JP2817700B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device in which a tool is pressed to perform pressure bonding or bonding, and more particularly to a pressure mechanism suitable for high quality connection.

[0002]

2. Description of the Related Art TAB inner lead bonding, die bonding, pellet bonding, inner bump bonding using transfer bumps, bump transfer technology for IC chips, inner lead bonding to IC chips, sealing heat reflow soldering, and the like are performed as tools for bonding or bonding with tools. There is a tool press operation in technology.

Conventionally, the apparatus used in these techniques is such that a tool is lowered while a low air pressure is applied to the tool, as in a method for crimping a tape bonder described in Japanese Patent Application Laid-Open No. 53-105972. After the contact, the air pressure is switched to a high pressure to start the bonding, thereby suppressing the impact load on the IC chip during bonding. At this time, the switching of the air pressure is performed in synchronization with the bonding start position by a timing cam provided in the tool driving mechanism.

[0004]

In the above prior art, since the force acting between the tool and the IC chip which is the portion to be pressed is not actually detected, the pressing force can be realized with high accuracy. There is no guarantee whether or not.

In addition, the rising waveform of the pressing force is affected by the tool speed at the start of contact and the repulsion characteristics of the part to be pressed, and there is a problem that reproducibility is low.

For these reasons, a reliable pressurizing operation cannot be realized.

Further, depending on the speed at the start of contact between the two, there is a possibility that an impulsive pressing force is applied transiently,
There is a problem that an adverse effect due to bonding remains on the IC chip.

[0008] Further, since the switching of the air pressure causes the flexibility of setting change to be low, there is a problem that bonding cannot be performed under optimum conditions and a problem that it takes time to change the target component.

For example, in consideration of inner lead bonding in a case where the height of a bump serving as an adhesive portion varies between individual IC chips, when pressing an IC chip having a low bump height, a tool may be used via a lead. The air pressure was switched to a high pressure before contacting the bumps, and there was a high possibility that the tool would apply impact pressure to the leads and bumps. As a result, stress concentration occurs on the leads and bumps,
There is a problem that a so-called bonding damage such as a crack in a lower layer portion of a bump peeling bump easily occurs.

[0010] Further, in such a batch bonding, it is inevitable that a pressing force is applied to only a small number of bumps at the start of pressurization due to variations in bump height due to bump formation accuracy. . In the above prior art, the air is switched in two stages so that a large number of bumps can be contacted at a low pressure. Since the applied pressure increases, the pressure change at the time of switching from low pressure to high pressure also becomes large. As a result, the above-mentioned bonding damage is also likely to occur.

An object of the present invention is to prevent a plurality of electrode portions of an IC chip and a portion to be joined to the IC chip from generating a transient impact pressure, thereby leaving damage to a pressurized object. It is an object of the present invention to provide a method of manufacturing an electronic circuit component which realizes a pressureless operation.

[0012]

[0013]

[0014]

An object of the present invention is to make a plurality of electrode portions of an IC chip face a portion to be joined to be joined to the IC chip and to be movable with respect to the electrode portion and the portion to be joined. By the tool, the tool is approached in the direction of the electrode portion from above the portion to be joined, and when the tool comes into contact with the portion to be joined, the moving speed contacts at an extremely low speed, and the tool is brought into contact with the portion to be joined. The force applied to the IC chip is measured by a force sensor, the tool is moved and controlled until the applied pressure reaches a set pressure value, and the electrode part of the IC chip and the part to be joined to the IC chip are joined together. This is achieved by:

[0015]

Here, the detection of the reaction force can be achieved by electrically detecting the amount of deflection of a member that undergoes elastic deformation by the reaction force using a strain gauge. Alternatively, electrical detection may be performed similarly using a load cell.

The control device controls the driving of the tool driving unit so that the reaction force detected in this way has a predetermined desired temporal behavior and a desired steady pressure. The tool drive control at that time may follow any form of position servo, speed servo, and driving force servo. There are two points, that is, appropriate setting of parameters in each servo and a feedback term of the reaction force detection value. Desirable reaction force control can be realized only by taking care of it.

The signal of the reaction force detected in real time is taken into the control device. An automatic calculation is performed in the control device, and the operation of the tool driving unit necessary for setting the reaction force to a desired value including the transient state is calculated in real time. This calculation result is transmitted to the tool drive unit as a command signal value, and the tool drive unit drives the tool in a state corresponding to the command signal value. That is, for position servo, the position is changed according to the command signal value, for speed servo, the speed is changed according to the command signal value, and for driving force servo, the driving force is changed according to the command signal value. Is changed.

