the bonding tool or heat from preheating, the stage 600 has a cooling and heat insulating structure to prevent the accuracy of the XY-θ table from being lowered due to the heat.

In particular, when preheating or the like is actively performed, since the amount of generated heat is large, as shown in FIG. 40 (a), there is also an example in which a heat radiation fin 603 is provided around the stage 600 to dissipate heat. is there.

In the case of multi-pin inner bonding (200 pins or more), although preheating is effective, it is required that the positioning accuracy between the leads and the bumps be extremely high, so this heat dissipation structure is particularly important.

In the present embodiment, in view of the above points, in order to more effectively dissipate heat, as shown in FIG. 40 (b), the stage 600 has a hollow structure and a water cooling water channel 604 is provided to make it water-cooled. . By adopting this structure,
As a matter of course, the preheating temperature can be increased more than before, and preheating up to 300 ° C. can be performed without increasing the temperature of the XY-θ table.

FIG. 4 shows a conventional bonding tool 700.
As shown in FIG. 1A, the bonding surface has a structure in which a sintered diamond 710 is attached to the bonding surface in order to make the temperature uniform in the bonding surface and to minimize the adhesion of oxides such as Sn plating on the leads. . However, sintered diamond 1
0 indicates that Co is used as an auxiliary agent during sintering, so Co is concentrated at the grain boundaries on the sintering surface and remains, and oxides and the like adhere to this, so polishing is required every 10 to 50 ICs It is.

As a result of the analysis, it was found that this Co became a nucleus and that SnO ₂ mainly adhered. Therefore, in this embodiment, as shown in FIG. 41B, the point that a diamond thin film can be formed by plasma CVD or the like was obtained. Focusing on this, a film 711 of about 15 μm was formed on the bonding surface of the tool 700, and a bonding experiment was performed. As a result, it was found that the adhesion was rare even at about 100 IC and the polishing was extremely easy, and the effectiveness was confirmed.

In FIG. 41, reference numeral 712 denotes a heater hole, and 713 denotes a thermocouple hole.

In the conventional bonding stage, a highly rigid material such as ceramic or stainless steel is used for the stage. Therefore, even if the parallelism between the bonding surface of the tool 700 and the chip is slightly deviated, there is a problem that the bonding failure due to the contact of the tool 700 frequently occurs. This tendency is due to larger chips,
As the number of pins increases, the adjustment before bonding starts
There is also a problem that a great deal of time is required, and a trial run is required, and the bonding yield is reduced. Further, in the conventional bonding method, since bonding is performed with a hard chip, stage, and tool, a very large impact force is generated at the moment when the tool is hit, which may cause damage to the chip.

In the embodiment shown in FIG.
By mounting an elastic body 720 such as Teflon, silicone rubber, or polyimide on the top, slight deviation in parallelism is absorbed and the impact force is effectively absorbed.

In the examples, for simplicity, an experiment was conducted with a structure in which a 125 μm polyimide tape was adhered on a ceramic stage. As a result, the adjustment, which conventionally took about 3 hours, was performed in only 30 minutes, the same bonding yield was achieved, and the effect of this embodiment was confirmed. 42A shows a state before bonding, and FIG. 42B shows a state at the time of bonding.

In the conventional stage structure, there is basically no structure for absorbing a deviation in the parallelism between the bonding surface of the tool 700 and the chip 4, and the stage structure is limited to a structure having a mechanical spring structure. This alone is not sufficient for the function of absorbing the deviation in parallelism, and also insufficient for absorbing the impact load during bonding.

In the embodiment shown in FIG. 43, attention is paid to the viscous behavior of a fluid such as air or oil to solve the above-mentioned problem. That is, as shown in FIG.
A damper 730 using a cylinder structure was mounted below the stage 600.

As a result, a slight parallelism shift (-2 μm / chip surface), which poses a practical problem, is absorbed, and the same bonding yield can be obtained even if the conventional parallelism adjustment time is reduced from 3 hours to about 30 minutes. It turned out to be obtained. It was also found that the damage of the chip under the same conditions can be reduced to 1/10 or less of the conventional one.

[0175]

According to the present invention, high-accuracy positioning can be performed, and the precision at the time of positioning can be maintained as it is during bonding, and the yield in the inner bonding step can be improved. In addition, even if there is an error in the height of the bumps, no excessive pressing force or shocking pressure is applied to the leads and bumps, and there is no adhesion failure such as chip breakage, lead breakage, or lead peeling. is there. Furthermore, efficient thermocompression bonding can be performed by, for example, making the temperature distribution of the tool uniform.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a conventional system.

FIG. 3 is an overall schematic view of the apparatus of the present invention.

FIG. 4 is a perspective view of an operation part.

FIG. 5 is a perspective view of a winding of a tape and a spacer and a tensioner portion.

FIG. 6 is an enlarged perspective view of a bonding section.

FIG. 7 is a sectional view of a chip stage.

FIG. 8 is a perspective view of a head unit.

FIG. 9 is an alignment state diagram.

FIG. 10 is a perspective view showing a configuration around a bonding position and a configuration of an alignment detection optical system.

FIG. 11 is a functional block diagram showing an overall configuration of an alignment system.

FIG. 12 is an explanatory diagram of a position correction amount calculation method in the XYθ directions.

