JP2600178B2 - Electronic circuit device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic circuit device such as a vehicle-mounted component.

2. Description of the Related Art Conventionally, as this type of electronic circuit device, FIGS.
The configuration was as shown in the figure. That is, in FIGS. 3 and 4, reference numeral 21 denotes an electronic circuit main body configured by mounting electronic components 23 such as resistors and capacitors and heat generating components 24 such as transistors on a printed circuit board 22 and performing predetermined electrical wiring. A lead wire 25 is connected to the electronic circuit main body 21. The electronic circuit body 21 has a radiating fin 26 on its outer surface.
The metal case 26 is housed in a metal case 26 made of a bottomed die-cast molding having a, and the metal case 26 is filled with a thermosetting resin 27. The lead wire 25 of the electronic circuit main body 21 is held by a holding plate 28 fitted on the side surface of the metal case 26, and is led out.

Problems to be Solved by the Invention In the case of such a conventional device, the opening side of the metal case 26 serves as a mounting portion to the device, and the resin surface side portion is in contact with the device. Electronic circuit body 21
After the parts are configured, they are housed in a metal case 26 and filled with a resin 27, so that they are assembled one by one, and there is a problem that productivity is poor, mass production is difficult, and cost reduction is difficult. .

The present invention has been made to solve such a problem, and has as its object to improve productivity.

Means for Solving the Problems In order to solve this problem, the present invention provides a U-shaped metal case formed by extrusion and having a plurality of fins formed on an outer surface thereof so as to be parallel to the extrusion direction. An electric circuit body having lead terminals is inserted and arranged, a metal case is filled with resin, and a plurality of pores are provided in the metal case.

According to this configuration, a long metal case member is prepared, a plurality of electronic circuit bodies are inserted and arranged in the metal case member, and after filling with resin, the electronic circuit bodies are individually divided or the long metal case member is separated. After obtaining the metal case from the member, the electronic circuit main body may be inserted and arranged and filled with resin, and high productivity can be obtained. Further, one surface of the U-shaped metal case serves as a mounting portion to the device, and the heat radiation efficiency is improved as compared with the conventional case where the resin portion serves as the mounting portion.

Further, the heat dissipation is improved by the pores of the metal case.

Embodiment Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG.

1 and 2 show an electronic circuit device according to one embodiment of the present invention. In the drawings, reference numeral 1 denotes an electronic circuit main body, and a printed circuit board 2 has electronic components 3 such as capacitors and resistors.
And a heat-generating component 4 such as a transistor. A plate-like lead terminal 5 for connection to an external device is directly connected and fixed to the printed circuit board 2 by soldering or the like.

Reference numeral 6 denotes a U-shaped metal case formed by extrusion and having open ends and a bottom surface. On the outer surface of the metal case 6, one side surface and the upper surface are parallel to the extrusion direction at the time of extrusion. A plurality of heat dissipating fins 6a are provided integrally. The electronic circuit body 1 is inserted and arranged in the metal case 6 such that the lead terminals 5 protrude outside from the bottom opening of the metal case 6.

Further, a plurality of grooves 6b are provided along the fins 6a at positions on the inner surface of the metal case 6 facing the fins 6a so as to be parallel to the fins 6a. A protruding wall 6c is provided which forms a recess into which the heat radiating portion of the heat generating component 4 of the electronic circuit body 1 is fitted.

Further, a plurality of pores 9 are provided in a thick portion of the U-shaped wall of the metal case 6 to play a role of further improving the heat radiation effect.

On one side surface of the metal case 6 where the fins 6a are not formed, there is provided a mounting portion 7 extending this side surface to the upper surface side. Mounted by

Reference numeral 8 denotes a thermosetting resin injected into the metal case 6 and serves to protect the electronic circuit body 1, waterproof, and assist heat radiation.

Effects of the Invention As described above, according to the present invention, a long metal case member is prepared by extrusion molding, a plurality of electronic circuit bodies are inserted and arranged in the metal case member, and after filling with resin, a finished product is formed. After individually dividing or obtaining individual metal cases from a long metal case member, the electronic circuit body can be inserted and arranged, filled with resin, and an electronic circuit device can be obtained with high productivity. In addition, since the metal case has a plurality of pores in the U-shaped wall thick portion, the heat radiation effect can be enhanced.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing an electronic circuit device according to an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIGS. 3 and 4 are perspective views showing a conventional electronic circuit device, and It is sectional drawing. DESCRIPTION OF SYMBOLS 1 ... Electronic circuit main body, 2 ... Printed circuit board, 3 ... Electronic component, 4 ... Heat-generating component, 5 ... Lead terminal, 6 ... Metal case, 6a ... Fin, 8 ... Resin, 9 ... Stomata.

Claims (1)

(57) [Claims] An electronic circuit having a plurality of heat dissipating fins formed on an outer surface of a metal case formed by extrusion molding so as to be parallel to the extrusion direction, and having a terminal connectable to an external electrode in the metal case. An electronic circuit device in which a main body is inserted and arranged, resin is injected, and a plurality of pores are provided in a metal case.