By doing so, appropriate tool driving is performed without time delay in accordance with the reaction force value at each time point and the past history of the reaction force value. Can be set with high accuracy.

If the time required for the automatic calculation cannot be neglected, an automatic calculation method taking into account this time delay is adopted, and the actual applied pressure during pressurization is similarly increased including the transient behavior. Can be set to accuracy.

The above control device has a storage element therein,
By providing the input means, it is possible to arbitrarily set and change the pressurizing operation parameters such as the pressurizing force, the pressurizing rise speed, and the contact speed of the tool, so that the setting of the above parameters can be made flexible. ing.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below in detail. However, for convenience of explanation, the description will be made assuming TAB inner lead bonding.

FIG. 1 shows an example of a pressing mechanism according to the present invention. (A) shows a front view and (b) shows a side view. A tool stage 127 slidably mounted in the Y direction with respect to the tool table base 124 is driven by a servomotor 128, a servomotor 131 is fixed on the tool stage 127, and a link mechanism is provided via a speed reducer 134. The configuration is such that the angle of the input link 136a of the 136 can be changed. The output link 136c of the link mechanism is held movably up and down along the slide guide mechanisms 139 and 140, and the head base 138 and the tool 7 coupled to the output link 136c can move up and down.

A notch 138a is formed in the head base 138.
When the tool 7 presses the IC chip 4, the notch portion is elastically deformed as shown in FIG. 2, and the load cell 151 held on the upper surface of the head base is pressed against a set screw. By detecting the generated distortion signal from the load cell, the total pressure applied by the tool 7 to the IC chip 4 can be detected at any time. Thus, by the detection method without the sliding portion, the pressing force can be detected without including an error caused by the eyelash. However, because the elastic force of the notch balances a part of the pressing force of the tool, the pressing operation is performed with a known pressing force in advance, and the calibration is not performed by measuring the distortion signal of the load cell at that time. Then, the actual load applied to the IC chip cannot be set accurately.

The tool is driven by a pulse encoder 28 coaxially arranged with the servomotors 128 and 131.
And 31 are input to a pressurizing mechanism control device (not shown) to obtain the rotation angle of the servo motor, to obtain the position of the tool in the front-rear direction (Y direction) and the vertical direction (Z direction). This is performed by calculating a target current value to be output to the servomotor based on the calculated value. Further, from the position where the tool can come into contact with the IC chip, the above-mentioned pressure detection is also performed simultaneously in parallel, and the above calculation is performed based on both the position of the tool and the detected pressure value.

FIG. 3 is an example of a control block diagram of a bonding apparatus using the pressing mechanism described above. In the figure, a main controller 41 for managing the entire apparatus transmits a bonding command 52 to a pressure mechanism controller 42 at the same time as the completion of the alignment of the connection target components. A tool driving algorithm 43 is provided inside the pressurizing mechanism controller 42.
Is being processed. The tool driving algorithm 43 detects a reaction force received when the tool 47 comes into contact with the IC chip 4 by the load cell 151, and detects this by the amplifier 5.
The servo motor 131 that drives the tool is controlled based on the detection value received via the 0, A / D converter 51.
The pulse encoder 31 is attached to the servomotor 131, and the pulse is processed by the counter 47 to obtain information on the position and speed of the tool. The tool is driven by the power amplifier 44 maintaining the motor current 45 at a predetermined value according to the current target value.

The detection of the reaction force of the tool pressing force, the detection of the tool position and the speed, and the calculation of the output to the tool drive motor are all performed at regular time intervals by a timer provided in the pressurizing mechanism controller 42. Activation is performed and operations are performed to make dynamic pressurization desirable.

The operation of the pressurizing mechanism controller 42 comprises the following four steps.

(1) Bring the tool closer to the IC chip at high speed.

(2) The tool is brought into contact with the IC chip at a predetermined speed.

(3) The pressure is raised so as to follow a predetermined time waveform, and pressure is applied for a predetermined time.

(4) The tool is retracted and the result of pressurization is sent back 53 to the main controller 41.

