JP2626480B2 - Removal mechanism for satellite-borne equipment - Google Patents

Removal mechanism for satellite-borne equipment

Info

Publication number
JP2626480B2
JP2626480B2 JP5184457A JP18445793A JP2626480B2 JP 2626480 B2 JP2626480 B2 JP 2626480B2 JP 5184457 A JP5184457 A JP 5184457A JP 18445793 A JP18445793 A JP 18445793A JP 2626480 B2 JP2626480 B2 JP 2626480B2
Authority
JP
Japan
Prior art keywords
satellite
lever member
removal
concave groove
mounted device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5184457A
Other languages
Japanese (ja)
Other versions
JPH0710098A (en
Inventor
明秀 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5184457A priority Critical patent/JP2626480B2/en
Publication of JPH0710098A publication Critical patent/JPH0710098A/en
Application granted granted Critical
Publication of JP2626480B2 publication Critical patent/JP2626480B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、人工衛星搭載機器用取
り外し機構に係り、とくに搭載機器の発熱を人工衛星の
構体に放熱するために、サーマル・フィラを搭載機器の
取付面に取り付けて成る機器についての人工衛星搭載機
器用取り外し機構に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a detaching mechanism for a device mounted on a satellite, and more particularly, a thermal filler is attached to a mounting surface of the mounted device in order to radiate heat generated from the mounted device to a structure of the satellite. The present invention relates to a detachment mechanism for a device mounted on a satellite.

【0002】[0002]

【従来の技術】従来の人工衛星の搭載機器は、図4に示
すように機器の内部発熱を放熱するため、衛星構体53
に伝熱する(符号57参照)という手法を採っている。
このため、機器の内部発熱を衛星構体に大きく放熱する
ためには、搭載機器51の取付面と衛星構体53の間に
サーマル・フィラ52(例えば、シリコン系接着剤又は
充てん剤)を塗布して、機器取付面の接触面積を大きく
確保することによって、機器と衛星構体間の熱伝導を大
きくしている。
2. Description of the Related Art As shown in FIG. 4, a conventional satellite-mounted device radiates heat generated inside the device.
(See reference numeral 57).
For this reason, in order to largely radiate the internal heat of the device to the satellite structure, a thermal filler 52 (for example, a silicon-based adhesive or a filler) is applied between the mounting surface of the on-board device 51 and the satellite structure 53. The heat conduction between the equipment and the satellite structure is increased by securing a large contact area of the equipment mounting surface.

【0003】[0003]

【発明が解決しようとする課題】上述したように従来の
人工衛星搭載機器は、機器取付面と衛星構体の間にサー
マル・フィラを塗布されている。このため、機器と衛星
構体がサーマル・フィラを介してぴったり貼り付いてし
まい、機器を衛星構体から取り外す必要性が生じた場
合、取り外しが非常に困難であるという欠点が生じてい
た。
As described above, the conventional satellite-mounted equipment has a thermal filler applied between the equipment mounting surface and the satellite structure. For this reason, the equipment and the satellite structure are stuck together via the thermal filler, and when it becomes necessary to remove the equipment from the satellite structure, there has been a disadvantage that it is very difficult to remove the equipment.

【0004】[0004]

【発明の目的】本発明は、かかる従来例の有する欠点を
改善し、とくに衛星構体からの機器の取り外しを比較的
容易に成し得る人工衛星搭載機器用取り外し機構を提供
することを、その目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a detaching mechanism for a satellite-mounted device capable of remedying the drawbacks of the prior art and, in particular, for relatively easily removing the device from the satellite structure. And

【0005】[0005]

【課題を解決するための手段】本発明では、人工衛星搭
載機器の人工衛星構体との当接面に凹溝を設け、この凹
溝内に、当該凹溝の両端部から所定の長さを突出させて
取り外し用テコ部材を装備する。また、この凹溝を除い
て人工衛星搭載機器と人工衛星構体とをサーマルフィラ
ーで接着すると共に、取り外し用テコ部材を前述した凹
溝内に配置する、という構成をとっている。これによっ
て前述した目的を達成使用とするものである。
According to the present invention, a concave groove is provided on a contact surface of a satellite-mounted device with an artificial satellite structure, and a predetermined length is set in the concave groove from both ends of the concave groove. Equipped with a lever member for removal by protruding. Further, the adhering the artificial satellite equipment and the artificial satellite structure except the concave groove in a thermal filler, concave described above removal for lever member
It is configured to be arranged in the groove . This achieves the purpose described above.

