JP2606174B2 - Mounting method of two-story electronic circuit package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method of an electronic circuit package, and more particularly to a mounting method capable of easily performing a test evaluation of a two-story package.

[0002]

2. Description of the Related Art Conventionally, a two-story electronic circuit package has one function by connecting a mother board constituting a first-floor part and a sub-board constituting a two-story part by a connector. In a two-story electronic circuit package, the distance between the front surface of the mother board and the back surface of the sub-board is very narrow, and it is not possible to directly connect a test measuring instrument to the elements on the front surface of the mother board or the back surface of the sub-board. A test was performed by attaching a lead wire to an element requiring connection and extracting the lead, and then connecting a measuring instrument to the end.

[0003]

Conventionally, when a lead wire is drawn from a device on a substrate for testing, there are problems such as unnecessary soldering on the device and noise on the lead wire. When testing the package, the extension package is used to pull out the package for evaluation.
Forced air cooling, which is often used in multi-story packages, will not be performed, so heat will build up between the boards,
There were also problems such as causing malfunction of the element.

An object of the present invention is to provide a two-story electronic circuit in which a normal operation is not hindered by drawing out a lead wire from a narrow space between the front surface of the mother substrate and the back surface of the sub-substrate, or by retaining heat. The purpose is to provide a package mounting method.

[0005]

According to the present invention, a two-story electronic circuit package is mounted on a front surface of a sub-substrate by mounting a connector of the same type as a connector mounted on the back surface of the sub-substrate. When necessary for circuit testing, face the sub-board surface to the mother board surface, connect the connector mounted on the sub-board surface to the connector mounted on the mother board surface, and provide the test. Can be.

It is desirable that the above-mentioned connectors are mounted on the front surface of the mother board and on the back and front ends of the sub-board, respectively.

[0007]

A connector of the same type as that mounted on the back surface of the sub-board is mounted on the front surface of the sub-board, and when testing a two-story electronic circuit package, the sub-board is rotated by 180 ° as necessary to By connecting to the motherboard using the connector mounted on the front surface, the test measuring instrument can be easily connected to the circuit element mounted on the front surface of the motherboard or the rear surface of the sub-board.

[0008]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram illustrating a two-story electronic circuit package according to an embodiment of the present invention.

FIG. 1A shows a relative positional relationship between a mother board 1 and a sub-board 2 during use.
The front surface of the mother substrate 1 and the back surface of the sub substrate 2 face each other. The facing electronic circuit elements (not shown) mounted on the front surface of the mother substrate 1 and the back surface of the sub-substrate 2 are connected to a pair of connectors (11) mounted on the front surface of the mother substrate 1 and the back surface of the sub-substrate 2, respectively. , 21) (the connector 21 is on the back surface of the sub-board, and the mounting position is indicated by a dotted line). The connector 22 mounted on the front surface of the sub-board 2 is
And is wired in parallel with the connector 21. The mother board 1 and the sub-board 2 are assembled close to the position where the connector 11 and the connector 21 are connected, and the electronic circuit element mounted on the front surface of the mother board 1 and the electronic circuit element mounted on the back surface of the sub-board 2 Is located in a very close positional relationship.

FIG. 1B shows a mother board 1 during a test.
And the relative positional relationship between the sub-substrate 2 and the sub-substrate 2.
Is rotated by 180 ° from the position at the time of use, and the connector 22 on the surface of the sub-board 2 is connected to the connector 11 on the surface of the mother board 1 (the connector 22 is on the surface of the sub-board 2, and FIG. )) Is indicated by a dotted line). Also in this case, the configuration of the electronic circuit using the electronic circuit elements mounted on the mother board 1 and the sub-board 2 is not different from that at the time of use, and the test evaluation of the two-story electronic circuit package can be performed.

Now, as shown in FIGS. 1 (a) and 1 (b), each of the connectors 11, 21, 22 is located at the end of the mother board 1 and the sub-board 2, ie, near the side. At the time of the test shown in FIG. 1B, the front surface of the mother substrate 1 and the back surface of the sub-substrate 2 are not in a positional relationship in which most of them are close to other components. The connection of the test measuring device to the electronic circuit element mounted on the back surface of the sub-substrate 2 is extremely easy, and there is no possibility that heat will be trapped.

[0013]

According to the present invention, the sub-board of the two-story electronic circuit package is rotated by 180 ° and mounted on the mother board in an upside-down manner. Further, the connector mounting position is provided at an end (near the side) of the board. The electronic circuit element mounted in an extremely narrow space between the mother board and the sub-board can be seen from the outside without changing the connection of the electronic circuit element by reducing the overlapping area of the electronic circuit element. There is an effect that a test measuring instrument can be easily connected to the element.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating a two-story electronic circuit package according to an embodiment of the present invention.

[Explanation of symbols]

 1 Mother board 2 Sub board 11, 21, 22 Connector

Claims (2)

(57) [Claims] 1. A two-story electronic circuit package comprising:
Assembling the front surface of the mother board constituting the floor portion and the back surface of the sub-board constituting the second floor portion face to face, and connecting by at least one pair of connectors mounted on the front surface of the mother board and the back surface of the sub-board, respectively. In the mounting method of the two-story electronic circuit package, a connector of the same type as the connector mounted on the back surface of the sub-substrate is mounted on the front surface of the sub-substrate. The surface of the sub-substrate faces the surface of the mother substrate, and a connector mounted on the surface of the sub-substrate is connected to a connector mounted on the surface of the mother substrate, and is subjected to the test.
Mounting method for multi-story electronic circuit packages. 2. The method according to claim 1, wherein the connectors are mounted on the front surface of the mother board and the back and front edges of the sub-board, respectively.