FIG. 4 shows the movement of the tool with the Y coordinate and the Z coordinate appropriately determined. In the figure, (corresponding to O～T _y of Y-coordinate) back-and-forth movement of the tool, the limitation of the obstacle 54, it is necessary to perform at Z = 0 around. The obstacle is, for example, the tape guide 119 (see FIG. 13). Az is IC
The Z coordinate of the point where the tool and the IC chip are definitely not in contact above the chip, and this value is determined by the designer or the operator as described later. C _z and B _z are the Z coordinates of the point at which the contact was detected and the point at which the applied pressure reached the set value during the previous bonding (hereinafter referred to as the contact point and the pressure point, respectively). 300μm information of the above A _z is for example C _z,
Alternatively, it is determined to be 500 μm above B _z . Since towards C _z is within this both sensitive to noise than the detection of B _z, in the latter case, the effect of determined stably and A _z. However, how much distance is required as a margin is a problem on the side of the IC chip to be pressurized, and the apparatus can change the setting of the margin as needed even during operation.

Hereinafter, (1) to (4) according to FIGS.
Each step of (4) will be described.

First, (0, Zo) → (0, 0) → (T
( _y , 0) → (T _y , A _z ) corresponds to (1). Here, the control calculation according to the block diagram shown in FIG. 5A is repeated at regular time intervals. Here, 55 corresponds to FIG.
Is a block showing characteristics obtained by integrating the power amplifier 44, the servo motor 131, and the pulse encoder 31 in FIG. Reference numeral 56 denotes a difference element for obtaining a difference between two terms before and after the time-series signal, 57 denotes a sample-and-hold element, and Z denotes a Z conversion factor. Also, θ and θ
_r is a general expression of the Y-axis or Z-axis motor rotation angle and its command value.

Here, (0, Zo) → (0,0) in FIG.
And (T _y , 0) → (T _y , A _z )
Figure 5 a theta _r of the Z-axis motor in (a) the rotation angle command theta _zr
By replacing θ with the rotation angle θ _z of the Z-axis motor, the output time series m _z (K) (K = 1, 2,...) To the motor system corresponding to the servo motor 131 is obtained as follows. I just need.

[0037]

_{M z} (K) = K _pz (θ _zr (K) −θ _z (K)) − K _vz (θ
_z (K) −θ _z (K−1)) Here, θ _zr (K) is not a constant value, and a value obtained by interpolating between the given initial position and target position is taken every moment. on the other hand,
In the movement from (0, 0) to (T _y , 0) in FIG. 4, a command for the Y axis is required instead of the Z axis.

[0038]

[Number 2] _{m y (K) = K py} (θ yr (K) -θ y (K)) - K
_vy (θ _y (K) −θ _y (K−1)).

It is also conceivable to move along a route indicated by a broken line in the figure. This between (Ty-r, 0) from _{(T y, r), (} T y -r cosφ, r sinφ)
(Where φ: 0 → π / 2). In this case, [Equation 1] and [Equation 2] are simultaneously calculated and mz
(K) and my (K) are output.

By following the broken line, the operating speed naturally increases.

Also, even when following the solid line in the figure, for example, after the target Y coordinate θ _yr reaches T _y , the actual Y coordinate θ _y (K)
There can be approximately shortened path and becomes time as a broken line by omitting the "positioning mode" waiting until T _y.

The constants Kp and Kd in FIG.
Since the step response of the motor system 55 can be determined by a known method by measuring the step response, the description is omitted.

Next, (T _y , A _z ) → (T _y , C
The operation of _z ) will be described. This corresponds to (2) of (1) to (4). Here, the control calculation of the block diagram of FIG. 5B is performed on the servomotor 131 for Z-direction movement. That is, a deviation between a digital speed value υ *, which is a difference between positions output from the motor system 55, and a speed command value Vref set in advance in the control device is integrated in discrete time by an integration element 59, and a constant is added thereto. After multiplying Kvi by virtual speed command, feedback control of this and the digital speed value υ * is performed. The above processing is as follows.

[0044]

(3) {* (K) = θ _z (K) −θ _z (K−1) i (K) = i (K−1) + K vi (Vref − (* (K)); i (0)} 0 m _z (K) = i (K) −Kvv · υ * (K) Kvi and Kvv used here are also represented by K in FIG.
It can be determined similarly to p and Kd.

By performing the integration operation as shown in FIG. 5B, the speed of the tool can be made to exactly coincide with the speed command value, so that the frictional force and gravity existing on the motor shaft and the sliding guide mechanism can be obtained. The tool can be brought into contact with the bump at an extremely low speed by canceling out the influence of the bump.

By the operation described above, the tool is operated at an extremely low speed
At the same time as approaching the C chip, the load cell signal is monitored to detect contact. Normally, since noise is superimposed on the load cell signal, in this embodiment, the influence of noise is removed by the following processing. That is, (i) the instantaneous change threshold ThrN
If there is a larger change, (ii) if the change from the detected value two times before is greater than ThrN, use the previous detected value,
(iii) If the change from the previous detection value is smaller than ThrN, the current detection value is used as it is.

