JPH0257343B2 - - Google Patents
Info
- Publication number
- JPH0257343B2 JPH0257343B2 JP17476886A JP17476886A JPH0257343B2 JP H0257343 B2 JPH0257343 B2 JP H0257343B2 JP 17476886 A JP17476886 A JP 17476886A JP 17476886 A JP17476886 A JP 17476886A JP H0257343 B2 JPH0257343 B2 JP H0257343B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- frame
- release plate
- hollow hole
- remaining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Dicing (AREA)
Description
【発明の詳細な説明】
〔概要〕
フレームに接着テープを貼付する際に、接着テ
ープとフレームの間に剥離板を介在さて、剥離板
の中空孔内で接着テープをフレームに貼付し、接
着テープを剥離板の中空孔の周囲に沿つて切り抜
いた際に、後に残つた接着テープがフレームに強
く貼付されて剥離し難くなるのを防止する接着テ
ープのフレームへの貼付方法。[Detailed Description of the Invention] [Summary] When applying an adhesive tape to a frame, a release plate is interposed between the adhesive tape and the frame.Then, the adhesive tape is applied to the frame within the hollow hole of the release plate, and the adhesive tape is removed. A method for attaching adhesive tape to a frame, which prevents the adhesive tape left behind from being strongly attached to the frame and becoming difficult to peel off when the adhesive tape is cut out along the circumference of a hollow hole in a release plate.
本発明は、半導体ウエーハを半導体チツプに切
断加工するダイサに搭載するフレームに、半導体
チツプを接着テープを介して固定するため、連続
した接着テープを貼付して切り抜き、周囲の残余
の接着テープを巻き取つてゆく方法に関するもの
である。
In order to fix semiconductor chips via adhesive tape to a frame mounted on a dicer that cuts semiconductor wafers into semiconductor chips, the present invention applies a continuous adhesive tape, cuts it out, and wraps the remaining adhesive tape around it. It's about how to go about it.
連続した接着テープをフレームに貼付した際
に、フレーム上に貼付して切り抜いた部分を除く
周囲の残余の接着テープがフレーム上に貼付され
て残る。この周囲に残つた接着テープがフレーム
に強く貼付されていると、フレームを接着テープ
から取り外す時に非常に剥がし難くなり、残つた
接着テープを巻きとつてゆく際に接着テープが変
形したり破れてしまうこともあるので、接着テー
プがフレームの周囲に貼付されない方法が要求さ
れている。 When the continuous adhesive tape is applied to the frame, the remaining adhesive tape around the area excluding the cut-out portion applied to the frame remains attached to the frame. If the adhesive tape remaining around this area is strongly attached to the frame, it will be very difficult to remove when removing the frame from the adhesive tape, and the adhesive tape may be deformed or torn when the remaining adhesive tape is rolled up. Therefore, there is a need for a method in which adhesive tape is not applied around the frame.
従来は第３図に示すように、フレーム１を接着
テープの下に直接置き、貼り付けローラＢ５を往
復させて接着テープ２とフレーム１を互いに密着
させて、接着テープをフレーム１に貼付してい
る。
Conventionally, as shown in Fig. 3, the frame 1 is placed directly under the adhesive tape, and the adhesive tape 2 and frame 1 are brought into close contact with each other by reciprocating the adhesive roller B5, and the adhesive tape is applied to the frame 1. There is.
次にフレーム１の中空孔１ａの周囲に沿つて、
接着テープ２の切り抜き線２ａで図示しないカツ
タを用いて接着テープを切り抜き、切り抜いた接
着テープ２が貼付されたフレーム１を、フレーム
１の周囲に強く貼付されている接着テープ２から
剥がして取り出す。 Next, along the periphery of the hollow hole 1a of the frame 1,
The adhesive tape is cut out using a cutter (not shown) along a cutout line 2a of the adhesive tape 2, and the frame 1 to which the cut out adhesive tape 2 is attached is peeled off from the adhesive tape 2 strongly attached to the periphery of the frame 1 and taken out.
その後、この残つた接着テープ２を巻き取り、
再び次のフレーム１を接着テープ２の下に置いて
作業を連続して行なつている。 After that, wind up this remaining adhesive tape 2,
The next frame 1 is again placed under the adhesive tape 2 and the work is continued.
