JP2628915C - - Google Patents
Info
- Publication number
- JP2628915C JP2628915C JP2628915C JP 2628915 C JP2628915 C JP 2628915C JP 2628915 C JP2628915 C JP 2628915C
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing cloth
- dressing
- cloth
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 claims description 110
- 239000004744 fabric Substances 0.000 claims description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 239000007921 spray Substances 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000005296 abrasive Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 12
- 239000002245 particle Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000000969 carrier Substances 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000002093 peripheral Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 241000960387 Torque teno virus Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000000149 penetrating Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000717 retained Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Family
ID=
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