FIG. 6A shows this state. In the figure, the horizontal axis indicates time, and the vertical axis indicates signal level, and the detection signal at each detection point is indicated by a white circle 64. Like points J, L and N,
The detection points that have changed by ThrN or more with respect to the previous and last detection signals are corrected 65 and replaced with the previous detection values. A black circle indicates the correction signal 66. In this case, the conditions (i) and (ii) described above are applied. At the point K, the condition (i) is satisfied, but since the change from the previous time is small, the conditions (i) and (iii) are satisfied, and no correction is performed. In this case, point J becomes isolated noise. Since the change of the point M is smaller than that of the point L, none of the above (i) to (iii) is established and the point M is not corrected. In this case, a sharp signal change (point L)
Is detected once with a delay. The point P has a large change both in the previous time (point N) and two times before, and is corrected to the previous level by (i) and (ii). Also in this case, a signal that keeps changing steeply is detected one time later.

According to this method, it is possible to discriminate between a mere noise and a sudden change of a signal by only a time delay of one detection interval by a simple process using only the detected values of the previous time and the previous two times. This is effective for the accurate detection of a signal containing both.

In addition to the above, a two-step contact threshold is used in the contact detection. This corresponds to FIGS. 6 (b), (c),
As shown in (d), the signal value is the first contact detection threshold value Thr1.
(The contact detection preparation point 68 in the figure) and the state where the contact detection second threshold value Thr2 is exceeded (the contact detection point 6 in the figure).
9) is a process in which contact detection is not determined unless passing through sequentially and continuously. By doing so, even when the contact detection threshold value is easily exceeded due to noise as in the case of (d), it is possible to prevent the pressing force from being generated from the non-contact state caused by the erroneous contact detection and to avoid the shock pressing force.

When the contact is detected by the method described above, the pressing operation of the processing step (3) is performed. This is shown in FIG.
(T _y , C _z ) → (T _y , B _z ). Here, the control calculation in the Z direction is performed in FIG. Where T
_z is the contact reference point of the tool, Kf is the repulsive force characteristic 62 between the tool and the IC chip, and the repulsive force F between the two is

[0051]

## EQU4 ## It is assumed that F = Kf ・ (θ _z -T _z ). This approximation is based on the tool IC
This is almost true if there is no impact contact or high-speed pressing between the chips. FIG. 5 (c) shows that, as compared with FIG. 5 (b), what is given as the control target value is that the point at which the pressing force between the tool and the IC chip is changed from the lowering speed of the tool and the amount that can be returned are the repulsion force and The processing principle and the method of setting constants are the same except for the difference in the two types of speed, so the description is omitted.

However, the pressing force target value Fr is sequentially increased using a value obtained by interpolating the pressing force detection value at the time of contact and the pressing force to be applied during bonding.

After performing the pressurizing operation for a certain period of time as described above, the process moves to the operation (4), evacuation of the tool. Since this is the reverse operation of the tool approach of the operation (1), it can be processed in the same manner, so that the description is omitted.

By the operation and processing described above, high-speed and accurate tool movement and positioning, accurate and reliable low-impact contact and contact detection, and accurate pressing force application are possible. There is an effect that a press operation with high reproducibility and low impact can be achieved. In particular, by switching the driving force calculation formula as shown in FIG. 5, it is possible to perform processing suitable for before and after contact, respectively, which has a remarkable effect on low impact contact.

Further, the target value to be set can be easily changed, and there is a degree of freedom in setting the optimum conditions for bonding. Therefore, the operation according to the target IC chip and the type of lead can be set in a short time, and there is an effect of shortening the setup change time and an effect of improving the quality of bonding.

Next, some alternative modifications will be described.

<Alternative Modification of Pressing Operation> Immediately after contact detection, the process does not proceed to the process of FIG. 5 (c), but descends at a constant speed as it is, while continuing to monitor the reaction force detection value. At the time when the pressing force target value Fref or the vicinity thereof is reached, FIG.
A processing method that shifts to the processing of (c) is also possible.

In this example, there is an effect of eliminating erroneous determination of contact detection and an effect of improving the stability of a rising waveform of the pressing force, which is advantageous for high quality bonding.

<Alternative Modification of Low-Speed Lowering Mode (Equation 4)>
Instead of the operation of [Equation 4] which descends at a low speed and prepares for non-impact contact, a method of performing the operation of the following Expression [5] can be considered.

[0060]

Υ * (K) = θ _z (K) −θ _z (K−1) i (K) = i (K−1) + K _vi (Vref−υ * (K)); i (0) ≡0 m _z (K) = i (K) −K _vv υ * (K) −Kf · F (K) According to this, the contact force is given by −Kf · F (K). When the pressing force is detected, the driving force of the motor system is immediately reduced, so that the peak value of the impact force immediately after the contact can be suppressed.

When the press operation is performed by the above-described tool up / down movement mechanism, the condition setting as shown in FIG. 7 can be realized. First, the rate of increase of the pressing force, that is, the slope in FIG.
It is almost given by Kf · Vref. Therefore, the slope at the rise of the pressing force can be arbitrarily realized by arbitrarily changing the low-speed command value which is a settable parameter.
Also, the pressing force target value Fref can be arbitrarily changed because it can be one variable in the program.

<Application Example to Bump Height Deviation> As an application example of this embodiment, a process in the case where a bump on an IC chip to be bonded has a height deviation will be described. FIG. 8 is a flowchart of an application example, and FIG. 9 shows behaviors of a tool and a bump in the application example.

The tool 7 is initially separated from the IC chip 4 and the leads 2 (400). When a command to start bonding is issued, the control device 42 detects the amount of movement of the tool and holds this as a current value in the memory (40).
2). Subsequently, after substituting the initial pressing force f ₀ into the pressing force set value Fr, the process returns to the repetitive execution of the tool drive control program.

First, the pressing force is detected (406), a servo operation is performed on the pressing force set value fr, and the result is output to the means 44 for changing the driving force of the tool (4).
08). Subsequently the amount of movement of the tool is detected, it is compared with the value x ₀ when the previously detected (410, 412). If the x ₀ and x is equal without any tool is running, pressure setting value fr return to the beginning of the repeated part while keeping to the precise value. This corresponds to either the state in which the tool 7 has not yet contacted the IC chip 4 or the state in which the bump 3 has been crushed with a pressure equal to or less than the initial pressure f ₀ .

If x ₀ is equal to x and the tool does not move, the pressure setting fr is increased by the increment Δf, and the process returns to the beginning of the repeated portion (414, 416). This corresponds to a state in which both are balanced while the tool 7 presses the bump 3.

After repeating this process until the pressing force set value fr becomes larger than the predetermined bonding startable pressing force Fc, the bonding operation is performed with the predetermined bonding load Fd set as the pressing force set value (41).
8) Then, the tool is retracted to complete the bonding (420, 422).

At this time, the value of Fc is experimentally determined on condition that a sufficiently large number of bumps come into contact with the tool. FIG. 9 illustrates a change in the contact state between the tool 7 and the bumps 3a and 3b corresponding to the progress of the above algorithm. Here, for ease of understanding, the illustrated bumps 3 are the bumps 3a that come into contact with the tool 7 the earliest.
Even before the pressure setting value fr becomes larger than Fc, only the two bumps, that is, the bump 3b that has come into contact with the tool 7 at the latest.

FIG. 7A shows a state in which the tool 7 does not come into contact with any of the bumps 3 and is lowered with the initial pressing force fo as a set value. (B) shows a state in which the tool 7 comes into contact with the bump 3 and is balanced by the pressing force fo. (C) is a state in which the tool 7 is descending while crushing the bump 3a while gradually increasing the pressing force. At this time, the pressing force takes a minimum value necessary for continuing to crush the bump 3a. No excessive pressure is applied to the bump 3a. (D) shows that the tool 7 descends further, and the bump 3
This is the state immediately before b contacts the tool 7. At this time, a predetermined number of bumps 3 including the bumps 3a are applied to the pressing force Fc.
It is considered that the object was crushed by -Δf. (E)
Indicates that the bump 3b comes into contact with the tool 7 and the pressure setting value is Fc
In this state, normal bonding is performed from this state with the bonding load set to a predetermined value Fb.

According to this application example, even when there is an error in the height of the bump 3 for each IC chip 4, the impact load change at the time of contact between the tool 7 and the bump 3 is within a predetermined initial pressing force. There is an effect that can be suppressed. In addition, there is an effect that an excessive pressurizing force on a small number of bumps 3a in the initial stage of bonding is avoided, which contributes to a reduction in bonding damage.

Next, TAB using the pressurizing mechanism according to the present invention
The inner bonding apparatus will be described.

FIG. 10 is a schematic view of a TAB inner bonding apparatus according to the present invention.