FIG. 13 is an explanatory diagram of definitions of a lead position and a chip position in a visual field.

FIG. 14 is an explanatory diagram of definitions of a lead position and a chip position in a visual field.

FIG. 15 is an explanatory diagram of definitions of a lead position and a chip position in a visual field.

FIG. 16 is an explanatory diagram of a lead position detection method.

FIG. 17 is an explanatory diagram of a chip corner position detection method.

FIG. 18 is an explanatory diagram of a bump position detection method.

FIG. 19 is an explanatory diagram of a bump position detection method.

FIG. 20 is a block diagram of an alignment operation flow.

FIG. 21 is an explanatory diagram of a displacement amount checking method.

FIG. 22 is an explanatory diagram of two-field average alignment.

FIG. 23 is an explanatory diagram of a method of returning from the one visual field detection state.

FIG. 24 is an explanatory diagram of a chip stage alignment mark.

FIG. 25 is an explanatory diagram of bonding after lead / bump proximity.

FIG. 26 is a diagram showing a vertical movement mechanism of the bonding tool.

FIG. 27 is a diagram showing a main part of FIG. 26;

FIG. 28 is a circuit block diagram for controlling driving of a tool.

FIG. 29 is an operation flowchart of a tool vertical movement drive mechanism.

FIG. 30 is an operation flowchart of a tool vertical movement drive mechanism.

FIG. 31 is a diagram schematically showing the movement of a tool.

FIG. 32 is a block diagram showing a control calculation method in each mode in FIG. 31;

FIG. 33 is a view for explaining the condition setting of the tool vertical movement mechanism.

FIG. 34 is a flowchart showing an application example of pressurization control.

FIG. 35 is a view showing the behavior of the tool and the bump in FIG. 34;

FIG. 36 is a view showing a shape for heating a bonding tool.

FIG. 37 is a view showing a shape for heating a bonding tool.

FIG. 38 is a view showing a shape for heating a bonding tool.

FIG. 39 is a view showing a shape for heating and cooling the chip stage.

FIG. 40 is a view showing a shape for heating and cooling the chip stage.

FIG. 41 is a view showing the shape of a tool on which a diamond thin film is formed.

FIG. 42 is a view showing a stage structure to which an elastic body is attached.

FIG. 43 is a view showing a stage structure to which a damper is attached.

[Explanation of symbols]

1 ... tape, 2 ... inner lead, 3 ... bump, 4
... IC chip, 5,5a, 5b ... Field of view, 6 ... Chip stage, 7 ... Bonding tool, 8 ... Light source for epi-illumination, 9 ... Mirror, 10 ... Aperture, 11 ... Shutter, 12 ... Mirror, 13 ... Half prism, 14 ...
Objective lens, 16: Light source for oblique illumination, 17: Rotary solenoid, 18: Shutter, 19: Glass fiber, 20: Ring illumination device, 21: Variable aperture, 2
2: Half prism, 23: Mirror, 24: Field lens, 25: Relay lens, 26a, 26b, 2
7a, 27b, 28a, 28b ... Mirror, 29a, 29
b: TV camera, 30a, 30b: detected image of TV camera, 31: image processing unit, 32: lens, 33: mirror, 34: zoom lens, 35: TV camera, 3
Reference numeral 6: XYθ stage, 37: enlarged view of bonding position, 38a, 38b: detection range of enlarged image, 39: bonding position, 40: A / D converter, 41: multi-value memory, 42: binarization circuit, 43 ... Binary memory, 44
... Projection processing circuit, 45 microcomputer, 46 mechanism control unit, 47 detection optical system, 48 switch.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshimitsu Hamada 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside of Hitachi, Ltd. Address Co., Ltd.Production Technology Laboratory, Hitachi, Ltd. (72) Inventor Aizo Kaneda 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture 292 Yoshida-cho, Hitachi, Ltd.Production Technology Laboratory (72) Inventor Hiroyuki Tanaka 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture Hitachi, Ltd.Production Technology Laboratory (72) Inventor Koichi Sugimoto Yokohama, Kanagawa Prefecture 292 Yoshida-cho, Totsuka-ku, Ichiba, Ltd.Production Technology Laboratory, Hitachi, Ltd. (72) Inventor Toshihiko Sakai Kana 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kawasaki Prefecture Inside Hitachi, Ltd.Production Technology Laboratory (72) Inventor Keizo Matsukawa 1450 Kosuimoto, Kodaira-shi, Tokyo Inside Musashi Plant of Hitachi Co., Ltd. (72) Inventor Miita Power 1450, Josuimoto, Kodaira-shi, Tokyo Inside Musashi Plant, Hitachi, Ltd. (56) References JP-A-63-169730 (JP, A) JP-A-63-169731 (JP, A) JP-A-60- 211854 (JP, A) JP-A-55-39687 (JP, A)

Claims (1)

(57) [Claims] A parallelogram-shaped phosphor formed so that lead connection electrodes formed on the surface of a circuit board and leads formed on a carrier face each other, and are symmetrically formed with respect to a center axis of a tool.
Connected to an elastically deformable tool support
Move the tool in the joining direction
A method for manufacturing an electronic circuit component , comprising: pressing a lead connection electrode and joining the lead connection electrode and the lead .