JPH0710098A - Removing mechanism for artificial satellite mounting equipment - Google Patents

Abstract

PURPOSE:To provide a removing mechanism for artificial satellite mounting equipment where the equipment can be removed from a satellite body in a relatively easy manner. CONSTITUTION:A recessed groove 5 is provided in the abutting surface of artificial satellite mounting equipment 1 and an artificial satellite body 3. A lever member 4 for removing use where the parts of the specified length are projecting from each end part of the recessed groove 5 is mounted in this recessed groove 5. The artificial satellite mounting equipment 1 and the artificial satellite body 3 are adhered to each other with the thermal filler 2 except the recessed groove 5 part. In addition, a part of the lever member 4 for removing use is adhered and fixed to the artificial satellite 3. This lever member 4 for removing use is arranged in the recessed groove 5 in a freely inserted manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanism for removing a device mounted on a satellite, and in particular, a thermal filler is attached to a mounting surface of the device mounted on the mounting device in order to dissipate heat generated by the device mounted on the body of the satellite. The present invention relates to a device removal mechanism for a device mounted on a satellite.

[0002]

2. Description of the Related Art A conventional satellite-mounted device dissipates the internal heat of the device as shown in FIG.
The method of transferring heat to the (see reference numeral 57) is adopted.
Therefore, in order to largely radiate the internal heat generation of the device to the satellite structure, a thermal filler 52 (for example, a silicon adhesive or a filler) is applied between the mounting surface of the onboard device 51 and the satellite structure 53. By ensuring a large contact area on the equipment mounting surface, heat conduction between the equipment and the satellite structure is increased.

[0003]

As described above, in the conventional artificial satellite-mounted device, the thermal filler is applied between the device mounting surface and the satellite structure. Therefore, if the device and the satellite structure are stuck to each other via the thermal filler, and it becomes necessary to remove the device from the satellite structure, it is very difficult to remove the device.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a mechanism for removing a device mounted on an artificial satellite, which is capable of remedying the drawbacks of the conventional example, and particularly capable of relatively easily removing the device from the satellite structure. And

[0005]

According to the present invention, a concave groove is provided on a contact surface of an artificial satellite-mounted device with an artificial satellite structure, and a predetermined length from both ends of the concave groove is provided in the concave groove. Equipped with a lever for removal by protruding. In addition, a structure is adopted in which the equipment mounted on the artificial satellite and the artificial satellite structure are bonded together with a thermal filler except for the groove, and at the same time, a part of the lever member for removal is bonded and fixed to the artificial satellite structure at the same time. In this way, the above-mentioned purpose is achieved and used.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In the embodiment shown in FIGS. 1 to 3, a groove 5 is provided on the contact surface of the artificial satellite-mounted device 1 with the artificial satellite structure 3. In the concave groove 5, a lever member 4 for removal is provided by projecting a predetermined length from both ends of the concave groove 5. The artificial satellite-mounted device 1 and the artificial satellite structure 3 described above, except for the groove 5, are bonded by a thermal filler 2. Furthermore, a part of the lever member 4 for removal is adhered and fixed to the artificial satellite structure 3. The lever member 4 for removal is arranged in the groove 5 in a loosely inserted state.

This will be described in more detail. In Fig. 1, the satellite-equipped device 1 has a thermal filler 2 on the structure 3 of the satellite.
(For example, a thin layer of a silicon adhesive or a silicon filler) is attached.

To remove the mounted device 1 from the structure 3, first, as shown in FIG. 3A, the lever lever 4 for removal is moved in the direction of reference numeral 6 in the figure. At this time, as shown in FIG. 2, since there is a clearance between the detaching lever member 4 and the concave groove 5 and the contact area between the detaching lever member 4 and the thermal filler 2 is small, the mounted device 1
Compared with, the adhesion with the thermal filler 2 is weaker,
The lever member 4 for removal can be easily moved in the direction of reference numeral 6 in FIG.

Further, as shown in FIG. 3A, the removing lever member 4 is moved in the direction of reference numeral 6 in the figure, and one end of the removing lever member 4 is moved to near the center of the mounted device 1. Subsequently, as shown in FIG. 3 (B), the other end of the lever member 4 for removal is lifted in the direction of reference numeral 6 in the figure, and the onboard equipment 1 can be easily removed from the satellite structure 3 by the principle of leverage. it can.

If the onboard device 1 is not removed from the satellite structure 3, the lever member 4 for removal is moved as shown in FIG. It may be pulled out from the bottom of the.

[0011]

Since the present invention is constructed and functions as described above, according to this, the onboard equipment having the thermal filler attached can be easily installed from the satellite body structure by the action of the lever member for removal and the groove of the onboard equipment. It is possible to provide an unprecedented excellent detachment mechanism for a device mounted on an artificial satellite that can be detached.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is an explanatory view showing the operation of FIG. 1, and FIG. 3 (A) shows a state in which the detaching lever member is separated from the satellite structure;
FIG. 3B is an explanatory diagram showing a state in which the on-board equipment is removed from the satellite structure using the removal lever member.

FIG. 4 is an explanatory diagram showing a conventional example.

[Explanation of symbols]

 1 Satellite mounted equipment 2 Thermal filler 3 Artificial satellite structure 4 Lever member for removal 5 Groove 6 Direction of movement of lever member for removal

Claims (2)

[Claims] 1. A concave groove is provided on a contact surface of an artificial satellite mounted device fixed to the artificial satellite structure with the artificial satellite structure, and a predetermined length is provided from both ends of the concave groove in the concave groove. Equipped with a lever member for removal so as to protrude, the artificial satellite mounting device and the artificial satellite structure are bonded by a thermal filler except for the concave groove portion, and at the same time, a part of the removable lever member is simultaneously added to the artificial satellite structure. A detachment mechanism for equipment mounted on artificial satellites, characterized in that it is adhered and fixed to the. 2. The lever member for removal is arranged in the groove in a loosely inserted state.
Detachment mechanism for the equipment onboard the satellite.