An optical system base 102 is mounted on an upper surface 101 of the base 100, and an optical system plate 104 is fixed on the upper surface 103. The inner leads 2 and I on the tape 1 are attached to the optical system plate 104 and the tip 105 thereof.
An optical system and an imaging system for alignment with the bumps 3 on the C chip 4 are arranged (see FIG. 11). 18
A reel plate 4 is fixed to the upper surface 101 of the base and holds a reel 187.

FIG. 11 is an enlarged explanatory view of the vicinity of the portion to be pressed, in which a number of inner leads 2 formed on the tape 1 are
The purpose of the work is to connect to the same number of bumps 3 formed on the C chip 4. At this time, in order to align the IC chip 4 with the tape 1, the IC chip 4 is placed on a chip stage 6 fixed on an XYθ stage 36 which can be translated and rotated in a horizontal plane. The connection is performed by aligning the plurality of inner leads 2 and the corresponding bumps 3, and then lowering and contacting and pressing the tool 7.

FIG. 12 is an explanatory view of the main mechanism of the above device. The main mechanism is roughly divided into the following four parts.

(1) Tool Driving Mechanism As shown in FIGS. 12 and 13, reference numeral 124 denotes a tool table base, on which a tool stage 127 is mounted via a pair of slide guides 125 and 126.
28 is a motor shaft 128a, a ball screw 129, a nut 1
30 and is attached to the tool stage 127 through rotation of the motor stage 128 by rotating the motor 128.
7 can be slid in the directions of arrows B and C.

The motor 131 is mounted on the tool stage 127, and is connected to the motor shaft 132, the coupling 133, the speed reducer 134, and the ring 136 connected by the pin 135.
It is connected to a vertical slide plate 138 via 137. The vertical slide plate 138 is the tool stage 1
27, a pair of sliding guide mechanisms 139, 140
By rotating the motor 131, the vertical sliding plate 138 can slide in the directions of arrows D and E.

As shown in FIG. 14, the upper and lower sliding plates 1
38, a pitching plate 143 for holding the thermocompression bonding tool 7 and adjusting the inclination of the lower surface 7a of the bonding tool 7;
4, a groove for holding the shaft portion 7 b of the bonding tool 7, a head 147 constituted by a holding plate 146, and a head 1
47 and a pair of slide guides 148 and 149 for holding the slide guide 47 in a vertically slidable state, and a head base 1 for mounting the slide guides
50 are attached. 151 is a load cell,
The head base 150 is attached to a gap between the upper portion 152 of the head base 150 and the upper surface 153 of the head 147, and the lower surface 7a of the bonding tool 7 comes into contact with the IC chip 4 and the inner lead 2 on the chip stage 6, so that the head 147 Stops, slides via the slide guides 148 and 149, the load cell 151 is compressed, and the bonding load can be detected.

The bonding tool 7 has a heater 154
Hole 155 for attaching the thermocouple 156
7 are provided, each of which is attached by a fixing screw 158, and maintained at a predetermined temperature by a temperature control unit (not shown). Unlike the load detection mechanism of FIG. 2, the load detection mechanism of this embodiment detects sliding displacement with a load cell. For this reason, the hysteresis corresponding to the frictional force remains as an error, but the load is applied directly to the load cell at the time of pressurization, so that there is an advantage that calibration is not required.

(2) Optical system and imaging system (FIGS. 12 and 13)
Reference numeral 8 denotes an epi-illumination light source, and the light emitted therefrom is projected on the inner lead 2 on the tape 1 via a mirror 9, a shutter (not shown), a mirror 12, a half prism 13, and an objective lens 14. Is done. Similarly, the light from the oblique illumination light source 16 drives a rotary solenoid (not shown) and opens the shutter 18 to be emitted to the IC chip 4 via the glass fiber 19 and the ring illumination device 20. The reflected light is the objective lens 14, the half prism 13, the mirror 2
3. Field lens, relay lens 25, mirror 26
Through b, images of the two corners are captured by the TV camera 29b and the TV camera 29a, respectively.

(3) Tape drive mechanism (see FIG. 12) Reference numeral 184 denotes a reel plate, on which a feed motor 185 is mounted, and a square shaft 189 for fitting a square hole of the reel 187 to the motor shaft. A fixed roller 192 is rotatably held on the reel plate 184.

A tension roller 194 has a tension roller shaft fixed via a slide guide 195 mounted on the reel plate 184, and is held rotatably via a bearing (not shown).