〔発明が解決しようとする問題点〕
以上説明の従来の接着テープの貼付方法で問題
となるのは、必要な部分の接着テープを切り抜き
線２ａで切り抜いた残りの周囲の接着テープが、
フレームの周囲に強く貼付されており、フレーム
を取り出して作業を連続して行なうためには、毎
回この接着テープをフレームの周辺部から剥がし
て接着テープを巻き取らねばならないことであ
る。もし残つた接着テープが破れるようなことに
なると、接着テープを巻き取れなくなり以後の作
業の大きな障害となる。[Problems to be Solved by the Invention] The problem with the conventional adhesive tape application method described above is that when the required portion of the adhesive tape is cut out along the cutout line 2a, the remaining surrounding adhesive tape is
The adhesive tape is strongly attached to the periphery of the frame, and in order to take out the frame and continue working, the adhesive tape must be peeled off from the periphery of the frame and rolled up each time. If the remaining adhesive tape were torn, it would be impossible to unwind the adhesive tape and this would be a major hindrance to subsequent work.
上記問題点は、接着テープとフレームの間に、
表面にシリコンゴムを接着するか或いはシリコン
ゴムを焼きつけた剥離板を介在させて作業を行な
うことにより解決する。
The above problem is that between the adhesive tape and the frame,
This can be solved by adhering silicone rubber to the surface or interposing a release plate with silicone rubber baked on it.
即ち本発明においては、接着テープとフレーム
の間に、シリコンゴム接着するか或いはシリコン
ゴムを焼きつけた剥離板を介在させ、必要な部分
の接着テープを剥離板の中空孔の周囲に沿つて切
り抜き線で切り抜くが、剥離板がステンレスの薄
板なので切り抜き作業には支障はなく、周囲に残
つた接着テープは直接フレームに接触せず、残つ
た接着テープの下には剥離板があるので容易に剥
がすことができ、残つた接着テープの巻き取りを
円滑に行なうことが可能となる。
That is, in the present invention, a release plate bonded with silicone rubber or baked with silicone rubber is interposed between the adhesive tape and the frame, and a necessary portion of the adhesive tape is cut out along the periphery of the hollow hole in the release plate. However, since the peeling plate is a thin stainless steel plate, there is no problem with the cutting process, and the adhesive tape remaining around the frame does not come into direct contact with the frame, and the peeling plate is underneath the remaining adhesive tape, so it can be easily peeled off. This makes it possible to smoothly wind up the remaining adhesive tape.
以下第１図〜第２図について本発明の一実施例
を説明する。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
図において、ステンレス製のフレーム１の上
に、シリコンゴムを接着したステンレス薄板から
なる剥離板３を載せて、接着テープ２、例えば
UVテープの下に置き、表面に毛足の短い弾性の
あるブラシを備えた貼り付けローラＡ４を往復さ
せて、剥離板３の中空孔３ａの内部で接着テープ
２をフレーム１に貼付する。 In the figure, a peeling plate 3 made of a thin stainless steel plate to which silicone rubber is adhered is placed on a stainless steel frame 1, and an adhesive tape 2, for example, is placed on the frame 1 made of stainless steel.
The adhesive tape 2 is pasted on the frame 1 inside the hollow hole 3a of the peeling plate 3 by placing it under the UV tape and reciprocating the pasting roller A4 having an elastic brush with short bristles on its surface.
その後で必要な部分の接着テープ２を剥離板３
の中空孔３ａの周囲に沿つて切り抜き線２ａでカ
ツタにより切り抜く。この際接着２とフレーム１
の間には剥離板３を介在させてあるので、接着テ
ープ２とフレーム１が密着しておらず、接着テー
プ２が貼付されたフレーム１及び剥離板３を共に
容易に接着テープ２の下から取り出すことができ
る。 After that, apply the adhesive tape 2 to the peeling plate 3 in the necessary areas.