【0006】[0006]

【実施例】以下、本発明の一実施例を図1乃至図3に基
づいて説明する。この図1乃至図3に示す実施例におい
て、人工衛星搭載機器1の人工衛星構体3との当接面に
凹溝5が設けられている。この凹溝5内には、当該凹溝
5の両端部から所定の長さを突出させて、取り外し用テ
コ部材4が装備されている。また、凹溝5部分を除いて
前述した人工衛星搭載機器1と人工衛星構体3とは、サ
ーマルフィラ2で接着されている。更に、取り外し用テ
コ部材4は、凹溝5内に遊挿状態で配置されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. In the embodiment shown in FIGS. 1 to 3, a concave groove 5 is provided on a contact surface of the satellite-mounted device 1 with the satellite structure 3. In the concave groove 5, a lever member 4 for removal is provided so as to project a predetermined length from both ends of the concave groove 5. The above-described artificial satellite mounted device 1 and the artificial satellite structure 3 except for the concave groove 5 are adhered by the thermal filler 2. Further, for removal lever member 4 is arranged in a loosely concave groove 5.

【0007】これを更に詳述する。図1は、人工衛星搭
載機器1が、人工衛星の構体3にサーマル・フィラ2
(例えば、シリコン系接着剤又はシリコン系充てん剤の
薄層物)を介して取り付けられている状態を示す。
This will be described in more detail. FIG. 1 shows that a satellite-mounted device 1 includes a thermal filler 2 on an artificial satellite structure 3.
(For example, the state which attached via the silicone adhesive or the thin layer of a silicone filler) is shown.

【0008】そして、搭載機器1を構体3から取り外す
には、まず、図3(A)に示すように、取り外し用テコ
部材4を図中の符号6の方向に動かす。この時、図2に
示すように、取り外し用テコ部材4と凹溝5の間にクリ
アランスがあるため、取り外し用テコ部材4の一部が
ーマル・フィラ2に当接していても図示の如くその当接
面積が小さいことから、搭載機器1に比べて、サーマル
・フィラ2との密着力が弱く、これがため取り外し用テ
コ部材4は、図3(A)中の符号6の方向に容易に動か
すことが可能となる。
Then, to remove the mounted device 1 from the structure 3, first, as shown in FIG. 3A, the lever member 4 for removal is moved in the direction of reference numeral 6 in the figure. At this time, as shown in FIG. 2, since there is a clearance between the pry lever member 4 and the groove 5, a part of the pry lever member 4 is not in contact with the support <br/> Maru-filler 2 from the fact that the contact <br/> area as shown is small compared to the mounting apparatus 1, the adhesion between the thermal filler 2 is rather weak, it is detached for lever member 4 for the Fig. 3 (a) It can be easily moved in the direction of reference numeral 6 in the figure.

【0009】また、図3(A)に示すように、取り外し
用テコ部材4を図中の符号6の方向に動かし、当該取り
外し用テコ部材4の片端を搭載機器1の中央付近まで移
動する。続いて図3(B)に示すように、取り外し用テ
コ部材4の他端を図中の符号6の方向に持ち上げて
、てこの原理により、容易に搭載機器1を衛星構体3
から取り外すことができる。
Further, as shown in FIG. 3A, the lever member 4 for removal is moved in the direction of reference numeral 6 in the figure, and one end of the lever member 4 for removal is moved to near the center of the mounted device 1. Subsequently, as shown in FIG. 3 (B), or lift the other end of the pry lever member 4 in the direction of reference numeral 6 in FIG.
Et al., Te This principle easily mounted device 1 a satellite structure 3
Can be removed from.

【0010】また、搭載機器1を衛星構体3から取り外
さない場合は、人工衛星のフライト時の重量削減のため
に取り外し用テコ部材4を図3(A)に示す方向にその
まま移動し、搭載機器1の底面より引き抜いてもよい。
Further, if not remove the mounting device 1 from the satellite structure 3, its removal for lever member 4 for weight reduction at the time of the satellite flight direction shown in FIG. 3 (A)
It may be moved as it is and pulled out from the bottom surface of the mounted device 1.

【0011】[0011]

【発明の効果】本発明は以上のように構成され機能する
ので、これによると、取り外し用テコ部材と搭載機器の
凹溝との作用によりサーマル・フィラを取り付けた搭載
機器を衛星の構体から容易に取り外しができるという従
来にない優れた人工衛星搭載機器用取り外し機構を提供
することができる。
Since the present invention is constructed and functions as described above, according to the present invention, the on-board equipment having the thermal filler attached thereto can be easily removed from the satellite structure by the action of the lever member for removal and the groove of the on-board equipment. It is possible to provide an unprecedented excellent detachment mechanism for a device mounted on an artificial satellite that can be detached.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing one embodiment of the present invention.

【図2】図1のA─A線に沿った断面図である。FIG. 2 is a sectional view taken along line AA of FIG. 1;

【図3】図1の動作を示す説明図で、図3(A)は取り
外し用テコ部材を衛星の構体から引き離す状態を示し、
図3(B)は取り外し用テコ部材を使用して搭載機器を
衛星の構体から取り外す状態を示す説明図である。
FIG. 3 is an explanatory view showing the operation of FIG. 1, and FIG. 3 (A) shows a state in which a detachable lever member is separated from a satellite structure;
FIG. 3B is an explanatory view showing a state in which the onboard device is removed from the satellite structure using the leverage member for removal.

【図4】従来例を示す説明図である。FIG. 4 is an explanatory diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

1 人工衛星の搭載機器 2 サーマル・フィラ 3 人工衛星の構体 4 取り外し用テコ部材 5 凹溝 6 取り外し用テコ部材の移動方向 DESCRIPTION OF SYMBOLS 1 Onboard equipment of artificial satellite 2 Thermal filler 3 Structure of artificial satellite 4 Lever member for removal 5 Groove 6 Moving direction of lever member for removal

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 人工衛星構体に固定される人工衛星搭載
機器の前記人工衛星構体との当接面に凹溝を設け、この
凹溝内に、当該凹溝の両端部から所定の長さを突出させ
て取り外し用テコ部材を装備し、前記凹溝を除いて前記
人工衛星搭載機器と前記人工衛星構体とをサーマルフィ
ラーで接着すると共に、前記取り外し用テコ部材を前記
凹溝内に配置したことを特徴とする人工衛星搭載機器用
取り外し機構。
1. A concave groove is provided on an abutment surface of a satellite-mounted device fixed to an artificial satellite structure with the artificial satellite structure, and a predetermined length is set in the concave groove from both ends of the concave groove. Equipped with a lever member for removal by protruding, excluding the groove, bonding the satellite-mounted device and the satellite structure with a thermal filler, and disposing the lever member for removal in the groove. artificial satellite onboard equipment for the removal mechanism you said.
JP5184457A 1993-06-29 1993-06-29 Removal mechanism for satellite-borne equipment Expired - Lifetime JP2626480B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5184457A JP2626480B2 (en) 1993-06-29 1993-06-29 Removal mechanism for satellite-borne equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5184457A JP2626480B2 (en) 1993-06-29 1993-06-29 Removal mechanism for satellite-borne equipment

Publications (2)

Publication Number Publication Date
JPH0710098A JPH0710098A (en) 1995-01-13
JP2626480B2 true JP2626480B2 (en) 1997-07-02

Family

ID=16153490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5184457A Expired - Lifetime JP2626480B2 (en) 1993-06-29 1993-06-29 Removal mechanism for satellite-borne equipment

Country Status (1)

Country Link
JP (1) JP2626480B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483225B2 (en) * 1995-03-22 2004-01-06 株式会社小松製作所 Tunnel excavator

Also Published As

Publication number Publication date
JPH0710098A (en) 1995-01-13

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A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970218