Reference numeral 197 denotes a spacer which is wound around the reel 187 together with the tape 1. Reference numeral 198 denotes a fixed roller for the spacer, which is rotatably held on the reel plate 184 via a bearing (not shown). 2
Reference numeral 00 denotes a tension roller, and a reel plate 184.
The tension roller shaft is fixed via a slide guide 201 attached to the shaft and held rotatably via a bearing (not shown). Reel plate 18
4, a winding motor, a reel, a tension roller, and a fixed roller are disposed symmetrically to the tape drive mechanism.

A pair of limit switches (not shown) for detecting the position of the tension roller 194 are attached to the reel plate 184, and operate by contacting a slide portion 195 a of a slide guide 195. Then, the winding motor is driven to move the tape in the direction of arrow G.

Reference numeral 110 denotes a pulse motor, which includes a pair of timing pulleys 111 and 112 and a timing belt 11.
3, a driving sprocket 115 attached to the sprocket base 114 and held in a rotatable state.
Is driven, and the sprocket hole 1 provided in the tape 1
The tape is conveyed in the direction of arrow A by a fixed pitch via b.

On the other side of the sprocket base 114, an idle sprocket 117 is held in a rotatable state. Sprocket base 114 is XYZ table 1
18 and a pulse motor drive stage 118
a, 118b, and 118c, and can move the sprocket base 114 back and forth, left and right, and up and down.
The tape guide 1 is located at the center of the sprocket base 114.
The tape 1 is positioned at a position where the center of the tape hole 1a of the tape 1 and the center of the bonding hole 121 provided in the tape guide 119 coincide with the optical axis 106.
And the lower surface of the tape guide 119 is processed into an arc shape, and the tape 1 can be brought into close contact with the lower surface by applying an appropriate tension.

(4) IC chip supply mechanism (see FIG. 12) 36 is mounted on the upper surface 102 of the base 100, and is a pulse motor drive stage 36 which moves back and forth and right and left in a horizontal plane.
a, 36b, and a swivel table 36c, on which the lower surface 4b of the IC chip 4 is provided with a vacuum pump (not shown), a solenoid valve 107, and a chip stage 6 at the center 108 of the upper surface of the chip stage. Is held by suction. With the IC chip 4 held, the XY position is set at a position where the turning center of the turning table 36c and the optical axis 106 match.
The drive stages 36a and 36b of the θ stage 36 are operated.

Reference numeral 164 denotes a vacuum suction pad for transferring an IC chip, which is attached to an arm 168. The arm 168 is held by a hand base 170 in a vertically slidable state.
Air cylinder 171 attached to hand base 170
Rod 172 is connected to the arm 168. 16
Reference numerals 7 and 175 denote solenoid valves for air driving the pads and the arms, respectively.

By driving the solenoid valve 175, the suction pad 164 slides up and down via the arm 168.

The hand base 170 is attached to the pulse motor drive stages 176a and 176b of the XY stage 176 that moves back and forth and right and left in the horizontal plane. 178
Denotes a tray base, on which the tray 180 is positioned on the upper surface 179 by a pair of positioning pins, a plurality of concave portions are provided on the upper surface of the tray 180, and the IC chip 4 is positioned and mounted in advance.

In the above configuration, the XY stage 176
After the suction pad 164 is moved onto the tray 180, the suction pad 164 is moved down, the upper surface of the IC chip 4 is vacuum-sucked, the arm is raised again, and the XY stage 176 is driven. The IC chip 4 is mounted on the chip stage 6.

Next, the XYθ stage 36 is driven, and the turning center of the turning table 36c is returned to the position where it coincides with the optical axis 106. At the same time, the pulse motor 110 is rotated to convey the tape 1 at a constant pitch in the direction of the arrow F, so that the center of the tape 1 matches the center of the bonding hole 121 of the tape guide 119.

Next, the optical system and the image pickup system are operated, and the enlarged image of the device hole 1a of the tape 1 and the IC chip 4 is taken into the processing device, and the positional deviation between the tape and the IC chip is obtained by computer processing. Based on this, XYθ
The stage 36 is driven to align the corners 4c and 4d of the IC chip 4 with the reference position.

The above operation is repeated to keep the above-mentioned positional deviation within a predetermined positional deviation.

After the positioning is completed, the operation of the above-described pressurizing mechanism is performed. That is, the motor 128 is driven, and the front and rear sliding plate 127 is moved in the direction of arrow B as shown in FIG. 13 to position the bonding tool 7 at the bonding position 39. Further, by driving the motor 131, the coupling 133, the speed reducer 134, the pin 135,
The head base 150 is lowered in the direction of arrow E via the links 136 and 137 and the vertical sliding plate 138. At this time, the reaction force received by the tool 7 from the IC chip 4 is detected in the load cell 151 via the bonding tool 7 and the head 147. Therefore, this electric signal is taken into the control device, and the reaction force detection value and the motor 131 The tool 7 is brought into contact with the IC chip 4 on the chip stage 6 via the inner lead 2 at a low speed based on a drive state detection value such as a position and a current command value, and a predetermined reaction force is generated. After pressing the bonding tool 7 for a predetermined time, the motor 131 and the motor 128 are driven again to return to the original position. Thus, one IC chip 4 and tape 1
The thermocompression bonding of the upper inner lead 2 is completed. By repeating all the above operations, the inner lead bonding can be performed continuously.

With the above configuration, the pressing force between the tool 7 and the IC chip 4 in bonding can be always detected and controlled, and a highly accurate and highly reliable fully automatic bonding apparatus is realized. With this device, the pressing operation parameters such as the pressing force, the pressing speed, and the contact speed can be easily changed, and the operation according to the type of the target IC chip 4 and the inner lead 2 can be automatically set. There is.

In the above embodiment, the description has been limited to the TAB inner lead bonding apparatus. However, the present invention is applicable to a technique of performing pressure bonding or bonding using a tool, and includes a die bonder, a pellet bonder, and a transfer method. Bump transfer technology in inner lead bonding using bumps,
It can also be applied to inner lead bonding to IC chips, tool pressing operation in tool heating solder reflow technology, and generally to pressure bonding / bonding / adhesion technology by planar pressure, and the effect of achieving high quality bonding can be achieved. is there.

[0097]

As described above, according to the present invention, the actual pressure during pressurization can be set with high accuracy, including the transient behavior. For this reason, the reproducibility in each bonding operation is improved, and a high-quality pressurizing mechanism can be realized, which is effective in improving the reliability and yield in manufacturing semiconductor devices.

Further, according to the present invention, it is possible to give flexibility to the setting of the pressing operation parameters such as the pressing force, the pressing force rising speed, and the contact speed of the tool.

Further, according to the present invention, it is possible to realize a pressurizing operation without leaving any damage to the pressurized object, which is effective in improving reliability and yield in manufacturing semiconductor devices.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a pressing mechanism according to the present invention.

FIG. 2 is an explanatory diagram of a principle of detecting a pressing force.

FIG. 3 is a circuit block diagram of drive control of a tool.

FIG. 4 is a diagram schematically showing the movement of a tool.

FIG. 5 is a block diagram showing a control calculation method in each mode in FIG. 4;

FIG. 6 is an explanatory diagram of a distortion signal detection method.

FIG. 7 is an explanatory diagram of setting conditions of a pressing mechanism.

FIG. 8 is a flowchart in an application example to uneven bump height.

FIG. 9 is a view showing the behavior of the tool and the bump in FIG. 8;

FIG. 10 is an overall conceptual diagram of a TAB device according to the present invention.

FIG. 11 is an enlarged perspective view of a bonding portion.

FIG. 12 is a perspective view of an operation part.

FIG. 13 is a view showing a vertical movement mechanism of the tool.

FIG. 14 is a perspective view showing the structure of a pressing unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Tape, 2 ... Inner lead, 3 ... Bump, 4 ... IC chip, 6 ... Chip stage, 7 ...
Bonding tool, 124: Tool table base, 125, 126: Slide guide, 127: Front and rear sliding plate, 128: Motor, 128a: Motor shaft, 129: Ball screw, 130: Nut, 131
... Motor, 132 ... Motor shaft, 133 ... Coupling, 134 ... Reducer, 135 ... Pin, 136,13
7 Link, 138 Vertical slide plate, 138a
Notch, 139, 140 ... Slide guide, 142
… Front of the upper and lower sliding plates, 143… biting plate, 144… rolling plate, 146… pressing plate,
147: head, 148, 149: slide guide,
150: head base, 151: load cell, 15
2: Upper part of head base, 153: Upper surface of head.

Claims (1)

(57) [Claims] 1. A method in which a plurality of electrode portions of an IC chip and a portion to be joined to be joined to the IC chip are opposed to each other, and the tool is movable with respect to the electrode portion and the portion to be joined. Approaching the tool in the direction of the electrode portion from above, when the tool comes into contact with the portion to be joined, the moving speed contacts at an extremely low speed, and the force applied by the tool to the portion to be joined is detected by a force sensor.
Measure and move the tool until the applied pressure reaches the set pressure value.
A method of manufacturing an electronic circuit component, comprising: performing dynamic control , and integrally bonding an electrode portion of the IC chip and a portion to be bonded to the IC chip.