Cut out along the circumference of the hollow hole 3a along the cutout line 2a with a cutter. At this time, glue 2 and frame 1
Since the release plate 3 is interposed between them, the adhesive tape 2 and the frame 1 are not in close contact with each other, and both the frame 1 to which the adhesive tape 2 is attached and the release plate 3 can be easily removed from under the adhesive tape 2. It can be taken out.
従つてその後に残つた接着テープ２の巻き取り
が非常に円滑に行われる。 Therefore, the remaining adhesive tape 2 can be wound up very smoothly.
なお、半導体ウエハはこの後、フレーム１の中
空孔１ａの中で接着テープ２に貼付し固定され
る。 Note that the semiconductor wafer is then attached and fixed to the adhesive tape 2 in the hollow hole 1a of the frame 1.
以上説明したように本発明によれば、極めて簡
単な構造の剥離板を、接着テープとフレームとの
間に介在させることにより、接着テープをフレー
ムに容易に貼り付けることができ、その後に残つ
た接着テープの巻き取りを非常に円滑に行なうこ
とが可能となる。
As explained above, according to the present invention, by interposing a release plate with an extremely simple structure between the adhesive tape and the frame, the adhesive tape can be easily attached to the frame, and the adhesive tape can be easily attached to the frame. It becomes possible to wind up the adhesive tape very smoothly.
第１図は本発明による一実施例の接着テープを
貼り付けローラＡでフレームに貼付した状態を示
す側断面図、第２図は本発明による一実施例のフ
レームと剥離板を重ねた平面図、第３図は従来技
術の接着テープを貼り付けローラＢでフレームに
貼付した状態を示す側断面図、である。
図において、１はフレーム、１ａは中空孔、２
は接着テープ、２ａは切り抜き線、３は剥離板、
３ａは中空孔、４は貼り付けローラＡ、５は貼り
付けローラＢ、である。
FIG. 1 is a side cross-sectional view showing a state in which an adhesive tape according to an embodiment of the present invention is pasted on a frame with a pasting roller A, and FIG. 2 is a plan view of an embodiment of the present invention in which a frame and a release plate are overlapped. , and FIG. 3 is a side sectional view showing a state in which a conventional adhesive tape is pasted on a frame by a pasting roller B. In the figure, 1 is a frame, 1a is a hollow hole, 2
is an adhesive tape, 2a is a cutout line, 3 is a release plate,
3a is a hollow hole, 4 is a pasting roller A, and 5 is a pasting roller B.
Claims (1)
接着テープ２と該フレーム１との間に、該接着テ
ープ２とは接着しない剥離板３を介在させて、該
剥離板３の中空孔３ａ内で該接着テープ２を該フ
レーム１に貼付し、該接着テープ２を該剥離板３
の中空孔３ａの周囲に沿つて切り抜き線２ａで切
り抜く、接着テープのフレームへの貼付方法。1 When attaching the adhesive tape 2 to the frame 1, a release plate 3 that does not adhere to the adhesive tape 2 is interposed between the adhesive tape 2 and the frame 1, and the inside of the hollow hole 3a of the release plate 3 is Attach the adhesive tape 2 to the frame 1, and attach the adhesive tape 2 to the release plate 3.
A method for attaching an adhesive tape to a frame by cutting out along a cutout line 2a along the circumference of a hollow hole 3a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61174768A JPS6331971A (en) | 1986-07-24 | 1986-07-24 | Method of applying adhesive tape on frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61174768A JPS6331971A (en) | 1986-07-24 | 1986-07-24 | Method of applying adhesive tape on frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6331971A JPS6331971A (en) | 1988-02-10 |
| JPH0257343B2 true JPH0257343B2 (en) | 1990-12-04 |
Family
ID=15984331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61174768A Granted JPS6331971A (en) | 1986-07-24 | 1986-07-24 | Method of applying adhesive tape on frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331971A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142156A (en) * | 1988-11-22 | 1990-05-31 | Takatori Haitetsuku:Kk | Tape sticking apparatus for wafer tray |
| JP3164654B2 (en) * | 1992-07-27 | 2001-05-08 | 日東電工株式会社 | Adhesive transfer device |
-
1986
- 1986-07-24 JP JP61174768A patent/JPS6331971A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6331971A (en) | 1988-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |